TMP300 TI | Alldatasheet
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/C0066/C0117/C0114/C0114/C0262/C0066/C0114/C0111/C0119/C0110 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0102/C0114/C0111/C0109 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115
FEATURES
DESCRIPTION
APPLICATIONS
210k/c87(1)RSET TSET OUT HYSTSET VTEMP TMP300 3/c109A Proportional to□TA NOTE:□(1)□Thinfilm□resistor□with□approximately□10%□accuracy; however,□this□accuracy□error□is□trimmed□out□at□the□factory. V TEMP HYSTSET TSET GND OUT TMP300 SC70-6,□SOT23-6 TMP300 SBOS335A JUNE 2005 REVISED SEPTEMBER 2007 1.8V, Resistor-Programmable TEMPERATURE SWITCH and ANALOG OUT TEMPERATURE SENSOR in SC70 ACCURACY: C (typical at +25 PROGRAMMABLE TRIP POINT The TMP300 is a low-power, resistor-programmable, digital output temperature switch. It allows a threshold PROGRAMMABLE HYSTERESIS: C/10 C point to be set by adding an external resistor. Two OPEN-DRAIN OUTPUTS levels of hysteresis are available. The TMP300 has a LOW-POWER: 110 μ A (max) V TEMP analog output that can be used as a testing point or in temperature-compensation loops. WIDE VOLTAGE RANGE: +1.8V to +18V OPERATION: C to +150 C The TMP300 detects temperature with C accuracy (max) over C to +125 ANALOG OUT: 10mV/ C With a supply voltage as low as 1.8V and low current SC70-6 AND SOT23-6 PACKAGES consumption, the TMP300 is ideal for power-sensitive systems. POWER-SUPPLY SYSTEMS Available in two micropackages that have proven thermal characteristics, this part gives a complete and DC-DC MODULES simple solution for users who need simple and THERMAL MONITORING reliable thermal management. ELECTRONIC PROTECTION SYSTEMS Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright 2005 2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
www.ti.com ABSOLUTE MAXIMUM RATINGS (1) TMP300 SBOS335A JUNE 2005 REVISED SEPTEMBER 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING TMP300 SC70-6 DCK BPN TMP300 SOT23-6 (2) DBV T300 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com (2) Available 4Q, 2007. VALUE UNIT Supply Voltage (V+) +18 V Signal Input Terminals, Voltage (2) 0.5 to (V+) 0.5 V Signal Input Terminals, Current (2) mA Output Short-Circuit SC (3) Continuous Open-Drain Output (V+) 0.5 V Operating Temperature to +150 C Storage Temperature to +150 C Junction Temperature J +150 C Human Body Model (HBM) 4000 V ESD Rating Charged Device Model (CDM) 1000 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground. Submit Documentation Feedback Copyright 2005 2007, Texas Instruments Incorporated Product Folder Link(s): TMP300
www.ti.com ELECTRICAL CHARACTERISTICS TMP300 SBOS335A JUNE 2005 REVISED SEPTEMBER 2007 At V S 3.3V and T A C to +125 unless otherwise noted. TMP300 PARAMETER TEST CONDITIONS MIN (1) TYP (1) MAX (1) UNIT TEMPERATURE MEASUREMENT Measurement Range V S 2.35V to 18V +125 C V S 1.8V to 2.35V 100(V S 0.95) C TRIP POINT Total Accuracy T A C to +125 C C R SET Equation T C is in C R SET (50 T C )/3 k Ω HYSTERESIS SET INPUT LOW Threshold 0.4 V HIGH Threshold V S 0.4 V Threshold Hysteresis HYST SET GND C HYST SET V S C DIGITAL OUTPUT Logic Family CMOS Open-Drain Leakage Current OUT V S μ A Logic Levels V OL V S 1.8V to 18V, I SINK 5mA 0.3 V ANALOG OUTPUT Accuracy C Temperature Sensitivity mV/ C Output Voltage T A +25 C 720 750 780 mV V TEMP Pin Output Resistance 210 k Ω POWER SUPPLY V S 1.8V to 18V, Quiescent Current (2) I Q 110 μ A T A C to +125 C TEMPERATURE RANGE Specified Range V S 2.35V to 18V +125 C V S 1.8V to 2.35V 100(V S 0.95) C Operating Range V S 2.35V to 18V +150 C V S 1.8V to 2.35V 100(V S 0.95) C Thermal Resistance, θ JA SC70 250 C/W SOT23-6 (3) 180 C/W (1) 100% of production is tested at T A +85 Specifications over temperature range are ensured by design. (2) See Figure for typical quiescent current. (3) Available Q4, 2007. Copyright 2005 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMP300
www.ti.com TYPICAL CHARACTERISTICS /c45 40 /c45 25 0 25 50 75 100 125 T emperature□( C)/c176 I ( A) /c109 Q V =□18VS V =□3.3VS V =□1.8VS /c45 40 /c45 25 0 2.0 1.5 1.0 0.5 /c45 0.5 /c45 1.0 /c45 1.5 /c45 2.0 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 T +□1%ERROR TERROR /c45 1% T +□0.1%ERROR TERROR /c45 0.1% /c45 40 /c45 25 0 700 600 500 400 300 200 100 25 50 75 100 125 T emperature□(/c176 C) R )/c87 SET /c45 40 /c45 25 0 4.0 /c45 4.0 25 50 75 100 125 T emperature□( C)/c176 Error□( C)/c176 2.0 /c45 1.0 1.0 /c45 2.0 /c45 3.0 3.0 /c45 40 /c45 25 0 3.0 2.0 /c45 3.0 25 50 75 100 125 T emperature□( C)/c176 Error□( C)/c176 1.5 /c45 2.0 1.0 /c45 2.5 2.5 0.5 /c45 0.5 /c45 1.0 /c45 1.5 /c45 40 /c45 25 0 0.10 0.08 /c45 0.02 /c45 0.04 /c45 0.06 /c45 0.08 /c45 0.10 25 50 75 100 125 T emperature□(/c176 C) Error ( C/V)/c176 0.06 0.04 0.02 T is□+85 C□for□V/c176MAX S =□1.8V□to□3.3V 3.3V□to□18V TMP300 SBOS335A JUNE 2005 REVISED SEPTEMBER 2007 At V S 5V, unless otherwise noted. QUIESCENT CURRENT OVER TEMPERATURE AND SUPPLY R SET SHIFT DUE TO R SET TOLERANCE Figure Figure R SET vs TEMPERATURE TYPICAL TRIP ERROR Figure Figure TYPICAL ANALOG OUTPUT ERROR ANALOG PSR OVER TEMPERATURE Figure Figure Submit Documentation Feedback Copyright 2005 2007, Texas Instruments Incorporated Product Folder Link(s): TMP300
www.ti.com /c45 40 /c45 25 0 0.10 0.08 /c45 0.02 /c45 0.04 /c45 0.06 /c45 0.08 /c45 0.10 25 50 75 100 125 T emperature□(/c176 C) Error ( C/V)/c176 0.06 0.04 0.02 3.3V□to□18V T is□+85 C□for□V/c176MAX S =□1.8V□to□3.3V TMP300 SBOS335A JUNE 2005 REVISED SEPTEMBER 2007 TYPICAL CHARACTERISTICS (continued) At V S 5V, unless otherwise noted. TRIP PSR OVER TEMPERATURE Figure Copyright 2005 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMP300
www.ti.com R =SET /c45 6 (1) CALCULATING R SET R in□k = /c87SET 10(50□+□T )SET (2) USING V TEMP TO TRIP THE DIGITAL OUTPUT RINT 210k/c87RSET TSET OUT HYSTSET VTEMP TMP300
3 A/c109
to□TA Open-Drain□Control Voltage□source to□test□trip□point. TMP300 SBOS335A JUNE 2005 REVISED SEPTEMBER 2007 To set the TMP300 to trip at a preset value, calculate The TMP300 is a thermal sensor designed for the R SET resistor value according to Equation or over-temperature protection circuits in electronic Equation systems. The TMP300 uses a set resistor to program the trip temperature of the digital output. An additional high-impedance (210k Ω analog voltage output provides the temperature reading. Where T SET is in or The set resistor SET provides a threshold voltage for the comparator input. The TMP300 trips when the Where T SET is in V TEMP pin exceeds the T SET voltage. The value of the set resistor is determined by the analog output function and the μ A internal bias current. The analog voltage output can also serve as a voltage input that forces a trip of the digital output to simulate a thermal event. This simulation facilitates easy system design and test of thermal safety circuits, as shown in Figure Figure Applying Voltage to Trip Digital Output Submit Documentation Feedback Copyright 2005 2007, Texas Instruments Incorporated Product Folder Link(s): TMP300
www.ti.com ANALOG TEMPERATURE OUTPUT USING A DAC TO SET THE TRIP POINT 210k/c87 TSET OUT HYSTSET VTEMP TMP300 to□TA Analog□Out OPA335 /c45 50 /c45 25 0 1.00 0.75 0.50 0.25 /c45 0.25 /c45 0.50 /c45 0.75 /c45 1.00 25 50 75 100 125 T emperature□( C)/c176 Trip□Set□Voltage□Error□( C) /c176 210k/c87 TSET OUT HYSTSET VTEMP TMP300 to□TA Open-Drain□Control Voltage□source to□test□trip□point. DAC8560 TMP300 SBOS335A JUNE 2005 REVISED SEPTEMBER 2007 The analog out or V TEMP pin is high-impedance The trip point is easily converted by changing the (210k Ω Avoid loading this pin to prevent degrading digital-to-analog converter (DAC) code. This the analog out value or trip point. Buffer the output of technique can be useful for control loops where a this pin when using it for direct thermal measurement. large thermal mass is being brought up to the set Figure shows buffering of the analog output signal. temperature and the OUT pin is used to control the heating element. The analog output can be monitored in a control algorithm that adjusts the set temperature to prevent overshoot. Trip set voltage error versus temperature is shown in Figure which shows error in C of the comparator input over temperature. An alternative method of setting the trip point by using a DAC is shown in Figure Figure Buffering the Analog Output Signal Figure 10. Trip Set Voltage Error vs Temperature Figure 11. DAC Generates the Voltage-Driving T SET Pin Copyright 2005 2007, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMP300
www.ti.com HYSTERESIS /c45 50 /c45 25 0 /c45 1 /c45 2 /c45 3 /c45 4 /c45 5 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 Maximum Average Minimum /c45 50 /c45 25 0 /c45 1 /c45 2 /c45 3 /c45 4 /c45 5 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 Maximum Average Minimum 210k/c87RSETCBYPASS TSET OUT HYSTSET VTEMP TMP300 to□TA Open-Drain□Control CBYPASS TMP300 SBOS335A JUNE 2005 REVISED SEPTEMBER 2007 Bypass capacitors should be used on the supplies as well as on the R SET and analog out TEMP pins when The hysteresis pin has two settings. Grounding in noisy environments, as shown in Figure These HYST SET results in C of hysteresis. Connecting it to capacitors reduce premature triggering of the V S results in C of hysteresis. Hysteresis error comparator. variation over temperature is shown in Figure and Figure Figure 13. C Hysteresis Error vs Temperature Figure 12. C Hysteresis Error vs Temperature Figure 14. Bypass Capacitors Prevent Early Comparator Toggling Due to Circuit Board Noise Submit Documentation Feedback Copyright 2005 2007, Texas Instruments Incorporated Product Folder Link(s): TMP300
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TMP300AIDBVR PREVIEW SOT-23 DBV 6 3000 TBD Call TI Call TI TMP300AIDCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TMP300AIDCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TMP300AIDCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TMP300AIDCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 8-Jul-2008 Addendum-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 5-Jun-2008 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP300AIDCKR SC70 DCK 6 3000 195.0 200.0 45.0 TMP300AIDCKT SC70 DCK 6 250 220.0 205.0 50.0 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jun-2008 Pack Materials-Page 2
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