TMP103 TI | Alldatasheet
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Tools & Software Support & Community Reference Design An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TMP103 SBOS545D –FEBRUARY 2011–REVISED DECEMBER 2018 TMP103Low-Power,DigitalTemperatureSensorWithTwo-WireInterfaceinWCSP
1 Features
1• Multiple Device Access (MDA): – Global Read/Write Operations
- I2C™ and SMBus™ -Compatible Interface
- Resolution: 8 Bits
- Accuracy: ±1°C Typical (–10°C to 100°C)
- Low Quiescent Current: – 3-μA Active IQ at 0.25 Hz – 1-μA Shutdown
- Supply Range: 1.4 V to 3.6 V
- Digital Output
- 4-Ball WCSP (DSBGA) Package
2 Applications
- Handsets
- Notebooks
- SSDs
- Servers
- Telecom
- Set Top Boxes
- Low Power Environmental
- Sensors
3 Description
The TMP103 is a digital output temperature sensor in a four-ball wafer chip-scale package (WCSP). The TMP103 is capable of reading temperatures to a resolution of 1°C. The TMP103 features a two-wire interface that is compatible with both I2C and SMBus interfaces. In addition, the interface supports multiple device access (MDA) commands that allow the master to communicate with multiple devices on the bus simultaneously, eliminating the need to send individual commands to each TMP103 on the bus. Up to eight TMP103s can be tied together in parallel and easily read by the host. The TMP103 is especially suitable for space-constrained, power- sensitive applications with multiple temperature measurement zones that must be monitored. The TMP103 is specified for operation over a temperature range of –40°C to 125°C. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TMP103 DSBGA (4) 0.76 mm × 0.76 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Diagram
SBOS545D –FEBRUARY 2011–REVISED DECEMBER 2018 www.ti.com Product Folder Links: TMP103 Submit Documentation Feedback Copyright © 2011–2018, Texas Instruments Incorporated Table of Contents
11.1 Receiving Notification of Documentation Updates 22
12 Mechanical, Packaging, and Orderable
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (October 2018) to Revision D Page
- Changed input voltage maximum value in the Absolute Maximum Ratings table from: (V+) + 0.5) and ≤ 4 to (V+) + Changes from Revision A (March 2011) to Revision B Page
- Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Changes from Original (February 2011) to Revision A Page
www.ti.com SBOS545D –FEBRUARY 2011–REVISED DECEMBER 2018 Product Folder Links: TMP103 Submit Documentation FeedbackCopyright © 2011–2018, Texas Instruments Incorporated
5 Pin Configuration and Functions
NO. NAME A1 V+ I Supply voltage A2 GND I Ground B1 SDA I/O Input/output data pin B2 SCL I Input clock pin (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT V+ Supply voltage 4 V Voltage at SCL and SDA –0.3 ((V+) + 0.3) and ≤ 4 V Operating temperature –55 150 °C TJ Junction temperature 150 °C Tstg Storage temperature –60 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 VCharged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000 Machine model (MM) ±200
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V+ Supply voltage 1.4 3.6 V TA Operating free-air temperature –40 125 °C
SBOS545D –FEBRUARY 2011–REVISED DECEMBER 2018 www.ti.com Product Folder Links: TMP103 Submit Documentation Feedback Copyright © 2011–2018, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.4 Thermal Information
THERMAL METRIC(1) TMP103 UNITYFF (DSBGA)
4 BALLS
RθJA Junction-to-ambient thermal resistance 160 °C/W RθJC(top) Junction-to-case (top) thermal resistance 75 °C/W RθJB Junction-to-board thermal resistance 76 °C/W ψJT Junction-to-top characterization parameter 3 °C/W ψJB Junction-to-board characterization parameter 74 °C/W
6.5 Electrical Characteristics
at TA = 25°C and V+ = 1.4 V to 3.6 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEMPERATURE INPUT Range –40 125 °C Accuracy (temperature error) –10°C to 100°C, V+ = 1.8 V –2 0 2 vs supply –0.5 ±0.2 0.5 °C/V Resolution 1 °C DIGITAL INPUT/OUTPUT VIH Input logic levels 0.7 (V+) V+ V VIL –0.5 0.3 (V+) IIN Input current 0 < VIN < (V+) + 0.3 V 1 μA VOL SDA Output logic levels V+ > 2 V, IOL = 2 mA 0 0.4 V V+ < 2 V, IOL = 2 mA 0 0.2 (V+) Resolution 8 Bit Conversion time 26 35 ms Conversion modes CR1 = 0, CR0 = 0 (default) 0.25 Conv/s CR1 = 0, CR0 = 1 1 CR1 = 1, CR0 = 0 4 CR1 = 1, CR0 = 1 8 Timeout time 30 40 ms POWER SUPPLY Operating supply range 1.4 3.6 V IQ Quiescent current Serial bus inactive, CR1 = 0, CR0 = 0 (default), V+ = 1.8 V 1.5 3 μASerial bus active, SCL frequency = 400 kHz 15 Serial bus active, SCL frequency = 3.4 MHz 85 ISD Shutdown current Serial bus inactive, V+ = 1.8 V 0.5 1 μASerial bus active, SCL frequency = 400 kHz 10 Serial bus active, SCL frequency = 3.4 MHz 80 TEMPERATURE Specified range –40 125 °C Operating range –55 150 °C
www.ti.com SBOS545D –FEBRUARY 2011–REVISED DECEMBER 2018 Product Folder Links: TMP103 Submit Documentation FeedbackCopyright © 2011–2018, Texas Instruments Incorporated (1) Values based on a statistical analysis of a one-time sample of devices. Minimum and maximum values are not guaranteed and not production tested.
6.6 Timing Requirements
See (1) FAST MODE HIGH-SPEED MODE UNIT MIN MAX MIN MAX t(BUF) Bus free time between STOP and START condition 600 160 ns t(HDSTA) Hold time after repeated START condition. After this period, the first clock is generated. 100 100 ns t(SUSTA) Repeated START condition setup time 100 100 ns t(SUSTO) STOP condition setup Time 100 100 ns t(HDDAT) Data hold time 20 400 10 125 ns t(SUDAT) Data setup time 100 10 ns t(LOW) SCL clock low period, VS > 1.7 V 1300 160 ns t(LOW) SCL clock low period, VS < 1.7 V 1300 200 ns t(HIGH) SCL clock high period 600 60 ns tF Clock/data fall time 300 ns tR Clock/data rise time 300 160 ns tR Clock/data rise time for SCLK ≤ 100 kHz 1000 ns The TMP103 is two-wire and SMBus compatible. Figure 1 to Figure 5 describe the various operations on the TMP103. Parameters for Figure 1 are defined in Timing Requirements. Bus definitions are: Bus Idle: Both SDA and SCL lines remain high. Start Data Transfer: A change in the state of the SDA line, from high to low, while the SCL line is high, defines a START condition. Each data transfer is initiated with a START condition. Stop Data Transfer: A change in the state of the SDA line from low to high while the SCL line is high defines a STOP condition. Each data transfer is terminated with a repeated START or STOP condition. Data Transfer: The number of data bytes transferred between a START and a STOP condition is not limited and is determined by the master device. Acknowledge: Each receiving device, when addressed, is obliged to generate an Acknowledge bit. A device that acknowledges must pull down the SDA line during the Acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the Acknowledge clock pulse. Setup and hold times must be taken into account. On a master receive, the termination of the data transfer can be signaled by the master generating a Not-Acknowledge (1) on the last byte transmitted by the slave.
(1) All TMP103 devices on the bus acknowledge the byte. (2) The master must issue an acknowledge for each byte read to read all of the TMP103 devices on the bus. (3) Three TMP103 devices used in this case; up to eight devices can be used (see Table 2). Figure 5. Two-Wire Timing Diagram MDA Read Word Format Using Figure 16 (Typical Application)
1.4 V Supply
3.6 V Supply
6.7 Typical Characteristics
At TA = 25°C and V+ = 1.8 V, unless otherwise noted. Figure 6. Quiescent Current vs Temperature Figure 7. Shutdown Current vs Temperature Figure 8. Conversion Time vs Temperature Figure 9. Quiescent Current vs Bus Frequency Figure 10. Temperature Error vs Temperature
7 Detailed Description
7.1 Overview
is specified over a temperature range of –40ºC to 125ºC. individual address and commands to each device. NOTE: SCL and SDA pins require pullup resistors. Figure 11. Typical Connections as the package. The lower thermal resistance of metal causes the bumps to provide the primary thermal path. the package from ambient air temperature.
7.2 Functional Block Diagram
www.ti.com SBOS545D –FEBRUARY 2011–REVISED DECEMBER 2018 Product Folder Links: TMP103 Submit Documentation FeedbackCopyright © 2011–2018, Texas Instruments Incorporated
7.3 Feature Description
The TMP103 is a 1°C resolution digital output temperature sensor offered in a four-ball wafer chip-scale package (WCSP). The TMP103 features a two-wire interface that is compatible with both I2C and SMBus interfaces. The serial interface supports multiple device access (MDA) commands that allow the master to communicate with multiple devices on the bus simultaneously, eliminating the need to send individual commands to each TMP103 device on the bus. Up to eight TMP103 devices can be tied together in parallel and easily read by the host. The TMP103 is an ideal choice for space-constrained and power-sensitive applications with multiple temperature measurement zones to be monitored.
7.4 Device Functional Modes
7.4.1 Shutdown Mode
Shutdown mode saves maximum power by shutting down all device circuitry other than the serial interface, reducing current consumption to typically less than 0.5 μA. For details on how to enter shutdown mode, see Shutdown Mode (M1 = 0, M0 = 0) in Programming.
7.4.2 One-Shot Mode
The TMP103 features a One-Shot Temperature Measurement mode. When the device is in Shutdown mode, the device can be instructed to complete a one-time temperature measurement before returning to the shutdown state. This feature is useful for reducing power consumption in the TMP103 when continuous temperature monitoring is not required. As a result of the short conversion time, the TMP103 can achieve a higher conversion rate. A single conversion typically takes 26 ms and a read can take place in less than 20 μs. When using One-Shot mode, 30 or more conversions per second are possible. For details on how to enter One-Shot mode, see One-Shot (M1 = 0, M0 = 1) in Programming.
7.4.3 Continuous Conversion Mode
In Continuous Conversion mode, the TMP103 performs temperature conversion at a rate determined by the conversion rate bits (CR1 and CR0) set in the configuration register. Because the actual temperature conversion takes only 26 mS, the TMP103 powers down in between conversions and waits for the appropriate delay. For details on how to enter One-Shot mode, see Continuous Conversion Mode (M1 = 1) and Conversion Rate in Programming.
7.5 Programming
7.5.1 Temperature Watchdog Function
The TMP103 contains a watchdog function that monitors device temperature and compares the result to the values stored in the temperature limit registers (THIGH and TLOW) to determine if the device temperature is within these set limits. If the temperature of the TMP103 becomes greater than the value in the THIGH register, then the flag-high bit (FH) in the configuration register is set to 1. If the temperature falls below the value in the TLOW register, then the flag-low bit (FL) is set to 1. If both flag bits remain 0, then the temperature is within the temperature window set by the temperature limit registers, as shown in Figure 12.
Figure 12. Temperature Flag Functional Diagram values for these bits are FH = 0, FL = 0, and LC = 0.
7.5.2 Conversion Rate
conversion rates of 8 Hz, 4 Hz, 1 Hz, or 0.25 Hz (default). The TMP103 has a typical conversion time of 26 ms. waits for the appropriate delay set by CR1 and CR0. Table 1 lists the settings for CR1 and CR0. Table 1. Conversion Rate Settings
27°C, V+ = 1.8 V). The quiescent current during delay is 1 μA (typical at 27°C, V+ = 1.8 V). (1) Delay is set by CR1 and CR0. Figure 13. Conversion Start
7.5.3 Shutdown Mode (M1 = 0, M0 = 0)
the Configuration Register) = 00. The device shuts down when the current conversion is completed.
7.5.4 One-Shot (M1 = 0, M0 = 1)
continuous temperature monitoring is not required. conversions per second are possible.
7.5.5 Continuous Conversion Mode (M1 = 1)
7.5.6 Bus Overview
generates the START and STOP conditions. slave being addressed responds to the master by generating an Acknowledge and pulling SDA low.
7.5.7 Serial Interface
7.5.8 Serial Bus Address
To communicate with the TMP103, the master must first address slave devices through a slave address byte. addresses can be used as either a location or a temperature zone designator. Table 2. Device Slave Addresses
7.5.9 Writing and Reading Operation
bit low. Every write operation to the TMP103 requires a value for the Pointer Register (see Figure 2). generate a START condition and send the slave address byte with the R/W bit high to initiate the read command. until it is changed by the next write operation, or the TMP103 is reset.
7.5.10 Slave Mode Operations
7.5.10.1 Slave Receiver Mode
terminate data transfer by generating a START or STOP condition.
7.5.10.2 Slave Transmitter Mode
by generating a Not-Acknowledge on reception of the data byte, or generating a START or STOP condition.
7.5.11 General Call
General Address acquire command.
7.5.12 High-Speed (Hs) Mode
the STOP condition, the TMP103 switches the input and output filters back to the default fast-mode operation.
7.5.13 Timeout Function
communication speed of at least 1 kHz for SCL operating frequency.
7.5.14 Multiple Device Access
TMP103 must be used in the system; see Table 2.
7.5.14.1 Multiple Device Access Write
Table 4. Following the pointer, all of the TMP103 devices on the bus acknowledge and wait for the next byte of one transaction; see Figure 4.
7.5.14.2 Multiple Device Access Read
TMP103s stop sending subsequent data for any remaining devices. Up to eight TMP103 devices can be on the same bus and respond to MDA commands; see Table 2.
four acknowledges to complete the MDA read transaction.
7.5.15 NOISE
in Figure 14 should be less than 5 kΩ and CF should be greater than 10 nF. Figure 14. Noise Reduction
7.6 Register Maps
7.6.1 Pointer Register
Figure 15. Internal Register Structure
Table 3. Pointer Register Byte Table 4. Pointer Addresses
7.6.2 Temperature Register
data format for temperature is summarized in Table 6. One LSB equals 1°C. Table 5. Temperature Register Temperature Register reads 0°C until the first conversion is complete. (1) The resolution for the ADC is 1°C/count, where count is equal to the digital output of the ADC. Table 6. 8-Bit Temperature Data Format(1) code, left-justified format. Denote a positive number with MSB = 0. and adding 1. Denote a negative number with MSB = 1.
7.6.3 Configuration Register
value of the Configuration Register is shown in Table 7. All registers are updated at the end of the data byte. Table 7. Configuration and Power-Up and Reset Format
7.6.4 Temperature Limit Registers
Table 8. THIGH Register Table 9. TLOW Register
8 Application and Implementation
validate and test their design implementation to confirm system functionality.
8.1 Application Information
temperature range of –40ºC to 125ºC. individual address and commands to each device.
8.2 Typical Application
Figure 16. Typical Application Diagram
8.2.1 Design Requirements
bypass capacitor on the supply.
8.2.2 Detailed Design Procedure
TMP103 device can further reduce any noise that the TMP103 device might propagate to other components.
8.2.3 Application Curve
Figure 17. Temperature vs Time
9 Power Supply Recommendations
high-impedance power supplies may require additional decoupling capacitors to reject power-supply noise.
10 Layout
10.1 Layout Guidelines
impedance power supplies. Pull up the SDA and SCL pins through 5-kΩ pullup resistors.
10.2 Layout Example
Figure 18. Recommended Layout Example
SBOS545D –FEBRUARY 2011–REVISED DECEMBER 2018 www.ti.com Product Folder Links: TMP103 Submit Documentation Feedback Copyright © 2011–2018, Texas Instruments Incorporated
11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments. SMBus is a trademark of Intel. I2C is a trademark of NXP Semiconductors. All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TMP103AYFFR Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TA TMP103AYFFR.B Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TA TMP103AYFFT Obsolete Production DSBGA (YFF) | 4 - - Call TI Call TI -40 to 125 TA TMP103BYFFR Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TB TMP103BYFFR.B Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TB TMP103BYFFT Obsolete Production DSBGA (YFF) | 4 - - Call TI Call TI -40 to 125 TB TMP103CYFFR Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TC TMP103CYFFR.B Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TC TMP103CYFFT Obsolete Production DSBGA (YFF) | 4 - - Call TI Call TI -40 to 125 TC TMP103DYFFR Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TD TMP103DYFFR.B Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TD TMP103DYFFT Obsolete Production DSBGA (YFF) | 4 - - Call TI Call TI -40 to 125 TD TMP103EYFFR Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TE TMP103EYFFR.B Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TE TMP103EYFFT Obsolete Production DSBGA (YFF) | 4 - - Call TI Call TI -40 to 125 TE TMP103FYFFR Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TF TMP103FYFFR.B Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TF TMP103FYFFT Obsolete Production DSBGA (YFF) | 4 - - Call TI Call TI -40 to 125 TF TMP103GYFFR Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TG TMP103GYFFR.B Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TG TMP103GYFFT Obsolete Production DSBGA (YFF) | 4 - - Call TI Call TI -40 to 125 TG TMP103HYFFR Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TH TMP103HYFFR.B Active Production DSBGA (YFF) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TH TMP103HYFFT Obsolete Production DSBGA (YFF) | 4 - - Call TI Call TI -40 to 125 TH (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. Addendum-Page 1
www.ti.com 23-May-2025 (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 20-Feb-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 20-Feb-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP103AYFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TMP103BYFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TMP103CYFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TMP103DYFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TMP103EYFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TMP103FYFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TMP103GYFFR DSBGA YFF 4 3000 182.0 182.0 20.0 TMP103HYFFR DSBGA YFF 4 3000 182.0 182.0 20.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C
0.625 MAX
0.30 0.12 0.4 TYP
0.4 TYP
4X 0.3 0.2 B E A D 4219460/A 02/2014 DSBGA - 0.625 mm max heightYFF0004 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. NanoFree TM package configuration. NanoFree Is a trademark of Texas Instruments. BALL A1 CORNER SEATING PLANE BALL TYP B A 1 2
0.015 C A B
SCALE 13.000 D: Max = E: Max = 0.79 mm, Min = 0.79 mm, Min = 0.73 mm 0.73 mm
www.ti.com EXAMPLE BOARD LAYOUT 4X 0.23 0.02 (0.4) TYP (0.4) TYP ( ) METAL 0.23 0.05 MAX SOLDER MASK OPENING METAL UNDER MASK SOLDER MASK OPENING 0.23
0.05 MIN
DSBGA - 0.625 mm max heightYFF0004 DIE SIZE BALL GRID ARRAY NOTES: (continued) 4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017). SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM LAND PATTERN EXAMPLE SCALE:50X 1 2 A B NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN (0.4) TYP (0.4) TYP 4X ( 0.25) (R ) TYP 0.05 METAL TYP 4219460/A 02/2014 DSBGA - 0.625 mm max heightYFF0004 DIE SIZE BALL GRID ARRAY NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. SYMM SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:50X 1 2 A B
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