TMP302A TI | Alldatasheet
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DRL□PACKAGE SOT563-6 (TOP□VIEW) Population Accuracy□( )C/c176 TRIP□THRESHOLD□ACCURACY TMP302A,TMP302B TMP302C,TMP302D Easy-to-Use,Low-Power,Low-Supply TEMPERATURESWITCHinMicroPackage Check forSamples: TMP302A TMP302B TMP302C TMP302D 1FEATURES DESCRIPTION 2• LOW POWER: 15μA (max) The TMP302x is a temperature switch in a micropackage (SOT563). The TMP302x offerslow• SOT563 PACKAGE: 1,6mm x 1,6mm x 0,6mm power (15μA max) and ease-of-use through• TRIP-POINT ACCURACY: ±0.2°C (typ)from pin-selectabletrippointsand hysteresis.+40°C to+125°C These devicesrequireno additionalcomponents for• PIN-SELECTABLE TRIP POINTS operation;they can function independent of• OPEN-DRAIN OUTPUT microprocessorsormicrocontrollers.
- SELECTABLE HYSTERESIS: 5°C/10°C The TMP302x is availablein several different• LOW SUPPLY VOLTAGE RANGE: 1.4Vto3.6V versions.For additionaltrippoints,contacta TI representative.
APPLICATIONS
TMP302 AvailableVersions(1)• CELL PHONE HANDSETS DEVICE SELECTABLE TRIP POINTS (°C)• PORTABLE MEDIA PLAYERS TMP302A 50,55,60,65• CONSUMER ELECTRONICS TMP302B 70,75,80,85• SERVERS TMP302C 90,95,100,105• POWER-SUPPLY SYSTEMS TMP302D 110,115,120,125• DC-DC MODULES
- THERMAL MONITORING (1) Forotheravailabletrippoints,pleasecontacta TI
- ELECTRONIC PROTECTION SYSTEMS representative. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2009,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
TMP302A,TMP302B TMP302C,TMP302D This integratedcircuitcan be damaged by ESD. Texas Instrumentsrecommends thatallintegratedcircuitsbe handled with appropriateprecautions.Failuretoobserveproperhandlingand installationprocedurescan cause damage. ESD damage can rangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmay be more susceptibletodamage because verysmallparametricchanges couldcause thedevicenottomeet itspublishedspecifications. PACKAGE INFORMATION (1) PACKAGE PRODUCT TRIP POINTS (°C) PACKAGE-LEAD DESIGNATOR PACKAGE MARKING TMP302A 50,55,60,65 SOT563 DRL OCP TMP302B 70,75,80,85 SOT563 DRL OCT TMP302C 90,95,100,105 SOT563 DRL OCR TMP302D 110,115,120,125 SOT563 DRL OCS (1) Forthemost currentpackage and orderinginformationsee thePackage OptionAddendum attheend ofthisdocument,orsee theTI web siteatwww.ti.com. ABSOLUTE MAXIMUM RATINGS (1) TMP302A, TMP302B, TMP302C, TMP302D UNIT SupplyVoltage +3.6 V InputPins,Voltage TRIPSET0 ,TRIPSET1 ,HYST SET –0.5toVS + 0.5 V OutputPin,Voltage OUT –0.5to+3.6 V OutputPin,Current OUT 10 mA OperatingTemperature –55 to+130 °C StorageTemperatureRange –60 to+150 °C JunctionTemperatureRange +150 °C Human Body Model (HBM) 2000 V ESD Rating: Charged-DeviceModel (CDM) 1000 V Machine Model (MM) 200 V (1) Stressesabove theseratingsmay cause permanentdamage. Exposuretoabsolutemaximum conditionsforextendedperiodsmay degradedevicereliability.These arestressratingsonly,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thosespecifiedisnotsupported.
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ProductFolderLink(s):TMP302A TMP302B TMP302C TMP302D
TMP302A,TMP302B TMP302C,TMP302D
ELECTRICAL CHARACTERISTICS
AtTA = –40°C to+125°C, and VS = +1.4V to+3.6V,unlessotherwisenoted. TMP302 (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEMPERATURE MEASUREMENT TripPointAccuracy TA = +40°C to+125°C ±0.2 ±2 °C vs.Supply ±0.2 ±0.5 °C/V TripPointHysteresis HYST SET = GND 5 °C HYST SET = VS 10 °C TEMPERATURE TRIP POINT SET TemperatureTripPointSet TRIPSET1 = GND, TRIPSET0 = GND Default °C TRIPSET1 = GND, TRIPSET0 = VS Default+ 5 °C TRIPSET1 = VS,TRIPSET0 = GND Default+ 10 °C TRIPSET1 = VS,TRIPSET0 = VS Default+ 15 °C HYSTERESIS SET INPUT InputLogicLevels: VIH 0.7× (VS) VS V VIL –0.5 0.3× (VS) V InputCurrent: IIN 0 < VIN < 3.6V 1 µA DIGITAL OUTPUT OutputLogicLevel: VOL VS > 2V,IOL = 3mA 0 0.4 V VS < 2V,IOL = 3mA 0 0.2× (VS) V POWER SUPPLY OperatingSupplyRange 1.4 3.6 V QuiescentCurrent IQ 8 15 µA VS = 3.3V,TA = +50°C 7 µA TEMPERATURE RANGE SpecifiedRange –40 +125 °C OperatingRange –55 +130 °C ThermalResistance θJA SOT563 JEDEC Low-K Board +260 °C/W (1) 100% ofallunitsareproductiontestedatTA = +25°C. Over temperaturespecificationsarespecifiedby design. Copyright© 2009,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TMP302A TMP302B TMP302C TMP302D
2.0 1.5 1.0 0.5 0.5 1.0 1.5 2.0 /c45 /c45 /c45 /c45 40 50 60 70 80 90 100 110 130 T emperature□( C)/c176 30□T ypical□Units Trip□Accuracy□( C) /c176 120 /c45 75 /c45 50 /c45 25 0 25 50 75 100 150 T emperature□( C)/c176 V =□3.6VS V =□3.3VS V =□1.4VS Quiescent□Current□( A) /c109 125 120 100 T emperature□( C) /c176 0 5 10 15 20 25 30 Time□(s) 100 T emperature□( C) /c176 0 20 40 60 80 100 120 140 160 180 200 Time□(s) 400 350 300 250 200 150 100 /c45 75 /c45 50 /c45 25 0 25 50 75 100 125 150 T emperature□( C)/c176 V =□1.4VS I =□2mAOL V (mV) OL Population Accuracy□( )C/c176 TMP302A,TMP302B TMP302C,TMP302D TYPICAL CHARACTERISTICS AtTA = +25°C and VS = 3.3V,unlessotherwisenoted. TRIP ACCURACY ERROR vs TEMPERATURE QUIESCENT CURRENT vs TEMPERATURE Figure1. Figure2. TEMPERATURE STEP RESPONSE IN PERFLUORINATED FLUID AT +100°C vs TIME THERMAL STEP RESPONSE IN AIR AT +100°C vs TIME Figure3. Figure4. TRIP THRESHOLD ACCURACY OUTPUT LOGIC LEVEL LOW VOL vs TEMPERATURE Figure5. Figure6.
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ProductFolderLink(s):TMP302A TMP302B TMP302C TMP302D
Voltage□(2V/div) Time□(10ms/div) VS OUT TMP302A,□T =□+55 C TRIP =□TRIP =□GND /c176A SET1 SET0 VS OUT Voltage□(2V/div) Time□(8 s/div)/c109 TMP302A,TMP302B TMP302C,TMP302D TYPICAL CHARACTERISTICS (continued) AtTA = +25°C and VS = 3.3V,unlessotherwisenoted. POWER-UP AND POWER-DOWN RESPONSE POWER-UP, TRIP,AND POWER-DOWN RESPONSE Figure7. Figure8. Copyright© 2009,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TMP302A TMP302B TMP302C TMP302D
+50/c176C +60 /c176C TTRIP VDD TMP302A,TMP302B TMP302C,TMP302D
APPLICATION INFORMATION
The TMP302 temperatureswitch is optimal for HYST SETultralow-powerbattery applicationsthat require accurate tripthresholds.The tripthresholdsare If the temperaturetripthresholdis crossed,the programmable to four differentsettingsusing the open-drainoutput(OUT) goes low and does not TRIPSET1 and TRIPSET0 pins.Table 1 shows the pin returnto itsoriginalhighstate(thatis,VS) untilthe settingsversustrippoints. temperaturereturnsto a value withina hysteresis window set by the HYST SET pin.The HYST SET pin Table1.TripPointvs TRIPSET1 and TRIPSET0 allowsthe user to choose between a +5°C and a +10°C hysteresiswindow. Table 2 shows the TRIPSET1 TRIPSET0 TMP302A TMP302B TMP302C TMP302D hysteresiswindow thatcorrespondsto the HYST SET GND GND +50°C +70°C +90°C +110°C setting. GND VS +55°C +75°C +95°C +115°C Table2.HYST SET WindowVS GND +60°C +80°C +100°C +120°C VS VS +65°C +85°C +105°C +125°C HYST SET THRESHOLD HYSTERESIS GND +5°CThe typicalthermalresponsetimefortheTMP302 is VS +10°Cabout250ms. Thisperiodistheminimum timeframe responseinas littleas 35ms. CONFIGURING THE TMP302 The TMP302 issimpletoconfigure.The onlyexternal components thatitrequiresare a bypass capacitor and pull-upresistor.Power-supply bypassing is stronglyrecommended; use a 0.1µF capacitorplaced as closeas possibleto the supplypin.To minimize the internalpower dissipationof the TMP302, use a pull-upresistorvaluegreaterthan10kΩ fromOUT to VS. Refer to Table 1 for trippoint temperature configuration.The TRIPSET pins can be toggled dynamically;however,thevoltageofthesepinsmust not exceed VS. To ensure a properlogichigh,the voltagemust notdropbelow0.7V× VS. Figure9. TMP302A; HYST SET = VS;TRIPSET1 = VS, TRIPSET0 = GND
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ProductFolderLink(s):TMP302A TMP302B TMP302C TMP302D
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TMP302ADRLR ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TMP302ADRLT ACTIVE SOT DRL 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TMP302BDRLR ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TMP302BDRLT ACTIVE SOT DRL 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TMP302CDRLR ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TMP302CDRLT ACTIVE SOT DRL 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TMP302DDRLR ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TMP302DDRLT ACTIVE SOT DRL 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 17-Sep-2009 Addendum-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 15-Sep-2009 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP302ADRLR SOT DRL 6 4000 202.0 201.0 28.0 TMP302ADRLT SOT DRL 6 250 202.0 201.0 28.0 TMP302BDRLR SOT DRL 6 4000 202.0 201.0 28.0 TMP302BDRLT SOT DRL 6 250 202.0 201.0 28.0 TMP302CDRLR SOT DRL 6 4000 202.0 201.0 28.0 TMP302DDRLR SOT DRL 6 4000 202.0 201.0 28.0 TMP302DDRLT SOT DRL 6 250 202.0 201.0 28.0 PACKAGE MATERIALS INFORMATION www.ti.com 15-Sep-2009 Pack Materials-Page 2
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