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Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS ˙ Product information in this catalog is as of October 2013. All of the contents speciﬁed herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be- fore practical application or usage of the Products. Please note that TAIYO YUDEN CO., LTD. shall not be responsible for any defects in products or equipment incor- porating such products, which are caused under the conditions other than those speciﬁed in this catalog or indi- vidual speciﬁcation. ˙ Please contact TAIYO YUDEN CO., LTD. for further details of product speciﬁcations as the individual speciﬁcation is available. ˙ Please conduct validation and veriﬁcation of products in actual condition of mounting and operating environment before commercial shipment of the equipment. ˙ All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the ﬁeld such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct inﬂuence to harm or injure a human body, please contact TAIYO YUDEN CO., LTD. for more detail in ad- vance. Do not incorporate the products into any equipment in ﬁelds such as aerospace, aviation, nuclear control, subma- rine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufﬁcient reliabil- ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. ˙ The contents of this catalog are applicable to the products which are purchased from our sales ofﬁces or distribu- tors (so called ʠTAIYO YUDENʟs ofﬁcial sales channelʡ). It is only applicable to the products purchased from any of TAIYO YUDENʟ s ofﬁcial sales channel. ˙ Please note that TAIYO YUDEN CO., LTD. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. TAIYO YUDEN CO., LTD. grants no license for such rights. ˙ Caution for export Certain items in this catalog may require speciﬁc procedures for export according to ʠForeign Exchange and For- eign Trade Control Lawʡ of Japan, ʠU.S. Export Administration Regulationsʡ, and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . CERAMIC CAPACITORS c_mlcc_e-E02R02 MULTILAYER CERAMIC CAPACITORS ■PARTS NUMBER J M K 3 1 6 △ B J 1 0 6 M L － T △ △＝Blank space ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ⑫ ①Rated voltage Code Rated voltage［VDC］ P 2.5 A 4 J 6.3 L 10 E 16 T 25 G 35 U 50 H 100 Q 250 S 630 ②Series name Code Series name M Multilayer ceramic capacitor V Multilayer ceramic capacitor for high frequency W LW reverse type multilayer capacitor ③End termination Code End termination K Plated S Cu Internal Electrodes ④Dimension（L×W） Type Dimensions 042 0.4 × 0.2 01005 063 0.6 × 0.3 0201 105 1.0 × 0.5 0402 0.52× 1.0 ※ 0204 107 1.6 × 0.8 0603 0.8 × 1.6 ※ 0306 212 2.0 × 1.25 0805 1.25× 2.0 ※ 0508 316 3.2 × 1.6 1206 325 3.2 × 2.5 1210 432 4.5 × 3.2 1812 Note : ※LW reverse type（□WK） only ⑤Dimension tolerance △ ALL Standard Standard Standard A 0.45±0.05 0.85±0.10 1.25＋0.15/－0.05 1.6±0.20 B 0.8＋0.20/－0 1.25＋0.20/－0 N o t e : P . 6 S t a n d a r d e x t e r n a l d i m e n s i o n s △ = B l a n k s p a c e ⑥Temperature characteristics code ■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor（CFCAP TM）） Code Applicable standard Temperature range［℃］ Ref. Temp.［℃］ Capacitance change Capacitance tolerance Tolerance code BJ ±20％ M ±20％ M ±20％ M ±20％ M ±20％ M ±20％ M Note : ※.LD Low distortion high value multilayer ceramic capaci t o r △ = B l a n k s p ace MULTILAYER CERAMIC CAPACITORS REFLOWWAVE

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . CERAMIC CAPACITORS c_mlcc_e-E02R01 ■Temperature compensating type Code Applicable standard Temperature range［℃］ Ref. Temp.［℃］ Capacitance change Capacitance tolerance Tolerance code CG EIA C0G －55～＋125 25 0±60ppm/℃ ±0.1pF B ±0.25pF C ±0.5pF D ±1pF F ±5％ J CH JIS CH －55～＋125 0±60ppm/℃ ±0.1pF B ±0.25pF C ±0.5pF D EIA C0H 25 ±1pF F ±5％ J ±10％ K CJ JIS CJ －55～＋125 20 0±120ppm/℃ ±0.25pF C EIA C0J 25 CK JIS CK －55～＋125 20 0±250ppm/℃ ±0.25pF C EIA C0J 25 UJ JIS UJ －55～＋125 －750±120ppm/℃ ±0.25pF C EIA U2J 25 ±0.5pF D ±5％ J UK JIS UK －55～＋125 20 －750±250ppm/℃ ±0.5pF C EIA U2K －55～＋125 25 SL JIS SL －55～＋125 20 +350～－1000ppm/℃ ±5％ J ⑥Series code （Super low distortion multilayer ceramic capacitor（CFCAP TM）only） Code Series code SD Standard ⑦Nominal capacitance Code （example） Nominal capacitance 0R5 0.5pF 010 1pF 100 10pF 101 100pF 102 1,000pF 103 10,000pF 104 0.1μF 105 1.0μF 106 10μF 107 100μF Note : R＝Decimal point ⑧Capacitance tolerance Code Capacitance tolerance B ±0.1pF C ±0.25pF D ±0.5pF F ±1pF G ±2％ J ±5％ K ±10％ M ±20％ Z ＋80/－20％ ⑨Thickness Code Thickness［mm］ C 0.2 D P 0.3 T K 0.45 V 0.5 W A 0.8 D 0.85(212type or more) F 1.15 G 1.25 L 1.6 N 1.9 Y 2.0 max M 2.5 ⑩Special code Code Special code － Standard ⑪Packaging Code Packaging F φ178mm Taping （2mm pitch） T φ178mm Taping （4mm pitch） P φ178mm Taping （4mm pitch, 1000 pcs/reel） 325 type（Thickness code M） W φ178mm Taping（1mm pitch）042type only ⑫Internal code Code Internal code △ Standard

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . CERAMIC CAPACITORS c_mlcc_e-E02R01 ■STANDARD EXTERNAL DIMENSIONS ※ LW reverse type Type( EIA ) Dimension [mm] ＬＷ T *1 e 0.2±0.02 C 0.5±0.05 V 0.45±0.05 K 1.25±0.10 G 0.85±0.10 D 1.25±0.10 G 1.6±0.20 L 0.85±0.10 D 0.6±0.3 1.15±0.10 F 1.9±0.20 N 1.9+0.1/-0.2 Y 2.5±0.20 M Note : ※. LW reverse type, *1.Thickness code ■STANDARD QUANTITY Type EIA（inch） Dimension Standard quantity［pcs］［ｍｍ］ Code Paper tape Embossed tape 042 01005 0.2 C － 40000 D 063 0201 0.3 P 15000 － T 105 0402

0.2 C 20000 －

0.3 P 15000 －

0.5 V 10000 － W 0204 ※ 0.30 P 107 0603 0.45 K 4000 － 0.8 A 0306 ※ 0.50 V － 4000 212 0805 0.45 K 4000 － 0.85 D

1.25 G － 3000

0508 ※ 0.85 D 4000 － 316 1206

0.85 D 4000 －

1.15 F － 3000 1.25 G

1.6 L － 2000

0.85 D － 2000 1.15 F 1.9 N 2.0 max Y 432 1812 2.5 M － 500 Note : ※.LW Reverse type（□WK） e

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . CERAMIC CAPACITORS ■PARTS NUMBER ・ All the Multilayer Ceramic Capacitors of Catalog Lineup are Compliance RoHS. ・ Capacitance tolerance code is applied to [] of part number. Note) *1 We may provide X7R/X7S for some items according to the ind ividual specification. *2 The exchange of individual specification is necessary depe nding on the application and circuit condition. Please contact TAIYO YUDEN sales channels. *3 The size standard should look at ④Dimension, ⑤Dimension to lerance, and ⑨Thickness, and P.6 Standard external dimensions. Multilayer Ceramic Capacitors (High dielectric type)

042TYPE 【Temperature Characteristic BJ : B/X5R】 0.2mm thickness（C） HTLT Rated voltage x ％ LMK042 BJ101[]C-W B X5R*1 100 p ±10，±20 5 200 0.2±0.02 R LMK042 BJ151[]C-W B X5R*1 150 p ±10，±20 5 200 0.2±0.02 R LMK042 BJ221[]C-W B X5R*1 220 p ±10，±20 5 200 0.2±0.02 R LMK042 BJ331[]C-W B X5R*1 330 p ±10，±20 5 200 0.2±0.02 R LMK042 BJ471[]C-W B X5R*1 470 p ±10，±20 5 200 0.2±0.02 R LMK042 BJ681[]C-W B X5R*1 680 p ±10，±20 5 200 0.2±0.02 R LMK042 BJ102[]C-W B X5R*1 1000 p ±10，±20 5 200 0.2±0.02 R LMK042 BJ152[]C-W X5R 1500 p ±10，±20 10 150 0.2±0.02 R LMK042 BJ222[]C-W X5R 2200 p ±10，±20 10 150 0.2±0.02 R LMK042 BJ332[]C-W X5R 3300 p ±10，±20 10 150 0.2±0.02 R LMK042 BJ472[]C-W X5R 4700 p ±10，±20 10 150 0.2±0.02 R LMK042 BJ682[]C-W X5R 6800 p ±10，±20 10 150 0.2±0.02 R LMK042 BJ103[]C-W X5R 10000 p ±10，±20 10 150 0.2±0.02 R JMK042 BJ152[]C-W B X5R*1 1500 p ±10，±20 10 150 0.2±0.02 R JMK042 BJ222[]C-W B X5R*1 2200 p ±10，±20 10 150 0.2±0.02 R JMK042 BJ332[]C-W B X5R*1 3300 p ±10，±20 10 150 0.2±0.02 R JMK042 BJ472[]C-W B X5R*1 4700 p ±10，±20 10 150 0.2±0.02 R JMK042 BJ682[]C-W B X5R*1 6800 p ±10，±20 10 150 0.2±0.02 R JMK042 BJ103[]C-W B X5R*1 10000 p ±10，±20 10 150 0.2±0.02 R JMK042 BJ223[]C-W X5R 22000 p ±10，±20 10 150 0.2±0.02 R JMK042 BJ473[]C-W X5R 47000 p ±10，±20 10 150 0.2±0.02 R AMK042 BJ473[]C-W X5R 47000 p ±10，±20 10 150 0.2±0.02 R AMK042 BJ104[]C-W X5R 0.1 μ ±10，±20 10 150 0.2±0.02 R 【Temperature Characteristic B7 : X7R】 0.2mm thickness（C） HTLT Rated voltage x ％ EMK042 B7101[]C-W X7R 100 p ±10，±20 5 200 0.2±0.02 R EMK042 B7151[]C-W X7R 150 p ±10，±20 5 200 0.2±0.02 R EMK042 B7221[]C-W X7R 220 p ±10，±20 5 200 0.2±0.02 R EMK042 B7331[]C-W X7R 330 p ±10，±20 5 200 0.2±0.02 R EMK042 B7471[]C-W X7R 470 p ±10，±20 5 200 0.2±0.02 R EMK042 B7681[]C-W X7R 680 p ±10，±20 5 200 0.2±0.02 R EMK042 B7102[]C-W X7R 1000 p ±10，±20 5 200 0.2±0.02 R LMK042 B7101[]C-W X7R 100 p ±10，±20 5 200 0.2±0.02 R LMK042 B7151[]C-W X7R 150 p ±10，±20 5 200 0.2±0.02 R LMK042 B7221[]C-W X7R 220 p ±10，±20 5 200 0.2±0.02 R LMK042 B7331[]C-W X7R 330 p ±10，±20 5 200 0.2±0.02 R LMK042 B7471[]C-W X7R 470 p ±10，±20 5 200 0.2±0.02 R LMK042 B7681[]C-W X7R 680 p ±10，±20 5 200 0.2±0.02 R LMK042 B7102[]C-W X7R 1000 p ±10，±20 5 200 0.2±0.02 R
063TYPE 【Temperature Characteristic BJ : B/X5R】 0.3mm thickness（P） HTLT Rated voltage x ％ UMK063 BJ101[]P-F B X5R*1 100 p ±10，±20 3.5 200 0.3±0.03 R UMK063 BJ151[]P-F B X5R*1 150 p ±10，±20 3.5 200 0.3±0.03 R UMK063 BJ221[]P-F B X5R*1 220 p ±10，±20 3.5 200 0.3±0.03 R UMK063 BJ331[]P-F B X5R*1 330 p ±10，±20 3.5 200 0.3±0.03 R UMK063 BJ471[]P-F B X5R*1 470 p ±10，±20 3.5 200 0.3±0.03 R UMK063 BJ681[]P-F B X5R*1 680 p ±10，±20 3.5 200 0.3±0.03 R UMK063 BJ102[]P-F B X5R*1 1000 p ±10，±20 3.5 200 0.3±0.03 R UMK063 BJ152[]P-F B X5R 1500 p ±10，±20 5 200 0.3±0.03 R UMK063 BJ222[]P-F B X5R 2200 p ±10，±20 5 200 0.3±0.03 R UMK063 BJ332[]P-F B X5R 3300 p ±10，±20 5 200 0.3±0.03 R UMK063 BJ472[]P-F B X5R 4700 p ±10，±20 5 200 0.3±0.03 R UMK063 BJ682[]P-F B X5R 6800 p ±10，±20 5 200 0.3±0.03 R UMK063 BJ103[]P-F B X5R 10000 p ±10，±20 5 200 0.3±0.03 R TMK063 BJ152[]P-F B X5R 1500 p ±10，±20 5 200 0.3±0.03 R TMK063 BJ222[]P-F B X5R 2200 p ±10，±20 5 200 0.3±0.03 R TMK063 BJ332[]P-F B X5R 3300 p ±10，±20 5 200 0.3±0.03 R TMK063 BJ472[]P-F B X5R 4700 p ±10，±20 5 200 0.3±0.03 R TMK063 BJ682[]P-F B X5R 6800 p ±10，±20 5 200 0.3±0.03 R TMK063 BJ103[]P-F B X5R 10000 p ±10，±20 5 200 0.3±0.03 R TMK063 BJ223[]P-F B X5R 22000 p ±10，±20 7.5 150 0.3±0.03 R EMK063 BJ152[]P-F B X5R*1 1500 p ±10，±20 5 200 0.3±0.03 R EMK063 BJ222[]P-F B X5R*1 2200 p ±10，±20 5 200 0.3±0.03 R EMK063 BJ332[]P-F B X5R*1 3300 p ±10，±20 5 200 0.3±0.03 R EMK063 BJ472[]P-F B X5R*1 4700 p ±10，±20 5 200 0.3±0.03 R EMK063 BJ682[]P-F B X5R*1 6800 p ±10，±20 5 200 0.3±0.03 R EMK063 BJ103[]P-F B X5R*1 10000 p ±10，±20 5 200 0.3±0.03 R EMK063 BJ223[]P-F B X5R 22000 p ±10，±20 7.5 150 0.3±0.03 R EMK063 BJ333[]P-F X5R 33000 p ±10，±20 7.5 150 0.3±0.03 R EMK063 BJ473[]P-F X5R 47000 p ±10，±20 7.5 150 0.3±0.03 R EMK063 BJ683[]P-F X5R 68000 p ±10，±20 10 150 0.3±0.03 R EMK063 BJ104[]P-F X5R 0.1 μ ±10，±20 10 150 0.3±0.03 R EMK063 BJ224[]P-F X5R 0.22 μ ±10，±20 10 150 0.3±0.03 R 6.3 Rated voltage [V] Rated voltage [V] Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave tanδ [％] Thickness*3 [mm] Part number 1 Capacitance [F] Capacitance tolerance [％] Capacitance [F] Temperature characteristics Capacitance tolerance [％] Part number 1 Part number 2 Temperature characteristicsPart number 1 Part number 2 Part number 2 tanδ [％] Thickness*3 [mm]Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance [％] Thickness*3 [mm] Soldering R:Reflow W:Wave tanδ [％] c_mlcc_e-E02R01

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . CERAMIC CAPACITORS ■PARTS NUMBER HTLT Rated voltage x ％ LMK063 BJ223[]P-F B X5R 22000 p ±10，±20 7.5 150 0.3±0.03 R LMK063 BJ333[]P-F X5R 33000 p ±10，±20 7.5 150 0.3±0.03 R LMK063 BJ473[]P-F X5R 47000 p ±10，±20 7.5 150 0.3±0.03 R LMK063 BJ683[]P-F X5R 68000 p ±10，±20 10 150 0.3±0.03 R LMK063 BJ104[]P-F X5R 0.1 μ ±10，±20 10 150 0.3±0.03 R LMK063 BJ224[]P-F X5R 0.22 μ ±10，±20 10 150 0.3±0.03 R JMK063 BJ223[]P-F B X5R 22000 p ±10，±20 7.5 150 0.3±0.03 R JMK063 BJ333[]P-F X5R 33000 p ±10，±20 7.5 150 0.3±0.03 R JMK063 BJ473[]P-F X5R 47000 p ±10，±20 7.5 150 0.3±0.03 R JMK063 BJ683[]P-F X5R 68000 p ±10，±20 10 150 0.3±0.03 R JMK063 BJ104[]P-F X5R 0.1 μ ±10，±20 10 150 0.3±0.03 R JMK063 BJ224[]P-F X5R 0.22 μ ±10，±20 10 150 0.3±0.03 R JMK063 BJ474[]P-F X5R 0.47 μ ±10，±20 10 150 0.3±0.03 R JMK063ABJ105MP-F X5R 1 μ ±20 10 150 0.3±0.05 R AMK063 BJ224[]P-F X5R 0.22 μ ±10，±20 10 150 0.3±0.03 R AMK063 BJ474MP-F X5R 0.47 μ ±20 10 150 0.3±0.03 R AMK063ABJ105MP-F X5R 1 μ ±20 10 150 0.3±0.05 R 【Temperature Characteristic C6 : X6S】 0.3mm thickness（P） HTLT Rated voltage x ％ LMK063 C6333[]P-F X6S 33000 p ±10，±20 7.5 150 0.3±0.03 R LMK063 C6473[]P-F X6S 47000 p ±10，±20 7.5 150 0.3±0.03 R LMK063 C6683[]P-F X6S 68000 p ±10，±20 10 150 0.3±0.03 R LMK063 C6104[]P-F X6S 0.1 μ ±10，±20 10 150 0.3±0.03 R LMK063 C6224[]P-F X6S 0.22 μ ±10，±20 10 150 0.3±0.03 R JMK063 C6333[]P-F X6S 33000 p ±10，±20 7.5 150 0.3±0.03 R JMK063 C6473[]P-F X6S 47000 p ±10，±20 7.5 150 0.3±0.03 R JMK063 C6683[]P-F X6S 68000 p ±10，±20 10 150 0.3±0.03 R JMK063 C6104[]P-F X6S 0.1 μ ±10，±20 10 150 0.3±0.03 R JMK063 C6224[]P-F X6S 0.22 μ ±10，±20 10 150 0.3±0.03 R AMK063 C6474MP-F X6S 0.47 μ ±20 10 150 0.3±0.03 R AMK063AC6105MP-F X6S 1 μ ±20 10 150 0.3±0.05 R 【Temperature Characteristic B7 : X7R】 0.3mm thickness（P） HTLT Rated voltage x ％ UMK063 B7101[]P-F X7R 100 p ±10，±20 3.5 200 0.3±0.03 R UMK063 B7151[]P-F X7R 150 p ±10，±20 3.5 200 0.3±0.03 R UMK063 B7221[]P-F X7R 220 p ±10，±20 3.5 200 0.3±0.03 R UMK063 B7331[]P-F X7R 330 p ±10，±20 3.5 200 0.3±0.03 R UMK063 B7471[]P-F X7R 470 p ±10，±20 3.5 200 0.3±0.03 R UMK063 B7681[]P-F X7R 680 p ±10，±20 3.5 200 0.3±0.03 R UMK063 B7102[]P-F X7R 1000 p ±10，±20 3.5 200 0.3±0.03 R TMK063 B7152[]P-F X7R 1500 p ±10，±20 5 200 0.3±0.03 R TMK063 B7222[]P-F X7R 2200 p ±10，±20 5 200 0.3±0.03 R TMK063 B7332[]P-F X7R 3300 p ±10，±20 5 200 0.3±0.03 R TMK063 B7472[]P-F X7R 4700 p ±10，±20 5 200 0.3±0.03 R TMK063 B7682[]P-F X7R 6800 p ±10，±20 5 200 0.3±0.03 R TMK063 B7103[]P-F X7R 10000 p ±10，±20 5 200 0.3±0.03 R EMK063 B7152[]P-F X7R 1500 p ±10，±20 5 200 0.3±0.03 R EMK063 B7222[]P-F X7R 2200 p ±10，±20 5 200 0.3±0.03 R EMK063 B7332[]P-F X7R 3300 p ±10，±20 5 200 0.3±0.03 R EMK063 B7472[]P-F X7R 4700 p ±10，±20 5 200 0.3±0.03 R EMK063 B7682[]P-F X7R 6800 p ±10，±20 5 200 0.3±0.03 R EMK063 B7103[]P-F X7R 10000 p ±10，±20 5 200 0.3±0.03 R EMK063 B7223[]P-F X7R 22000 p ±10，±20 7.5 150 0.3±0.03 R

105TYPE 【Temperature Characteristic BJ : B/X5R】 0.5mm thickness（V） HTLT Rated voltage x ％ UMK105 BJ221[]V-F B X5R*1 220 p ±10，±20 2.5 200 0.5±0.05 R UMK105 BJ331[]V-F B X5R*1 330 p ±10，±20 2.5 200 0.5±0.05 R UMK105 BJ471[]V-F B X5R*1 470 p ±10，±20 2.5 200 0.5±0.05 R UMK105 BJ681[]V-F B X5R*1 680 p ±10，±20 2.5 200 0.5±0.05 R UMK105 BJ102[]V-F B X5R*1 1000 p ±10，±20 2.5 200 0.5±0.05 R UMK105 BJ152[]V-F B X5R*1 1500 p ±10，±20 2.5 200 0.5±0.05 R UMK105 BJ222[]V-F B X5R*1 2200 p ±10，±20 2.5 200 0.5±0.05 R UMK105 BJ332[]V-F B X5R*1 3300 p ±10，±20 2.5 200 0.5±0.05 R UMK105 BJ472[]V-F B X5R*1 4700 p ±10，±20 2.5 200 0.5±0.05 R UMK105 BJ682[]V-F B X5R*1 6800 p ±10，±20 2.5 150 0.5±0.05 R UMK105 BJ103[]V-F B X5R*1 10000 p ±10，±20 3.5 200 0.5±0.05 R UMK105 BJ104[]V-F X5R 0.1 μ ±10，±20 10 150 0.5±0.05 R UMK105 BJ224[]V-F X5R 0.22 μ ±10，±20 10 150 0.5±0.05 R UMK105ABJ474[]V-F X5R 0.47 μ ±10，±20 10 150 0.5±0.10 R GMK105 BJ104[]V-F 35 B X5R 0.1 μ ±10，±20 5 150 0.5±0.05 R TMK105 BJ153[]V-F B X5R*1 15000 p ±10，±20 3.5 200 0.5±0.05 R TMK105 BJ223[]V-F B X5R*1 22000 p ±10，±20 3.5 200 0.5±0.05 R TMK105 BJ333[]V-F B X5R*1 33000 p ±10，±20 3.5 150 0.5±0.05 R TMK105 BJ473[]V-F B X5R*1 47000 p ±10，±20 3.5 150 0.5±0.05 R TMK105 BJ104[]V-F B X5R 0.1 μ ±10，±20 5 150 0.5±0.05 R ＴMK105 BJ224[]V-F X5R 0.22 μ ±10，±20 10 200 0.5±0.05 R ＴMK105ABJ474[]V-F X5R 0.47 μ ±10，±20 10 200 0.5±0.10 R TMK105 BJ105[]V-F X5R 1 μ ±10，±20 10 150 0.5±0.05 R TMK105CBJ225MV-F X5R 2.2 μ ±20 10 150 0.5+0.20/-0 R Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance [％] tanδ [％] Thickness*3 [mm] Capacitance tolerance [％] Capacitance [F]Part number 1 Temperature characteristics Capacitance tolerance [％] Capacitance tolerance [％] tanδ [％] Soldering R:Reflow W:Wave tanδ [％] Thickness*3 [mm] Soldering R:Reflow W:Wave Thickness*3 [mm] Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave tanδ [％] Thickness*3 [mm] Temperature characteristicsPart number 2 Rated voltage [V] Part number 1 Part number 2 Rated voltage [V] Part number 1 Part number 2 Capacitance [F] Capacitance [F] Temperature characteristics 6.3 Rated voltage [V] 6.3 c_mlcc_e-E02R01

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . CERAMIC CAPACITORS ■PARTS NUMBER HTLT Rated voltage x ％ EMK105 BJ153[]V-F B X5R*1 15000 p ±10，±20 3.5 200 0.5±0.05 R EMK105 BJ223[]V-F B X5R*1 22000 p ±10，±20 3.5 200 0.5±0.05 R EMK105 BJ333[]V-F B X5R*1 33000 p ±10，±20 3.5 200 0.5±0.05 R EMK105 BJ473[]V-F B X5R*1 47000 p ±10，±20 3.5 200 0.5±0.05 R EMK105 BJ683[]V-F B X5R 68000 p ±10，±20 5 200 0.5±0.05 R EMK105 BJ104[]V-F B X5R*1 0.1 μ ±10，±20 5 150 0.5±0.05 R EMK105 BJ224[]V-F B X5R 0.22 μ ±10，±20 5 150 0.5±0.05 R EMK105ABJ474[]V-F X5R 0.47 μ ±10，±20 10 150 0.5±0.10 R EMK105 BJ105[]V-F X5R 1 μ ±10，±20 10 150 0.5±0.05 R EMK105ABJ225MV-F X5R 2.2 μ ±20 10 150 0.5±0.10 R LMK105 BJ104[]V-F B X5R 0.1 μ ±10，±20 5 200 0.5±0.05 R LMK105 BJ224[]V-F B X5R 0.22 μ ±10，±20 5 150 0.5±0.05 R LMK105 BJ474[]V-F X5R 0.47 μ ±10，±20 10 150 0.5±0.05 R LMK105 BJ105[]V-F X5R 1 μ ±10，±20 10 150 0.5±0.05 R LMK105 BJ225MV-F X5R 2.2 μ ±20 10 150 0.5±0.05 R LMK105BBJ475MVLF X5R 4.7 μ ±20 10 150 0.5+0.15/-0.05 R JMK105 BJ224[]V-F B X5R 0.22 μ ±10，±20 5 150 0.5±0.05 R JMK105 BJ474[]V-F X5R 0.47 μ ±10，±20 10 150 0.5±0.05 R JMK105 BJ105[]V-F X5R 1 μ ±10，±20 10 150 0.5±0.05 R JMK105 BJ225MV-F X5R 2.2 μ ±20 10 150 0.5±0.05 R JMK105BBJ475MV-F JMK105 BJ475MV-FD X5R 4.7 μ ±20 10 150 0.5+0.15/-0.05 R AMK105 BJ335MV-F X5R 3.3 μ ±20 10 150 0.5±0.05 R AMK105ABJ475MV-F AMK105 BJ475MV-F X5R 4.7 μ ±20 10 150 0.5±0.10 R AMK105CBJ106MV-F X5R 10 μ ±20 10 150 0.5+0.20/-0 R 【Temperature Characteristic BJ : B/X5R】 0.3mm thickness（P） HTLT Rated voltage x ％ TMK105 BJ103[]P-F B X5R 10000 p ±10，±20 5 150 0.3±0.03 R TMK105 BJ104[]P-F X5R 0.1 μ ±10，±20 10 150 0.3±0.03 R TMK105 BJ224[]P-F X5R 0.22 μ ±10，±20 10 150 0.3±0.03 R TMK105 BJ474[]P-F X5R 0.47 μ ±10，±20 10 150 0.3±0.03 R EMK105 BJ474[]P-F 16 X5R 0.47 μ ±10，±20 10 150 0.3±0.03 R LMK105 BJ105[]PLF 10 X5R 1 μ ±10，±20 10 150 0.3±0.03 R JMK105 BJ105[]P-F 6.3 X5R 1 μ ±10，±20 10 150 0.3±0.03 R AMK105 BJ225MP-F 4 X5R 2.2 μ ±20 10 150 0.3±0.03 R 【Temperature Characteristic BJ : X5R】 0.2mm thickness（C） HTLT Rated voltage x ％ LMK105 BJ104[]C-F 10 X5R 0.1 μ ±10，±20 10 150 0.2±0.02 R JMK105 BJ224[]C-F X5R 0.22 μ ±10，±20 10 150 0.2±0.02 R JMK105 BJ474[]C-F X5R 0.47 μ ±10，±20 10 150 0.2±0.02 R JMK105 BJ105MC-F X5R 1 μ ±20 10 150 0.2±0.02 R 【Temperature Characteristic C6 : X6S】 0.5mm thickness（V） HTLT Rated voltage x ％ EMK105 C6105[]V-F 16 X6S 1 μ ±10，±20 10 150 0.5±0.05 R EMK105CC6225MV-F X6S 2.2 μ ±20 10 150 0.5+0.20/-0 R LMK105 C6105[]V-F X6S 1 μ ±10，±20 10 200 0.5±0.05 R LMK105AC6225MV-F X6S 2.2 μ ±20 10 150 0.5±0.10 R JMK105 C6105[]V-F X6S 1 μ ±10，±20 10 150 0.5±0.05 R JMK105 C6225MV-F X6S 2.2 μ ±20 10 150 0.5±0.05 R JMK105BC6475MV-F X6S 4.7 μ ±20 10 150 0.5+0.15/-0.05 R AMK105BC6475MV-F 4 X6S 4.7 μ ±20 10 150 0.5+0.15/-0.05 R 【Temperature Characteristic B7 : X7R】 0.5mm thickness（V） HTLT Rated voltage x ％ UMK105 B7221[]V-F X7R 220 p ±10，±20 2.5 200 0.5±0.05 R UMK105 B7331[]V-F X7R 330 p ±10，±20 2.5 200 0.5±0.05 R UMK105 B7471[]V-F X7R 470 p ±10，±20 2.5 200 0.5±0.05 R UMK105 B7681[]V-F X7R 680 p ±10，±20 2.5 200 0.5±0.05 R UMK105 B7102[]V-F X7R 1000 p ±10，±20 2.5 200 0.5±0.05 R UMK105 B7152[]V-F X7R 1500 p ±10，±20 2.5 200 0.5±0.05 R UMK105 B7222[]V-F X7R 2200 p ±10，±20 2.5 200 0.5±0.05 R UMK105 B7332[]V-F X7R 3300 p ±10，±20 2.5 200 0.5±0.05 R UMK105 B7472[]V-F X7R 4700 p ±10，±20 2.5 200 0.5±0.05 R UMK105 B7682[]V-F X7R 6800 p ±10，±20 2.5 200 0.5±0.05 R UMK105 B7103[]V-F X7R 10000 p ±10，±20 3.5 200 0.5±0.05 R UMK105 B7104[]V-FR X7R 0.1 μ ±10，±20 10 150 0.5±0.05 R TMK105 B7152[]V-F X7R 1500 p ±10，±20 2.5 200 0.5±0.05 R TMK105 B7222[]V-F X7R 2200 p ±10，±20 2.5 200 0.5±0.05 R TMK105 B7332[]V-F X7R 3300 p ±10，±20 2.5 200 0.5±0.05 R TMK105 B7472[]V-F X7R 4700 p ±10，±20 2.5 200 0.5±0.05 R TMK105 B7682[]V-F X7R 6800 p ±10，±20 2.5 200 0.5±0.05 R TMK105 B7103[]V-F X7R 10000 p ±10，±20 3.5 200 0.5±0.05 R TMK105 B7104[]V-FR X7R 0.1 μ ±10，±20 10 200 0.5±0.05 R TMK105 B7224[]V-FR X7R 0.22 μ ±10，±20 10 150 0.5±0.05 R EMK105 B7223[]V-F X7R 22000 p ±10，±20 3.5 200 0.5±0.05 R EMK105 B7473[]V-F X7R 47000 p ±10，±20 3.5 200 0.5±0.05 R EMK105 B7104[]V-F X7R 0.1 μ ±10，±20 5 150 0.5±0.05 R EMK105 B7224[]V-FR X7R 0.22 μ ±10，±20 10 150 0.5±0.05 R Soldering R:Reflow W:Wave 6.3 Capacitance tolerance [％] Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave Capacitance tolerance [％] Rated voltage [V] Temperature characteristics Thickness*3 [mm] Capacitance [F] Capacitance [F] Capacitance tolerance [％] Capacitance tolerance [％] tanδ [％] tanδ [％] Capacitance [F] Part number 1 Thickness*3 [mm] Thickness*3 [mm] Temperature characteristics Capacitance tolerance [％] Capacitance [F] Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave tanδ [％] Thickness*3 [mm] Part number 1 tanδ [％] Thickness*3 [mm] Part number 2 6.3 Part number 1 Part number 2 Part number 2 Rated voltage [V] Part number 1 Part number 2 Rated voltage [V] Rated voltage [V] Rated voltage [V] Part number 2 Part number 1 Temperature characteristics Capacitance [F] Temperature characteristics Temperature characteristics tanδ [％] 6.3 c_mlcc_e-E02R01

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . CERAMIC CAPACITORS ■PARTS NUMBER HTLT Rated voltage x ％ LMK105 B7223[]V-F X7R 22000 p ±10，±20 3.5 200 0.5±0.05 R LMK105 B7473[]V-F X7R 47000 p ±10，±20 3.5 200 0.5±0.05 R LMK105 B7104[]V-F X7R 0.1 μ ±10，±20 5 150 0.5±0.05 R LMK105 B7224[]V-FR X7R 0.22 μ ±10，±20 10 150 0.5±0.05 R LMK105 B7474[]V-F X7R 0.47 μ ±10，±20 10 150 0.5±0.05 R JMK105 B7224[]V-F X7R 0.22 μ ±10，±20 5 150 0.5±0.05 R JMK105 B7474[]V-F X7R 0.47 μ ±10，±20 10 150 0.5±0.05 R 【Temperature Characteristic F : F/Y5V】 0.5mm thickness（V） HTLT Rated voltage x ％ UMK105 F103ZV-F 50 F Y5V 10000 p ＋80/-20 5 200 0.5±0.05 R TMK105 F223ZV-F 25 F Y5V 22000 p ＋80/-20 5 200 0.5±0.05 R EMK105 F473ZV-F F Y5V 47000 p ＋80/-20 7 200 0.5±0.05 R EMK105 F104ZV-F F Y5V 0.1 μ ＋80/-20 9 200 0.5±0.05 R LMK105 F224ZV-F 10 F Y5V 0.22 μ ＋80/-20 11 200 0.5±0.05 R JMK105 F474ZV-F F Y5V 0.47 μ ＋80/-20 12.5 200 0.5±0.05 R JMK105 F105ZV-F F Y5V 1 μ ＋80/-20 20 150 0.5±0.05 R

107TYPE 【Temperature Characteristic BJ : B/X5R】 0.8mm thickness（A） HTLT Rated voltage x ％ UMK107ABJ474[]A-T UMK107 BJ474[]A-TD X5R 0.47 μ ±10，±20 10 150 0.8+0.15 /-0.05 R UMK107 BJ105[]A-T X5R 1 μ ±10，±20 10 150 0.8±0.10 R UMK107BBJ225[]A-T X5R 2.2 μ ±10，±20 10 150 0.8+0.20/-0 R GMK107 BJ105[]A-T 35 B X5R 1 μ ±10，±20 5 150 0.8±0.10 R TMK107 BJ224[]A-T B X5R 0.22 μ ±10，±20 3.5 200 0.8±0.10 R/W TMK107 BJ474[]A-T B X5R 0.47 μ ±10，±20 3.5 150 0.8±0.10 R TMK107 BJ105[]A-T B X5R 1 μ ±10，±20 5 150 0.8±0.10 R TMK107ABJ225[]A-T TMK107 BJ225[]A-TD X5R 2.2 μ ±10，±20 10 150 0.8+0.15/ -0.05 R EMK107 BJ224[]A-T B X5R*1 0.22 μ ±10，±20 3.5 200 0.8±0.10 R/W EMK107 BJ474[]A-T B X5R*1 0.47 μ ±10，±20 3.5 200 0.8±0.10 R EMK107 BJ105[]A-T B X5R*1 1 μ ±10，±20 5 150 0.8±0.10 R EMK107 BJ225[]A-T B X5R 2.2 μ ±10，±20 10 150 0.8±0.10 R EMK107ABJ475[]A-T EMK107 BJ475[]A-TD X5R 4.7 μ ±10，±20 10 150 0.8+0.15/ -0.05 R EMK107BBJ106MA-T X5R 10 μ ±20 10 150 0.8+0.20/-0 R LMK107 BJ224[]A-T B X5R*1 0.22 μ ±10，±20 3.5 200 0.8±0.10 R/W LMK107 BJ474[]A-T B X5R*1 0.47 μ ±10，±20 3.5 200 0.8±0.10 R LMK107 BJ105[]A-T B X5R*1 1 μ ±10，±20 5 200 0.8±0.10 R LMK107 BJ225[]A-T B X5R 2.2 μ ±10，±20 10 150 0.8±0.10 R LMK107 BJ475[]A-T X5R 4.7 μ ±10，±20 10 150 0.8±0.10 R LMK107BBJ106MALT LMK107 BJ106MALTD X5R 10 μ ±20 10 150 0.8+0.20/-0 R JMK107 BJ225[]A-T B X5R 2.2 μ ±10，±20 10 150 0.8±0.10 R JMK107 BJ475[]A-T X5R 4.7 μ ±10，±20 10 150 0.8±0.10 R JMK107ABJ106MA-T JMK107 BJ106MA-T X5R 10 μ ±20 10 150 0.8+0.15/-0.05 R AMK107 BJ106MA-T X5R 10 μ ±20 10 150 0.8±0.10 R AMK107BBJ226MA-T AMK107 BJ226MA-T X5R 22 μ ±20 10 150 0.8+0.20/-0 R 【Temperature Characteristic BJ : B/X5R】 0.45mm thickness（K） HTLT Rated voltage x ％ TMK107 BJ105[]K-T 25 X5R 1 μ ±10，±20 10 150 0.45±0.05 R EMK107 BJ105[]K-T X5R 1 μ ±10，±20 10 150 0.45±0.05 R EMK107BBJ225[]K-T X5R 2.2 μ ±10，±20 10 150 0.45±0.05 R LMK107 BJ105[]K-T B X5R 1 μ ±10，±20 10 150 0.45±0.05 R LMK107 BJ225[]K-T X5R 2.2 μ ±10，±20 10 150 0.45±0.05 R LMK107BBJ475MKLT LMK107 BJ475MKLTD X5R 4.7 μ ±20 10 150 0.45±0.05 R JMK107 BJ105[]K-T B X5R 1 μ ±10，±20 10 150 0.45±0.05 R JMK107 BJ225[]K-T X5R 2.2 μ ±10，±20 10 150 0.45±0.05 R JMK107 BJ475MK-T X5R 4.7 μ ±20 10 150 0.45±0.05 R JMK107BBJ106MK-T X5R 10 μ ±20 10 150 0.45±0.05 R AMK107BBJ106MK-T 4 X5R 10 μ ±20 10 150 0.45±0.05 R 【Temperature Characteristic C6 : X6S】 0.8mm thickness（A） HTLT Rated voltage x ％ EMK107 C6105[]A-T 16 X6S 1 μ ±10，±20 5 150 0.8±0.10 R LMK107 C6105[]A-T X6S 1 μ ±10，±20 5 150 0.8±0.10 R LMK107AC6475[]A-T X6S 4.7 μ ±10，±20 10 150 0.8+0.15/-0.05 R LMK107BC6106MA-T X6S 10 μ ±20 10 150 0.8+0.20/-0 R JMK107 C6105[]A-T X6S 1 μ ±10，±20 5 150 0.8±0.10 R JMK107 C6475[]A-T X6S 4.7 μ ±10，±20 10 150 0.8±0.10 R JMK107BC6106MA-T X6S 10 μ ±20 10 150 0.8+0.20/-0 R AMK107AC6106MA-T 4 X6S 10 μ ±20 10 150 0.8+0.15/-0.05 R 【Temperature Characteristic B7 : X7R】 0.8mm thickness（A） HTLT Rated voltage x ％ UMK107 B7224[]A-TR X7R 0.22 μ ±10，±20 10 150 0.8±0.10 R UMK107 B7474[]A-TR X7R 0.47 μ ±10，±20 10 150 0.8±0.10 R UMK107AB7105[]A-T X7R 1 μ ±10，±20 10 150 0.8+0.15/-0.05 R TMK107 B7474[]A-TR X7R 0.47 μ ±10，±20 10 150 0.8±0.10 R TMK107 B7105[]A-T X7R 1 μ ±10，±20 10 150 0.8±0.10 R Temperature characteristics Capacitance tolerance [％] Capacitance [F] Capacitance tolerance [％] tanδ [％] Temperature characteristics Rated voltage [V]Part number 2 Temperature characteristics tanδ [％] Capacitance tolerance [％] tanδ [％] Capacitance tolerance [％] Thickness*3 [mm] Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave tanδ [％] Thickness*3 [mm] Soldering R:Reflow W:Wave Thickness*3 [mm] Thickness*3 [mm] Soldering R:Reflow W:Wave Thickness*3 [mm] Capacitance tolerance [％] tanδ [％] Soldering R:Reflow W:Wave tanδ [％] Capacitance tolerance [％] Part number 1 Part number 1 Capacitance [F] Capacitance [F] Capacitance [F] Capacitance [F] Thickness*3 [mm] Temperature characteristics Capacitance [F] Part number 1 Rated voltage [V] Part number 1 Part number 2 Part number 1 Part number 2 Part number 2 Part number 1 Part number 2 Part number 2 Rated voltage [V] 6.3 6.3 Temperature characteristics 6.3 Temperature characteristics Rated voltage [V] 6.3 Rated voltage [V] Rated voltage [V] 6.3 c_mlcc_e-E02R01

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . CERAMIC CAPACITORS ■PARTS NUMBER HTLT Rated voltage x ％ EMK107 B7224[]A-T X7R 0.22 μ ±10，±20 3.5 150 0.8±0.10 R/W EMK107 B7474[]A-T X7R 0.47 μ ±10，±20 3.5 150 0.8±0.10 R EMK107 B7105[]A-T X7R 1 μ ±10，±20 5 150 0.8±0.10 R EMK107BB7225[]A-T X7R 2.2 μ ±10，±20 10 150 0.8+0.20/-0 R LMK107 B7224[]A-T X7R 0.22 μ ±10，±20 3.5 200 0.8±0.10 R/W LMK107 B7474[]A-T X7R 0.47 μ ±10，±20 3.5 200 0.8±0.10 R LMK107 B7105[]A-T X7R 1 μ ±10，±20 5 150 0.8±0.10 R LMK107 B7225[]A-TR X7R 2.2 μ ±10，±20 10 150 0.8±0.10 R JMK107 B7224[]A-T X7R 0.22 μ ±10，±20 3.5 200 0.8±0.10 R/W JMK107 B7474[]A-T X7R 0.47 μ ±10，±20 3.5 200 0.8±0.10 R JMK107 B7105[]A-T X7R 1 μ ±10，±20 5 150 0.8±0.10 R 【Temperature Characteristic F : F/Y5V】 0.8mm thickness（A） HTLT Rated voltage x ％ UMK107 F104ZA-T 50 F Y5V 0.1 μ ＋80/-20 7 200 0.8±0.10 R/W TMK107 F474ZA-T 25 F Y5V 0.47 μ ＋80/-20 7 200 0.8±0.10 R/W EMK107 F224ZA-T F Y5V 0.22 μ ＋80/-20 7 200 0.8±0.10 R/W EMK107 F474ZA-T F Y5V 0.47 μ ＋80/-20 7 200 0.8±0.10 R/W EMK107 F105ZA-T F Y5V 1 μ ＋80/-20 16 200 0.8±0.10 R EMK107 F225ZA-T F Y5V 2.2 μ ＋80/-20 16 200 0.8±0.10 R LMK107 F105ZA-T F Y5V 1 μ ＋80/-20 16 200 0.8±0.10 R LMK107 F225ZA-T F Y5V 2.2 μ ＋80/-20 16 200 0.8±0.10 R

212TYPE 【Temperature Characteristic BJ : B/X5R】 1.25mm thickness（G） HTLT Rated voltage x ％ UMK212 BJ104[]G-T B X5R*1 0.1 μ ±10，±20 3.5 200 1.25±0.10 R/W UMK212 BJ224[]G-T B X5R*1 0.22 μ ±10，±20 3.5 200 1.25±0.10 R/W UMK212 BJ474[]G-T B X5R*1 0.47 μ ±10，±20 3.5 150 1.25±0.10 R/W UMK212 BJ105[]G-T B X5R 1 μ ±10，±20 5 150 1.25±0.10 R/W UMK212ABJ225[]G-T B X5R 2.2 μ ±10，±20 10 150 1.25+0.15/-0.05 R UMK212BBJ475[]G-T X5R 4.7 μ ±10，±20 10 150 1.25+0.20/-0 R TMK212 BJ225[]G-T B X5R 2.2 μ ±10，±20 5 150 1.25±0.10 R TMK212ABJ475[]G-T TMK212 BJ475[]G-T X5R 4.7 μ ±10，±20 10 150 1.25+0.15/ -0.05 R TMK212BBJ106MG-T X5R 10 μ ±20 10 150 1.25+0.20/-0 R EMK212 BJ225[]G-T B X5R*1 2.2 μ ±10，±20 5 200 1.25±0.10 R EMK212ABJ475[]G-T EMK212 BJ475[]G-T B X5R*1 4.7 μ ±10，±20 5 150 1.25+0.15/-0.05 R EMK212ABJ106[]G-T EMK212 BJ106[]G-T X5R 10 μ ±10，±20 10 150 1.25+0.15/- 0.05 R EMK212BBJ226MG-T X5R 22 μ ±20 10 150 1.25+0.20/-0 R LMK212 BJ225[]G-T B X5R*1 2.2 μ ±10，±20 5 200 1.25±0.10 R LMK212ABJ475[]G-T LMK212 BJ475[]G-T B X5R*1 4.7 μ ±10，±20 5 200 1.25+0.15/-0.05 R LMK212ABJ106[]G-T LMK212 BJ106[]G-T X5R 10 μ ±10，±20 10 200 1.25+0.15/- 0.05 R LMK212BBJ226MG-T LMK212 BJ226MG-T X5R 22 μ ±20 10 150 1.25+0.20/-0 R JMK212ABJ475[]G-T JMK212 BJ475[]G-T B X5R 4.7 μ ±10，±20 5 200 1.25+0.15/ -0.05 R JMK212ABJ106[]G-T JMK212 BJ106[]G-T X5R*1 10 μ ±10，±20 10 200 1.25+0.15/-0.05 R JMK212ABJ226MG-T JMK212 BJ226MG-T X5R 22 μ ±20 10 150 1.25+0.15/-0.05 R JMK212BBJ476MG-T JMK212 BJ476MG-T X5R 47 μ ±20 10 150 1.25+0.20/-0 R 【Temperature Characteristic BJ : B/X5R】 0.85mm thickness（D） HTLT Rated voltage x ％ UMK212ABJ105[]D-T UMK212 BJ105[]D-TD X5R 1 μ ±10，±20 10 150 0.85±0.10 R UMK212BBJ225[]D-T X5R 2.2 μ ±10，±20 10 150 0.85±0.10 R TMK212 BJ474[]D-T B X5R 0.47 μ ±10，±20 3.5 200 0.85±0.10 R TMK212 BJ105[]D-T B X5R 1 μ ±10，±20 5 200 0.85±0.10 R TMK212ABJ225[]D-T TMK212 BJ225[]D-T B X5R 2.2 μ ±10，±20 5 150 0.85±0.10 R TMK212BBJ475[]D-T TMK212 BJ475[]D-TD X5R 4.7 μ ±10，±20 10 150 0.85±0.10 R EMK212 BJ105[]D-T B X5R*1 1 μ ±10，±20 5 200 0.85±0.10 R EMK212ABJ225[]D-T EMK212 BJ225[]D-T B X5R*1 2.2 μ ±10，±20 5 150 0.85±0.10 R EMK212 BJ475[]D-T B X5R 4.7 μ ±10，±20 10 150 0.85±0.10 R EMK212ABJ106[]D-T EMK212 BJ106[]D-TD X5R 10 μ ±10，±20 10 150 0.85±0.10 R LMK212 BJ105[]D-T B X5R*1 1 μ ±10，±20 3.5 200 0.85±0.10 R LMK212 BJ225[]D-T B X5R*1 2.2 μ ±10，±20 5 200 0.85±0.10 R LMK212 BJ475[]D-T B X5R 4.7 μ ±10，±20 10 200 0.85±0.10 R LMK212ABJ106[]D-T LMK212 BJ106[]D-T X5R 10 μ ±10，±20 10 150 0.85±0.10 R LMK212BBJ226MD-T X5R 22 μ ±20 10 150 0.85±0.10 R JMK212 BJ475[]D-T X5R 4.7 μ ±10，±20 10 200 0.85±0.10 R JMK212ABJ106[]D-T JMK212 BJ106[]D-T X5R 10 μ ±10，±20 10 200 0.85±0.10 R JMK212ABJ226MD-T JMK212 BJ226MD-T X5R 22 μ ±20 10 150 0.85±0.10 R AMK212BBJ476MD-T 4 X5R 47 μ ±20 10 150 0.85±0.10 R 【Temperature Characteristic BJ : X5R】 0.45mm thickness（K） HTLT Rated voltage x ％ LMK212ABJ475[]K-T LMK212 BJ475[]K-T 10 X5R 4.7 μ ±10，±20 10 150 0.45±0.05R JMK212ABJ475[]K-T JMK212 BJ475[]K-T X5R 4.7 μ ±10，±20 10 150 0.45±0.05 R JMK212ABJ106MK-T *2 JMK212 BJ106MK-T X5R 10 μ ±20 10 150 0.45±0.05 R Capacitance tolerance [％] tanδ [％] tanδ [％] Temperature characteristics tanδ [％] Rated voltage [V] 6.3 Part number 1 Part number 2 Rated voltage [V] Part number 1 Part number 2 Part number 1 Part number 2 Temperature characteristics Temperature characteristics Part number 1 Part number 2 Part number 1 Part number 2 6.3 Temperature characteristics Capacitance tolerance [％] Thickness*3 [mm] Capacitance tolerance [％] Thickness*3 [mm] Thickness*3 [mm] Capacitance [F] Capacitance [F] Capacitance tolerance [％] Capacitance [F] Capacitance [F] Capacitance [F] Temperature characteristics tanδ [％] tanδ [％] Soldering R:Reflow W:Wave Capacitance tolerance [％] Thickness*3 [mm] Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave Thickness*3 [mm] Soldering R:Reflow W:Wave Rated voltage [V] Rated voltage [V] Rated voltage [V] 6.3 6.3 c_mlcc_e-E02R01

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . CERAMIC CAPACITORS ■PARTS NUMBER 【Temperature Characteristic C6 : X6S】 1.25mm thickness（G） HTLT Rated voltage x ％ LMK212BC6226MG-T 10 X6S 22 μ ±20 10 150 1.25+0.20/-0 R JMK212BC6226MG-T 6.3 X6S 22 μ ±20 10 150 1.25+0.20/-0 R AMK212AC6226MG-T X6S 22 μ ±20 10 150 1.25+0.15/-0.05 R AMK212BC6476MG-T X6S 47 μ ±20 10 150 1.25+0.20/-0 R 【Temperature Characteristic C6 : X6S】 0.85mm thickness（D） HTLT Rated voltage x ％ LMK212AC6106[]D-T 10 X6S 10 μ ±10，±20 10 150 0.85±0.10 R 【Temperature Characteristic B7 : X7R】 1.25mm thickness（G） HTLT Rated voltage x ％ UMK212 B7104[]G-T X7R 0.1 μ ±10，±20 3.5 200 1.25±0.10 R/W UMK212 B7224[]G-T X7R 0.22 μ ±10，±20 3.5 150 1.25±0.10 R/W UMK212 B7474[]G-T X7R 0.47 μ ±10，±20 3.5 150 1.25±0.10 R/W UMK212 B7105[]G-T X7R 1 μ ±10，±20 10 150 1.25±0.10 R/W UMK212BB7225[]G-T X7R 2.2 μ ±10，±20 10 150 1.25+0.20/-0 R GMK212 B7105[]G-T 35 X7R 1 μ ±10，±20 3.5 150 1.25±0.10 R/W TMK212 B7105[]G-T X7R 1 μ ±10，±20 3.5 150 1.25±0.10 R TMK212 B7225[]G-TR X7R 2.2 μ ±10，±20 10 150 1.25±0.10 R TMK212AB7475[]G-T TMK212 B7475[]G-T X7R 4.7 μ ±10，±20 10 150 1.25+0.15/ -0.05 R EMK212 B7105[]G-T X7R 1 μ ±10，±20 3.5 200 1.25±0.10 R/W EMK212 B7225[]G-T X7R 2.2 μ ±10，±20 10 150 1.25±0.10 R EMK212 B7475[]G-T X7R 4.7 μ ±10，±20 10 150 1.25±0.10 R EMK212BB7106MG-T X7R 10 μ ±20 10 150 1.25+0.20/-0 R LMK212 B7105[]G-T X7R 1 μ ±10，±20 3.5 200 1.25±0.10 R/W LMK212 B7225[]G-T X7R 2.2 μ ±10，±20 5 200 1.25±0.10 R LMK212 B7475[]G-T X7R 4.7 μ ±10，±20 10 150 1.25±0.10 R LMK212AB7106MG-T LMK212 B7106MG-TD X7R 10 μ ±20 10 150 1.25+0.15/-0.05 R JMK212AB7106[]G-T JMK212 B7106[]G-T 6.3 X7R 10 μ ±10，±20 10 150 1.25+0.1 5/-0.05 R 【Temperature Characteristic B7 : X7R】 0.85mm thickness（D） HTLT Rated voltage x ％ UMK212AB7104[]D-T X7R 0.1 μ ±10，±20 10 150 0.85±0.10 R UMK212AB7224[]D-T X7R 0.22 μ ±10，±20 10 150 0.85±0.10 R UMK212AB7474[]D-T X7R 0.47 μ ±10，±20 10 150 0.85±0.10 R UMK212AB7105[]D-T X7R 1 μ ±10，±20 10 150 0.85±0.10 R TMK212AB7225[]D-TR 25 X7R 2.2 μ ±10，±20 10 150 0.85±0.10 R EMK212 B7474[]D-T X7R 0.47 μ ±10，±20 3.5 200 0.85±0.10 R/W EMK212 B7105[]D-T X7R 1 μ ±10，±20 5 200 0.85±0.10 R EMK212AB7225[]D-T EMK212 B7225[]D-T X7R 2.2 μ ±10，±20 5 150 0.85±0.10 R LMK212 B7105[]D-T X7R 1 μ ±10，±20 3.5 200 0.85±0.10 R LMK212AB7225[]D-T LMK212 B7225[]D-T X7R 2.2 μ ±10，±20 5 200 0.85±0.10 R LMK212AB7475[]D-TR LMK212 B7475[]D-TR X7R 4.7 μ ±10，±20 10 150 0.85±0.10R 【Temperature Characteristic F :F/Y5V】 1.25mm thickness（G） HTLT Rated voltage x ％ UMK212 F474ZG-T F Y5V 0.47 μ ＋80/-20 7 200 1.25±0.10 R/W UMK212 F105ZG-T F Y5V 1 μ ＋80/-20 7 200 1.25±0.10 R/W EMK212 F225ZG-T 16 F Y5V 2.2 μ ＋80/-20 7 200 1.25±0.10 R/W LMK212 F475ZG-T F Y5V 4.7 μ ＋80/-20 9 200 1.25±0.10 R LMK212 F106ZG-T F Y5V 10 μ ＋80/-20 16 200 1.25±0.10 R JMK212 F106ZG-T 6.3 F Y5V 10 μ ＋80/-20 16 200 1.25±0.10 R 【Temperature Characteristic F : F/Y5V】 0.85mm thickness（D） HTLT Rated voltage x ％ UMK212 F224ZD-T 50 F Y5V 0.22 μ ＋80/-20 7 200 0.85±0.10 R/W LMK212 F225ZD-T 10 F Y5V 2.2 μ ＋80/-20 9 200 0.85±0.10 R JMK212 F475ZD-T 6.3 F Y5V 4.7 μ ＋80/-20 16 200 0.85±0.10 R

316TYPE 【Temperature Characteristic BJ : B/Y5R】 1.6mm thickness（D） HTLT Rated voltage x ％ UMK316 BJ105[]L-T B X5R*1 1 μ ±10，±20 3.5 200 1.6±0.20 R UMK316 BJ225[]L-T X5R 2.2 μ ±10，±20 10 150 1.6±0.20 R UMK316 BJ475[]L-T X5R 4.7 μ ±10，±20 10 150 1.6±0.20 R UMK316BBJ106ML-T X5R 10 μ ±20 10 150 1.6±0.30 R TMK316 BJ225[]L-T B X5R*1 2.2 μ ±10，±20 3.5 200 1.6±0.20 R TMK316 BJ475[]L-T B X5R 4.7 μ ±10，±20 5 150 1.6±0.20 R TMK316 BJ106[]L-T X5R*1 10 μ ±10，±20 5 150 1.6±0.20 R TMK316BBJ226ML-T X5R 22 μ ±20 10 150 1.6±0.30 R EMK316 BJ225[]L-T B X5R*1 2.2 μ ±10，±20 3.5 200 1.6±0.20 R/W EMK316 BJ475[]L-T B X5R 4.7 μ ±10，±20 5 200 1.6±0.20 R EMK316 BJ106[]L-T B X5R*1 10 μ ±10，±20 5 150 1.6±0.20 R EMK316ABJ226ML-T EMK316 BJ226ML-T B X5R 22 μ ±20 10 150 1.6±0.20 R LMK316 BJ106[]L-T B X5R*1 10 μ ±10，±20 5 200 1.6±0.20 R LMK316ABJ226[]Ｌ-T LMK316 BJ226[]L-T B X5R 22 μ ±10，±20 10 150 1.6±0.20 R LMK316ABJ476ML-T LMK316 BJ476ML-T X5R 47 μ ±20 10 150 1.6±0.20 R Capacitance [F] tanδ [％] Capacitance tolerance [％] Capacitance tolerance [％] Rated voltage [V] tanδ [％] Capacitance tolerance [％] Temperature characteristics Thickness*3 [mm] Thickness*3 [mm] Thickness*3 [mm] Rated voltage [V] Thickness*3 [mm] tanδ [％] Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave tanδ [％] Thickness*3 [mm] Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave Temperature characteristics Thickness*3 [mm] Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave Capacitance [F] tanδ [％] Capacitance tolerance [％] Capacitance [F] Capacitance [F] Capacitance tolerance [％] Temperature characteristics Temperature characteristics Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Part number 1 Part number 2 Part number 1 Part number 2 Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Part number 1 Part number 2 Rated voltage [V]Part number 1 Part number 2 Rated voltage [V] Thickness*3 [mm] Capacitance tolerance [％] Capacitance [F] Capacitance tolerance [％] Capacitance [F] Capacitance [F] Part number 1 Part number 2 Temperature characteristics tanδ [％] tanδ [％] Soldering R:Reflow W:Wave Rated voltage [V] c_mlcc_e-E02R01

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . CERAMIC CAPACITORS ■PARTS NUMBER HTLT Rated voltage x ％ JMK316 BJ106[]L-T B X5R*1 10 μ ±10，±20 5 200 1.6±0.20 R JMK316ABJ226[]L-T JMK316 BJ226[]L-T B X5R 22 μ ±10，±20 10 200 1.6±0.20 R JMK316ABJ476ML-T JMK316 BJ476ML-T X5R 47 μ ±20 10 200 1.6±0.20 R JMK316ABJ107ML-T JMK316 BJ107ML-T X5R 100 μ ±20 10 150 1.6±0.20 R AMK316ABJ107ML-T AMK316 BJ107ML-T X5R 100 μ ±20 10 150 1.6±0.20 R AMK316BBJ157ML-T X5R 150 μ ±20 10 150 1.6±0.30 R 【Temperature Characteristic BJ : B/Y5R】 0.85mm thickness（D） HTLT Rated voltage x ％ UMK316 BJ105[]D-T B X5R 1 μ ±10，±20 3.5 150 0.85±0.10 R UMK316 BJ225[]D-T B X5R 2.2 μ ±10，±20 3.5 150 0.85±0.10 R UMK316ABJ475[]D-T UMK316 BJ475[]D-T X5R 4.7 μ ±10，±20 10 150 0.85±0.10 R TMK316 BJ105[]D-T B X5R 1 μ ±10，±20 3.5 200 0.85±0.10 R TMK316 BJ225[]D-T B X5R 2.2 μ ±10，±20 3.5 150 0.85±0.10 R TMK316 BJ475[]D-T X5R 4.7 μ ±10，±20 5 150 0.85±0.10 R TMK316ABJ106[]D-T TMK316 BJ106[]D-TD X5R 10 μ ±10，±20 10 150 0.85±0.10 R EMK316 BJ225[]D-T B X5R 2.2 μ ±10，±20 3.5 200 0.85±0.10 R EMK316 BJ475[]D-T B X5R 4.7 μ ±10，±20 5 200 0.85±0.10 R EMK316 BJ106[]D-T X5R 10 μ ±10，±20 10 150 0.85±0.10 R EMK316ABJ226MD-T EMK316 BJ226MD-T X5R 22 μ ±20 10 150 0.85±0.10 R LMK316 BJ475[]D-T B X5R 4.7 μ ±10，±20 5 200 0.85±0.10 R LMK316 BJ106[]D-T B X5R 10 μ ±10，±20 10 200 0.85±0.10 R LMK316ABJ226MD-T LMK316 BJ226MD-T X5R 22 μ ±20 10 150 0.85±0.10 R JMK316 BJ106[]D-T B X5R 10 μ ±10，±20 10 200 0.85±0.10 R JMK316ABJ226MD-T JMK316 BJ226MD-T X5R 22 μ ±20 10 150 0.85±0.10 R JMK316ABJ476MD-T JMK316 BJ476MD-T X5R 47 μ ±20 10 150 0.85±0.10 R 【Temperature Characteristic C7 : X7S】 1.6mm thickness（L） HTLT Rated voltage x ％ AMK316AC7476ML-T 4 X7S 47 μ ±20 10 150 1.6±0.20 R 【Temperature Characteristic C6 : X6S】 1.6mm thickness（L） HTLT Rated voltage x ％ EMK316BC6226ML-T 16 X6S 22 μ ±20 10 150 1.6±0.30 R JMK316AC6476ML-T 6.3 X6S 47 μ ±20 10 150 1.6±0.20 R AMK316AC6476ML-T X6S 47 μ ±20 10 200 1.6±0.20 R AMK316AC6107ML-T X6S 100 μ ±20 10 150 1.6±0.20 R 【Temperature Characteristic B7 : X7R】 1.6mm thickness（L） HTLT Rated voltage x ％ UMK316 B7224[]L-T X7R 0.22 μ ±10，±20 2.5 200 1.6±0.20 R/W UMK316 B7474[]L-T X7R 0.47 μ ±10，±20 3.5 200 1.6±0.20 R/W UMK316 B7105[]L-T X7R 1 μ ±10，±20 3.5 200 1.6±0.20 R UMK316 B7225[]L-T X7R 2.2 μ ±10，±20 10 150 1.6±0.20 R UMK316AB7475[]L-T UMK316 B7475[]L-T X7R 4.7 μ ±10，±20 10 150 1.6±0.20 R TMK316 B7105[]L-T X7R 1 μ ±10，±20 3.5 200 1.6±0.20 R/W TMK316 B7225[]L-T X7R 2.2 μ ±10，±20 3.5 200 1.6±0.20 R TMK316AB7475[]L-T TMK316 B7475[]L-T X7R 4.7 μ ±10，±20 10 200 1.6±0.20 R TMK316AB7106[]L-T TMK316 B7106[]L-TD X7R 10 μ ±10，±20 10 150 1.6±0.20 R EMK316 B7225[]L-T X7R 2.2 μ ±10，±20 3.5 200 1.6±0.20 R/W EMK316AB7106[]L-T EMK316 B7106[]L-TD X7R 10 μ ±10，±20 10 200 1.6±0.20 R LMK316 B7225[]L-T X7R 2.2 μ ±10，±20 3.5 200 1.6±0.20 R/W LMK316 B7475[]L-T X7R 4.7 μ ±10，±20 5 200 1.6±0.20 R LMK316AB7106[]L-T LMK316 B7106[]L-TD X7R 10 μ ±10，±20 10 200 1.6±0.20 R LMK316AB7226[]L-TR LMK316 B7226[]Ｌ-TD X7R 22 μ ±10，±20 10 150 1.6±0.20 R JMK316 B7106[]L-T 6.3 X7R 10 μ ±10，±20 5 200 1.6±0.20 R 【Temperature Characteristic B7 : X7R】 0.85mm thickness（D） HTLT Rated voltage x ％ UMK316 B7225[]D-T 50 X7R 2.2 μ ±10，±20 10 150 0.85±0.10 R TMK316AB7475[]D-T 25 X7R 4.7 μ ±10，±20 10 150 0.85±0.10 R LMK316AB7106MD-T 10 X7R 10 μ ±20 10 150 0.85±0.10 R 【Temperature Characteristic F : F/Y5V】 1.6mm thickness（L） HTLT Rated voltage x ％ GMK316 F106ZL-T 35 F Y5V 10 μ ＋80/-20 9 200 1.6±0.20 R TMK316 F106ZL-T 25 F Y5V 10 μ ＋80/-20 9 200 1.6±0.20 R EMK316 F106ZL-T 16 F Y5V 10 μ ＋80/-20 9 200 1.6±0.20 R LMK316 F226ZL-T 10 F Y5V 22 μ ＋80/-20 16 200 1.6±0.20 R 【Temperature Characteristic F : F/Y5V】 1.25mm thickness（G） HTLT Rated voltage x ％ UMK316 F225ZG-T 50 F Y5V 2.2 μ ＋80/-20 7 200 1.25±0.10 R/W GMK316 F475ZG-T 35 F Y5V 4.7 μ ＋80/-20 7 200 1.25±0.10 R Soldering R:Reflow W:Wave Capacitance [F] Capacitance tolerance [％] tanδ [％] Thickness*3 [mm]Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance [％] tanδ [％] Temperature characteristics tanδ [％] Capacitance [F] Part number 1 Part number 2 Temperature characteristics Part number 1 Thickness*3 [mm] Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Temperature characteristics Capacitance [F]Part number 2 Thickness*3 [mm] Capacitance [F] Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Part number 2 Rated voltage [V] Temperature characteristics Thickness*3 [mm] Thickness*3 [mm] Temperature characteristics Capacitance [F] Capacitance [F] Capacitance tolerance [％] Soldering R:Reflow W:Wave Thickness*3 [mm] tanδ [％] Soldering R:Reflow W:Wave Capacitance tolerance [％] Part number 1 tanδ [％] Capacitance tolerance [％] Capacitance [F] tanδ [％] tanδ [％] Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave Rated voltage [V] 6.3 Part number 2 Rated voltage [V] Part number 1 Part number 2 Rated voltage [V] Part number 1 Capacitance tolerance [％] Capacitance tolerance [％] Capacitance tolerance [％] Soldering R:Reflow W:Wave tanδ [％] Soldering R:Reflow W:Wave Thickness*3 [mm] Soldering R:Reflow W:Wave Thickness*3 [mm] Rated voltage [V] 6.3 c_mlcc_e-E02R01

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . CERAMIC CAPACITORS ■PARTS NUMBER 【Temperature Characteristic F : F/Y5V】 0.85mm thickness（D） HTLT Rated voltage x ％ LMK316 F475ZD-T 10 F Y5V 4.7 μ ＋80/-20 9 200 0.85±0.10 R JMK316 F106ZD-T 6.3 F Y5V 10 μ ＋80/-20 16 200 0.85±0.10 R

325TYPE 【Temperature Characteristic BJ : B/X5R】 2.5mm thickness（M） HTLT Rated voltage x ％ UMK325 BJ475[]M-T X5R 4.7 μ ±10，±20 5 150 2.5±0.20 R UMK325 BJ106[]M-T X5R 10 μ ±10，±20 5 150 2.5±0.20 R GMK325 BJ226MM-T 35 X5R 22 μ ±20 10 150 2.5±0.20 R TMK325 BJ106[]M-T B X5R*1 10 μ ±10，±20 3.5 150 2.5±0.20 R TMK325 BJ226[]M-T X5R 22 μ ±10，±20 5 150 2.5±0.20 R TMK325ABJ476MM-T X5R 47 μ ±20 10 150 2.5±0.30 R EMK325 BJ226[]M-T B X5R 22 μ ±10，±20 5 150 2.5±0.20 R EMK325 BJ476MM-T X5R 47 μ ±20 10 150 2.5±0.20 R LMK325 BJ226[]M-T B X5R 22 μ ±10，±20 5 200 2.5±0.20 R LMK325 BJ476MM-T X5R 47 μ ±20 10 150 2.5±0.20 R LMK325ABJ107MM-T LMK325 BJ107MM-T X5R 100 μ ±20 10 150 2.5±0.30 R JMK325 BJ476MM-T X5R 47 μ ±20 10 150 2.5±0.20 R JMK325ABJ107MM-T JMK325 BJ107MM-T X5R 100 μ ±20 10 150 2.5±0.30 R JMK325ABJ227MM-T X5R 220 μ ±20 10 150 2.5±0.30 R AMK325ABJ227MM-T 4 X5R 220 μ ±20 10 150 2.5±0.30 R 【Temperature Characteristic BJ : B/X5R】 1.9mm thickness（Y,N） HTLT Rated voltage x ％ UMK325 BJ475[]N-T 50 X5R 4.7 μ ±10，±20 10 150 1.9±0.20 R GMK325 BJ225MN-T B X5R 2.2 μ ±20 3.5 200 1.9±0.20 R GMK325 BJ475[]N-T X5R 4.7 μ ±10，±20 10 150 1.9±0.20 R GMK325 BJ106[]N-T B X5R 10 μ ±10，±20 5 150 1.9±0.20 R TMK325 BJ335MN-T B X5R*1 3.3 μ ±20 3.5 200 1.9±0.20 R TMK325 BJ475[]N-T B X5R*1 4.7 μ ±10，±20 3.5 200 1.9±0.20 R TMK325 BJ106[]N-T B X5R 10 μ ±10，±20 5 200 1.9±0.20 R EMK325 BJ475[]N-T B X5R*1 4.7 μ ±10，±20 3.5 200 1.9±0.20 R EMK325 BJ106[]N-T B X5R 10 μ ±10，±20 3.5 200 1.9±0.20 R EMK325 BJ476MY-T X5R 47 μ ±20 10 150 1.9+0.1/-0.2 R LMK325 BJ226MY-T B X5R 22 μ ±20 5 150 1.9+0.1/-0.2 R LMK325 BJ106[]N-T B X5R 10 μ ±10，±20 3.5 200 1.9±0.20 R JMK325 BJ226MY-T B X5R 22 μ ±20 5 200 1.9+0.1/-0.2 R JMK325 BJ107MY-T X5R 100 μ ±20 10 150 1.9+0.1/-0.2 R JMK325 BJ476MN-T X5R 47 μ ±20 10 150 1.9±0.20 R 【Temperature Characteristic BJ : B/X5R】 0.85mm thickness（D） HTLT Rated voltage x ％ TMK325 BJ106[]D-T 25 B X5R 10 μ ±10，±20 5 150 0.85±0.10 R EMK325 BJ106[]D-T B X5R 10 μ ±10，±20 5 150 0.85±0.10 R EMK325 BJ226MD-T B X5R 22 μ ±20 10 150 0.85±0.10 R LMK325 BJ335[]D-T B X5R 3.3 μ ±10，±20 3.5 200 0.85±0.10 R LMK325 BJ475[]D-T B X5R 4.7 μ ±10，±20 5 200 0.85±0.10 R LMK325 BJ106[]D-T B X5R 10 μ ±10，±20 5 150 0.85±0.10 R 【Temperature Characteristic C7 : X7S】 2.5mm thickness（M） HTLT Rated voltage x ％ JMK325AC7107MM-T 6.3 X7S 100 μ ±20 10 150 2.5±0.30 R 【Temperature Characteristic C6 : X6S】 2.5mm thickness（M） HTLT Rated voltage x ％ EMK325AC6476MM-T 16 X6S 47 μ ±20 10 150 2.5±0.30 R JMK325AC6107MM-T 6.3 X6S 100 μ ±20 10 150 2.5±0.30 R 【Temperature Characteristic B7 : X7R】 2.5mm thickness（M） HTLT Rated voltage x ％ UMK325 B7475[]M-T X7R 4.7 μ ±10，±20 5 150 2.5±0.20 R UMK325AB7106[]M-T X7R 10 μ ±10，±20 10 150 2.5±0.30 R TMK325AB7106[]M-T X7R 10 μ ±10，±20 10 150 2.5±0.30 R TMK325 B7226[]M-TR X7R 22 μ ±10，±20 10 150 2.5±0.20 R EMK325 B7226[]M-TR 16 X7R 22 μ ±10，±20 10 150 2.5±0.20 R LMK325 B7476[]M-TR 10 X7R 47 μ ±10，±20 10 150 2.5±0.20 R JMK325 B7476[]M-TR 6.3 X7R 47 μ ±10，±20 10 200 2.5±0.20 R Rated voltage [V] Rated voltage [V] Thickness*3 [mm] Part number 1 Part number 2 Capacitance tolerance [％] tanδ [％] tanδ [％] Capacitance tolerance [％] Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance [％] Capacitance tolerance [％] tanδ [％] Capacitance [F] tanδ [％] Soldering R:Reflow W:Wave Part number 1 Part number 2 Temperature characteristics Capacitance [F] Capacitance tolerance [％] Part number 1 Part number 2 Part number 1 Part number 2 Temperature characteristicsRated voltage [V] Temperature characteristics Part number 1 Part number 2 Temperature characteristics Capacitance [F] Temperature characteristics Capacitance [F] Temperature characteristics Soldering R:Reflow W:Wave Thickness*3 [mm] Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave Thickness*3 [mm] Soldering R:Reflow W:Wave Thickness*3 [mm] Capacitance [F] Soldering R:Reflow W:Wave Thickness*3 [mm] Thickness*3 [mm] Thickness*3 [mm] Capacitance [F] Capacitance tolerance [％] Capacitance tolerance [％] tanδ [％] tanδ [％] tanδ [％] Soldering R:Reflow W:Wave Rated voltage [V] Rated voltage [V] Part number 1 Part number 2 Rated voltage [V] 6.3 6.3 Part number 2 Part number 1 c_mlcc_e-E02R01

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . CERAMIC CAPACITORS ■PARTS NUMBER 【Temperature Characteristic B7 : X7R】 1.9mm thickness（N） HTLT Rated voltage x ％ UMK325 B7475[]N-TR 50 X7R 4.7 μ ±10，±20 10 150 1.9±0.20 R TMK325 B7335[]N-T X7R 3.3 μ ±10，±20 3.5 200 1.9±0.20 R TMK325 B7475[]N-T X7R 4.7 μ ±10，±20 3.5 150 1.9±0.20 R TMK325 B7106[]N-TR X7R 10 μ ±10，±20 10 150 1.9±0.20 R EMK325 B7475[]N-T X7R 4.7 μ ±10，±20 3.5 200 1.9±0.20 R EMK325 B7106[]N-T X7R 10 μ ±10，±20 3.5 150 1.9±0.20 R LMK325 B7106[]N-T 10 X7R 10 μ ±10，±20 3.5 200 1.9±0.20 R 【Temperature Characteristic F : F/Y5V】 1.9mm thickness（N） HTLT Rated voltage x ％ EMK325 F226ZN-T 16 F Y5V 22 μ ＋80/-20 16 200 1.9±0.20 R LMK325 F226ZN-T 10 F Y5V 22 μ ＋80/-20 16 200 1.9±0.20 R JMK325 F476ZN-T 6.3 F Y5V 47 μ ＋80/-20 16 200 1.9±0.20 R Multilayer Ceramic Capacitors（Temperature compensating type）

042TYPE 【Temperature Characteristic CG : CG/C0G】 0.2mm thickness（C,D） HTLT Rated voltage x ％ EMK042 CG010[]D-W CG C0G 1 p ±0.1pF, ±0.25pF 420 200 0.2±0.02 R EMK042 CG020[]D-W CG C0G 2 p ±0.1pF, ±0.25pF 440 200 0.2±0.02 R EMK042 CG030[]D-W CG C0G 3 p ±0.1pF, ±0.25pF 460 200 0.2±0.02 R EMK042 CG040[]D-W CG C0G 4 p ±0.1pF, ±0.25pF 480 200 0.2±0.02 R EMK042 CG050[]D-W CG C0G 5 p ±0.1pF, ±0.25pF 500 200 0.2±0.02 R EMK042 CG5R1DD-W CG C0G 5.1 p ±0.5pF 502 200 0.2±0.02 R EMK042 CG5R2DD-W CG C0G 5.2 p ±0.5pF 504 200 0.2±0.02 R EMK042 CG5R3DD-W CG C0G 5.3 p ±0.5pF 506 200 0.2±0.02 R EMK042 CG5R4DD-W CG C0G 5.4 p ±0.5pF 508 200 0.2±0.02 R EMK042 CG5R5DD-W CG C0G 5.5 p ±0.5pF 510 200 0.2±0.02 R EMK042 CG5R6DD-W CG C0G 5.6 p ±0.5pF 512 200 0.2±0.02 R EMK042 CG5R7DD-W CG C0G 5.7 p ±0.5pF 514 200 0.2±0.02 R EMK042 CG5R8DD-W CG C0G 5.8 p ±0.5pF 516 200 0.2±0.02 R EMK042 CG5R9DD-W CG C0G 5.9 p ±0.5pF 518 200 0.2±0.02 R EMK042 CG060DD-W CG C0G 6 p ±0.5pF 520 200 0.2±0.02 R EMK042 CG6R1DD-W CG C0G 6.1 p ±0.5pF 522 200 0.2±0.02 R EMK042 CG6R2DD-W CG C0G 6.2 p ±0.5pF 524 200 0.2±0.02 R EMK042 CG6R3DD-W CG C0G 6.3 p ±0.5pF 526 200 0.2±0.02 R EMK042 CG6R4DD-W CG C0G 6.4 p ±0.5pF 528 200 0.2±0.02 R EMK042 CG6R5DD-W CG C0G 6.5 p ±0.5pF 530 200 0.2±0.02 R EMK042 CG6R6DD-W CG C0G 6.6 p ±0.5pF 532 200 0.2±0.02 R EMK042 CG6R7DD-W CG C0G 6.7 p ±0.5pF 534 200 0.2±0.02 R Rated voltage [V] Thickness*3 [mm] Thickness*3 [mm] Part number 2 Part number 1 Part number 2 Capacitance [F] Capacitance tolerance [％] Temperature characteristics Part number 1 Soldering R:Reflow W:Wave tanδ [％] Soldering R:Reflow W:Wave Thickness*3 [mm] tanδ [％] Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Capacitance tolerance [％] Capacitance tolerance [％] Temperature characteristics Capacitance [F] Capacitance [F] Q (at 1MHz) min Soldering R:Reflow W:Wave Rated voltage [V] c_mlcc_e-E02R01

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E02R01 Multilayer Ceramic Capacitors ■PACKAGING ①Minimum Quantity

Taped package Type(EIA) Thickness Standard quantity [pcs] mm code Paper tape Embossed tape □MK042(01005) 0.2 C, D － 40000 □VS042(01005) 0.2 C □MK063(0201) 0.3 P, T 15000 □WK105(0204) ※ 0.3 P 10000 □MK105(0402)

0.2 C 20000

0.3 P 15000

0.5 V 10000 □VK105(0402) ※ 0.5 W □MK107(0603) □WK107(0306) ※ □MR107(0603)

0.45 K 4000

0.5 V － 4000

0.8 A 4000 － □MK212(0805) □WK212(0508) ※ □MR212(0805) 0.45 K 0.85 D

125 G － 3000

□MK316(1206) □MR316(1206)

1.15 F － 3000 125 G

□MK325(1210) □MR325(1210) 0.85 D － 2000 1.15 F 1.9 N 2.0max. Y □MK432(1812) 2.5 M － 500 N o t e : ※ L W R e v e r s e t y p e . ②Taping material ※No bottom tape for pressed carrier tape

Card board carrier tape Top tape Base tape Sprocket hole Bottom tape Chip cavity
Embossed tape Top tape Base tape Sprocket hole Chip cavity Chip filled Chip

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E02R01 ③Representative taping dimensions

Paper Tape（8mm wide）
Pressed carrier tape（ 2mm pitch） Type(EIA) Chip Cavity Insertion Pitch Tape Thickness ＡＢＦＴ T1 □MK063(0201) 0.37 0.67 2.0±0.05 0.45max. 0.42max. □WK105(0204) ※ Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type. Unit：m m
Punched carrier tape （2mm pitch） Type(EIA) Chip Cavity Insertion Pitch Tape Thickness ＡＢＦＴ □MK105 (0402) Unit：mm
Punched carrier tape （4mm pitch） Type(EIA) Chip Cavity Insertion Pitch Tape Thickness ＡＢＦＴ □MK107(0603) □WK107(0306) ※ □MR107(0603) 1.0 1.8 4.0±0.1 1.1max. □MK212(0805) □MK316(1206) 2.0 3.6 Note：Taping size might be different depending on the size of the product. ※ LW Reverse type. Unit：mm

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E02R01

Embossed tape（4mm wide） Type(EIA) Chip Cavity Insertion Pitch Tape Thickness ＡＢＦ K T Unit：mm
Embossed tape（8mm wide） Type(EIA) Chip Cavity Insertion Pitch Tape Thickness ＡＢＦ K T 4.0±0.1 1.3max. 0.25±0.1 □MK212(0805) □MR212(0805) 1.65 2.4 3.4max. 0.6max. □MK316(1206) □MR316(1206) 2.0 3.6 □MK325(1210) □MR325(1210) 2.8 3.6 Note： ※ LW Reverse type. Unit：mm
Embossed tape（12mm wide） Type(EIA) Chip Cavity Insertion Pitch Tape Thickness ＡＢＦ K T Unit：mm

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E02R01 ④Trailer and Leader B l a n k p o r t i o n C h i p c a v i t y B l a n k p o r t i o n L e a d e r 160mm or more (6.3inches or more) Direction of tape feed 100mm or more (3.94inches or more) 400mm or more (15.7inches or more) ⑤Reel size E C D R B t A W A B C D E R T W 4mm wide tape 1.5max. 5±1.0 8mm wide tape 2.5max. 10±1.5 12mm wide tape 2.5max. 14±1.5 Unit：mm ⑥Top Tape Strength The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below. 0～20° Top tape Base tape Pull direction ⑦Bulk Cassette The exchange of individual specification is necessary. Please contact Taiyo Yuden sales channels. Shutter 36＋0/－0.2 12±0.1 Slider Connecting Port 110±0.7 31.5＋0.2/－0 36＋0/－0.2 12.0±0.1 8.8±0.1 6.8±0.1 Unit：mm

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E02R01 Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and High Reliability Application Multilayer Ceramic Capacitors are noted separately. Multilayer Ceramic Capacitors ■RELIABILITY DATA 1.Operating Temperature Range Specified Value Temperature Compensating（Class1） Standard －55 to ＋125℃ High Frequency Type High Permittivity （Class2） Specification Temperature Range BJ B －25 to ＋85℃ X5R －55 to ＋85℃ B7 X7R －55 to ＋125℃ C6 X6S －55 to ＋105℃ C7 X7S －55 to ＋125℃ LD(※) X5R －55 to ＋85℃ F F －25 to ＋85℃ Y5V －30 to ＋85℃ Note: ※LD Low distortion high value multilayer ceramic capacito r 2. Storage Conditions Specified Value Temperature Compensating（Class1） Standard －55 to ＋125℃ High Frequency Type High Permittivity （Class2） Specification Temperature Range BJ B －25 to ＋85℃ X5R －55 to ＋85℃ B7 X7R －55 to ＋125℃ C6 X6S －55 to ＋105℃ C7 X7S －55 to ＋125℃ LD(※) X5R －55 to ＋85℃ F F －25 to ＋85℃ Y5V －30 to ＋85℃ Note: ※LD Low distortion high value multilayer ceramic capacito r 3. Rated Voltage Specified Value Temperature Compensating（Class1） Standard 50VDC, 25VDC, 16VDC High Frequency Type 50VDC, 25VDC, 16VDC High Permittivity （Class2） 50VDC , 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC 4. Withstanding Voltage （Between terminals） Specified Value Temperature Compensating（Class1） Standard No breakdown or damage High Frequency Type High Permittivity （Class2） Test Methods and Remarks Class 1 Class 2 Applied voltage Rated voltage×3 Rated voltage×2.5 Duration 1 to 5 sec. Charge/discharge current 50mA max. 5. Insulation Resistance Specified Value Temperature Compensating（Class1） Standard 10000 MΩ min. High Frequency Type High Permittivity （Class2） Note 1 C≦0.047μF : 10000 MΩ min. C＞0.047μF : 500MΩ・μF Test Methods and Remarks Applied voltage : Rated voltage Duration : 60±5 sec. Charge/discharge current : 50mA max.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E02R01 6. Capacitance （Tolerance） Specified Value Temperature Compensating（Class1） Standard SL 0.2pF≦C≦5pF : ±0.25pF 0.2pF≦C≦10pF : ±0.5pF C＞10pF : ±5% or ±10% High Frequency Type CH 0.2pF≦C≦2pF : ±0.1pF C＞2pF : ±5% High Permittivity （Class2） F : ＋80/－20% Note: ※LD Low distortion high value multilayer ceramic capacito r Test Methods and Remarks Class 1 Class 2 Standard High Frequency Type C≦10μF C＞10μF Preconditioning None Thermal treatment （at 150℃ for 1hr） Note 2 Measuring frequency 1ＭHz±10% 1kHz±10% 120±10Hz Measuring voltage Note 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1Vrms Bias application None 7. Q or Dissipation Factor Specified Value Temperature Compensating（Class1） Standard C＜30pF : Q≧400＋20C C≧30pF : Q≧1000 （ C ： N o m i n a l c a p a c i t ance） High Frequency Type Refer to detailed specification High Permittivity （Class2） Note 1 BJ, B7, C6, C7：2.5% max., F： 7% max. Test Methods and Remarks Class 1 Class 2 Standard High Frequency Type C≦10μF C＞10μF Preconditioning None Thermal treatment （at 150℃ for 1hr） Note 2 Measuring frequency 1ＭHz±10% 1GHz 1ｋHz±10% 120±10Hz Measuring voltage Note 1 0.5 t o 5Vrms 1±0.2Vrms 0.5±0.1Vrms Bias application None High Frequency Type Measuring equipment : HP4291A Measuring jig : HP16192A 8. Temperature Characteristic （Without voltage application） Specified Value Temperature Compensating（Class1） Standard Temperature Characteristic ［ppm/℃］ Tolerance ［ppm/℃］ C□ : 0 CG,CH, CJ, CK G : ±30 H : ±60 J : ±120 K : ±250 U□ : －750 UJ, UK SL : ＋350 to －1000 High Frequency Type Temperature Characteristic ［ppm/℃］ Tolerance ［ppm/℃］ C□ : 0 CH H : ±60 High Permittivity （Class2） Specification Capacitance change Reference temperature Temperature Range BJ B ±10% 20℃ －25 to ＋85℃ B7 X7R ±15% 25℃ －55 to ＋125℃ C6 X6S ±22% 25℃ －55 to ＋105℃ C7 X7S ±22% 25℃ －55 to ＋125℃ Note : ※LD Low distortion high value multilayer ceramic capaci tor Test Methods and Remarks Class 1 Capacitance at 20℃ and 85℃ shall be measured in thermal equilib rium, and the temperature characteristic shall be calculated fr om the following equation. C20×△T △T＝65 Class 2 Capacitance at each step shall be measured in thermal equilibri um, and the temperature characteristic shall be calculated from the following equation. Step B、F X5R、X7R、X6S、X7S、Y5V

1 Minimum operating temperature

2 20℃ 25℃

3 Maximum operating temperature

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E02R01 C ：Capacitance in Step 1 or Step 3 C2 ：Capacitance in Step 2 9. Deflection Specified Value Temperature Compensating（Class1） Standard Appearance : No abnormality Capacitance change : Within ±5% or ±0.5 pF, whichever is larger . High Frequency Type Appearance : No abnormality Capacitance change : Within±0.5 pF High Permittivity （Class2） Appearance : No abnormality Capacitance change : Within ±12.5%（BJ, B7, C6, C7,LD(※)） Within ±30%（F） Note: ※LD Low distortion high value multilayer ceramic capacito r Test Methods and Remarks Multilayer Ceramic Capacitors 042, 063, ※105 Type The other types Board Glass epoxy-resin substrate Thickness 0.8mm 1.6mm Warp 1mm Duration 10 sec. ※105 Type thickness, C： 0.2mm ,P： 0.3mm. Capacitance measurement shall be conducted with the board bent 10. Body Strength Specified Value Temperature Compensating（Class1） Standard － High Frequency Type No mechanical damage. High Permittivity （Class2）－ Test Methods and Remarks High Frequency Type Applied force : 5N Duration : 10 sec. 11. Adhesive Strength of Terminal Electrodes Specified Value Temperature Compensating（Class1） Standard No terminal separation or its indication. High Frequency Type High Permittivity （Class2） Test Methods and Remarks Multilayer Ceramic Capacitors 042, 063 Type 105 Type or more Applied force 2N 5N Duration 30±5 sec. 12. Solderability Specified Value Temperature Compensating（Class1） Standard At least 95% of terminal electrode is covered by new solder. High Frequency Type High Permittivity （Class2） Test Methods and Remarks Eutectic solder Lead-free solder Solder type H60A or H63A Sn-3.0Ag-0.5Cu Solder temperature 230±5℃ 245±3℃ Duration 4±1 sec.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E02R01 13. Resistance to Soldering Specified Value Temperature Compensating（Class1） Standard Appearance : No abnormality Capacitance change : Within ±2. 5% or ±0.25pF, whichever is larger. Q : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality High Frequency Type Appearance : No abnormality Capacitance change : Within ±2.5% Q : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality High Permittivity （Class2） Note 1 Appearance : No abnormality Capacitance change : Within ± 7.5%（BJ, B7, C6, C7, LD(※)） Within ±20%（F） Dissipation factor : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals）: No abnormality Note: ※LD Low distortion high value multilayer ceramic capacito r Test Methods and Remarks Class 1 042, 063 Type 105 Type Preconditioning None Preheating 150℃, 1 to 2 min. 80 to 100℃, 2 to 5 min. 150 to 200℃, 2 to 5 min. Solder temp. 270±5℃ Duration 3±0.5 sec. Recovery 6 to 24 hrs （Standard condition） Note 5 Class 2 042、063 Type 105, 107, 212 Type 316, 325 Type Preconditioning Thermal treatment （at 150℃ for 1 hr） Note 2 Preheating 150℃, 1 to 2 min. 80 to 100℃, 2 to 5 min. 150 to 200℃, 2 to 5 min. 80 to 100℃, 5 to 10 min. 150 to 200℃, 5 to 10 min. Solder temp. 270±5℃ Duration 3±0.5 sec. Recovery 24±2 hrs （Standard condition） Note 5 14. Temperature Cycle (Thermal Shock） Specified Value Temperature Compensating（Class1） Standard Appearance : No abnormality Capacitance change : Within ±2. 5% or ±0.25pF, whichever is larger. Q : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality High Frequency Type Appearance : No abnormality Capacitance change : Within ±0.25pF Q : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality High Permittivity （Class2） Note 1 Appearance : No abnormality Capacitance change : Within ±7. 5% （BJ, B7, C6, C7, LD(※)） Within ±20% （F） Dissipation factor : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Note: ※LD Low distortion high value multilayer ceramic capacito r Test Methods and Remarks Class 1 Class 2 Preconditioning None Thermal treatment （at 150℃ for 1 hr） Note 2 1 cycle Step Temperature（℃） Time（min.）

1 Minimum operating temperature 30±3

2 Normal temperature 2 to 3

3 Maximum operating temperature 30±3

4 Normal temperature 2 to 3

Recovery 6 to 24 hrs （Standard condition） Note 5 24±2 hrs （Stan dard condition） Note 5

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E02R01 15. Humidity （Steady State） Specified Value Temperature Compensating（Class1） Standard Appearance : No abnormality Capacitance change : Within ±5% or ±0.5pF, whichever is larger. Q : C＜10pF : Q≧200＋10C C≧30pF:Q≧350（C：Nominal capacitance） Insulation resistance : 1000 MΩ min. High Frequency Type Appearance : No abnormality Capacitance change : Within ±0.5pF, Insulation resistance : 1000 MΩ min. High Permittivity （Class2） Note 1 Appearance : No abnormality Capacitance change : Within ±12.5% （BJ, B7, C6, C7, LD(※)） Within ±30% （F） Dissipation factor : 5.0% max.（BJ, B7, C6, C7, LD(※)） 11.0% max.（F） Insulation resistance : 50 MΩμF or 1000 MΩ whichever is smaller . Note: ※LD Low distortion high value multilayer ceramic capacito r Test Methods and Remarks Class 1 Class 2 Standard High Frequency Type All items Preconditioning None Thermal treatment（ at 150℃ for 1 hr） Note 2 Humidity 90 to 95%RH 90 to 95%RH Duration 500＋24/－0 hrs 500＋24/－0 hrs Recovery 6 to 24 hrs （Standard condition） Note 5 24±2 hrs （Stan dard condition） Note 5 16. Humidity Loading Specified Value Temperature Compensating（Class1） Standard Appearance : No abnormality Capacitance change : Within ±7. 5% or ±0.75pF, whichever is larger. Q : C＜30pF：Q≧100＋10C/3 C≧30pF：Q≧200 （C：Nominal capacitance） Insulation resistance : 500 MΩ min. High Frequency Type Appearance : No abnormality Capacitance change : C≦2pF：Within ±0.4 pF C＞2pF：Within ±0.75 pF （ C ： N o m i n a l c a p a c i t ance） Insulation resistance : 500 MΩ min. High Permittivity （Class2） Note 1 Appearance : No abnormality Capacitance change : Within ±12.5% （BJ, B7, C6, C7, LD(※)） Within ±30% （F） Dissipation factor : 5.0% ma x. （BJ, B7, C6, C7, LD(※)） 11.0% max. （F） Insulation resistance : 25 MΩμF or 500 MΩ, whichever is smaller . Note: ※LD Low distortion high value multilayer ceramic capacito r Test Methods and Remarks Class 1 Class 2 Standard High Frequency Type All items Preconditioning None Voltage treatment （Rated voltage are applied for 1 hour at 40℃） Note 3 Humidity 90 to 95%RH 90 to 95%RH Duration 500＋24/－0 hrs 500＋24/－0 hrs Applied voltage Rated voltage Rated voltage Charge/discharge current 50mA max. 50mA max. Recovery 6 to 24 hrs （Standard condition） Note 5 24±2 hrs（Stan dard condition） Note 5

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E02R01 17. High Temperature Loading Specified Value Temperature Compensating（Class1） Standard Appearance : No abnormality Capacitance change : Within ±3% or ±0.3pF, whichever is larger. Q : C＜10pF： Q≧200＋10C C≧30pF： Q≧350（C：Nominal capacitance） Insulation resistance : 1000 MΩ min. High Frequency Type Appearance : No abnormality Capacitance change : Within ±3% or ±0.3pF, whichever is larger. Insulation resistance : 1000 MΩ min. High Permittivity （Class2） Note 1 Appearance : No abnormality Capacitance change : Within ±12.5% （BJ, B7, C6, C7, LD(※)） Within ±30% （F） Dissipation factor : 5.0% max.（BJ, B7, C6, C7, LD(※)） 11.0% max.（F） Insulation resistance : 50 MΩμF or 1000 MΩ, whichever is smalle r. Note: ※LD Low distortion high value multilayer ceramic capacito r Test Methods and Remarks Class 1 Class 2 Standard High Frequency Type BJ, LD(※), F C6 B7, C7 Preconditioning None Voltage treatment（Twice the rated voltage shall be applied for 1 hour at 85℃, 105℃ or 125℃） Note 3, 4 Temperature Maximum operating temperature Maximum operating te mperature Duration 1000＋48/－0 hrs 1000＋48/－0 hrs Applied voltage Rated voltage×2 Rated voltage×2 Note 4 Charge/discharge current 50mA max. 50mA max. Recovery 6 to 24hr （Standard condition） Note 5 24±2 hrs （Stand ard condition） Note 5 Note: ※LD Low distortion high value multilayer ceramic capacito r Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail. Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kep t at room temperature for 24±2hours. Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and kept at room temperature for 24±2 hours. Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information. Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning m e a s u r e m e n t r e s u l t s , i n o r d e r t o p r o v i d e c o r r e l a t i o n d a ta, the test shall be conducted under the following condition. Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the "standard condition".

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E02R01 High Reliability Application Multilayer Ceramic Capacitors are noted separately. Precautions on the use of Multilayer Ceramic Capacitors ■PRECAUTIONS 1. Circuit Design Precautions ◆Verification of operating environment, electrical rating and performance 1. A malfunction of equipment in fields such as medical, aerosp ace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications. Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general purpose applications. ◆Operating Voltage （Verifi cation of Rated voltage） 1. The operating voltage for capacitors must always be their rated voltage or less. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less. For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less. 2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage having rapid rise time is used in a circuit. 2. PCB Design Precautions ◆Pattern configurations （D esign of Land-patterns） 1. When capacitors are mounted on PCBs, the amount of solder us ed （size of fillet） can directly affect the capacitor performan ce. Therefore, the following items must be carefully considered in the design of land patterns: （1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper amount of solder. （2）When more than one component are jointly soldered onto the s ame land, each component's soldering point shall be separated b y solder-resist. ◆Pattern configurations （Capacitor layout on PCBs） After capacitors are mounted on boards, they can be subjected t o mechanical stresses in subsequent manufacturing processes （PC B cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern configurations and positions of capacitors shall be carefully considered to minimize stresses. Technical considerations ◆Pattern configurations （D esign of Land-patterns） The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts. （1）Recommended land dimensions for typical chip capacitors

Multilayer Ceramic Capacitors : Recommended land dimensions （unit: mm） Wave-soldering Type 107 212 316 325 Size L 1.6 2.0 3.2 3.2 W 0.8 1.25 1.6 2.5 Land patterns for PCBs C B A B Chip capacitor Land pattern Solder-resist L W Chip capacitor Reflow-soldering Type 042 063 105 107 212 316 325 432 Note：Recommended land size might be different according to the allowance of the size of the product.
LWDC: Recommended land dimensions for reflow-soldering （unit: mm） Type 105 107 212 Size L 0.52 0.8 1.25 W 1.0 1.6 2.0 L W LWDC

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E02R01 （2）Examples of good and bad solder application Item Not recommended Recommended Mixed mounting of SMD and leaded components Lead wire of component Solder-resist Component placement close to the chassis Chassis Solder (for grounding) Electrode pattern Solder-resist Hand-soldering of leaded components near mounted components Soldering iron Lead wire of component Solder-resist Horizontal component placement Solder-resist ◆Pattern configurations （Capacitor layout on PCBs） 1-1. The following is examples of good and bad capacitor layout s ; c a p a c i t o r s s h a l l b e l o c a t e d t o m i n i m i z e a n y p o s s i b l e m e c hanical stresses from board warp or deflection. Items Not recommended Recommended Deflection of board Place the product at a right angle to the direction of the anticipated mechanical stress. 1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below. E D C A B Slit Magnitude of stress A＞B＝C＞D＞E Perforation 1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location. 3. Mounting Precautions ◆Adjustment of mounting machine 1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them. 2. Maintenance and inspection of mounting machines shall be conducted periodically. ◆Selection of Adhesives 1. When chips are attached on PCBs with adhesives prior to sold ering, it may cause capacitor characteristics degradation unles s the following factors are appropriately checked : size of land patt erns, type of adhesive, amount applied, hardening temperature a nd hardening period. Therefore, please contact us for further information.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E02R01 Technical considerations ◆Adjustment of mounting machine 1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points shall be considerable. （1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection. （2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads. （3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins sh all be used on the other side of the PCB. The following diagrams show s o m e t y p i c a l e x a m p l e s o f g o o d a n d b a d p i c k - u p n o z z l e placement: Item Improper method Proper method Single-sided mounting chipping or cracking supporting pins or back-up pins Double-sided mounting chipping or cracking supporting pins or back-up pins 2. As the alignment pin is worn out, adjustment of the nozzle h eight can cause chipping or cracking of capacitors because of m echanical impact on the capacitors. To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted periodically. ◆Selection of Adhesives Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions shall be noted in the application of adhesives. （1）Required adhesive characteristics a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive shall have sufficient strength at high temperatures. c. The adhesive shall have good coating and thickness consistency. d. The adhesive shall be used during its prescribed shelf life. e. The adhesive shall harden rapidly. f. The adhesive shall have corrosion resistance. g. The adhesive shall have excellent insulation characteristics. h. The adhesive shall have no emission of toxic gasses and no effect on the human body. （2）The recommended amount of adhesives is as follows; ［Recommended condition］ Figure 212/316 case sizes as examples a 0.3mm min b 100 to 120μm c Adhesives shall not contact land Amount adhesive aa b After capacitor are bonded c c 4. Soldering Precautions ◆Selection of Flux Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; （1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equi valent） of halogenated content. Flux having a strong acidity co ntent shall not be applied. （2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level. （3）When water-soluble flux is used, special care shall be taken to properly clean the boards. ◆Soldering Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions. Sn-Zn solder paste can adversely affect MLCC reliability. Please contact us prior to usage of Sn-Zn solder. Technical considerations ◆Selection of Flux 1-1. When too much halogenated substance（Chlorine, etc.） conten t is used to activate flux, or highly acidic flux is used, it m ay lead to corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors. 1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolve d in moisture in the air, the residues on the surfaces of capac itors in high humidity conditions may cause a degradation of insulation resis tance and reliability of the capacitors. Therefore, the cleanin g methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E02R01 ◆Soldering ･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. ･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive t hermal shock. ･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃. ･ Cooling : The temperature difference between the capacitors a nd cleaning process shall not be greater than 100℃. ［Reflow soldering］【Recommended conditions for eutectic soldering】 Preheating 230℃ Within 10sec. Slow cooling 60sec. Min. 60sec Min. 300 200 100 Temperature（℃）【Recommended condition for Pb-free soldering】 Peak 260℃ Max. Within 10sec. Slow cooling Heating above 230℃ 40sec. Max. 300 200 100 Temperature（℃） Preheating150℃ 60sec. Min. Caution ①The ideal condition is to have solder mass（fillet）controlled t o 1/2 to 1/3 of the thickness of a capacitor. ②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as close to recommended times as possible. 1/2T～1/3T PC board Solder Capacitor T ［Wave soldering］【Recommended conditions for eutectic soldering】 230～250℃ Within 3sec. Slow cooling Preheating 120sec. Min. 300 200 100 Temperature（℃）【Recommended condition for Pb-free soldering】 Peak 260℃ Max. Within 10sec. Slow cooling 120sec. Min. 300 200 100 Temperature（℃） Preheating 150℃ Caution ①Wave soldering must not be applied to capacitors designated as for reflow soldering only. ［Hand soldering］【Recommended conditions for eutectic soldering】 230～280℃ Within 3sec. Slow cooling Preheating 60sec. Min. 400 200 100 Temperature（℃） 300 【Recommended condition for Pb-free soldering】 Peak 350℃ Max. Within 3sec. Slow cooling 400 200 100 Temperature（℃） Preheating 150℃ Min. 60sec. Min. 300 316type or less ⊿T≦150℃ Peak 280℃ Max. Within 3sec. Slow cooling⊿T 400 200 100 温度（℃） Preheating 150℃ Min. 60sec. Min. 300 325type or more ⊿T≦130℃ Caution ①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm. ②The soldering iron shall not directly touch capacitors. 5. Cleaning Precautions ◆Cleaning conditions 1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning. （e.g. to remove soldering flux or other materi als from the production process.） 2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics. Technical considerations 1. The use of inappropriate cleaning solutions can cause foreig n substances such as flux residue to adhere to capacitors or de teriorate their outer coating, resulting in a degradation of the capacitor's electrical properties （esp ecially insulation resistance）. 2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of the cap acitors. In the case of ultrasonic cleaning, too much power output can c a u s e e x c e s s i v e v i b r a t i o n o f P C B s w h i c h m a y l e a d t o t he cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked; U l t r a s o n i c o u t p u t : 2 0 W / ℓ o r l e s s U l t r a s o n i c f r e q u e n c y : 4 0 k H z o r l e s s Ultrasonic washing period : 5 min. or less

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E02R01 6. Resin coating and mold Precautions 1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. 2. When a resin's hardening temperature is higher than capacito r's operating temperature, the stresses generated by the excess ive heat may lead to damage or destruction of capacitors. The use of such resins, molding materials etc. is not recommended. 7. Handling Precautions ◆Splitting of PCB 1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board. 2. Board separation shall not be done manually, but by using the appropriate devices. ◆Mechanical considerations Be careful not to subject capacitors to excessive mechanical shocks. （1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used. （2）Please be careful that the mounted components do not come in c o n t a c t w i t h o r b u m p a g a i n s t o t h e r b o a r d s o r c o m p onents. 8. Storage conditions Precautions ◆Storage 1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. ・Recommended conditions Ambient temperature : Below 30℃ H u m i d i t y : B e l o w 7 0 % R H The ambient temperature must be kept below 40℃. Even under idea l storage conditions, solderability of capacitor is deteriorated as time passes, so capacitors shall be used within 6 months from the time of delivery. ・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air. 2. The capacitance values of high dielectric constant capacitor s will gradually decrease with th e passage of time, so care shall be taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for 1hour. Technical considerations If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the capacitors. ※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA. Please check the guide regarding precautions for deflection te st, soldering by spot heat, and so on.

Product Information

TMK105BJ104P-F specifications and overview.

Summary

Multilayer Ceramic Capacitors (High dielectric type)

Description

Multilayer Ceramic Capacitors (High dielectric type)

Source title TMK105BJ104P-F Datasheet(PDF) - Taiyo Yuden (U.S.A.), Inc

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