TMP300 TI | Alldatasheet
Document overview
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Technical content
TMP300 1.8-V, Resistor-Programmable Temperature Switch and Analog Out Temperature Sensor in SC70
1 Features
- Accuracy: ±1°C (typical at +25°C)
- Programmable trip point
- Programmable hysteresis: 5°C/10°C
- Open-drain outputs
- Low power: 110 μA (maximum)
- Wide voltage range: +1.8 V to +18 V
- Temperature range: –40°C to +125°C
- Analog out: 10mV/°C
- SC70-6 and SOT23-6 packages
2 Applications
- Power-supply systems
- DC-DC modules
- Thermal monitoring
- Electronic protection systems
3 Description
The TMP300 is a low-power, resistor-programmable, digital output temperature switch. The device allows a threshold point to be set by adding an external resistor. Two levels of hysteresis are available. The TMP300 has a V TEMP analog output that can be used as a testing point or in temperature-compensation loops. Available in two micropackages with proven thermal characteristics, low current consumption, and a supply voltage as low as 1.8 V, the TMP300 is designed for power-sensitive systems that require simple and reliable thermal management. Package Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TMP300 SOT-23 (6) 2.90 mm × 1.60 mm SC70 (6) 2.00 mm × 1.25 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 1TSET 6 V+ 2GND 5 V TEMP 3OUT 4 HYST SET Not to scale Pinout RPULL-UP 210k/c87 (1)RSET TSET OUT HYSTSET VTEMP TMP300
3 A/c109
NOTE: Thinfilm resistor with approximately 10% accuracy; however, this accuracy error is trimmed out at the factory. Application Schematic TMP300 SBOS335F – JUNE 2005 – REVISED JANUARY 2023 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
9 Mechanical, Packaging, and Orderable Information..12
4 Revision History
Changes from Revision E (December 2018) to Revision F (January 2023) Page Changes from Revision D (January 2016) to Revision E (December 2018) Page Changes from Revision C (January 2011) to Revision D (January 2016) Page
- Added Device Information table, ESD Ratings table, Feature Description section, Device and Documentation Changes from Revision B (November 2008) to Revision C (January 2011) Page TMP300 SBOS335F – JUNE 2005 – REVISED JANUARY 2023 www.ti.com
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Product Folder Links: TMP300
5 Pin Configuration and Functions
Figure 5-1. DCK and DBV Package 6-Pin SOT-23 and SC70 Top View Table 5-1. Pin Functions PIN I/O DESCRIPTION NAME NO. TSET 1 I Temperature set pin. Connects to a resistor to set the trip point GND 2 — Ground OUT 3 O Trip output HYSTSET 4 I Hysteresis Set. Connect to Ground for 5°C hysteresis or connect to V+ for 10°C hysteresis VTEMP 5 I Analog Temperature output V+ 6 O Supply voltage: 1.8 V to 18 V www.ti.com TMP300 SBOS335F – JUNE 2005 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TMP300
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT V+ Supply voltage +18 V Signal input pins, voltage(2) –0.5 (V+) + 0.5 V Signal input pins, current(2) –10 10 mA Input current into any pin 10 mA ISC Output short-circuit(3) Continuous Open-drain output (V+) + 0.5 V TA Functional temperature –40 +150 °C Tstg Storage temperature –55 +150 °C TJ Junction temperature +150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground.
6.2 ESD Ratings
V(ESD) Electrostatic discharge Human-body model (HBM) ±4000 V Charged-device model (CDM) ±1000 TMP300 SBOS335F – JUNE 2005 – REVISED JANUARY 2023 www.ti.com
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Product Folder Links: TMP300
6.3 Electrical Characteristics
At VS = 3.3 V and TA = –40°C to +125°C, unless otherwise noted. PARAMETER TEST CONDITIONS TMP300 TMP300B UNITMIN(1) TYP(1) MAX(1) MIN TYP MAX TEMPERATURE MEASUREMENT Measurement range VS = 2.35 V to 18 V –40 +125 –40 +125 VS = 1.8 V to 2.35 V –40 100 × (VS – 0.95) TRIP POINT Total accuracy TA = –40°C to +125°C ±2 ±4(3) ±2 ±6 °C RSET equation TC is in °C RSET = 10 (50 + TC)/3 RSET = 10 (50 + TC)/3 kΩ HYSTERESIS SET INPUT LOW threshold 0.4 0.4 V HIGH threshold VS – 0.4 VS – 0.4 V Threshold hysteresis HYSTSET = GND 5 5 HYSTSET = VS 10 10 DIGITAL OUTPUT Logic family CMOS CMOS Open-drain leakage current OUT = VS 10 10 μA VOL Logic levels VS = 1.8 V to 18 V, ISINK = 5 mA 0.3 0.3 V ANALOG OUTPUT Accuracy ±2 ±3 ±2 ±5 °C Temperature sensitivity 10 10 mV/°C Output voltage TA = +25°C 720 750 780 720 750 780 mV VTEMP pin output resistance 210 210 kΩ POWER SUPPLY IQ Quiescent current(2) VS = 1.8 V to 18 V, TA = –40°C to +125°C 110 110 μA TEMPERATURE RANGE TA Specified range VS = 2.35 V to 18 V –40 +125 –40 +125 VS = 1.8 V to 2.35 V –40 100 × (VS – 0.95) Functional range(4) VS = 2.35 V to 18 V –40 +150 –40 +150 VS = 1.8 V to 2.35 V –50 100 × (VS – 0.95) θJA Thermal resistance SC70 250 250 °C/W SOT23-6 180 180 (1) 100% of production is tested at TA = +85°C. Specifications over temperature range are ensured by design. (2) See Figure 6-1 for typical quiescent current. (3) Shaded cells indicate characteristic performance difference. (4) The TMP300 is functional over this range and no indication of performance is implied. www.ti.com TMP300 SBOS335F – JUNE 2005 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TMP300
6.4 Typical Characteristics
At VS = 5 V, unless otherwise noted. /c45 40 /c45 25 0 25 50 75 100 125 T emperature□( C)/c176 I ( A) /c109 Q V =□18VS V =□3.3VS V =□1.8VS Figure 6-1. Quiescent Current Over Temperature and Supply /c45 40 /c45 25 0 2.0 1.5 1.0 0.5 /c45 0.5 /c45 1.0 /c45 1.5 /c45 2.0 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 T +□1%ERROR TERROR /c45 1% T +□0.1%ERROR TERROR /c45 0.1% Figure 6-2. RSET Shift Resulting From RSET Tolerance /c45 40 /c45 25 0 700 600 500 400 300 200 100 25 50 75 100 125 T emperature□(/c176 C) R (k ) /c87 SET Figure 6-3. RSET vs Temperature /c45 40 /c45 25 0 4.0 /c45 4.0 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 2.0 /c45 1.0 1.0 /c45 2.0 /c45 3.0 3.0 Figure 6-4. Typical Trip Error /c45 40 /c45 25 0 3.0 2.0 /c45 3.0 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 1.5 /c45 2.0 1.0 /c45 2.5 2.5 0.5 /c45 0.5 /c45 1.0 /c45 1.5 Figure 6-5. Typical Analog Output Error /c45 40 /c45 25 0 0.10 0.08 /c45 0.02 /c45 0.04 /c45 0.06 /c45 0.08 /c45 0.10 25 50 75 100 125 T emperature□(/c176 C) Error ( C/V) /c176 0.06 0.04 0.02 T is□+85 C□for□V/c176MAX S =□1.8V□to□3.3V 3.3V□to□18V Figure 6-6. Analog PSR Over Temperature TMP300 SBOS335F – JUNE 2005 – REVISED JANUARY 2023 www.ti.com
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/c45 40 /c45 25 0 0.10 0.08 /c45 0.02 /c45 0.04 /c45 0.06 /c45 0.08 /c45 0.10 25 50 75 100 125 T emperature□(/c176 C) Error ( C/V) /c176 0.06 0.04 0.02 3.3V□to□18V T is□+85 C□for□V/c176MAX S =□1.8V□to□3.3V Figure 6-7. Trip PSR Over Temperature www.ti.com TMP300 SBOS335F – JUNE 2005 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TMP300
7 Detailed Description
7.1 Overview
The TMP300 is a thermal sensor designed for overtemperature protection circuits in electronic systems. The TMP300 uses a set resistor to program the trip temperature of the digital output. An additional high-impedance (210 kΩ) analog voltage output provides the temperature reading.
7.2 Feature Description
7.2.1 Calculating RSET
The set resistor (RSET) provides a threshold voltage for the comparator input. The TMP300 trips when the VTEMP pin exceeds the T SET voltage. The value of the set resistor is determined by the analog output function and the 3-μA internal bias current. To set the TMP300 to trip at a preset value, calculate the R SET resistor value according to Equation 1 or Equation 2: R =SET /c45 6 (1) where
- TSET is in °C; or R in□k = /c87SET 10(50□+□T )SET (2) where
- TSET is in °C.
7.2.2 Using VTEMP to Trip the Digital Output
The analog voltage output can also serve as a voltage input that forces a trip of the digital output to simulate a thermal event. This simulation facilitates easy system design and test of thermal safety circuits, as shown in Figure 7-1. RINT 210k/c87RSET TSET OUT HYSTSET VTEMP TMP300 to□TA Open-Drain□Control Voltage□source to□test□trip□point. Figure 7-1. Applying Voltage to Trip Digital Output TMP300 SBOS335F – JUNE 2005 – REVISED JANUARY 2023 www.ti.com
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Product Folder Links: TMP300
7.2.3 Analog Temperature Output
The analog out or VTEMP pin is high-impedance (210 kΩ). Avoid loading this pin to prevent degrading the analog out value or trip point. Buffer the output of this pin when used for direct thermal measurement. Figure 7-2 shows buffering of the analog output signal. 210k/c87 TSET OUT HYSTSET VTEMP TMP300 to□TA Analog□Out OPA335 Figure 7-2. Buffering the Analog Output Signal
7.2.4 Using a DAC to Set the Trip Point
The trip point is easily converted by changing the digital-to-analog converter (DAC) code. This technique can be useful for control loops where a large thermal mass is being brought up to the set temperature and the OUT pin is used to control the heating element. The analog output can be monitored in a control algorithm that adjusts the set temperature to prevent overshoot. Figure 7-3 shows the trip set voltage error versus temperature, which shows error in °C of the comparator input over temperature. Figure 7-4 shows an alternative method of setting the trip point by using a DAC. /c45 50 /c45 25 0 1.00 0.75 0.50 0.25 /c45 0.25 /c45 0.50 /c45 0.75 /c45 1.00 25 50 75 100 125 T emperature□( C)/c176 Trip□Set□Voltage□Error□( C) /c176 Figure 7-3. Trip Set Voltage Error vs Temperature www.ti.com TMP300 SBOS335F – JUNE 2005 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: TMP300
to□TA Open-Drain□Control Voltage□source to□test□trip□point. DAC8560 Figure 7-4. DAC Generates the Voltage-Driving TSET Pin
7.2.5 Hysteresis
The hysteresis pin has two settings. Grounding HYST SET results in 5°C of hysteresis. Connecting HYST SET to VS results in 10°C of hysteresis. Figure 7-5 and Figure 7-6 show the hysteresis error variation over temperature. /c45 50 /c45 25 0 /c45 1 /c45 2 /c45 3 /c45 4 /c45 5 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 Maximum Average Minimum Figure 7-5. 5°C Hysteresis Error vs Temperature /c45 50 /c45 25 0 /c45 1 /c45 2 /c45 3 /c45 4 /c45 5 25 50 75 100 125 T emperature□( C)/c176 Error□( C) /c176 Maximum Average Minimum Figure 7-6. 10°C Hysteresis Error vs Temperature TMP300 SBOS335F – JUNE 2005 – REVISED JANUARY 2023 www.ti.com
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Use bypass capacitors on the supplies as well as on the R SET and analog out (V TEMP) pins when in noisy environments, as shown in Figure 7-7. These capacitors reduce premature triggering of the comparator. 210k/c87RSETCBYPASS TSET OUT HYSTSET VTEMP TMP300 to□TA Open-Drain□Control CBYPASS Figure 7-7. Bypass Capacitors Prevent Early Comparator Toggling Due to Circuit Board Noise www.ti.com TMP300 SBOS335F – JUNE 2005 – REVISED JANUARY 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: TMP300
8 Device and Documentation Support
8.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
8.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
8.3 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
8.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. TMP300 SBOS335F – JUNE 2005 – REVISED JANUARY 2023 www.ti.com
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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TMP300AIDBVR NRND Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 T300 TMP300AIDBVR.A NRND Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 T300 TMP300AIDCKR NRND Production SC70 (DCK) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 BPN TMP300AIDCKR.A NRND Production SC70 (DCK) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 BPN TMP300BIDBVR Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 DUDC TMP300BIDBVR.A Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 DUDC TMP300BIDBVT Obsolete Production SOT-23 (DBV) | 6 - - Call TI Call TI -40 to 125 DUDC TMP300BIDCKR Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 QWL TMP300BIDCKR.A Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 QWL TMP300BIDCKT Obsolete Production SC70 (DCK) | 6 - - Call TI Call TI -40 to 125 QWL (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative Addendum-Page 1
www.ti.com 23-May-2025 and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP300 :
- Automotive : TMP300-Q1 NOTE: Qualified Version Definitions:
- Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 20-Feb-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 20-Feb-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP300AIDBVR SOT-23 DBV 6 3000 200.0 183.0 25.0 TMP300AIDCKR SC70 DCK 6 3000 200.0 183.0 25.0 TMP300BIDBVR SOT-23 DBV 6 3000 200.0 183.0 25.0 TMP300BIDCKR SC70 DCK 6 3000 200.0 183.0 25.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.22
0.08 TYP
0.15 2.4 1.8 4X 0.65 1.1 0.8 0.1
0.0 TYP
6X 0.30 0.15 NOTE 5 0.46
0.26 TYP
0 TYP
1.3 4X 0 -12 4X 4 -15 A 2.15 1.85 B1.4 1.1 SOT - 1.1 max heightDCK0006A SMALL OUTLINE TRANSISTOR 4214835/D 11/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. 4. Falls within JEDEC MO-203 variation AB. INDEX AREA PIN 1 NOTE 5
0.1 C A B
0.1 C SCALE 5.600
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
6X (0.9) 6X (0.4) (2.2) 4X (0.65) (R0.05) TYP 4214835/D 11/2024 SOT - 1.1 max heightDCK0006A SMALL OUTLINE TRANSISTOR NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.2) 4X(0.65) 6X (0.9) 6X (0.4) (R0.05) TYP SOT - 1.1 max heightDCK0006A SMALL OUTLINE TRANSISTOR 4214835/D 11/2024 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:18X SYMM PKG 3 4
www.ti.com PACKAGE OUTLINE C 0.22 0.25 3.0 2.6 2X 0.95 1.45 0.90 0.15
0.00 TYP
6X 0.50 0.25 0.6
0.3 TYP
1.9 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0006A SMALL OUTLINE TRANSISTOR 4214840/G 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side. 4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation. 5. Refernce JEDEC MO-178.
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT 6X (1.1) 6X (0.6) (2.6) 2X (0.95) (R0.05) TYP 4214840/G 08/2024 SOT-23 - 1.45 mm max heightDBV0006A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.6) 2X(0.95) 6X (1.1) 6X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0006A SMALL OUTLINE TRANSISTOR 4214840/G 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4
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