TMP235AEDBZTQ1

TMP235-Q1_19 TI1 | Alldatasheet

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ADVANCE□INFORMATION TA (qC) VOUT (V) -50 -25 0 25 50 75 100 125 1500 0.5 1.5 2.5 D003 TMP235 TMP236 GND VOUT VDD Thermal Diodes Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. TMP235-Q1, TMP236-Q1 SBOS939 –APRIL 2019 TMP23x-Q1AutomotiveGrade,High-AccuracyAnalogOutputTemperatureSensors

1 Features

1• AEC-Q100 qualified for automotive applications – TMP235-Q1 grade 0: –40°C to +150°C – TMP236-Q1 grade 1: –40°C to +125°C

• Tight accuracy across a wide temperature range: – ±2.5°C (Max): –40°C to +150°C (TMP235-Q1) – ±2.5°C (Max): –10°C to +125°C (TMP236-Q1)
• Positive slope sensor gain, offset (typical): – 10 mV/°C, 500 mV at 0°C (TMP235-Q1) – 19.5 mV/°C, 400 mV at 0°C (TMP236-Q1)
• Wide operating supply voltage range: – 2.3 V to 5.5 V (TMP235-Q1) – 3.1 V to 5.5 V (TMP236-Q1)
• Short-circuit protected output
• Low power: 9 μA (typical)
• Strong output for driving loads up to 1000 pF
• Available package options: – 5-pin SC70 (DCK) surface mount – 3-pin SOT-23 (DBZ) surface mount – Footprint compatible with industry-standard LMT8x-Q1 and LM20 temperature sensors
• Cost-effective alternative to thermistors

2 Applications

• Automotive head unit
• Electric power steering (EPS)
• Shifter system
• Battery management system (BMS)
• Gasoline engine

3 Description

The TMP23x-Q1 devices are a family of automotive grade precision CMOS integrated-circuit linear analog temperature sensors with an output voltage proportional to temperature, serving various automotive applications from powertrain to infotainment. These temperature sensors have a typical accuracy from 0°C to +70°C of ±0.5°C. The TMP235-Q1 device provides a positive slope output of 10 mV/°C over the full –40°C to +150°C temperature range and a supply range from 2.3 V to 5.5 V. The higher gain TMP236-Q1 sensor provides a positive slope output of 19.5 mV/°C from –10°C to +125°C and a supply range from 3.1 V to 5.5 V. The 9-µA typical quiescent current and 800-µs typical power-on time enable effective power-cycling architectures to minimize power consumption for battery-powered devices. A class-AB output driver provides a strong 500-µA maximum output to drive capacitive loads up to 1000 pF and is designed to directly interface to analog-to-digital converter sample and hold inputs. With excellent accuracy and a strong linear output driver, the TMP23x-Q1 analog output temperature sensors are cost-effective alternatives to passive thermistors. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TMP235-Q1, TMP236-Q1 SC70 (5) 2.00 mm × 1.25 mm SOT-23 (3) 2.92 mm × 1.30 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Functional Block Diagram Output Voltage vs Ambient

ADVANCE□INFORMATION TMP235-Q1, TMP236-Q1 SBOS939 –APRIL 2019 www.ti.com Product Folder Links: TMP235-Q1 TMP236-Q1 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Table of Contents

11.2 Receiving Notification of Documentation Updates 13

12 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES April 2019 * Initial release.

ADVANCE□INFORMATION 1NC 2GND 3VOUT 4 V DD 5 NC Not to scale 1VDD 2VOUT

3 GND

TMP235-Q1, TMP236-Q1 www.ti.com SBOS939 –APRIL 2019 Product Folder Links: TMP235-Q1 TMP236-Q1 Submit Documentation FeedbackCopyright © 2019, Texas Instruments Incorporated

5 Pin Configuration and Functions

NC- no internal connection Pin Functions NAME PIN TYPE DESCRIPTION SOT-23 SC70 GND 3 2 Ground Power supply ground. NC — 5 — No internal connection. This pin may be left floating or connected to GND. NC — 1 — No internal connection. This pin may be left floating or connected to GND. VOUT 2 3 O Outputs voltage proportional to temperature VDD 1 4 I Positive supply input

ADVANCE□INFORMATION TMP235-Q1, TMP236-Q1 SBOS939 –APRIL 2019 www.ti.com Product Folder Links: TMP235-Q1 TMP236-Q1 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Theseare stress ratings only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under Recommended OperatingConditions. Exposure to absolute-maximum-rated conditions for extended periods mayaffect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VDD +6 V Output voltage, VOUT –0.3 (VDD + 0.3) Output current –30 +30 mA Latch-up current, each pin –200 +200 Junction temperature (TJ) +150 Storage temperature (Tstg) –65 +150 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification

6.2 ESD Ratings

V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±2000 V V(ESD) Electrostatic discharge Charged device model (CDM), per AEC Q100-011: All Pins ±500 V V(ESD) Electrostatic discharge Charged device model (CDM), per AEC Q100-011: Corner Pins ±750 V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Input voltage (TMP235-Q1) 2.3 5.5 V Input voltage (TMP236-Q1) 3.1 5.5 TA Operating free-air temperature –50 150 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) For information on self-heating and thermal response time see Layout Guidelines section. (3) The junction to ambient thermal resistance (RθJA ) under natural convection is obtained in a simulation on a JEDEC-standard, High-K board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are included in the PCB, per JESD 51-5. (4) Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.

6.4 Thermal Information

THERMAL METRIC (1)(2) TMP23X-Q1 UNITDCK (SC70) DBZ (SOT-23) PINS PINS RθJA Junction-to-ambient thermal resistance(3)(4) 275 167 °C/W RθJC(top) Junction-to-case (top) thermal resistance 84 90 °C/W RθJB Junction-to-board thermal resistance 56 146 °C/W ΨJT Junction-to-top characterization parameter 1.2 35 °C/W ΨJB Junction-to-board characterization parameter 55 146 °C/W

ADVANCE□INFORMATION TMP235-Q1, TMP236-Q1 www.ti.com SBOS939 –APRIL 2019 Product Folder Links: TMP235-Q1 TMP236-Q1 Submit Documentation FeedbackCopyright © 2019, Texas Instruments Incorporated (1) Accuracy is defined as the error between the measured and reference output voltages, tabulated in the TMP235-Q1 Transfer Table and TMP236-Q1 Transfer Table at the specified conditions of supply voltage and temperature (expressed in °C). Accuracy limits include line regulation within the specified conditions. Accuracy limits do not include load regulation; they assume no DC load.

6.5 Electrical Characteristics

TMP235-Q1: VDD = 2.3 V to 5.5 V, GND = Ground, TA = –40°C to +125°C and no load (unless otherwise noted) TMP236-Q1: VDD = 3.1 V to 5.5 V, GND = Ground, TA = –10°C to +125°C and no load (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLY IDD Operating current TA = 25℃, VDD = 2.3 V, TMP235-Q1 9 µA TA = 25℃, VDD = 3.1 V, TMP236-Q1 10 TA = –40℃ to +125℃, TMP235-Q1 14.5 TA = –10℃ to +125℃, TMP236-Q1 15 TA = 150℃, TMP235-Q1 17 Δ℃/ ΔVDD Line regulation –0.1 0.02 0.1 ℃/V SENSOR ACCURACY TACY Temperature accuracy(1) TA = 25°C ±0.5 ℃ TACY Temperature accuracy(1) TA = 0°C to 70°C (SC70 Package) –1.5 ±0.5 +1.2 ℃ TACY Temperature accuracy(1) TA = 0°C to 70°C (SOT-23 Package) –1.5 ±0.5 +1.2 ℃ TACY Temperature accuracy(1) TA = –40°C to 125°C (TMP235-Q1) –2.5 ±0.5 +2.5 ℃ TACY Temperature accuracy(1) TA = –40°C to 150°C (TMP235-Q1) –2.5 ±0.5 +2.5 ℃ TACY Temperature accuracy(1) TA = –10°C to 125°C (TMP236-Q1) –2.5 ±0.5 +2.5 ℃ SENSOR OUTPUT V0℃ Output voltage offset at 0 °C TMP235-Q1 500 mV TMP236-Q1 400 TC Temperature coefficient (sensor gain) TMP235-Q1 10 mV/℃ TMP236-Q1 19.5 VONL Output nonlinearity(1) TA = 0 °C to 70 °C, no load ±0.5 ℃ IOUT Output current 500 μA ZOUT Output impedance IOUT = 100 μA, f = 100 Hz 20 Ω IOUT = 100 μA, f = 500 Hz 50 Output load regulation TA = 0°C to 70°C, IOUT = 100 μA, ΔVOUT / ΔIOUT 1 Ω tON Turn on time Time to reach accuracy within ±0.5°C 800 μs CLOAD Typical load capacitance 1000 pF tRES Thermal response to 63% SC70 30°C (Air) to +125°C (Fluid Bath) 1.3 s

6.6 Typical Characteristics

Figure 1. Accuracy vs. TA Temperature Figure 2. Output Voltage vs. Ambient Temperature Figure 3. Changes in Accuracy vs. Ambient Temperature Figure 4. Supply Current vs. Temperature Figure 5. Load Regulation vs. Ambient Temperature Figure 6. Line Regulation (Δ°C / ΔVDD) vs. Ambient

7 Detailed Description

7.1 Overview

output of 500 µA to drive capacitive loads up to 1000 pF.

7.2 Functional Block Diagram

7.3 Feature Description

linear columns indicate the small voltage shift at elevated temperatures.

• VOUT is the TMP23x-Q1 voltage output for a given temperature
• TA is the ambient temperature in °C
• TINFL is the temperature inflection point for a piecewise segment in °C
• TC is the TMP23x-Q1 temperature coefficient or gain
• VOFFS is the TMP23x-Q1 voltage offset (1) Therefore, the TA temperature for a given VOUT voltage output within a piecewise voltage range (VRANGE) is calculated in Equation 2. For applications where the accuracy enhancement above 100°C is not required, use the first row of Table 1 and Table 2 for all voltages. TA = (VOUT – VOFFS ) / TC + TINFL (2)

Table 1. TMP235-Q1 Piecewise Linear Function Summary

Table 2. TMP236-Q1 Piecewise Linear Function Summary Table 3. TMP235-Q1 Transfer Table

Table 4. TMP236-Q1 Transfer Table

7.4 Device Functional Modes

The singular functional mode of the TMP23x-Q1 is an analog output directly proportional to temperature.

8 Application and Implementation

validate and test their design implementation to confirm system functionality.

8.1 Application Information

8.2 Typical Application

8.2.1 Connection to an ADC

Figure 12. Suggested Connections to an ADC Input Stage

8.2.1.1 Design Requirements

instantaneous charge from the output of the analog source temperature sensor, such as the TMP23x-Q1. recommends placing RFILTER and CFILTER as close as possible to the ADC input for optimal performance.

8.2.1.2 Detailed Design Procedure

CLOAD of 1000 pF. The capacitor requirements can vary because the input stages of all ADCs are not identical. Figure 12 shows a general ADC application as an example only.

8.2.1.3 Application Curve

Figure 13. Output Voltage vs. Ambient

9 Power Supply Recommendations

required and are dependent on the noise of the power supply.

10 Layout

10.1 Layout Guidelines

connected as Layout Examples shows.

10.2 Layout Examples

Figure 14. Recommended Layout: SC70 Package

11 Device and Documentation Support

11.1 Related Links

resources, tools and software, and quick access to order now. Table 5. Related Links

11.2 Receiving Notification of Documentation Updates

changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

solve problems with fellow engineers. contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 8-May-2019 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PTMP235QDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125 PTMP235QDBZTQ1 PREVIEW SOT-23 DBZ 3 250 TBD Call TI Call TI -40 to 125 PTMP235QDCKRQ1 ACTIVE SC70 DCK 5 3000 TBD Call TI Call TI PTMP236QDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125 TMP235AEDBZRQ1 PREVIEW SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 150 235E TMP235AEDBZTQ1 PREVIEW SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 150 235E TMP235AEDCKRQ1 PREVIEW SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 150 1CF TMP235AEDCKTQ1 PREVIEW SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 150 1CF TMP235AQDBZRQ1 PREVIEW SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 235Q TMP235AQDBZTQ1 PREVIEW SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 235Q TMP235AQDCKRQ1 PREVIEW SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 1CG TMP235AQDCKTQ1 PREVIEW SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 1CG TMP236AQDBZRQ1 PREVIEW SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 236Q TMP236AQDBZTQ1 PREVIEW SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 236Q (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

www.ti.com 8-May-2019 Addendum-Page 2 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP235-Q1, TMP236-Q1 :

• Catalog: TMP235 , TMP236 NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product

www.ti.com PACKAGE OUTLINE C TYP0.20 0.08 0.25 2.64 2.10

1.12 MAX

TYP0.10 0.01 3X 0.5 0.3 TYP0.6 0.2 1.9 0.95 TYP -80 A 3.04 2.80 B1.4 1.2 (0.95) SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length.

0.2 C A B

0.1 C SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

0.07 MIN

3X (1.3) 3X (0.6) (2.1) 2X (0.95) (R0.05) TYP 4214838/C 04/2017 SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE SCALE:15X PKG SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS

www.ti.com EXAMPLE STENCIL DESIGN (2.1) 2X(0.95) 3X (1.3) 3X (0.6) (R0.05) TYP SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X SYMM PKG

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