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T emp. Sensor /c68/c83 A/D Converter OSC Control Logic Serial Interface Config. and□T emp. Register T emperature SCL 1 4ALERT SDA GND 2 5 V+ ADD0 SCL GND ALERT ADD0 0.01 µF Two-Wire Host Controller TMP102 1.4 V to 3.6 V SDA Pullup Resistors Supply Bypass Capacitor Supply Voltage 5 k Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community Reference Design TMP102 SBOS397F –AUGUST 2007–REVISED DECEMBER 2015 TMP102Low-PowerDigitalTemperatureSensorWithSMBusandTwo-WireSerial InterfaceinSOT563
1 Features 3 Description
The TMP102 device is a digital temperature sensor 1• SOT563 Package (1.6-mm × 1.6-mm) is a 68% ideal for NTC/PTC thermistor replacement where highSmaller Footprint than SOT-23 accuracy is required. The device offers an accuracy• Accuracy Without Calibration: of ±0.5°C without requiring calibration or external – 2.0°C (max) from –25°C to 85°C component signal conditioning. Device temperature sensors are highly linear and do not require complex– 3.0°C (max) from –40°C to 125°C calculations or lookup tables to derive the• Low Quiescent Current: temperature. The on-chip 12-bit ADC offers – 10-μA Active (max) resolutions down to 0.0625°C. – 1-μA Shutdown (max) The 1.6-mm × 1.6-mm SOT563 package is 68%
- Supply Range: 1.4 to 3.6 V smaller footprint than an SOT-23 package. The TMP102 device features SMBus™ , two-wire and I2C• Resolution: 12 Bits interface compatibility, and allows up to four devices• Digital Output: SMBus™ , Two-Wire, and I2C on one bus. The device also features an SMBus alertInterface Compatibility function. The device is specified to operate over
- NIST Traceable supply voltages from 1.4 to 3.6 V with the maximum quiescent current of 10 µA over the full operating range.2 Applications The TMP102 device is ideal for extended temperature• Portable and Battery-Powered Applications measurement in a variety of communication,• Power-supply Temperature Monitoring computer, consumer, environmental, industrial, and• Computer Peripheral Thermal Protection instrumentation applications. The device is specified
- Notebook Computers for operation over a temperature range of –40°C to 125°C.• Battery Management
- Office Machines The TMP102 production units are 100% tested against sensors that are NIST-traceable and are• Thermostat Controls verified with equipment that are NIST-traceable• Electromechanical Device Temperatures through ISO/IEC 17025 accredited calibrations.
- General Temperature Measurements: Device Information(1)– Industrial Controls PART NUMBER PACKAGE BODY SIZE (NOM)– Test Equipment TMP102 SOT563 (6) 1.60 mm × 1.20 mm– Medical Instrumentations (1) For all available packages, see the orderable addendum at the end of the data sheet.Simplified Schematic Block Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
SBOS397F –AUGUST 2007–REVISED DECEMBER 2015 www.ti.com Table of Contents
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (April 2015) to Revision F Page Changes from Revision D (December 2014) to Revision E Page Changes from Revision C (October 2012) to Revision D Page
- Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Changes from Revision B (October 2008) to Revision C Page
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Product Folder Links: TMP102
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5 Pin Configuration and Functions
NO. NAME 1 SCL I Serial clock. Open-drain output; requires a pullup resistor.
2 GND — Ground
3 ALERT O Overtemperature alert. Open-drain output; requires a pullup resistor. 4 ADD0 I Address select. Connect to GND or V+ 5 V+ I Supply voltage, 1.4 V to 3.6 V 6 SDA I/O Serial data. Open-drain output; requires a pullup resistor.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply Voltage 4 V Input Voltage(2) –0.5 3.6 V Output voltage 3.6 V Operating temperature –55 150 °C Junction temperature 150 °C Storage temperature, Tstg –60 150 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) Input voltage rating applies to all TMP102 input voltages.
6.2 Handling Ratings
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 V Machine model (MM) ±200 (1) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Copyright © 2007–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TMP102
SBOS397F –AUGUST 2007–REVISED DECEMBER 2015 www.ti.com
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT V+ Supply voltage 1.4 3.3 3.6 V TA Operating free-air temperature –40 125 °C
6.4 Thermal Information
THERMAL METRIC(1) DRL (SOT563) UNIT
6 PINS
RθJA Junction-to-ambient thermal resistance 200 °C/W RθJC(top) Junction-to-case (top) thermal resistance 73.7 °C/W RθJB Junction-to-board thermal resistance 34.4 °C/W ψJT Junction-to-top characterization parameter 3.1 °C/W ψJB Junction-to-board characterization parameter 34.2 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
At TA = 25°C and VS = 1.4 to 3.6 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEMPERATURE INPUT Range –40 125 °C Accuracy (temperature error) °C –40°C to 125°C ±1 ±3 vs supply 0.2 0.5 °C/V Resolution 0.0625 °C DIGITAL INPUT/OUTPUT Input capacitance 3 pF VIH Input logic high 0.7 × (V+) 3.6 V VIL Input logic low –0.5 0.3 × (V+) V IIN Input current 0 < VIN < 3.6 V 1 μA V+ > 2 V, IOL = 3 mA 0 0.4 SDA VOL Output logic V V+ > 2 V, IOL = 3 mA 0 0.4 ALERT Resolution 12 Bit Conversion time 26 35 ms CR1 = 0, CR0 = 0 0.25 CR1 = 0, CR0 = 1 1 Conversion modes Conv/s CR1 = 1, CR0 = 0 (default) 4 CR1 = 1, CR0 = 1 8 Timeout time 30 40 ms
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Product Folder Links: TMP102
www.ti.com SBOS397F –AUGUST 2007–REVISED DECEMBER 2015 Electrical Characteristics (continued) At TA = 25°C and VS = 1.4 to 3.6 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLY Operating supply range +1.4 +3.6 V Serial bus inactive, CR1 = 1, CR0 = 7 100 (default) Serial bus active, SCL frequency =IQ Average quiescent current 15 μA400 kHz Serial bus active, SCL frequency = 853.4 MHz Serial bus inactive 0.5 1 Serial bus active, SCL frequency = 10ISD Shutdown current 400 kHz μA Serial bus active, SCL frequency = 803.4 MHz TEMPERATURE Specified range –40 125 °C Operating range –55 150 °C
6.6 Timing Requirements
See the Timing Diagrams section for additional information. FAST MODE HIGH-SPEED MODE UNIT MIN TYP MAX MIN TYP MAX ƒ(SCL) SCL operating frequency V+ 0.001 0.4 0.001 2.85 MHz Bus-free time between STOP andt(BUF) 600 160 nsSTART condition Hold time after repeated START condition.t(HDSTA) 600 160 nsAfter this period, the first clock is generated. See Figure 7 t(SUSTA) repeated start condition setup time 600 160 ns t(SUSTO) STOP condition setup time 600 160 ns t(HDDAT) Data hold time 100 900 25 105 ns t(SUDAT) Data setup time 100 25 ns t(LOW) SCL-clock low period V+ , see Figure 7 1300 210 ns t(HIGH) SCL-clock high period See Figure 7 600 60 ns tFD Data fall time See Figure 7 300 80 ns See Figure 7 300 ns tRD Data rise time SCLK ≤ 100 kHz, 1000 nssee Figure 7 tFC Clock fall time See Figure 7 300 40 ns tRC Clock rise time See Figure 7 300 40 ns Copyright © 2007–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TMP102
1.4 V Supply
3.6 V Supply
6.7 Typical Characteristics
At TA = 25°C and V+ = 3.3 V, unless otherwise noted. Figure 1. Average Quiescent Current vs Temperature Figure 2. Shutdown Current vs Temperature Figure 3. Conversion Time vs Temperature Figure 4. Quiescent Current vs Bus Frequency Figure 6. Temperature Error at 25°CFigure 5. Temperature Error vs Temperature
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7 Detailed Description
7.1 Overview
diagram of the TMP102 device. micro-package, and is pin-to-pin compatible. Table 1. Advantages of TMP112 versus TMP102
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Digital Temperature Output
between the two temperature register data formats. The unused bits in the temperature register always read 0.
Table 2. 12-Bit Temperature Data Format(1) (1) The resolution for the Temp ADC in Internal Temperature mode is 0.0625°C/count. temperature or the temperature for a given digital data format.
- Divide the temperature by the resolution
- Convert the result to binary code with a 12-bit, left-justified format, and MSB = 0 to denote a positive sign.
- Convert the 12-bit, left-justified binary temperature result, with the MSB = 0 to denote a positive sign, to a
- Multiply the decimal number by the resolution to obtain the positive temperature.
- Divide the absolute value of the temperature by the resolution, and convert the result to binary code with a
12-bit, left-justified format.
- Generate the twos complement of the result by complementing the binary number and adding one. Denote a
negative number with MSB = 1.
- Generate the twos compliment of the 12-bit, left-justified binary number of the temperature result (with MSB
represents the binary number of the absolute value of the temperature.
- Convert to decimal number and multiply by the resolution to get the absolute temperature, then multiply by
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Table 3. 13-Bit Temperature Data Format
7.3.2 Serial Interface
modes. All data bytes are transmitted MSB first.
7.3.3 Bus Overview
access, and generates the START and STOP conditions. slave being addressed responds to the master by generating an acknowledge and by pulling SDA pin low. high is interpreted as a START signal or STOP signal. low to high, when the SCL pin is high.
7.3.4 Serial Bus Address
describes the pin logic levels used to properly connect up to four devices.
Table 4. Address Pin and Slave Addresses
1001000 Ground
1001010 SDA
1001011 SCL
7.3.5 Writing and Reading Operation
R/W bit low. Every write operation to the TMP102 device requires a value for the pointer register (see Figure 8). changed by the next write operation. Register bytes are sent with the most significant byte first, followed by the least significant byte.
7.3.6 Slave Mode Operations
7.3.6.1 Slave Receiver Mode
can terminate data transfer by generating a START or STOP condition..
7.3.6.2 Slave Transmitter Mode
7.3.7 SMBus Alert Function
this bit is inverted if POL = 1. See Figure 10 for details of this sequence.
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7.3.8 General Call
support the general address acquire command.
7.3.9 High-Speed (HS) Mode
master code has been issued, the master transmits a two-wire slave address to initiate a data transfer operation. condition, the TMP102 device switches the input and output filters back to fast-mode operation..
7.3.10 Timeout Function
1 kHz for SCL operating frequency is necessary..
7.3.11 Timing Diagrams
Bus Idle Both SDA and SCL lines remain high. is determined by the master device. The TMP102 device can also be used for single byte updates. START condition. Each data transfer is initiated with a START condition. STOP condition. Each data transfer is terminated with a repeated START or STOP condition. Figure 7. Two-Wire Timing Diagram
NOTE: (1)□The□value□of□A0□and□A1□are□determined□by□the□ADD0□pin. (2)□Master□should□leave□SDA□high□to□terminate□a□single-byte□read□operation. (3)□Master□should□leave□SDA□high□to□terminate□a□two-byte□read□operation. Figure 8. Two-Wire Timing Diagram for Write Word Format Figure 9. Two-Wire Timing Diagram for Read Word Format
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Figure 10. Timing Diagram for SMBus Alert
7.4 Device Functional Modes
7.4.1 Continuos-Conversion Mode
Table 5. Conversion Rate Settings +27°C). The quiescent current during delay is 2.2 μA (typical at +27°C). (1) Delay is set by CR1 and CR0. Figure 11. Conversion Start
7.4.2 Extended Mode (EM)
(EM = 1). In Normal mode, the Temperature Register and high- and low-limit registers use a 12-bit data format. Normal mode is used to make the TMP102 device compatible with the TMP75 device. Register, and high- and low-limit registers for 13-bit data format.
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7.4.3 Shutdown Mode (SD)
The Shutdown-mode bit saves maximum power by shutting down all device circuitry other than the serial interface, reducing current consumption to typically less than 0.5 μA. Shutdown mode enables when the SD bit is 1; the device shuts down when current conversion is completed. When SD is equal to 0, the device maintains a continuous conversion state.
7.4.4 One-Shot/Conversion Ready (OS)
The TMP102 device features a one-shot temperature measurement mode. When the device is in Shutdown Mode, writing a 1 to the OS bit starts a single temperature conversion. During the conversion, the OS bit reads '0'. The device returns to the shutdown state at the completion of the single conversion. After the conversion, the OS bit reads 1. This feature reduces power consumption in the TMP102 device when continuous temperature monitoring is not required. As a result of the short conversion time, the TMP102 device achieves a higher conversion rate. A single conversion typically takes 26 ms and a read can take place in less than 20 μs. When using One-Shot Mode, 30 or more conversions per second are possible.
7.4.5 Thermostat Mode (TM)
The thermostat-mode bit indicates to the device whether to operate in comparator mode (TM = 0) or Interrupt mode (TM = 1).
7.4.5.1 Comparator Mode (TM = 0)
In Comparator mode (TM = 0), the Alert pin is activated when the temperature equals or exceeds the value in the T(HIGH) register and remains active until the temperature falls below the value in the T(LOW)register. For more information on the comparator mode, see the High- and Low-Limit Registers section.
7.4.5.2 Interrupt Mode (TM = 1)
In Interrupt mode (TM = 1), the Alert pin is activated when the temperature exceeds T(HIGH) or goes below T(LOW) registers. The Alert pin is cleared when the host controller reads the temperature register. For more information on the interrupt mode, see the High- and Low-Limit Registers section.
7.5 Programming
7.5.1 Pointer Register
Figure 12 illustrates the internal register structure of the TMP102 device. The 8-bit Pointer Register of the device is used to address a given data register. The Pointer Register uses the two least-significant bytes (LSBs) (see Table 15 and Table 16) to identify which of the data registers must respond to a read or write command. Table 6 identifies the bits of the Pointer Register byte. During a write command, P2 through P7 must always be '0'. Table 7 describes the pointer address of the registers available in the TMP102 device. The power-up reset value of P1 and P0 is 00. By default, the TMP102 device reads the temperature on power up.
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Product Folder Links: TMP102
Figure 12. Internal Register Structure Table 6. Pointer Register Byte Table 7. Pointer Addresses
7.5.2 Temperature Register
in Table 8 and Table 9. Note that byte 1 is the most significant byte, followed by byte 2, the least significant byte. have to be read if that information is not needed. Table 8. Byte 1 of Temperature Register(1) (1) Extended mode 13-bit configuration shown in parenthesis.
Table 9. Byte 2 of Temperature Register(1) (1) Extended mode 13-bit configuration shown in parenthesis.
7.5.3 Configuration Register
device data sheets, SBOS288 and SBOS363, respectively). All registers are updated byte by byte. Table 10. Byte 1 of Configuration and Power-Up or Reset Format Table 11. Byte 2 of Configuration and Power-Up or Reset Format
7.5.3.1 Shutdown Mode (SD)
7.5.3.2 Thermostat Mode (TM)
7.5.3.3 Polarity (POL)
state of the ALERT pin is inverted. The operation of the ALERT pin in various modes is illustrated in Figure 13.
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Figure 13. Output Transfer Function Diagrams
7.5.3.4 Fault Queue (F1/F0)
TLOW register format and byte order, see the High- and Low-Limit Registers section. Table 12. TMP102 Fault Settings
7.5.3.5 Converter Resolution (R1/R0)
start-up to 11 which sets the temperature register to a 12 bit-resolution.
7.5.3.6 One-Shot (OS)
7.5.3.7 EM Bit
format. For more information on the extended mode, see the Extended Mode (EM) section.
7.5.3.8 Alert (AL Bit)
The AL bit is a read-only function. Reading the AL bit provides information about the comparator mode status.
7.5.3.9 Conversion Rate (CR)
Hz, or 8 Hz. The default rate is 4 Hz. For more information on the conversion rate bits, see Table 5.
7.5.4 High- and Low-Limit Registers
TM bit in the configuration register. remains active until the temperature falls below the indicated TLOW value for the same number of faults. THIGH and TLOW registers. Note that the most significant byte is sent first, followed by the least significant byte. and TLOW is the same as for the Temperature Register. Table 13. Byte 1 Temperature Register HIGH (1) Extended mode 13-bit configuration shown in parenthesis. Table 14. Byte 2 Temperature Register HIGH Table 15. Byte 1 Temperature Register LOW (1) Extended mode 13-bit configuration shown in parenthesis.
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Table 16. Byte 2 Temperature Register LOW
8 Application and Implementation
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TMP102 device is used to measure the PCB temperature of the board location where the device is mounted.
8.2 Typical Application
Figure 14. Typical Connections
8.2.1 Design Requirements
either the GND, V+, SDA, or SCL pin.
8.2.2 Detailed Design Procedure
adhesive is helpful in achieving accurate surface temperature measurement.
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to other components. R(F) in Figure 15 must be less than 5 kΩ and C(F) must be greater than 10 nF. Figure 15. Noise Reduction Techniques
8.2.3 Application Curve
the TMP102 device was soldered to a two-layer PCB that measured 0.375 inch × 0.437 inch. Figure 16. Temperature Step Response
9 Power Supply Recommendations
operation at 3.3-V supply but can measure temperature accurately in the full supply range.
10 Layout
10.1 Layout Guidelines
10.2 Layout Example
Figure 17. TMP102 Layout Example
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
- TMP175, TMP75 Data Sheet, SBOS288
- TMP275 Data Sheet, SBOS363
- Capacitive Touch Operated Automotive LED Dome Light with Haptics Feedback Design Guide
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments. SMBus is a trademark of Intel, Inc. All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2007–2015, Texas Instruments Incorporated Submit Documentation Feedback 23 Product Folder Links: TMP102
www.ti.com 4-May-2017 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples HPA00330AIDRLR ACTIVE SOT-5X3 DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CBZ HPA00330AIDRLRG4 ACTIVE SOT-5X3 DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CBZ TMP102AIDRLR ACTIVE SOT-5X3 DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CBZ TMP102AIDRLRG4 ACTIVE SOT-5X3 DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CBZ TMP102AIDRLT ACTIVE SOT-5X3 DRL 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CBZ TMP102AIDRLTG4 ACTIVE SOT-5X3 DRL 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 CBZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
www.ti.com 4-May-2017 Addendum-Page 2 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP102 :
- Automotive: TMP102-Q1 NOTE: Qualified Version Definitions:
- Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 4-May-2017 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP102AIDRLR SOT-5X3 DRL 6 4000 202.0 201.0 28.0 PACKAGE MATERIALS INFORMATION www.ti.com 4-May-2017 Pack Materials-Page 2
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