TMP236A4DCKR

TMP236 TI | Alldatasheet

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TA (qC) VOUT (V) -50 -25 0 25 50 75 100 125 1500 0.5 1.5 2.5 D003 TMP235 TMP236 GND VOUT VDD Thermal Diodes Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TMP235, TMP236 SBOS857E –SEPTEMBER 2017–REVISED MAY 2019 TMP23xLow-Power,High-AccuracyAnalogOutputTemperatureSensors

1 Features

1• Cost-effective alternative to thermistors

• Tight accuracy across a wide temperature range: – ±2.5°C (maximum): –40°C to +150°C (TMP235) – ±2.5°C (maximum): –10°C to +125°C (TMP236)
• Available in two accuracy level variants: – A2 level: ±0.5°C (typical) – A4 level: ±1°C (typical)
• Positive slope sensor gain, offset (typical): – 10 mV/°C, 500 mV at 0°C (TMP235) – 19.5 mV/°C, 400 mV at 0°C (TMP236)
• Wide operating supply voltage range: – 2.3 V to 5.5 V (TMP235) – 3.1 V to 5.5 V (TMP236)
• Short-circuit protected output
• Low power: 9 μA (typical)
• Strong output for driving loads up to 1000 pF
• Available package options: – 5-pin SC70 (DCK) surface mount – 3-pin SOT-23 (DBZ) surface mount – Footprint compatible with industry-standard LMT8x-Q1 and LM20 temperature sensors

2 Applications

• Grid infrastructure
• Wireless and telecom infrastructure
• Automotive infotainment
• Factory automation and control
• Test and measurement

3 Description

The TMP23x devices are a family of precision CMOS integrated-circuit linear analog temperature sensors with an output voltage proportional to temperature engineers can use in multiple analog temperature- sensing applications. These temperature sensors are more accurate than similar pin-compatible devices on the market, featuring typical accuracy from 0°C to +70°C of ±0.5°C. The increased accuracy of the series is designed for many analog temperature- sensing applications.The TMP235 device provides a positive slope output of 10 mV/°C over the full –40°C to +150°C temperature range and a supply range from 2.3 V to 5.5 V. The higher gain TMP236 sensor provides a positive slope output of 19.5 mV/°C from –10°C to +125°C and a supply range from 3.1 V to 5.5 V. The 9-µA typical quiescent current and 800-µs typical power-on time enable effective power-cycling architectures to minimize power consumption for battery-powered devices. A class-AB output driver provides a strong 500-µA maximum output to drive capacitive loads up to 1000 pF and is designed to directly interface to analog-to-digital converter sample and hold inputs. With excellent accuracy and a strong linear output driver, the TMP23x analog output temperature sensors are cost-effective alternatives to passive thermistors. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TMP235, TMP236 SC70 (5) 2.00 mm × 1.25 mm SOT-23 (3) 2.92 mm × 1.30 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Functional Block Diagram Output Voltage vs Ambient

TMP235, TMP236 SBOS857E –SEPTEMBER 2017–REVISED MAY 2019 www.ti.com Product Folder Links: TMP235 TMP236 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Table of Contents

11.2 Receiving Notification of Documentation Updates 13

12 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (August 2018) to Revision E Page Changes from Revision C (August 2018) to Revision D Page Changes from Revision B (February 2018) to Revision C Page Changes from Revision A (December 2017) to Revision B Page Changes from Original (September 2017) to Revision A Page

3 GND

TMP235, TMP236 www.ti.com SBOS857E –SEPTEMBER 2017–REVISED MAY 2019 Product Folder Links: TMP235 TMP236 Submit Documentation FeedbackCopyright © 2017–2019, Texas Instruments Incorporated

5 Pin Configuration and Functions

NC- no internal connection Pin Functions NAME PIN TYPE DESCRIPTION SOT-23 SC70 GND 3 2 Ground Power supply ground. NC — 5 — No internal connection. This pin may be left floating or connected to GND. NC — 1 — No internal connection. This pin may be left floating or connected to GND. VOUT 2 3 O Outputs voltage proportional to temperature VDD 1 4 I Positive supply input

TMP235, TMP236 SBOS857E –SEPTEMBER 2017–REVISED MAY 2019 www.ti.com Product Folder Links: TMP235 TMP236 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Theseare stress ratings only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under Recommended OperatingConditions. Exposure to absolute-maximum-rated conditions for extended periods mayaffect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VDD +6 V Output voltage, VOUT –0.3 (VDD + 0.3) Output current –30 +30 mA Latch-up current, each pin –200 +200 Junction temperature (TJ) +150 Storage temperature (Tstg) –65 +150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

V(ESD) Electrostatic discharge Human-body model (HBM) per JESD22-A114 (1) ±4000 V Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Input voltage (TMP235) 2.3 5.5 V Input voltage (TMP236) 3.1 5.5 TA Operating free-air temperature –40 150 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) For information on self-heating and thermal response time see Layout Guidelines section. (3) The junction to ambient thermal resistance (RθJA ) under natural convection is obtained in a simulation on a JEDEC-standard, High-K board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are included in the PCB, per JESD 51-5. (4) Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.

6.4 Thermal Information

THERMAL METRIC (1)(2) TMP235 UNITDCK (SC70) DBZ (SOT-23) PINS PINS RθJA Junction-to-ambient thermal resistance(3)(4) 275 167 °C/W RθJC(top) Junction-to-case (top) thermal resistance 84 90 °C/W RθJB Junction-to-board thermal resistance 56 146 °C/W ΨJT Junction-to-top characterization parameter 1.2 35 °C/W ΨJB Junction-to-board characterization parameter 55 146 °C/W

TMP235, TMP236 www.ti.com SBOS857E –SEPTEMBER 2017–REVISED MAY 2019 Product Folder Links: TMP235 TMP236 Submit Documentation FeedbackCopyright © 2017–2019, Texas Instruments Incorporated (1) Accuracy is defined as the error between the measured and reference output voltages, tabulated in the TMP235 Transfer Tableand TMP236 Transfer Table at the specified conditions of supply voltage and temperature (expressed in °C). Accuracy limits include line regulation within the specified conditions. Accuracy limits do not include load regulation; they assume no DC load.

6.5 Electrical Characteristics

TMP235: VDD = 2.3 V to 5.5 V, GND = Ground, TA = –40°C to +125°C and no load (unless otherwise noted) TMP236: VDD = 3.1 V to 5.5 V, GND = Ground, TA = –10°C to +125°C and no load (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLY IDD Operating current TA = 25℃, VDD = 2.3 V, TMP235 9 µA TA = 25℃, VDD = 3.1 V, TMP236 10 TA = –40℃ to +125℃, TMP235 14.5 TA = –10℃ to +125℃, TMP236 15 TA = 150℃, TMP235 17 Δ℃/ ΔVDD Line regulation –0.1 0.02 0.1 ℃/V SENSOR ACCURACY TACY Temperature accuracy (1) TA = 25°C ±0.5 TA = 0°C to 70°C (SC70 Package) –1 ±0.5 +1 TA = 0°C to +70°C (SOT-23 Package) –1.2 ±0.5 +1.2 Accuracy Level 4 (A4) TA = 25°C ±1 TA = 0°C to 70°C –2 ±1 +2 TA = –40°C to +125°C (TMP235A4) –4 ±1 +4 TA = –10°C to +125°C (TMP236A4) –4 ±1 +4 TA = –40°C to +150°C (TMP235A4) –5 ±1 +5 SENSOR OUTPUT V0℃ Output voltage offset at 0 °C TMP235 500 mV TMP236 400 TC Temperature coefficient (sensor gain) TMP235 10 mV/℃ TMP236 19.5 VONL Output nonlinearity(1) TA = 0 °C to 70 °C, no load ±0.5 ℃ IOUT Output current 500 μA ZOUT Output impedance IOUT = 100 μA, f = 100 Hz 20 Ω IOUT = 100 μA, f = 500 Hz 50 Output load regulation TA = 0°C to 70°C, IOUT = 100 μA, ΔVOUT / ΔIOUT 1 Ω tON Turn on time Time to reach accuracy within ±0.5°C 800 μs CLOAD Typical load capacitance 1000 pF tRES Thermal response to 63% SC70 30°C (Air) to +125°C (Fluid Bath) 1.3 s

6.6 Typical Characteristics

Figure 1. Accuracy vs. TA Temperature (A2 Accuracy Level) Figure 2. Accuracy vs. TA Temperature (A4 Accuracy Level) Figure 3. Output Voltage vs. Ambient Temperature Figure 4. Changes in Accuracy vs. Ambient Temperature Figure 5. Supply Current vs. Temperature Figure 6. Load Regulation vs. Ambient Temperature

7 Detailed Description

7.1 Overview

driver provides a maximum output of 500 µA to drive capacitive loads up to 1000 pF.

7.2 Functional Block Diagram

7.3 Feature Description

columns indicate the small voltage shift at elevated temperatures.

• VOUT is the TMP23x voltage output for a given temperature
• TA is the ambient temperature in °C
• TINFL is the temperature inflection point for a piecewise segment in °C
• TC is the TMP23x temperature coefficient or gain
• VOFFS is the TMP23x voltage offset (1) Therefore, the TA temperature for a given VOUT voltage output within a piecewise voltage range (VRANGE) is calculated in Equation 2. For applications where the accuracy enhancement above 100°C is not required, use the first row of Table 1 and Table 2 for all voltages. TA = (VOUT – VOFFS ) / TC + TINFL (2)

Table 1. TMP235 Piecewise Linear Function Summary

Table 2. TMP236 Piecewise Linear Function Summary Table 3. TMP235 Transfer Table

Table 4. TMP236 Transfer Table

7.4 Device Functional Modes

The singular functional mode of the TMP23x is an analog output directly proportional to temperature.

8 Application and Implementation

validate and test their design implementation to confirm system functionality.

8.1 Application Information

8.2 Typical Application

8.2.1 Connection to an ADC

Figure 13. Suggested Connections to an ADC Input Stage

8.2.1.1 Design Requirements

recommends placing RFILTER and CFILTER as close as possible to the ADC input for optimal performance.

8.2.1.2 Detailed Design Procedure

CLOAD of 1000 pF. The capacitor requirements can vary because the input stages of all ADCs are not identical. Figure 13 shows a general ADC application as an example only.

8.2.1.3 Application Curve

Figure 14. Output Voltage vs. Ambient

9 Power Supply Recommendations

capacitances may be required and are dependent on the noise of the power supply.

10 Layout

10.1 Layout Guidelines

connected as Layout Examples shows.

10.2 Layout Examples

Figure 15. Recommended Layout: SC70 Package

11 Device and Documentation Support

11.1 Related Links

resources, tools and software, and quick access to order now. Table 5. Related Links

11.2 Receiving Notification of Documentation Updates

changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

solve problems with fellow engineers. contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TMP235A2DBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAU | SN | NIPDAUAG Level-1-260C-UNLIM -40 to 150 2352 TMP235A2DBZR.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 150 2352 TMP235A2DBZRG4.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R - Call TI Call TI -40 to 150 TMP235A2DBZT Obsolete Production SOT-23 (DBZ) | 3 - - Call TI Call TI -40 to 150 2352 TMP235A2DCKR Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU | SN | NIPDAUAG Level-1-260C-UNLIM -40 to 150 19L TMP235A2DCKR.A Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 150 19L TMP235A2DCKT Obsolete Production SC70 (DCK) | 5 - - Call TI Call TI -40 to 150 19L TMP235A4DBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAU | SN | NIPDAUAG Level-1-260C-UNLIM -40 to 150 2354 TMP235A4DBZR.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 150 2354 TMP235A4DBZRG4.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 150 2354 TMP235A4DBZT Obsolete Production SOT-23 (DBZ) | 3 - - Call TI Call TI -40 to 150 2354 TMP235A4DCKR Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU | SN | NIPDAUAG Level-1-260C-UNLIM -40 to 150 19M TMP235A4DCKR.A Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 150 19M TMP235A4DCKT Obsolete Production SC70 (DCK) | 5 - - Call TI Call TI -40 to 150 19M TMP236A2DBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAU | SN | NIPDAUAG Level-1-260C-UNLIM -10 to 125 2362 TMP236A2DBZR.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -10 to 125 2362 TMP236A2DBZT Obsolete Production SOT-23 (DBZ) | 3 - - Call TI Call TI -10 to 125 2362 TMP236A2DCKR Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU | SN | NIPDAUAG Level-1-260C-UNLIM -10 to 125 1BS TMP236A2DCKR.A Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -10 to 125 1BS TMP236A2DCKT Obsolete Production SC70 (DCK) | 5 - - Call TI Call TI -10 to 125 1BS TMP236A4DBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAU | SN | NIPDAUAG Level-1-260C-UNLIM -10 to 125 2364 TMP236A4DBZR.A Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -10 to 125 2364 TMP236A4DBZT Obsolete Production SOT-23 (DBZ) | 3 - - Call TI Call TI -10 to 125 2364 Addendum-Page 1

www.ti.com 23-May-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TMP236A4DCKR Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU | SN | NIPDAUAG Level-1-260C-UNLIM -10 to 125 1BT TMP236A4DCKR.A Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -10 to 125 1BT TMP236A4DCKT Obsolete Production SC70 (DCK) | 5 - - Call TI Call TI -10 to 125 1BT (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP235, TMP236 :

• Automotive : TMP235-Q1 , TMP236-Q1 Addendum-Page 2

www.ti.com 23-May-2025 NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 27-Apr-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 27-Apr-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP235A2DBZR SOT-23 DBZ 3 3000 210.0 185.0 35.0 TMP235A2DCKR SC70 DCK 5 3000 210.0 185.0 35.0 TMP235A4DBZR SOT-23 DBZ 3 3000 210.0 185.0 35.0 TMP235A4DCKR SC70 DCK 5 3000 210.0 185.0 35.0 TMP236A2DBZR SOT-23 DBZ 3 3000 210.0 185.0 35.0 TMP236A2DBZR SOT-23 DBZ 3 3000 210.0 185.0 35.0 TMP236A2DCKR SC70 DCK 5 3000 210.0 185.0 35.0 TMP236A4DBZR SOT-23 DBZ 3 3000 210.0 185.0 35.0 TMP236A4DBZR SOT-23 DBZ 3 3000 210.0 185.0 35.0 TMP236A4DCKR SC70 DCK 5 3000 210.0 185.0 35.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 0.20

0.08 TYP

0.25 2.64 2.10

1.12 MAX

0.10

0.01 TYP

3X 0.5 0.3 0.6

0.2 TYP

1.9 0.95 0 -8 TYP 4X 0 -15 4X 4 -15 A 3.04 2.80 B1.4 1.2 (0.95) (0.15) (0.125) SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. 4. Support pin may differ or may not be present. 5. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25mm per side

0.2 C A B

0.1 C SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

0.07 MIN

3X (1.3) 3X (0.6) (2.1) 2X (0.95) (R0.05) TYP 4214838/F 08/2024 SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE SCALE:15X PKG SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS

www.ti.com EXAMPLE STENCIL DESIGN (2.1) 2X(0.95) 3X (1.3) 3X (0.6) (R0.05) TYP SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X SYMM PKG

www.ti.com PACKAGE OUTLINE C 0.22 0.15 2.4 1.8 2X 0.65 1.3

1.1 MAX

0.1

0.0 TYP

5X 0.33 0.15 NOTE 5

0.1 C A B

0.46

0.26 TYP

0 TYP

1.3 4X 0 -12 4X 4 -15 A 2.15 1.85 B1.4 1.1 (0.9) (0.15) (0.1) SOT - 1.1 max heightDCK0005A SMALL OUTLINE TRANSISTOR 4214834/G 11/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-203. 4. Support pin may differ or may not be present. 5. Lead width does not comply with JEDEC. 6. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25mm per side 0.1 C SCALE 5.600

www.ti.com EXAMPLE BOARD LAYOUT 5X (0.95) 5X (0.4) (2.2) (1.3) 2X (0.65) (R0.05) TYP 4214834/G 11/2024 SOT - 1.1 max heightDCK0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 7. Publication IPC-7351 may have alternate designs. 8. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (2.2) (1.3) 2X(0.65) 5X (0.95) 5X (0.4) (R0.05) TYP SOT - 1.1 max heightDCK0005A SMALL OUTLINE TRANSISTOR 4214834/G 11/2024 NOTES: (continued) 9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 10. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:18X SYMM PKG 3 4

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