TMP275 BURR-BROWN | Alldatasheet
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Technical content
FEATURES
/C00688 ADDRESSES /C0068DIGITAL OUTPUT: Two-Wire Serial Interface /C0068RESOLUTION: 9- to 12-Bits, User-Selectable /C0068ACCURACY: ±0.5°C (max) from +10°C to +85°C ±0.75°C (max) from +0°C to +100°C /C0068LOW QUIESCENT CURRENT: 50µA, 0.1µA Standby /C0068WIDE SUPPLY RANGE: 2.7V to 5.5V /C0068SMALL MSOP-8 PACKAGE
APPLICATIONS
/C0068POWER-SUPPLY TEMPERATURE MONITORING /C0068COMPUTER PERIPHERAL THERMAL PROTECTION /C0068NOTEBOOK COMPUTERS /C0068CELL PHONES /C0068BATTERY MANAGEMENT /C0068OFFICE MACHINES /C0068THERMOSTAT CONTROLS /C0068ENVIRONMENTAL MONITORING AND HVAC /C0068ELECTROMECHANICAL DEVICE TEMPERATURE −0.50 −0.45 −0.30 −0.20 −0.10 0.00 0.10 0.20 0.30 0.40 0.50 Temperature Error (/C0095C) Population TEMPERATURE ERROR AT 25 /C0095C
DESCRIPTION
The TMP275 is a 0.5°C accurate, two-wire, serial output temperature sensor available in the MSOP-8 package. The TMP275 is capable of reading temperatures with a resolution of 0.0625°C. The TMP275 is SMBus-compatible and allows up to eight devices on one bus. It is ideal for extended temperature measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications. The TMP275 is specified for operation over a temperature range of −40°C to +125°C. Diode Temp. Sensor A/D Converter OSC Control Logic Serial Interface Config. and Temp. Register TMP275 Temperature ALERT SDA 1 5GND SCL 27 A0 TEMPERATURE ERROR vs TEMPERATURE
36 Units Shown
Temperature (/C0095C) Temperature Error (/C0095C) −55 −35 −1 55 2 54 56 58 5 1 0 5 1 2 5 1 3 0 0.500 0.375 0.250 0.125 −0.125 −0.250 −0.375 −0.500 TMP275 SBOS363A − JUNE 2006 − REVISED JUNE 2006 0.5°C Digital Out Temperature Sensor /C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 www.ti.com Copyright 2006, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners.
/C0084/C0077/C0080/C0050/C0055/C0053 SBOS363A − JUNE 2006 − REVISED JUNE 2006 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) ESD Rating: (1)Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2)Input voltage rating applies to all TMP275 input voltages. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING TMP275 MSOP-8 DGK T275 (1)For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. PIN ASSIGNMENTS Top View NOTE: Pin 1 is determined by orienting the package marking as indicated in the diagram. SDA SCL ALERT GND T275 MSOP−8
/C0084/C0077/C0080/C0050/C0055/C0053 SBOS363A − JUNE 2006 − REVISED JUNE 2006 www.ti.com
ELECTRICAL CHARACTERISTICS
At TA = −40°C to +125°C, and V+ = 2.7V to 5.5V, unless otherwise noted. PARAMETER CONDITION TMP275 UNITSPARAMETER CONDITION MIN TYP MAX UNITS TEMPERATURE INPUT Range −40 +125 °C Accuracy (Temperature Error) +10°C to +85°C, V+ = 3.3V ±0.0625 ±0.5 °C Resolution(1) Selectable +0.0625 °C DIGITAL INPUT/OUTPUT Input Capacitance 3 pF Input Logic Levels: VIH 0.7(V+) 6.0 V VIL −0.5 0.3(V+) V Leakage Input Current, IIN 0V ≤ VIN ≤ 6V 1 µA Input Voltage Hysteresis SCL and SDA Pins 500 mV Output Logic Levels: VOL SDA IOL = 3mA 0 0.15 0.4 V VOL ALERT IOL = 4mA 0 0.15 0.4 V Resolution Selectable 9 to 12 Bits Conversion Time 9-Bit 27.5 37.5 ms 10-Bit 55 75 ms 11-Bit 110 150 ms 12-Bit 220 300 ms Timeout Time 25 54 74 ms POWER SUPPLY Operating Range 2.7 5.5 V Quiescent Current IQ Serial Bus Inactive 50 85 µA Serial Bus Active, SCL Freq = 400kHz 100 µA Serial Bus Active, SCL Freq = 3.4MHz 410 µA Shutdown Current ISD Serial Bus Inactive 0.1 3 µA Serial Bus Active, SCL Freq = 400kHz 60 µA Serial Bus Active, SCL Freq = 3.4MHz 380 µA TEMPERATURE RANGE Specified Range −40 +125 °C Operating Range −55 +127 °C Thermal Resistance /C0113JA MSOP-8 250 °C/W (1)Specified for 12-bit resolution.
/C0084/C0077/C0080/C0050/C0055/C0053 SBOS363A − JUNE 2006 − REVISED JUNE 2006 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C and V+ = 5.0V, unless otherwise noted. QUIESCENT CURRENT vs TEMPERATURE Temperature (/C0095C) −55 −35 −15 5 25 45 65 85 105 125 130 IQ (µA) Serial Bus Inactive V +=5 V V+ = 2.7V 300 250 200 150 100 CONVERSION TIME vs TEMPERATURE Temperature (/C0095C) Conversion Time (ms) 12−bit resolution. −55 −35 −15 5 25 45 65 85 105 125 130 V +=5 V V+ = 2.7V 500 450 400 350 300 250 200 150 100 QUIESCENT CURRENT WITH BUS ACTIVITY vs TEMPERATURE Frequency (Hz) 1k 10k 100k 1M 10M IQ (µA) 125/C0095C 25/C0095C −55/C0095C Hs MODE FAST MODE 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 −0.1 SHUTDOWN CURRENT vs TEMPERATURE Temperature (/C0095C) ISD (µA) −55 −35 −15 5 25 45 65 85 105 125 130 TEMPERATURE ERROR vs TEMPERATURE Temperature (/C0095C) Temperature Error (/C0095C) −55 −35 −1 55 2 54 56 58 5 1 0 5 1 2 5 1 3 0 0.500 0.375 0.250 0.125 −0.125 −0.250 −0.375 −0.500 −0.50 −0.45 −0.30 −0.20 −0.10 0.00 0.10 0.20 0.30 0.40 0.50 Temperature Error (/C0095C) Population TEMPERATURE ERROR AT 25 /C0095C
Table 5. Temperature Data Format used with the unused LSBs set to zero. Configuration Register is all bits equal to 0.
1 OS R1 R0 F1 F0 POL TM SD
Table 6. Configuration Register Format Figure 3. Output Transfer Function Diagrams order, see section High and Low Limit Registers. Table 7. Fault Settings of the TMP275
resolution and conversion time. Table 8. Resolution of the TMP275 when continuous temperature monitoring is not required. LOW value for the same number of faults. returning the device to Comparator Mode (TM = 0). Both operational modes are represented in Figure 3. for the Temperature Register.
1 H11 H10 H9 H8 H7 H6 H5 H4
2 H3 H2 H1 H0 0 0 0 0
Table 9. Bytes 1 and 2 of THIGH Register
1 L11 L10 L9 L8 L7 L6 L5 L4
2 L3 L2 L1 L0 0 0 0 0
Table 10. Bytes 1 and 2 of TLOW Register configured for 9-bit resolution. power dissipation associated with detection.
000 R/W D7 D6 D5 D4 D3 D2 D1 D0
Figure 6. Two-Wire Timing Diagram for Read Word Format
0001100 R / W 1001000 St atus
Figure 7. Timing Diagram for SMBus ALERT
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TMP275AIDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP275AIDGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP275AIDGKT ACTIVE MSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMP275AIDGKTG4 ACTIVE MSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 Addendum-Page 1
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