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DIGITAL PROXIMITY DETECTOR TAOS149C − AUGUST 2012 The LUMENOLOGY /C0114 Company /C0114 /C0114 Copyright /C0069 2012, TAOS Inc. www.taosinc.com
Features
/C0068Digital Proximity Detector, LED Driver, and IR LED in a Single Optical Module /C0068Register Set- and Pin-Compatible with the TMD2671 Series /C0068Proximity Detection − Reduced Proximity Count Variation * − Programmable Offset Control Register * − Saturation Indicator * − Programmable Integration Time and Offset − Current Sink Driver for IR LED − 16,000:1 Dynamic Range /C0068Maskable Proximity Interrupt − Programmable Upper and Lower Thresholds with Persistence Filter /C0068Power Management − Low Power 2.2 /C0109A Sleep State with User- Selectable Sleep-After-Interrupt Mode * − 90 /C0109A Wait State with Programmable Wait Time from 2.7 ms to > 8 seconds /C0068I2C Fast Mode Compatible Interface − Data Rates up to 400 kbit/s − Input Voltage Levels Compatible with V DD or 1.8-V Bus /C00683.94 mm /C0121 2.36 mm /C0121 1.35 mm Package * New or improved feature
Applications
/C0068Mobile Handset Touchscreen Control and Automatic Speakerphone Enable /C0068Mechanical Switch Replacement /C0068Paper Alignment End Products and Market Segments /C0068Mobile Handsets, Tablets, Laptops and HDTVs /C0068White Goods /C0068Toys /C0068Digital Signage /C0068Printing
Description
The TMD2672 family of devices provides a complete proximity detection system and digital interface logic in a single 8-pin surface mount module. The devices are register-set and pin-compatible with the TMD2671 series and includes new and improved proximity detection features. The proximity detection includes improved signal-to-noise and accuracy. A proximity offset register allows compensation for optical system crosstalk between the IR LED and the sensor. To prevent false proximity data measurement readings, a proximity saturation indicator bit signals that the internal analog circuitry has reached saturation. Interrupts have been enhanced with the addition of a sleep-on-interrupt feature that also allows for a single cycle operation. The device internal state machine provides the ability to put the device in a low-power mode in between proximity measurements, providing very low average power consumption. The proximity detection system includes an LED driver and an IR LED, which are factory trimmed to eliminate the need for end-equipment calibration due to component variations. /C0114 /C0114 Texas Advanced Optoelectronic Solutions Inc.
1001 Klein Road /C0083 Suite 300 /C0083 Plano, TX 75074 /C0083 (972) 673-0759
MODULE−8 (TOP VIEW) VDD 1 SCL 2 GND 3 LEDA 4
8 SDA
7 INT
6 LDR
5 LEDK
Package Drawing is Not to Scale ams AG Technical content still valid
DIGITAL PROXIMITY DETECTOR TAOS149C − AUGUST 2012 /C0114 /C0114 Copyright /C0069 2012, TAOS Inc. The LUMENOLOGY /C0114 Company www.taosinc.com Functional Block Diagram SDA INT SCL Wait Control Prox ADC Prox Control Prox Data IR LED Constant Current Sink Prox Integration Upper Limit Lower Limit Interrupt I2C Interface GND Channel 1 LEDA LEDK VDDLDR Channel 0 Detailed Description A fully integrated proximity detection solution is provided with an 850-nm IR LED, LED driver circuit, and proximity detection engine. An internal LED driver (LDR) pin, is externally connected to the LED cathode (LEDK) to provide a controlled LED sink current. This is accomplished with a proprietary current calibration technique that accounts for all variances in silicon, optics, package, and most important, IR LED output power. This eliminates or greatly reduces the need for factory calibration that is required for most discrete proximity sensor solutions. The device is factory calibrated to achieve a proximity count reading at a specified distance with a specific number of pulses. In use, the number of proximity LED pulses can be programmed from 1 to 255 pulses, which allows different proximity distances to be achieved. Each pulse has a 16-μs period, with a 7.2-μs on time. The device provides a separate pin for level-style interrupts. When interrupts are enabled and a pre-set value is exceeded, the interrupt pin is asserted and remains asserted until cleared by the controlling firmware. The interrupt feature simplifies and improves system efficiency by eliminating the need to poll a sensor for a proximity value. An interrupt is generated when the value of a proximity conversion exceeds either an upper or lower threshold. In addition, a programmable interrupt persistence feature allows the user to determine how many consecutive exceeded thresholds are necessary to trigger an interrupt. ams AG Technical content still valid
DIGITAL PROXIMITY DETECTOR TAOS149C − AUGUST 2012 The LUMENOLOGY /C0114 Company /C0114 /C0114 Copyright /C0069 2012, TAOS Inc. www.taosinc.com Terminal Functions TERMINAL TYPE DESCRIPTIONNAME NO. TYPE DESCRIPTION GND 3 Power supply ground. All voltages are referenced to GND. INT 7 O Interrupt — open drain (active low). LDR 6 O LED driver input for proximity IR LED, constant current source LED driver. LEDA 4 LED anode. LEDK 5 LED cathode. Connect to LDR pin when using internal LED driver circuit. SCL 2 I I2C serial clock input terminal — clock signal for I 2C serial data. SDA 8 I/O I2C serial data I/O terminal — serial data I/O for I 2C . VDD 1 Supply voltage. Available Options DEVICE ADDRESS LEADS INTERFACE DESCRIPTION ORDERING NUMBER TMD26721 0x39 Module−8 I2C Vbus = VDD Interface TMD26721 TMD26723 0x39 Module−8 I2C Vbus = 1.8 V Interface TMD26723 TMD26725† 0x29 Module−8 I2C Vbus = VDD Interface TMD26725 TMD26727† 0x29 Module−8 I2C Vbus = 1.8 V Interface TMD26727 † Contact TAOS for availability. Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to GND. Recommended Operating Conditions MIN NOM MAX UNIT Supply voltage, VDD 2.6 3 3.6 V Supply voltage accuracy, VDD total error including transients −3 3 % Operating free-air temperature, TA (Note 2) −30 85 °C NOTE 2: While the device is operational across the temperature range, functionality will vary with temperature. Specifications a re stated only at 25°C unless otherwise noted. ams AG Technical content still valid
DIGITAL PROXIMITY DETECTOR TAOS149C − AUGUST 2012 /C0114 /C0114 Copyright /C0069 2012, TAOS Inc. The LUMENOLOGY /C0114 Company www.taosinc.com Operating Characteristics, VDD = 3 V, TA = 25/C0053C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Active — LDR pulse off 195 250 IDD Supply current Wait state 90 μAIDD Supply current Sleep state — no I 2C activity 2.2 4 μA V INT SDA output low voltage 3 mA sink current 0 0.4 VVOL INT, SDA output low voltage 6 mA sink current 0 0.6 V ILEAK Leakage current, SDA, SCL, INT pins −5 5 μA ILEAK Leakage current, LDR pin −5 5 μA V SCL SDA input high voltage TMD26721 0.7 VDD VVIH SCL, SDA input high voltage TMD26723 1.25 V V SCL SDA input low voltage TMD26721 0.3 VDD VVIL SCL, SDA input low voltage TMD26723 0.54 V Proximity Characteristics, VDD = VLEDA = 3 V, TA = 25/C0053C, PEN = 1 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IDD Supply current LED On 3 mA LED On, PDRIVE = 0 100 I LEDA current (Note 1) LED On, PDRIVE = 1 50 mAILEDA LEDA current (Note 1) LED On, PDRIVE = 2 25 mA LED On, PDRIVE = 3 12.5 PTIME ADC conversion steps 1 256 steps PTIME ADC conversion time PTIME = 0xFF ( = 1 conversion step) 2.58 2.73 2.9 ms PTIME ADC counts per step PTIME = 0xFF ( = 1 conversion step) 0 1023 counts PPULSE LED pulses (Note 5) 0 255 pulses LED On LED pulse width PPULSE = 1, PDRIVE = 0 7.3 μs LED pulse period PPULSE = 2, PDRIVE = 0 16.0 μs Proximity response, no target (offset) PPULSE = 8, PDRIVE = 0, PGAIN = 4 ×, (Note 2) 100 counts Prox count, 100-mm target (Note 3) 73 mm × 83 mm, 90% reflective Kodak Gray Card, PGAIN = 4×, PPULSE = 8, PDRIVE = 0, PTIME = 0xFF (Note 4) 450 520 590 counts NOTES: 1. Value is factory-adjusted to meet the Prox count specification. Considerable variation (relative to the typical value) is possible after adjustment. 2. Proximity offset varies with power supply characteristics and noise. 3. I LEDA is factory calibrated to achieve this specification. Offset and crosstalk directly sum with this value and is system dependent. 4. No glass or aperture above the module. Tested value is the average of 5 consecutive readings. 5. These parameters are ensured by design and characterization and are not 100% tested. 6. Proximity test was done using the following circuit. See the Application Information: Hardware section for recommended application circuit. TMD2672 VDD 1 /C0109F 4VDD GND LDR LEDK LEDA 1 /C0109F 22 /C0109F ams AG Technical content still valid
DIGITAL PROXIMITY DETECTOR TAOS149C − AUGUST 2012 The LUMENOLOGY /C0114 Company /C0114 /C0114 Copyright /C0069 2012, TAOS Inc. www.taosinc.com IR LED Characteristics, VDD = 3 V, TA = 25/C0053C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VF Forward Voltage IF = 20 mA 1.4 1.5 V VR Reverse Voltage IR = 10 μA 5 V PO Radiant Power IF = 20 mA 4.5 mW λp Peak Wavelength IF = 20 mA 850 nm Δλ Spectral Radiation Bandwidth IF = 20 mA 40 nm TR Optical Rise Time IF = 100 mA, TW = 125 ns, duty cycle = 25% 20 40 ns TF Optical Fall Time IF = 100 mA, TW = 125 ns, duty cycle = 25% 20 40 ns Wait Characteristics, VDD = 3 V, TA = 25/C0053C, WEN = 1 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Wait time WTIME = 0xFF (= 1 wait step) 2.73 2.9 ms Wait steps 1 256 steps PARAMETER† TEST CONDITIONS MIN TYP MAX UNIT f(SCL) Clock frequency (I2C only) 0 400 kHz t(BUF) Bus free time between start and stop condition 1.3 μs t(HDSTA) Hold time after (repeated) start condition. After this period, the first clock is generated. 0.6 μs t(SUSTA) Repeated start condition setup time 0.6 μs t(SUSTO) Stop condition setup time 0.6 μs t(HDDAT) Data hold time 0 μs t(SUDAT) Data setup time 100 ns t(LOW) SCL clock low period 1.3 μs t(HIGH) SCL clock high period 0.6 μs tF Clock/data fall time 300 ns tR Clock/data rise time 300 ns Ci Input pin capacitance 10 pF † Specified by design and characterization; not production tested. ams AG Technical content still valid
Enable register (0x00) PON bit. If PON is disabled, the device will return to the Sleep state to save power. the device will automatically begin a new prox-wait cycle as long as PON and PEN are enabled. Interrupts section for additional information. Figure 6. Simplified State Diagram
DIGITAL PROXIMITY DETECTOR TAOS149C − AUGUST 2012 /C0114 /C0114 Copyright /C0069 2012, TAOS Inc. The LUMENOLOGY /C0114 Company www.taosinc.com Referring again to Figure 8, the reflected IR LED and the background energy is integrated during the LED On time, then during the LED Off time, the integrated background energy is subtracted from the LED On time energy, leaving the IR LED energy to accumulate from pulse to pulse. During LED On time integration, the proximity saturation bit in the Status register (0x13) will be set if the integrator saturates. This condition can occur if the proximity gain is set too high for the lighting conditions, such as in the presence of bright sunlight. Once asserted, PSAT will remain set until a special function proximity interrupt clear command is received from the host (see command register). After the programmed number of proximity pulses have been generated, the proximity ADC converts and scales the proximity measurement to a 16-bit value, then stores the result in two 8-bit proximity data (PDATAx) registers. ADC scaling is controlled by the proximity ADC conversion time (PTIME) which is programmable from 1 to 256 2.73-ms time units. However, depending on the application, scaling the proximity data will equally scale any accumulated noise. Therefore, in general, it is recommended to leave PTIME at the default value of one 2.73-ms ADC conversion time (0xFF). In many practical proximity applications, a number of optical system and environmental conditions can produce an offset in the proximity measurement result. To counter these effects, a proximity offset (POFFSET) is provided which allows the proximity data to be shifted positive or negative. Additional information on the use of the proximity offset feature is provided in available TAOS application notes. Once the first proximity cycle has completed, the proximity valid (PVALID) bit in the Status register will be set and remain set until the proximity detection function is disabled (PEN). For additional information on using the proximity detection function behind glass and for optical system design guidance, please see available TAOS application notes. ams AG Technical content still valid
Copyright /C0069 2012, TAOS Inc. interrupt enable (PIEN) field in the Enable register (0x00). Two 16-bit interrupt threshold registers allow the user to set limits below and above a desired proximity range. (PILTx) or exceeds the proximity interrupt high threshold (PIHTx). the low threshold is evaluated. persistence filter (PPERS) values. See the persistence filter register for details on the persistence filter values. is received (see Command register). Figure 9. Programmable Interrupt
machine cycle time, and provides details to determine system level timing. will be asserted at the end of the Prox ADC state and transition to the Sleep state if SAI is enabled. WTIME. The formula to determine the wait time is given in the box associated with the Wait state in Figure 10. Note: PON, PEN, WEN, and SAI are fields in the Enable register (0x00). Figure 10. Expanded State Diagram
Copyright /C0069 2012, TAOS Inc. the example, the average IDD is estimated to be 157 μA. Table 1. Power Management
- Prox Accum − LED Off time = 8.7 μ s per pulse × 4 pulses = 34.7μs = 0.035 ms
current occurs when the Wait state is not enabled. Table 2. Average IDD Current
The I2C standard provides for three types of bus transaction: read, write, and a combined protocol (Figure 11). commands can also be used to clear interrupts. review the NXP I2C design specification at http://www.i2c−bus.org/references/. Figure 11. I2C Protocols
Copyright /C0069 2012, TAOS Inc. ADC conversions. The register set is summarized in Table 3. Table 3. Register Address 0x11 REVISION R Die revision number Rev Num. control/status register for following read/write operations.
The command registers specifies the address of the target register for future write and read operations. Table 4. Command Register COMMAND 7 Select Command Register. Must write as 1 when addressing COMMAND register.
00 Repeated byte protocol transaction
01 Auto-increment protocol transaction
10 Reserved — Do not use
11 Special function — See description below
Transaction type 00 will repeatedly read the same register with each data access. Transaction type 01 will provide an auto-increment function to read successive register bytes.
00000 Normal — no action
00101 Proximity interrupt clear
Proximity Interrupt Clear clears any pending proximity interrupt. This special function is self clearing. The ENABLE register is used to power the device on/off, enable functions, and interrupts. Table 5. Enable Register Reserved 7 Reserved. Write as 0. PIEN 5 Proximity interrupt mask. When asserted, permits proximity interrupts to be generated. Reserved 4 Reserved. Write as 0. Reserved 1 Reserved. Write as 0. a 1 activates the oscillator. Writing a 0 disables the oscillator.
Copyright /C0069 2012, TAOS Inc. value of 0xFF (1 integration cycle). Table 6. Proximity Time Control Register NOTE: The Proximity Wait Time register should be configured before PEN is asserted. lower threshold specified, or above the higher threshold, an interrupt is signaled to the host processor.
produced a result that is outside of the values specified by threshold register for some specified amount of time. Table 9. Persistence Register PPERS 7:4 Proximity interrupt persistence. Controls rate of proximity interrupt to the host processor. Reserved 3:0 Default setting is 0x00. The configuration register sets the wait long time. Table 10. Configuration Register Reserved 7:2 Reserved. Write as 0. Reserved 0 Reserved. Write as 0. the number of pulses to be transmitted at a 62.5-kHz rate. Table 11. Proximity Pulse Count Register PPULSE 7:0 Proximity Pulse Count. Specifies the number of proximity pulses to be generated.
Copyright /C0069 2012, TAOS Inc. and diode selection functions. Table 12. Control Register PDIODE 5:4 Proximity Diode Selector.
00 Proximity uses neither diode
01 Proximity uses the CH0 diode
10 Proximity uses the CH1 diode
11 Reserved — Do not write
NOTE 1: LED STRENGTH values (italic) are nominal operating values. Specifications can be found in the Proximity Characteristics table. of the silicon used internally. Table 13. Revision Register
The ID Register provides the value for the part number. The ID register is a read-only register. Table 14. ID Register The Status Register provides the internal status of the device. This register is read only. Table 15. Status Register PSAT 6 Proximity Saturation. Indicates that the proximity measurement saturated. PINT 5 Proximity Interrupt. Indicates that the device is asserting a proximity interrupt. Reserved 4:2 Reserved. Bits read as 0. the reading of the lower and upper registers. Table 16. PDATA Registers
DIGITAL PROXIMITY DETECTOR TAOS149C − AUGUST 2012 The LUMENOLOGY /C0114 Company /C0114 /C0114 Copyright /C0069 2012, TAOS Inc. www.taosinc.com Proximity Offset Register (0x1E) The 8-bit proximity offset register provides compensation for proximity offsets caused by device variations, optical crosstalk, and other environmental factors. Proximity offset is a sign-magnitude value where the sign bit, bit 7, determines if the offset is negative (bit 7 = 0) or positive (bit 7 = 1). At power up, the register is set to 0x00. The magnitude of the offset compensation depends on the proximity gain (PGAIN), proximity LED drive strength (PDRIVE), and the number of proximity pulses (PPULSE). Because a number of environmental factors contribute to proximity offset, this register is best suited for use in an adaptive closed-loop control system. See available TAOS application notes for proximity offset register application information. Table 17. Proximity Offset Register 675 42 31 0 POFFSET Reset 0x00MAGNITUDESIGN FIELD BIT DESCRIPTION SIGN 7 Proximity Offset Sign. The offset sign shifts the proximity data negative when equal to 0 and positive when equal to 1. MAGNITUDE 6:0 Proximity Offset Magnitude. The offset magnitude shifts the proximity data positive or negative, depending on the proximity offset sign. The actual amount of the shift depends on the proximity gain (PGAIN), proximity LED drive strength (PDRIVE), and the number of proximity pulses (PPULSE). ams AG Technical content still valid
Copyright /C0069 2012, TAOS Inc. recommended surface finish for the landing pads. NOTES: A. All linear dimensions are in mm. B. This drawing is subject to change without notice. Figure 14. Suggested Module PCB Layout
DIGITAL PROXIMITY DETECTOR TAOS149C − AUGUST 2012 /C0114 /C0114 Copyright /C0069 2012, TAOS Inc. The LUMENOLOGY /C0114 Company www.taosinc.com
PACKAGE INFORMATION
/C0106 1.0 0.60 0.25 3.73 /C0043 0.1 3.94 /C0043 0.2 Detector LED TOP VIEW SIDE VIEW BOTTOM VIEW Lead Free Pb END VIEW /C0106 0.9 1.18 0.58 2.36 /C0043 0.2 2.10 /C0043 0.1 1.35 /C0043 0.2 0.05 0.72 0.80 2.40 NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.05 mm unless otherwise noted. B. Contacts are copper with NiPdAu plating. C. This package contains no lead (Pb). D. This drawing is subject to change without notice. Figure 15. Module Packaging Configuration
Copyright /C0069 2012, TAOS Inc. NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted. B. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly. C. Symbols on drawing A o, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001. D. Each reel is 330 millimeters in diameter and contains 2500 parts. E. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B. F. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape. G. This drawing is subject to change without notice. Figure 16. Module Carrier Tape
process, equipment, and materials used in these test are detailed below. be limited to a maximum of three passes through this solder reflow profile. Table 18. Solder Reflow Profile Figure 17. Solder Reflow Profile Graph
DIGITAL PROXIMITY DETECTOR TAOS149C − AUGUST 2012 The LUMENOLOGY /C0114 Company /C0114 /C0114 Copyright /C0069 2012, TAOS Inc. www.taosinc.com STORAGE INFORMATION Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope called a moisture barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. The Moisture Barrier Bags should be stored under the following conditions: Temperature Range < 40° C Relative Humidity < 90% Total Time No longer than 12 months from the date code on the aluminized envelope if unopened. Rebaking of the reel will be required if the devices have been stored unopened for more than 12 months and the Humidity Indicator Card shows the parts to be out of the allowable moisture region. Opened reels should be used within 168 hours if exposed to the following conditions: Temperature Range < 30° C Relative Humidity < 60% If rebaking is required, it should be done at 50°C for 12 hours. The Module has been assigned a moisture sensitivity level of MSL 3. ams AG Technical content still valid
DIGITAL PROXIMITY DETECTOR TAOS149C − AUGUST 2012 /C0114 /C0114 Copyright /C0069 2012, TAOS Inc. The LUMENOLOGY /C0114 Company www.taosinc.com PRODUCTION DATA — information in this document is current at publication date. Products conform to specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard warranty. Production processing does not necessarily include testing of all parameters. LEAD-FREE (Pb-FREE) and GREEN STATEMENT Pb-Free (RoHS) TAOS’ terms Lead-Free or Pb-Free mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TAOS Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br) TAOS defines Green to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information and Disclaimer The information provided in this statement represents TAOS’ knowledge and belief as of the date that it is provided. TAOS bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TAOS has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TAOS and TAOS suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. NOTICE Texas Advanced Optoelectronic Solutions, Inc. (TAOS) reserves the right to make changes to the products contained in this document to improve performance or for any other purpose, or to discontinue them without notice. Customers are advised to contact TAOS to obtain the latest product information before placing orders or designing TAOS products into systems. TAOS assumes no responsibility for the use of any products or circuits described in this document or customer product design, conveys no license, either expressed or implied, under any patent or other right, and makes no representation that the circuits are free of patent infringement. TAOS further makes no claim as to the suitability of its products for any particular purpose, nor does TAOS assume any liability arising out of the use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS, INC. PRODUCTS ARE NOT DESIGNED OR INTENDED FOR USE IN CRITICAL APPLICATIONS IN WHICH THE FAILURE OR MALFUNCTION OF THE TAOS PRODUCT MAY RESULT IN PERSONAL INJURY OR DEATH. USE OF TAOS PRODUCTS IN LIFE SUPPORT SYSTEMS IS EXPRESSLY UNAUTHORIZED AND ANY SUCH USE BY A CUSTOMER IS COMPLETELY AT THE CUSTOMER’S RISK. LUMENOLOGY, TAOS, the TAOS logo, and Texas Advanced Optoelectronic Solutions are registered trademarks of Texas Advanced Optoelectronic Solutions Incorporated. ams AG Technical content still valid