TMP101NA250

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 19

Technical content

FEATURES

/C0068DIGITAL OUTPUT: I2C Serial 2-Wire /C0068RESOLUTION: 9- to 12-Bits, User-Selectable /C0068ACCURACY: ±2.0°C from −25°C to +85°C (max) ±3.0°C from −55°C to +125°C (max) /C0068LOW QUIESCENT CURRENT: 45µA, 0.1µA Standby /C0068WIDE SUPPLY RANGE: 2.7V to 5.5V /C0068TINY SOT23-6 PACKAGE

APPLICATIONS

/C0068POWER-SUPPLY TEMPERATURE MONITORING /C0068COMPUTER PERIPHERAL THERMAL PROTECTION /C0068NOTEBOOK COMPUTERS /C0068CELL PHONES /C0068BATTERY MANAGEMENT /C0068OFFICE MACHINES /C0068THERMOSTAT CONTROLS /C0068ENVIRONMENTAL MONITORING AND HVAC /C0068ELECTROMECHANICAL DEVICE TEMPERATURE

DESCRIPTION

The TMP100 and TMP101 are two-wire, serial output temperature sensors available in SOT23-6 packages. Requiring no external components, the TMP100 and TMP101 are capable of reading temperatures with a resolution of 0.0625°C. The TMP100 and TMP101 feature SMBus and I interface compatibility, with the TMP100 allowing up to eight devices on one bus. The TMP101 offers SMBus alert function with up to three devices per bus. The TMP100 and TMP101 are ideal for extended temperature measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications. The TMP100 and TMP101 are specified for operation over a temperature range of −55°C to +125°C. Diode Te m p . Sensor A/D Converter OSC Control Logic Serial Interface Config and T emp Register TMP100 T emperature GND SCL 1 4ADD1 SDA ADD0 Diode Tem p. Sensor A/D Converter OSC Control Logic Serial Interface Config and T emp Register TMP101 T emperature GND SCL ALERT SDA ADD0 TMP100 TMP101 SBOS231G − JANUARY 2002 − REVISED NOVEMBER 2007 Digital Temperature Sensor with I2C /C0116 Interface /C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 www.ti.com Copyright  2002−2007, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. I2C is a trademark of NXP Semiconductors. All other trademarks are the property of their respective owners.

/C0084/C0077/C0080/C0049/C0048/C0048 /C0084/C0077/C0080/C0049/C0048/C0049 SBOS231G − JANUARY 2002 − REVISED NOVEMBER 2007 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (1)Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2)Input voltage rating applies to all TMP100 and TMP101 input voltages. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING TMP100 SOT23-6 DBV T100TMP100 SOT23-6 DBV T100 TMP101 SOT23-6 DBV T101TMP101 SOT23-6 DBV T101 (1)For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. PIN CONFIGURATION Top View SOT23 Top View SOT23 SCL GND ADD1 SDA ADD0 T100 TMP100 SCL GND ALERT SDA ADD0 T101 TMP101

/C0084/C0077/C0080/C0049/C0048/C0048 /C0084/C0077/C0080/C0049/C0048/C0049 SBOS231G − JANUARY 2002 − REVISED NOVEMBER 2007 www.ti.com

ELECTRICAL CHARACTERISTICS

At TA = −55°C to +125°C and V+ = 2.7V to 5.5V, unless otherwise noted. PARAMETER TEST CONDITIONS TMP100, TMP101 UNITPARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEMPERATURE INPUT Range −55 +125 °C Accuracy (temperature error) −25°C to +85°C ±0.5 ±2.0 °C Resolution Selectable ±0.0625 °C DIGITAL INPUT/OUTPUT Input Logic Levels: VIH 0.7(V+) 6.0 V VIL −0.5 0.3(V+) V Input Current, IIN 0V ≤ VIN ≤ 6V 1 µA Output Logic Levels: VOL SDA IOL = 3mA 0 0.15 0.4 V VOL ALERT IOL = 4mA 0 0.15 0.4 V Resolution Selectable 9 to 12 Bits Conversion Time 9-Bit 40 75 ms 10-Bit 80 150 ms 11-Bit 160 300 ms 12-Bit 320 600 ms Conversion Rate 9-Bit 25 s/s 10-Bit 12 s/s 11-Bit 6 s/s 12-Bit 3 s/s POWER SUPPLY Operating Range 2.7 5.5 V Quiescent Current IQ Serial Bus Inactive 45 75 µA Serial Bus Active, SCL Frequency = 400kHz 70 µA Serial Bus Active, SCL Frequency = 3.4MHz 150 µA Shutdown Current ISD Serial Bus Inactive 0.1 1 µA Serial Bus Active, SCL Frequency = 400kHz 20 µA Serial Bus Active, SCL Frequency = 3.4MHz 100 µA TEMPERATURE RANGE Specified Range −55 +125 °C Storage Range −60 +150 °C Thermal Resistance /C0113JA SOT23-6 Surface-Mount 200 °C/W

/C0084/C0077/C0080/C0049/C0048/C0048 /C0084/C0077/C0080/C0049/C0048/C0049 SBOS231G − JANUARY 2002 − REVISED NOVEMBER 2007 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C and V+ = 5.0V, unless otherwise noted. QUIESCENT CURRENT vs TEMPERATURE Temperature (/C0095C) −60 −40 −2 00 2 04 06 08 0 1 0 0 1 2 0 1 4 0 IQ (µA) Serial Bus Inactive V +=5 V V +=2 . 7 V 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 −0.1 SHUTDOWN CURRENT vs TEMPERATURE Temperature (/C0095C) −60 −40 −20 0 20 40 60 80 100 120 140 ISD (µA) 400 350 300 250 CONVERSION TIME vs TEMPERATURE Temperature (/C0095C) −60 −40 −2 00 2 04 06 08 0 1 0 0 1 2 0 1 4 0 Conversion Time (ms) V+ = 5V V+ = 2.7V NOTE: 12−bit resolution. 2.0 1.5 1.0 0.5 0.0 −0.5 −1.0 −1.5 −2.0 TEMPERATURE ACCURACY vs TEMPERATURE Temperature (/C0095C) −60 −40 −20 0 20 40 60 80 100 120 140 Temperature Error (/C0095C) 3 Typical Units NOTE: 12−bit resolution. 180 160 140 120 100 QUIESCENT CURRENT WITH BUS ACTIVITY vs TEMPERATURE SCL Frequency (Hz) 10k 100k 1M 10M IQ (µA) 125/C0095C FAST MODE Hs MODE −55/C0095C −55/C0095C 125/C0095C 25/C0095C 25/C0095C

Register will read 0°C until the first conversion is complete. Table 3. Byte 1 of Temperature Register Table 4. Byte 2 of Temperature Register Table 5. Temperature Data Format used with the unused LSBs set to zero. OS/ALERT bit will read as 1 after power-up/reset. Table 6. Configuration Register Format

1 OS/ALERT R1 R0 F1 F0 POL TM SD

maintain continuous conversion. Figure 4. Output Transfer Function Diagrams programmed to trigger an alert condition in the device.

Table 7. Fault Settings of the TMP100 and Table 8. Resolution of the TMP100 and TMP101 temperature is not required. invert the polarity of data returned from the OS/ALERT bit. number of consecutive faults when it will again read as 1. device to Comparator Mode (TM = 0). Both operational modes are represented in Figure 4. Table 9. Bytes 1 and 2 of THIGH Register

1 H11 H10 H9 H8 H7 H6 H5 H4

2 H3 H2 H1 H0 0 0 0 0

Table 10. Bytes 1 and 2 of TLOW Register

1 L11 L10 L9 L8 L7 L6 L5 L4

2 L3 L2 L1 L0 0 0 0 0

configured for 9-bit resolution.

to eight devices. Float indicates the pin is left unconnected. Table 11. Address Pins and Slave Addresses for

0 Float 1001001

1 Float 1001101

minimize power dissipation associated with detection. Table 12. Address Pins and Slave Addresses for the START and STOP conditions. indicating whether a read or write operation is intended. read command. See Figure 7 for details of this sequence. generating a START or STOP condition.

/C0084/C0077/C0080/C0049/C0048/C0048 /C0084/C0077/C0080/C0049/C0048/C0049 SBOS231G − JANUARY 2002 − REVISED NOVEMBER 2007 www.ti.com acknowledges reception of the data byte. The next byte transmitted by the slave is the least significant byte. The master acknowledges reception of the data byte. The master may terminate data transfer by generating a Not-Acknowledge on reception of any data byte, or generating a START or STOP condition. SMBus ALERT FUNCTION The TMP101 supports the SMBus Alert function. When the TMP101 is operating in Interrupt Mode (TM = 1), the ALERT pin of the TMP101 may be connected as an SMBus Alert signal. When a master senses that an ALERT condition is present on the ALERT line, the master sends an SMBus Alert command (00011001) on the bus. If the ALERT pin of the TMP101 is active, the TMP101 will acknowledge the SMBus Alert command and respond by returning its slave address on the SDA line. The eighth bit (LSB) of the slave address byte will indicate if the temperature exceeding T HIGH or falling below TLOW caused the ALERT condition. For POL = 0, this bit will be LOW if the temperature is greater than or equal to THIGH . This bit will be HIGH if the temperature is less than TLOW . The polarity of this bit will be inverted if POL = 1. Refer to Figure 8 for details of this sequence. If multiple devices on the bus respond to the SMBus Alert command, arbitration during the slave address portion of the SMBus alert command will determine which device will clear its ALERT status. If the TMP101 wins the arbitration, its ALERT pin will become inactive at the completion of the SMBus Alert command. If the TMP101 loses the arbitration, its ALERT pin will remain active. The TMP100 will also respond to the SMBus ALERT command if its TM bit is set to 1. Since it does not have an ALERT pin, the master needs to periodically poll the device by issuing an SMBus Alert command. If the TMP100 has generated an ALERT, it will acknowledge the SMBus Alert command and return its slave address in the next byte. GENERAL CALL The TMP100 and TMP101 respond to the I2C General Call address (0000000) if the eighth bit is 0. The device will acknowledge the General Call address and respond to commands in the second byte. If the second byte is 00000100, the TMP100 and TMP101 will latch the status of their address pins, but will not reset. If the second byte is 00000110, the TMP100 and TMP101 will latch the status of their address pins and reset their internal registers. POR (POWER-ON RESET) The TMP100 and TMP101 both have on-chip power-on reset circuits that reset the device to default settings when the device is powered on. This circuit activates when the power supply is less than 0.3V for more than 100ms. If the TMP100 and TMP101 are powered down by removing supply voltage from the device, but the supply voltage is not assured to be less than 0.3V, it is recommended to issue a General Call reset command on the I 2C interface bus to ensure that the TMP100 and TMP101 are completely reset. HIGH-SPEED MODE In order for the I2C bus to operate at frequencies above 400kHz, the master device must issue an Hs-mode master code (00001XXX) as the first byte after a START condition to switch the bus to high-speed operation. The TMP100 and TMP101 will not acknowledge this byte as required by the I 2C specification, but will switch their input filters on SDA and SCL and their output filters on SDA to operate in Hs-mode, allowing transfers at up to 3.4MHz. After the Hs-mode master code has been issued, the master will transmit an I 2C slave address to initiate a data transfer operation. The bus will continue to operate in Hs-mode until a STOP condition occurs on the bus. Upon receiving the STOP condition, the TMP100 and TMP101 will switch their input and output filters back to fast-mode operation.

Bus Idle: Both SDA and SCL lines remain HIGH. repeated START or STOP condition. acknowledges the transfer of data. Table 13. Timing Diagram Definitions Hold time after repeated START condition.

www.ti.com 11-Apr-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples SN0312100DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -55 to 125 T100 TMP100NA/250 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR T100 TMP100NA/250G4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR T100 TMP100NA/3K ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -55 to 125 T100 TMP100NA/3KG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -55 to 125 T100 TMP101NA/250 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -55 to 125 T101 TMP101NA/250G4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -55 to 125 T101 TMP101NA/3K ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -55 to 125 T101 TMP101NA/3KG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -55 to 125 T101 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

www.ti.com 11-Apr-2013 Addendum-Page 2 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP100, TMP101 :

• Automotive: TMP101-Q1
• Enhanced Product: TMP100-EP NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP100NA/250 SOT-23 DBV 6 250 180.0 180.0 18.0 TMP100NA/3K SOT-23 DBV 6 3000 180.0 180.0 18.0 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 Pack Materials-Page 2

Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46, latestissue,and todiscontinueany productorserviceperJESD48, latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. TIassumes no liabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.To minimizetherisksassociatedwithBuyers’productsand applications,Buyersshouldprovide adequatedesignand operatingsafeguards. TIdoes notwarrantorrepresentthatany license,eitherexpressorimplied,isgrantedunderany patentright,copyright,mask work right,or otherintellectualpropertyrightrelatingtoany combination,machine,orprocessinwhichTIcomponents orservicesareused.Information publishedby TIregardingthird-partyproductsorservicesdoes notconstitutea licensetouse such productsorservicesora warrantyor endorsementthereof.Use ofsuch informationmay requirea licensefroma thirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,ora licensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooks ordatasheetsispermissibleonlyifreproductioniswithoutalteration and isaccompaniedby allassociatedwarranties,conditions,limitations,and notices.TIisnotresponsibleorliableforsuch altered documentation.Informationofthirdpartiesmay be subjecttoadditionalrestrictions. ResaleofTIcomponents orserviceswithstatementsdifferentfromorbeyond theparametersstatedby TIforthatcomponent orservice voidsallexpressand any impliedwarrantiesfortheassociatedTIcomponent orserviceand isan unfairand deceptivebusinesspractice. TIisnotresponsibleorliableforany such statements. Buyeracknowledgesand agreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryand safety-relatedrequirements concerningitsproducts,and any use ofTIcomponents initsapplications,notwithstandingany applications-relatedinformationorsupport thatmay be providedby TI.Buyerrepresentsand agreesthatithas allthenecessaryexpertisetocreateand implementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresand theirconsequences,lessenthelikelihoodoffailuresthatmightcause harm and takeappropriateremedialactions.BuyerwillfullyindemnifyTIand itsrepresentativesagainstany damages arisingoutoftheuse ofany TIcomponents insafety-criticalapplications. Insome cases,TIcomponents may be promotedspecificallytofacilitatesafety-relatedapplications.Withsuch components,TI’s goalisto helpenablecustomerstodesignand createtheirown end-productsolutionsthatmeet applicablefunctionalsafetystandardsand requirements.Nonetheless,such components aresubjecttotheseterms. No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents as meetingISO/TS16949 requirements,mainlyforautomotiveuse.Inany case ofuse of non-designatedproducts,TIwillnotbe responsibleforany failuretomeet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotiveand Transportationwww.ti.com/automotive Amplifiers amplifier.ti.com Communicationsand Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP ® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energyand Lighting www.ti.com/energy Clocksand Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space,Avionicsand Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Videoand Imaging www.ti.com/video RFID www.ti-rfid.com OMAP ApplicationsProcessors www.ti.com/omap TIE2E Community e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2013,Texas InstrumentsIncorporated