TLWJ1100T11

TLWJ1100 TOSHIBA | Alldatasheet

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Technical content

TLWJ1100(T11) 2007-10-01 1 TOSHIBA LED Lamps TLWJ1100(T11) Panel Circuit Indicator

• Surface-mount devices
• LED chip + phosphor
• Luminous intensity : Iv = 750 mcd (typ.) @20mA
• Color: White
• Chromaticity (typ.) : Cx=0.32,Cy=0.31
• Topr / Tstg = -40 to 100°C
• Reflow soldering is possible
• Applications: automotive use, backlighting etc.
• Standard embossed tape packing: T11 (2000/reel) 8-mm tape reel Color and Material Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Forward Current (Note 1) I F 30 mA Power Dissipation PD 120 mW Operating Temperature Topr −40~100 °C Storage Temperature Tstg −40~100 °C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Forward current derating Unit: mm JEDEC ― JEITA ― TOSHIBA 4-3R1 Weight: 0.035 g (typ.) Product Name Color Material TLWJ1100 White InGaN IF – Ta 0 20 40 60 80 100 120 Ambient temperature Ta (°C) Allowable forward current I F ( m A )

TLWJ1100(T11) 2007-10-01 2 Electrical Characteristics (Ta = 25°C) Characteristics Symbol Test condition Min. Typ. Max. Unit Forward Voltage VF I F = 20 mA 2.8 3.3 4.0 V Reverse Voltage VR I R = 10 mA ⎯ 0.75 ⎯ V Optical Characteristics (Ta = 25°C) Characteristics Symbol Test condition Min. Typ. Max. Unit Cx I F = 20 mA (Note 2) ⎯ Chromaticity Cy I F = 20 mA (Note 2) ⎯ Luminous Intensity (Note 3) I V I F = 20 mA 400 750 1250 mcd Note 2: The product is tested at the following chromaticity coordinate groups. Test conditions: IF=20mA, Ta=25°C Tolerance: +/-0.01 0.20 0.21 0.22 0.23 0.24 0.25 0.26 0.27 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.40 0.41 0.42 Cx Cy Cx C y Cx C y Cx C y 5K 7K 5L 7L 6K 8K 6L 8L

TLWJ1100(T11) 2007-10-01 3 Note 3: Iv rank classification Test conditions: IF=20mA, Ta=25°C Luminous intensity IV Product name min typ max I F TLWJ1100(T11) 400 750 1250 UA 400 ⎯ 800 VA 630 ⎯ 1250 Unit mcd mA The specification on the above table is used for Iv classification of LEDs in Toshiba facility. Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned. Note 4: Caution This product is designed as a general display light source usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application (ex. Light source for sensor, optical communication and etc) except general display light source.

TLWJ1100(T11) 2007-10-01 4 TLWJ1100 0.1 -40 -20 0 20 40 60 80 100 0.0 0.2 0.4 0.6 0.8 1.0 300 400 500 600 700 800 0.29 0.3 0.31 0.32 0.33 0.34 0 5 10 15 20 25 30 35 40 Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Ta = 25°C Radiation pattern 30° 60° 90° 90° 30° 60° 80° 70° 50° 40° 20° 10° 70° 80° 50° 40° 20° 10° 100 Ta = 25°C 2000 1 50 1000 300 100 3 5 10 30 100 500 Ta = 25°C Relative luminous Intensity IV Chromaticity Cx, Cy Forward current I F ( m A ) Cx, Cy – IF Case Temperature Tc (°C) Relative IV – Tc Relative luminous Intensity Wavelength λ (nm) Wavelength characteristic (typ.) (typ.) Ta = 25°C Cx Cy (typ.) (typ.) (typ.) (typ.)

TLWJ1100(T11) 2007-10-01 5 Packaging These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. This moisture proof bag may be stored unopene d within 12 months at the following conditions. Temperature: 5°C~30°C Humidity: 90% (max) 2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5°C to 30°C/60% RH or below. 3. If upon opening, the moisture in dicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60±5°C, for 12 to 24 hours. Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed. 4. Repeated baking can cause the pee ling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of laminate would be broken , the hermeticity would deteriorate. Therefore, do not throw or drop the packed devices. Mounting Method Soldering

• Reflow soldering
• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package.
• Second reflow soldering In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
• Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron : 25 W Temperature : 300 °C or less T i m e : w i t h i n 3 s
• If the product needs to be performed by other soldering method (ex. wave soldering), please contact Toshiba sales representative. Recommended soldering pattern 1.65 1.15 2.41 Unit: mm 1.65 (*) 60~120 s max 10 s max 240°C max 4°C/s max 140~160°C max 4°C/s max Time (s) Package surface temperature ( °C) Temperature profile (example) (*) (*) (*) (*) (*)

TLWJ1100(T11) 2007-10-01 6 Cleaning When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition, using condition and etc. ASAHI CLEAN AK-225AES : (made by ASAHI GLASS) KAO CLEAN TROUGH 750H : (made by KAO) PINE ALPHA ST-100S : (made by ARAKAWA CHEMICAL) TOSHIBA TECHNOCARE : (made by GE TOSHIBA SILICONES) (FRW-17, FRW-1, FRV-100) Precautions when Mounting Do not apply force to the plastic part of the LED under high-temperature conditions. To avoid damaging the LED plastic, do not apply friction using a hard material. When installing the PCB in a product, ensure that the device does not come into contact with other cmponents. Tape Specifications 1. Product number format The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard Toshiba specifications) (1) Tape Type: T11 (4-mm pitch) (2) Example 2. Tape dimensions Unit: mm Symbol Dimension Tolerance Symbol Dimension Tolerance t 0.3 ±0.05 A 0 2.9 ±0.1 F 3.5 ±0.05 B 0 3.7 ±0.1 D1 1.5 ±0.1 K 0 2.3 ±0.1 TLWJ1100 (T11) Tape type Toshiba product No. P D1 F E W Polarity t D

TLWJ1100(T11) 2007-10-01 7 3. Reel dimensions Unit: mm 4. Leader and trailer sections of tape Note1: Empty trailer section Note2: Empty leader section 9 ± 0.3 180 +0 φ60 φ13 11.4 ± 1.0 2 ± 0.5φ44 (Note 1) Leading part: 190 mm (min) 40 mm or more (Note 2) 40 mm or more

TLWJ1100(T11) 2007-10-01 8 5. Packing form (1) Packing quantity Reel 2,000 pcs Carton 10,000 pcs (2) Packing form: Each reel is sealed in an aluminum pack with silica gel. 6. Label format (1) Example: TLWJ1100 (T11) P / N : TOSHIBA TYPE TLWJ1100 ADDC (T11) Q’TY 2,000 pcs Lot Number Key code for TSB 32C 2000 (RANK SYMBOL) Use under 5-30degC/60%RH within 168h SEAL DATE: [[G]]/RoHS COMPATIBLE DIFFUSED IN ***** *Y3804xxxxxxxxxxxxxxxxx* ASSEMBLED IN ***** (2) Label location Tape feel direction Label position Label position

• Reel • Carton
• The aluminum package in which the reel is supplied also has the label attached to center of one side.

TLWJ1100(T11) 2007-10-01 9 RESTRICTIONS ON PRODUCT USE 20070701-EN GENERAL

• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity a nd vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIB A products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconduct or Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.
• The TOSHIBA products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage incl ude atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, et c.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringement s of patents or other rights of the third parties which may result from its use. No license is granted by implic ation or otherwise under any patents or other rights of TOSHIBA or the third parties.
• Please contact your sales representative for product- by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.