TMP300-Q1 TI1 | Alldatasheet

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(1)RSET TSET OUT HYSTSET VTEMP TMP300 3mA Proportional to TA NOTE: (1) Thinfilm resistor with approximately 10% accuracy; however, this accuracy error is trimmed out at the factory. VTEMP HYSTSET TSET GND OUT TMP300B-Q1 SC70-6 TMP300B-Q1 www.ti.com SBOS586 –DECEMBER 2011 1.8V,Resistor-Programmable TEMPERATURESWITCHand ANALOGOUTTEMPERATURESENSORinSC70 Check forSamples: TMP300B-Q1 1FEATURES DESCRIPTION The TMP300B-Q1 is a low-power, 2• ACCURACY: ±1°C (typicalat+25°C) resistor-programmable,digitaloutput temperature• PROGRAMMABLE TRIP POINT switch.Itallowsa thresholdpointtobe setby adding

  • PROGRAMMABLE HYSTERESIS: 5°C/10°C an externalresistor.Two levelsof hysteresisare available.The TMP300B-Q1 has a VTEMP analog• OPEN-DRAIN OUTPUTS outputthatcan be used as a testingpointor in• LOW-POWER: 110μA (max) temperature-compensationloops.
  • WIDE VOLTAGE RANGE: +1.8V to+18V Witha supplyvoltageas low as 1.8V and low current• OPERATION: –40°C to+150°C consumption, the TMP300B-Q1 is ideal for
  • ANALOG OUT: 10mV/ °C power-sensitivesystems.
  • SC70-6 PACKAGE Availablein two micropackages thathave proven thermalcharacteristics,thispartgivesa completeand APPLICATIONS simple solutionfor users who need simple and reliablethermalmanagement.• QUALIFIED FOR forAUTOMOTIVE

APPLICATIONS

  • POWER-SUPPLY SYSTEMS
  • DC-DC MODULES
  • THERMAL MONITORING
  • ELECTRONIC PROTECTION SYSTEMS Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2011,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SBOS586 –DECEMBER 2011 www.ti.com This integratedcircuitcan be damaged by ESD. Texas Instrumentsrecommends thatallintegratedcircuitsbe handled with appropriateprecautions.Failuretoobserveproperhandlingand installationprocedurescan cause damage. ESD damage can rangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmay be more susceptibletodamage because verysmallparametricchanges couldcause thedevicenottomeet itspublishedspecifications. ORDERING INFORMATION (1) ORDERABLE P/N TA PACKAGE TOP SIDE SYMBOL TMP300BQDCKRQ1 or -40°C to125°C SC70 -DCK |Reelof3000 SBGTMP300B-Q1 (1) Forthemost currentpackage and orderinginformationsee thePackage OptionAddendum attheend ofthisdocument,orsee theTI web siteatwww.ti.com. ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT SupplyVoltage V+ +18 V SignalInputTerminals,Voltage(2) –0.5to(V+)+ 0.5 V SignalInputTerminals,Current(2) ±10 mA OutputShort-Circuit(3) ISC Continuous Open-DrainOutput (V+)+ 0.5 V OperatingTemperature TA –40 to+150 °C StorageTemperature TA –55 to+150 °C JunctionTemperature TJ +150 °C Human Body Model (HBM) 4000 V ESD Rating Charged DeviceModel (CDM) 1000 V Machine Model (MM) 200 V (1) Stressesabove theseratingsmay cause permanentdamage. Exposuretoabsolutemaximum conditionsforextendedperiodsmay degradedevicereliability.These arestressratingsonly,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thosespecifiedisnotsupported. (2) Inputterminalsarediode-clampedtothepower-supplyrails.Inputsignalsthatcan swingmore than0.5Vbeyond thesupplyrailsshould be currentlimitedto10mA orless. (3) Short-circuittoground.

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www.ti.com SBOS586 –DECEMBER 2011

ELECTRICAL CHARACTERISTICS

AtVS = 3.3Vand TA = –40°C to+125°C, unlessotherwisenoted. TMP300B-Q1 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEMPERATURE MEASUREMENT VS = 2.35Vto18V –40 +125 °C Measurement Range 100 ×VS = 1.8Vto2.35V –40 °C(VS – 0.95) TRIP POINT TotalAccuracy TA = –40°C to+125°C ±2 ±6 °C R SET Equation TC isin°C R SET = 10 (50+ TC )/3 kΩ HYSTERESIS SET INPUT LOW Threshold(1) 0.4 V HIGH Threshold(1) VS – 0.4 V HYST SET = GND 5 °C ThresholdHysteresis HYST SET = VS 10 °C DIGITAL OUTPUT LogicFamily CMOS Open-DrainLeakage Current(1) OUT = VS 10 μA LogicLevels VOL VS = 1.8Vto18V,ISINK = 5mA 0.3 V ANALOG OUTPUT Accuracy ±2 ±5 °C TemperatureSensitivity 10 mV/°C OutputVoltage(1) TA = +25°C 720 750 780 mV VTEMP PinOutputResistance 210 kΩ POWER SUPPLY VS = 1.8Vto18V,QuiescentCurrent(2) IQ 110 μATA = –40°C to+125°C TEMPERATURE RANGE VS = 2.35Vto18V –40 +125 °C SpecifiedRange TA 100 ×VS = 1.8Vto2.35V –40 °C(VS – 0.95) VS = 2.35Vto18V –40 +150 °C OperatingRange TA 100 ×VS = 1.8Vto2.35V –50 °C(VS – 0.95) ThermalResistance θJA SC70 250 °C/W SOT23-6 180 °C/W (1) Specifiedby design.Not productiontested. (2) See Figure1 fortypicalquiescentcurrent. Copyright© 2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TMP300B-Q1

/c45 40 /c45 25 0 25 50 75 100 125 T emperature□( C)/c176 I ( A) /c109 Q V =□18VS V =□3.3VS V =□1.8VS /c45 40 /c45 25 0 2.0 1.5 1.0 0.5 /c45 0.5 /c45 1.0 /c45 1.5 /c45 2.0 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 T +□1%ERROR TERROR /c45 1% T +□0.1%ERROR TERROR /c45 0.1% /c45 40 /c45 25 0 700 600 500 400 300 200 100 25 50 75 100 125 T emperature□(/c176 C) R (k ) /c87 SET /c45 40 /c45 25 0 4.0 /c45 4.0 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 2.0 /c45 1.0 1.0 /c45 2.0 /c45 3.0 3.0 /c45 40 /c45 25 0 3.0 2.0 /c45 3.0 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 1.5 /c45 2.0 1.0 /c45 2.5 2.5 0.5 /c45 0.5 /c45 1.0 /c45 1.5 /c45 40 /c45 25 0 0.10 0.08 /c45 0.02 /c45 0.04 /c45 0.06 /c45 0.08 /c45 0.10 25 50 75 100 125 T emperature□(/c176 C) Error ( C/V) /c176 0.06 0.04 0.02 T is□+85 C□for□V/c176MAX S =□1.8V□to□3.3V 3.3V□to□18V TMP300B-Q1 SBOS586 –DECEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS AtVS = 5V,unlessotherwisenoted. QUIESCENT CURRENT OVER TEMPERATURE AND SUPPLY R SET SHIFT DUE TO R SET TOLERANCE Figure1. Figure2. R SET vs TEMPERATURE TYPICAL TRIP ERROR Figure3. Figure4. TYPICAL ANALOG OUTPUT ERROR ANALOG PSR OVER TEMPERATURE Figure5. Figure6.

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/c45 40 /c45 25 0 0.10 0.08 /c45 0.02 /c45 0.04 /c45 0.06 /c45 0.08 /c45 0.10 25 50 75 100 125 T emperature□(/c176 C) Error ( C/V) /c176 0.06 0.04 0.02 3.3V□to□18V T is□+85 C□for□V/c176MAX S =□1.8V□to□3.3V TMP300B-Q1 www.ti.com SBOS586 –DECEMBER 2011 TYPICAL CHARACTERISTICS (continued) AtVS = 5V,unlessotherwisenoted. TRIP PSR OVER TEMPERATURE Figure7. Copyright© 2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TMP300B-Q1

R =SET /c45 6 R in□k = /c87SET 10(50□+□T )SET RINT 210k/c87RSET TSET OUT HYSTSET VTEMP TMP300

3 A/c109

to□TA Open-Drain□Control Voltage□source to□test□trip□point. TMP300B-Q1 SBOS586 –DECEMBER 2011 www.ti.com APPLICATIONS INFORMATION To set the TMP300B-Q1 to tripat a presetvalue,The TMP300B-Q1 isa thermalsensordesignedfor calculatethe R SET resistorvalue according toover-temperatureprotectioncircuitsin electronic Equation1 orEquation2:systems.The TMP300B-Q1 uses a set resistorto program thetriptemperatureofthedigitaloutput.An additionalhigh-impedance(210kΩ) analog voltage (1) outputprovidesthetemperaturereading. Where TSET isin°C; or CALCULATING R SET The setresistor(RSET ) providesa thresholdvoltage (2) for the comparator input.The TMP300B-Q1 trips Where TSET isin°C.when the VTEMP pin exceeds the TSET voltage.The valueofthesetresistorisdeterminedby theanalog USING VTEMP TO TRIP THE DIGITAL OUTPUToutputfunctionand the3μA internalbiascurrent. The analog voltageoutput can also serve as a voltageinputthatforcesa tripofthedigitaloutputto simulatea thermalevent.This simulationfacilitates easy system design and test of thermal safety circuits,as shown inFigure8. Figure8. ApplyingVoltagetoTripDigitalOutput

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to□TA Analog□Out OPA335 /c45 50 /c45 25 0 1.00 0.75 0.50 0.25 /c45 0.25 /c45 0.50 /c45 0.75 /c45 1.00 25 50 75 100 125 T emperature□( C)/c176 Trip□Set□Voltage□Error□( C) /c176 210k/c87 TSET OUT HYSTSET VTEMP TMP300 to□TA Open-Drain□Control Voltage□source to□test□trip□point. DAC8560 TMP300B-Q1 www.ti.com SBOS586 –DECEMBER 2011 ANALOG TEMPERATURE OUTPUT USING A DAC TO SET THE TRIP POINT The analog out or VTEMP pin is high-impedance The trippointis easilyconvertedby changing the (210kΩ).Avoidloadingthispintopreventdegrading digital-to-analogconverter (DAC) code. This theanalogoutvalueortrippoint.Buffertheoutputof techniquecan be usefulforcontrolloops where a thispinwhen usingitfordirectthermalmeasurement. largethermalmass is being broughtup to the set Figure9 shows bufferingoftheanalogoutputsignal. temperatureand the OUT pinisused to controlthe heatingelement.The analogoutputcan be monitored ina controlalgorithmthatadjuststhesettemperature to preventovershoot.Tripset voltageerrorversus temperatureisshown inFigure10,whichshows error in°C of the comparatorinputover temperature.An alternativemethod ofsettingthetrippointby usinga DAC isshown inFigure11. Figure9. BufferingtheAnalog Output Signal Figure10. TripSet VoltageErrorvs Temperature Figure11. DAC Generates theVoltage-DrivingTSET Pin Copyright© 2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TMP300B-Q1

/c45 50 /c45 25 0 /c45 1 /c45 2 /c45 3 /c45 4 /c45 5 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 Maximum Average Minimum /c45 50 /c45 25 0 /c45 1 /c45 2 /c45 3 /c45 4 /c45 5 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 Maximum Average Minimum 210k/c87RSETCBYPASS TSET OUT HYSTSET VTEMP TMP300 to□TA Open-Drain□Control CBYPASS TMP300B-Q1 SBOS586 –DECEMBER 2011 www.ti.com HYSTERESIS Bypass capacitorsshouldbe used on thesuppliesas The hysteresispin has two settings.Grounding wellas on theR SET and analogout(VTEMP )pinswhen HYST SET resultsin5°C ofhysteresis.Connectingitto innoisyenvironments,as shown inFigure14.These VS resultsin 10°C of hysteresis.Hysteresiserror capacitorsreduce premature triggeringof the variationovertemperatureisshown inFigure12 and comparator. Figure13. Figure13. 10°C HysteresisErrorvs Temperature Figure12. 5°C HysteresisErrorvs Temperature Figure14. Bypass CapacitorsPreventEarlyComparator TogglingDue toCircuitBoard Noise

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www.ti.com 30-Dec-2011 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TMP300BQDCKRQ1 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP300-Q1 :

  • Catalog: TMP300 NOTE: Qualified Version Definitions:
  • Catalog - TI's standard catalog product

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 30-Dec-2011 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP300BQDCKRQ1 SC70 DCK 6 3000 203.0 203.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 30-Dec-2011 Pack Materials-Page 2

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