TMP300-Q1 TI | Alldatasheet

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(1)RSET TSET OUT HYSTSET VTEMP TMP300 3mA Proportional to TA NOTE: (1) Thinfilm resistor with approximately 10% accuracy; however, this accuracy error is trimmed out at the factory. VTEMP HYSTSET TSET GND OUT TMP300B-Q1 SC70-6 TMP300B-Q1 www.ti.com SBOS586 –DECEMBER 2011 1.8V,Resistor-Programmable TEMPERATURESWITCHand ANALOGOUTTEMPERATURESENSORinSC70 Check forSamples: TMP300B-Q1 1FEATURES DESCRIPTION The TMP300B-Q1 is a low-power, 2• ACCURACY: ±1°C (typicalat+25°C) resistor-programmable,digitaloutput temperature• PROGRAMMABLE TRIP POINT switch.Itallowsa thresholdpointtobe setby adding

  • PROGRAMMABLE HYSTERESIS: 5°C/10°C an externalresistor.Two levelsof hysteresisare available.The TMP300B-Q1 has a VTEMP analog• OPEN-DRAIN OUTPUTS outputthatcan be used as a testingpointor in• LOW-POWER: 110μA (max) temperature-compensationloops.
  • WIDE VOLTAGE RANGE: +1.8V to+18V Witha supplyvoltageas low as 1.8V and low current• OPERATION: –40°C to+150°C consumption, the TMP300B-Q1 is ideal for
  • ANALOG OUT: 10mV/ °C power-sensitivesystems.
  • SC70-6 PACKAGE Availablein two micropackages thathave proven thermalcharacteristics,thispartgivesa completeand APPLICATIONS simple solutionfor users who need simple and reliablethermalmanagement.• QUALIFIED FOR forAUTOMOTIVE

APPLICATIONS

  • POWER-SUPPLY SYSTEMS
  • DC-DC MODULES
  • THERMAL MONITORING
  • ELECTRONIC PROTECTION SYSTEMS Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2011,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SBOS586 –DECEMBER 2011 www.ti.com This integratedcircuitcan be damaged by ESD. Texas Instrumentsrecommends thatallintegratedcircuitsbe handled with appropriateprecautions.Failuretoobserveproperhandlingand installationprocedurescan cause damage. ESD damage can rangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmay be more susceptibletodamage because verysmallparametricchanges couldcause thedevicenottomeet itspublishedspecifications. ORDERING INFORMATION (1) ORDERABLE P/N TA PACKAGE TOP SIDE SYMBOL TMP300BQDCKRQ1 or -40°C to125°C SC70 -DCK |Reelof3000 SBGTMP300B-Q1 (1) Forthemost currentpackage and orderinginformationsee thePackage OptionAddendum attheend ofthisdocument,orsee theTI web siteatwww.ti.com. ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT SupplyVoltage V+ +18 V SignalInputTerminals,Voltage(2) –0.5to(V+)+ 0.5 V SignalInputTerminals,Current(2) ±10 mA OutputShort-Circuit(3) ISC Continuous Open-DrainOutput (V+)+ 0.5 V OperatingTemperature TA –40 to+150 °C StorageTemperature TA –55 to+150 °C JunctionTemperature TJ +150 °C Human Body Model (HBM) 4000 V ESD Rating Charged DeviceModel (CDM) 1000 V Machine Model (MM) 200 V (1) Stressesabove theseratingsmay cause permanentdamage. Exposuretoabsolutemaximum conditionsforextendedperiodsmay degradedevicereliability.These arestressratingsonly,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thosespecifiedisnotsupported. (2) Inputterminalsarediode-clampedtothepower-supplyrails.Inputsignalsthatcan swingmore than0.5Vbeyond thesupplyrailsshould be currentlimitedto10mA orless. (3) Short-circuittoground.

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www.ti.com SBOS586 –DECEMBER 2011

ELECTRICAL CHARACTERISTICS

AtVS = 3.3Vand TA = –40°C to+125°C, unlessotherwisenoted. TMP300B-Q1 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEMPERATURE MEASUREMENT VS = 2.35Vto18V –40 +125 °C Measurement Range 100 ×VS = 1.8Vto2.35V –40 °C(VS – 0.95) TRIP POINT TotalAccuracy TA = –40°C to+125°C ±2 ±6 °C R SET Equation TC isin°C R SET = 10 (50+ TC )/3 kΩ HYSTERESIS SET INPUT LOW Threshold(1) 0.4 V HIGH Threshold(1) VS – 0.4 V HYST SET = GND 5 °C ThresholdHysteresis HYST SET = VS 10 °C DIGITAL OUTPUT LogicFamily CMOS Open-DrainLeakage Current(1) OUT = VS 10 μA LogicLevels VOL VS = 1.8Vto18V,ISINK = 5mA 0.3 V ANALOG OUTPUT Accuracy ±2 ±5 °C TemperatureSensitivity 10 mV/°C OutputVoltage(1) TA = +25°C 720 750 780 mV VTEMP PinOutputResistance 210 kΩ POWER SUPPLY VS = 1.8Vto18V,QuiescentCurrent(2) IQ 110 μATA = –40°C to+125°C TEMPERATURE RANGE VS = 2.35Vto18V –40 +125 °C SpecifiedRange TA 100 ×VS = 1.8Vto2.35V –40 °C(VS – 0.95) VS = 2.35Vto18V –40 +150 °C OperatingRange TA 100 ×VS = 1.8Vto2.35V –50 °C(VS – 0.95) ThermalResistance θJA SC70 250 °C/W SOT23-6 180 °C/W (1) Specifiedby design.Not productiontested. (2) See Figure1 fortypicalquiescentcurrent. Copyright© 2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TMP300B-Q1

/c45 40 /c45 25 0 25 50 75 100 125 T emperature□( C)/c176 I ( A) /c109 Q V =□18VS V =□3.3VS V =□1.8VS /c45 40 /c45 25 0 2.0 1.5 1.0 0.5 /c45 0.5 /c45 1.0 /c45 1.5 /c45 2.0 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 T +□1%ERROR TERROR /c45 1% T +□0.1%ERROR TERROR /c45 0.1% /c45 40 /c45 25 0 700 600 500 400 300 200 100 25 50 75 100 125 T emperature□(/c176 C) R (k ) /c87 SET /c45 40 /c45 25 0 4.0 /c45 4.0 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 2.0 /c45 1.0 1.0 /c45 2.0 /c45 3.0 3.0 /c45 40 /c45 25 0 3.0 2.0 /c45 3.0 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 1.5 /c45 2.0 1.0 /c45 2.5 2.5 0.5 /c45 0.5 /c45 1.0 /c45 1.5 /c45 40 /c45 25 0 0.10 0.08 /c45 0.02 /c45 0.04 /c45 0.06 /c45 0.08 /c45 0.10 25 50 75 100 125 T emperature□(/c176 C) Error ( C/V) /c176 0.06 0.04 0.02 T is□+85 C□for□V/c176MAX S =□1.8V□to□3.3V 3.3V□to□18V TMP300B-Q1 SBOS586 –DECEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS AtVS = 5V,unlessotherwisenoted. QUIESCENT CURRENT OVER TEMPERATURE AND SUPPLY R SET SHIFT DUE TO R SET TOLERANCE Figure1. Figure2. R SET vs TEMPERATURE TYPICAL TRIP ERROR Figure3. Figure4. TYPICAL ANALOG OUTPUT ERROR ANALOG PSR OVER TEMPERATURE Figure5. Figure6.

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/c45 40 /c45 25 0 0.10 0.08 /c45 0.02 /c45 0.04 /c45 0.06 /c45 0.08 /c45 0.10 25 50 75 100 125 T emperature□(/c176 C) Error ( C/V) /c176 0.06 0.04 0.02 3.3V□to□18V T is□+85 C□for□V/c176MAX S =□1.8V□to□3.3V TMP300B-Q1 www.ti.com SBOS586 –DECEMBER 2011 TYPICAL CHARACTERISTICS (continued) AtVS = 5V,unlessotherwisenoted. TRIP PSR OVER TEMPERATURE Figure7. Copyright© 2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TMP300B-Q1

R =SET /c45 6 R in□k = /c87SET 10(50□+□T )SET RINT 210k/c87RSET TSET OUT HYSTSET VTEMP TMP300

3 A/c109

to□TA Open-Drain□Control Voltage□source to□test□trip□point. TMP300B-Q1 SBOS586 –DECEMBER 2011 www.ti.com APPLICATIONS INFORMATION To set the TMP300B-Q1 to tripat a presetvalue,The TMP300B-Q1 isa thermalsensordesignedfor calculatethe R SET resistorvalue according toover-temperatureprotectioncircuitsin electronic Equation1 orEquation2:systems.The TMP300B-Q1 uses a set resistorto program thetriptemperatureofthedigitaloutput.An additionalhigh-impedance(210kΩ) analog voltage (1) outputprovidesthetemperaturereading. Where TSET isin°C; or CALCULATING R SET The setresistor(RSET ) providesa thresholdvoltage (2) for the comparator input.The TMP300B-Q1 trips Where TSET isin°C.when the VTEMP pin exceeds the TSET voltage.The valueofthesetresistorisdeterminedby theanalog USING VTEMP TO TRIP THE DIGITAL OUTPUToutputfunctionand the3μA internalbiascurrent. The analog voltageoutput can also serve as a voltageinputthatforcesa tripofthedigitaloutputto simulatea thermalevent.This simulationfacilitates easy system design and test of thermal safety circuits,as shown inFigure8. Figure8. ApplyingVoltagetoTripDigitalOutput

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to□TA Analog□Out OPA335 /c45 50 /c45 25 0 1.00 0.75 0.50 0.25 /c45 0.25 /c45 0.50 /c45 0.75 /c45 1.00 25 50 75 100 125 T emperature□( C)/c176 Trip□Set□Voltage□Error□( C) /c176 210k/c87 TSET OUT HYSTSET VTEMP TMP300 to□TA Open-Drain□Control Voltage□source to□test□trip□point. DAC8560 TMP300B-Q1 www.ti.com SBOS586 –DECEMBER 2011 ANALOG TEMPERATURE OUTPUT USING A DAC TO SET THE TRIP POINT The analog out or VTEMP pin is high-impedance The trippointis easilyconvertedby changing the (210kΩ).Avoidloadingthispintopreventdegrading digital-to-analogconverter (DAC) code. This theanalogoutvalueortrippoint.Buffertheoutputof techniquecan be usefulforcontrolloops where a thispinwhen usingitfordirectthermalmeasurement. largethermalmass is being broughtup to the set Figure9 shows bufferingoftheanalogoutputsignal. temperatureand the OUT pinisused to controlthe heatingelement.The analogoutputcan be monitored ina controlalgorithmthatadjuststhesettemperature to preventovershoot.Tripset voltageerrorversus temperatureisshown inFigure10,whichshows error in°C of the comparatorinputover temperature.An alternativemethod ofsettingthetrippointby usinga DAC isshown inFigure11. Figure9. BufferingtheAnalog Output Signal Figure10. TripSet VoltageErrorvs Temperature Figure11. DAC Generates theVoltage-DrivingTSET Pin Copyright© 2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TMP300B-Q1

/c45 50 /c45 25 0 /c45 1 /c45 2 /c45 3 /c45 4 /c45 5 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 Maximum Average Minimum /c45 50 /c45 25 0 /c45 1 /c45 2 /c45 3 /c45 4 /c45 5 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 Maximum Average Minimum 210k/c87RSETCBYPASS TSET OUT HYSTSET VTEMP TMP300 to□TA Open-Drain□Control CBYPASS TMP300B-Q1 SBOS586 –DECEMBER 2011 www.ti.com HYSTERESIS Bypass capacitorsshouldbe used on thesuppliesas The hysteresispin has two settings.Grounding wellas on theR SET and analogout(VTEMP )pinswhen HYST SET resultsin5°C ofhysteresis.Connectingitto innoisyenvironments,as shown inFigure14.These VS resultsin 10°C of hysteresis.Hysteresiserror capacitorsreduce premature triggeringof the variationovertemperatureisshown inFigure12 and comparator. Figure13. Figure13. 10°C HysteresisErrorvs Temperature Figure12. 5°C HysteresisErrorvs Temperature Figure14. Bypass CapacitorsPreventEarlyComparator TogglingDue toCircuitBoard Noise

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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TMP300BQDCKRQ1 Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 SBG TMP300BQDCKRQ1.A Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 SBG (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP300-Q1 :

  • Catalog : TMP300 Addendum-Page 1

www.ti.com 23-May-2025 NOTE: Qualified Version Definitions:

  • Catalog - TI's standard catalog product Addendum-Page 2

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 5-Jan-2021 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP300BQDCKRQ1 SC70 DCK 6 3000 200.0 183.0 25.0 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jan-2021 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 0.22

0.08 TYP

0.15 2.4 1.8 4X 0.65 1.1 0.8 0.1

0.0 TYP

6X 0.30 0.15 NOTE 5 0.46

0.26 TYP

0 TYP

1.3 4X 0 -12 4X 4 -15 A 2.15 1.85 B1.4 1.1 SOT - 1.1 max heightDCK0006A SMALL OUTLINE TRANSISTOR 4214835/D 11/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. 4. Falls within JEDEC MO-203 variation AB. INDEX AREA PIN 1 NOTE 5

0.1 C A B

0.1 C SCALE 5.600

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

0.07 MIN

6X (0.9) 6X (0.4) (2.2) 4X (0.65) (R0.05) TYP 4214835/D 11/2024 SOT - 1.1 max heightDCK0006A SMALL OUTLINE TRANSISTOR NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (2.2) 4X(0.65) 6X (0.9) 6X (0.4) (R0.05) TYP SOT - 1.1 max heightDCK0006A SMALL OUTLINE TRANSISTOR 4214835/D 11/2024 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:18X SYMM PKG 3 4

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