TLV70012DDCT

TLV700XX_103 TI | Alldatasheet

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/c109 EN N/C N/C IN GND OUT TLV700xx□DSE 1,5-mm□x□1,5-mm□SON (TOP□VIEW) TLV700xxDDC TSOT23-5 (TOP□VIEW) OUT N/C IN GND EN TLV700xx□DCK SC70-5□PACKAGE (TOP□VIEW) OUT N/C IN GND EN 3 4 TLV700xx TLV701xx www.ti.com SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 200-mA,Low-IQ,Low-DropoutRegulatorforPortableDevices 1FEATURES

DESCRIPTION

234• Very Low Dropout: – 43 mV atIOUT = 50 mA, VOUT = 2.8V The TLV700xx/TLV701xxseriesoflow-dropout(LDO) linearregulatorsare low quiescentcurrentdevices– 85 mV atIOUT = 100 mA, VOUT = 2.8V withexcellentlineand load transientperformance.– 175 mV atIOUT = 200 mA, VOUT = 2.35V These LDOs are designed for power-sensitive

• 2% Accuracy applications.A precisionbandgap and erroramplifier providesoverall2% accuracy.Low outputnoise,very• Low IQ :31 mA high power-supplyrejectionratio(PSRR), and low• AvailableinFixed-OutputVoltagesfrom 0.7V dropoutvoltagemake thisseriesofdevicesidealforto4.8V most battery-operatedhandheld equipment. All
• High PSRR: 68 dB at1 kHz deviceversionshave thermalshutdown and current limitforsafety.• StablewithEffectiveCapacitanceof0.1mF
• Thermal Shutdown and OvercurrentProtection Furthermore,these devices are stable with an effectiveoutputcapacitanceof only 0.1 mF. This• Availablein1,5-mm × 1,5-mm SON-6, SOT23-5, featureenablesthe use of cost-effectivecapacitorsand SC-70 packages that have higher bias voltagesand temperature derating.The devicesregulateto specifiedaccuracyAPPLICATIONS withno outputload.
• WirelessHandsets The TLV700xx seriesof LDOs are availablein• Smart Phones, PDAs 1,5-mm x 1,5-mm SON-6, TSOT23-5, and SC-70• MP3 Players packages. The TLV701xx series of LDOs are
• ZigBee® Networks availableina 1,5-mm x 1,5-mm SON-6 package.
• Bluetooth® Devices space
• Li-IonOperated Handheld Products space• WLAN and Other PC Add-on Cards TypicalApplicationCircuit(Fixed-Voltage Versions) Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Bluetoothisa registeredtrademarkofBluetoothSIG. 3ZigBeeisa registeredtrademarkoftheZigBeeAlliance. 4Allothertrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2009–2010,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com This integratedcircuitcan be damaged by ESD. Texas Instrumentsrecommends thatallintegratedcircuitsbe handled with appropriateprecautions.Failuretoobserveproperhandlingand installationprocedurescan cause damage. ESD damage can rangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmay be more susceptibletodamage because verysmallparametricchanges couldcause thedevicenottomeet itspublishedspecifications. ORDERING INFORMATION (1) PRODUCT VOUT (2) TLV700 xx yyy z XX isnominaloutputvoltage(forexample,28 = 2.8V). TLV701 xx yyy z YYY isthepackage designator. Z istapeand reelquantity(R = 3000,T = 250). (1) Forthemost currentpackage and orderinginformationsee thePackage OptionAddendum attheend ofthisdocument,orvisitthe deviceproductfolderatwww.ti.com. (2) Outputvoltagesfrom0.7V to4.8V in50-mV incrementsareavailable.Contactfactoryfordetailsand availability. ABSOLUTE MAXIMUM RATINGS (1) AtTJ = –40°C to+125°C (unlessotherwisenoted).AllvoltagesarewithrespecttoGND. PARAMETER TLV700xx/TLV701xx UNIT Inputvoltagerange,VIN –0.3to+6.0 V Enablevoltagerange,VEN –0.3to+6.0 V Outputvoltagerange,VOUT –0.3to+6.0 V Maximum outputcurrent,IOUT Internallylimited Outputshort-circuitduration Indefinite Totalcontinuouspower dissipation,PDISS See DissipationRatingsTable Human body model (HBM) 2 kV ESD rating Charged devicemodel (CDM) 500 V Operatingjunctiontemperaturerange,TJ –55 to+150 °C Storagetemperaturerange,TSTG –55 to+150 °C (1) Stressesabove theseratingsmay cause permanentdamage. Exposuretoabsolutemaximum conditionsforextendedperiodsmay degradedevicereliability.These arestressratingsonly,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thosespecifiedisnotimplied. DISSIPATION RATINGS DERATING FACTOR BOARD PACKAGE R qJC R qJA ABOVE TA = +25°C TA < +25°C TA = +70°C TA = +85°C Low-K (1) DCK 165°C/W 395°C/W 2.5mW/ °C 250 mW 140 mW 100 mW High-K(2) DCK 165°C/W 315°C/W 3.2mW/ °C 320 mW 175 mW 130 mW High-K(2) DSE 67°C/W 180°C/W 4.55mW/ °C 555 mW 305 mW 222 mW Low-K(1) DDC 90°C/W 280°C/W 3.6mW/ °C 360 mW 200 mW 145 mW High-K(2) DDC 90°C/W 200°C/W 5.0mW/ °C 500 mW 275 mW 200 mW (1) The JEDEC low-K(1s)boardused toderivethisdatawas a 3-inch× 3-inch,two-layerboardwith2-ouncecoppertraceson topofthe board. (2) The JEDEC high-K(2s2p)boardused toderivethisdatawas a 3-inch× 3-inch,multilayerboardwith1-ounceinternalpower and groundplanesand 2-ouncecoppertraceson topand bottomoftheboard.

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www.ti.com SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010

ELECTRICAL CHARACTERISTICS

AtVIN = VOUT(Typ) + 0.3V or2.0V (whicheverisgreater);IOUT = 10 mA, VEN = 0.9V,C OUT = 1.0mF,and TJ = –40°C to +125°C, unlessotherwisenoted.TypicalvaluesareatTJ = +25°C. space PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIN Inputvoltagerange 2.0 5.5 V VOUT ≥ 1 V –2 +2 % VOUT DC outputaccuracy –40°C ≤ TJ ≤ +125°C VOUT < 1 V –20 +20 mV VOUT(NOM) + 0.3V ≤ VIN ≤ 5.5V,ΔVO /ΔVIN Lineregulation 1 5 mVIOUT = 10 mA ΔVO /ΔIOUT Load regulation 0 mA ≤ IOUT ≤ 200 mA 1 15 mV VIN = 0.98× VOUT(NOM) ,IOUT = 50 mA, 43 mVVOUT = 2.8V VIN = 0.98× VOUT(NOM) ,IOUT = 100 mA,VDO Dropoutvoltage(1) 85 mVVOUT = 2.8V VIN = 0.98× VOUT(NOM) ,IOUT = 200 mA, 175 250 mVVOUT = 2.35V ICL Outputcurrentlimit VOUT = 0.9× VOUT(NOM) 220 350 550 mA IOUT = 0 mA 31 55 mA IGND Ground pincurrent IOUT = 200 mA, VIN = VOUT + 0.5V 270 mA VEN ≤ 0.4V,VIN = 2.0V 400 nA ISHDN Ground pincurrent(shutdown) VEN ≤ 0.4V,2.0V ≤ VIN ≤ 4.5V 1 2 mA VIN = 2.3V,VOUT = 1.8V,PSRR Power-supplyrejectionratio 68 dBIOUT = 10 mA, f= 1 kHz BW = 100 Hz to100 kHz,VN Outputnoisevoltage 48 mVRMSVIN = 2.3V,VOUT = 1.8V,IOUT = 10 mA tSTR Startuptime(2) C OUT = 1.0mF,IOUT = 200 mA 100 ms VEN(HI) Enablepinhigh(enabled) 0.9 VIN V VEN(LO) Enablepinlow(disabled) 0 0.4 V IEN Enablepincurrent VIN = VEN = 5.5V 0.04 0.5 mA UVLO Undervoltagelockout VIN rising 1.9 V ActivepulldownresistanceR DISCHARGE VEN = 0 V 120 Ω(TLV701xxonly) Shutdown,temperatureincreasing +160 °C TSD Thermalshutdowntemperature Reset,temperaturedecreasing +140 °C TJ Operatingjunctiontemperature –40 +125 °C (1) VDO ismeasured fordeviceswithVOUT(NOM) ≥ 2.35V. (2) Startuptime= timefromEN assertionto0.98× VOUT(NOM) . Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3

TLV700xx□Series Thermal Shutdown Current Limit UVLO Bandgap IN EN OUT LOGIC GND TLV701xx Series 120/c87 TLV700xx TLV701xx SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com FUNCTIONAL BLOCK DIAGRAMS Figure1. TLV700xx Figure2. TLV701xx

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(1) IN GND EN 3 4 OUT N/C (1) IN GND EN EN N/C (1) N/C (1) IN GND OUT TLV700xx TLV701xx www.ti.com SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 PIN CONFIGURATIONS DDC PACKAGE DCK PACKAGETSOT23-5 SC70-5(TOP VIEW) (TOP VIEW) DSE PACKAGE SON-6 (TOP VIEW) (1) No connection. PIN DESCRIPTIONS SON-6 SC70-5 TSOT23-5 NAME DSE DCK DDC DESCRIPTION Inputpin.A small1-mF ceramiccapacitorisrecommended fromthispintoground IN 1 1 1 toassurestabilityand good transientperformance.See Inputand OutputCapacitor RequirementsintheApplicationInformationsectionformore details. GND 2 2 2 Ground pin Enablepin.DrivingEN over0.9V turnson theregulator.DrivingEN below0.4V putstheregulatorintoshutdownmode and reducesoperatingcurrentto1 mA, EN 6 3 3 nominal. ForTLV701xx,outputvoltageisdischargedthroughan internal120-Ω resistor when deviceisshutdown. NC 4,5 4 4 No connection.Thispincan be tiedtogroundtoimprovethermaldissipation. Regulatedoutputvoltagepin.A small1-mF ceramiccapacitorisneeded fromthis OUT 3 5 5 pintogroundtoassurestability.See Inputand OutputCapacitorRequirementsin theApplicationInformationsectionformore details. Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5

Input□Voltage□(V) 1.90 1.88 1.86 1.84 1.82 1.80 1.78 1.76 1.74 1.72 1.70 Output□Voltage□(V) +125 C +85 C +25 C

40 C/c45

/c176 /c176 /c176 /c176 I =□10□mAOUT Input□Voltage□(V) 1.90 1.88 1.86 1.84 1.82 1.80 1.78 1.76 1.74 1.72 1.70 Output□Voltage□(V) +125 C +85 C +25 C /c176 /c176 /c176 /c176 I =□200□mAOUT 0 40 60 100 120 140 180 200 Output□Current□(mA) 1.90 1.88 1.86 1.84 1.82 1.80 1.78 1.76 1.74 1.72 1.70 Output□Voltage□(V) +125 C +85 C +25 C /c176 /c176 /c176 /c176 20 80 160 250 200 150 100 Dropout□Voltage□(mV) Input□Voltage□(V) +125 C +85 C +25 C /c176 /c176 /c176 /c176 I =□200□mAOUT TLV700xx TLV701xx SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com TYPICAL CHARACTERISTICS Over operatingtemperaturerange(TJ = –40°C to+125°C),VIN = VOUT(TYP) + 0.5V or2.0V,whicheverisgreater;IOUT = 10 mA, VEN = VIN,C OUT = 1.0mF,unlessotherwisenoted.TypicalvaluesareatTJ = +25°C. TLV70018 TLV70018 LINE REGULATION LINE REGULATION Figure3. Figure4. TLV70018 DROPOUT VOLTAGE vs INPUT VOLTAGE LOAD REGULATION VOUT = 4.8V Figure5. Figure6.

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1.90 1.88 1.86 1.84 1.82 1.80 1.78 1.76 1.74 1.72 1.70 Output□Voltage□(V) /c45 40 /c45 25 /c45 10 5 20 35 50 65 80 95 110 125 T emperature□( C)/c176 I =□200□mA I =□10□mA I =□150□mA OUT OUT OUT 0 30 60 90 120 150 180 210 Output□Current□(mA) 180 160 140 120 100 Dropout□Voltage□(V) +125 C +85 C +25 C /c176 /c176 /c176 /c176 +125 C +85 C +25 C /c176 /c176 /c176 /c176 300 250 200 150 100 Ground□Pin□Current□( A) /c109 0 20 40 60 80 100 120 140 160 180 200 Output□Current□(mA) Input□Voltage□(V) Ground□Pin□Current□( A) /c109 +125 C +85 C +25 C /c176 /c176 /c176 /c176 I =□0□mAOUT TLV700xx TLV701xx www.ti.com SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 TYPICAL CHARACTERISTICS (continued) Over operatingtemperaturerange(TJ = –40°C to+125°C),VIN = VOUT(TYP) + 0.5V or2.0V,whicheverisgreater; IOUT = 10 mA, VEN = VIN,C OUT = 1.0mF,unlessotherwisenoted.TypicalvaluesareatTJ = +25°C. TLV70048 TLV70018 DROPOUT VOLTAGE vs OUTPUT CURRENT OUTPUT VOLTAGE vs TEMPERATURE Figure7. Figure8. TLV70018 TLV70018 GROUND PIN CURRENT vs INPUT VOLTAGE GROUND PIN CURRENT vs LOAD Figure9. Figure10. Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7

Ground□Pin□Current□( A) /c109 /c45 40 /c45 25 /c45 10 5 20 35 50 65 80 95 110 125 T emperature□( C)/c176 I =□0□mAOUT Input□Voltage□(V) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 Shutdown□Current□( A) /c109 +125 C +85 C +25 C /c176 /c176 /c176 Input□Voltage□(V) 440 430 420 410 400 390 380 370 360 350 Current□Limit□(mA) T =□+25 CA /c176 100 PSRR□(dB) 10 100 1□k 10□k 100□k 1□M 10□M Frequency□(Hz) I =□150□mAOUT I =□10□mAOUT V V =□0.5□VIN OUT/c45 TLV700xx TLV701xx SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) Over operatingtemperaturerange(TJ = –40°C to+125°C),VIN = VOUT(TYP) + 0.5V or2.0V,whicheverisgreater; IOUT = 10 mA, VEN = VIN,C OUT = 1.0mF,unlessotherwisenoted.TypicalvaluesareatTJ = +25°C. TLV70018 TLV70018 GROUND PIN CURRENT vs TEMPERATURE SHUTDOWN CURRENT vs INPUT VOLTAGE Figure11. Figure12. TLV70018 TLV70018 CURRENT LIMITvs INPUT VOLTAGE POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY Figure13. Figure14.

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0.1 0.01 0Output□Spectral□Noise□Density□( V/ ) /c109 Hz/c214 10 100 1□k 10□k 100□k 1□M 10□M Frequency□(Hz) I =□10□mA C =□C =□1 F OUT /c109IN OUT Input□Voltage□(V) PSRR□(dB) 10□kHz 100□kHz 1□kHz 100□mA/div 50□mV/div 10 s/div/c109 VOUT VIN =□2.1□V IOUT 200□mA 0□mA t =□t =□1 sR F /c109 20□mA/div 5□mV/div 10 s/div/c109 VOUT VIN =□2.3□V IOUT 10□mA 0□mA t =□t =□1 sR F /c109 1□V/div 5□mV/div 1□ms/div VOUT VIN2.9□V 2.3□V I 200□mAOUT = 50□mA/div 20□mV/div 10 s/div/c109 VOUT VIN =□2.3□V IOUT 50□mA 0□mA t =□t =□1 sR F /c109 TLV700xx TLV701xx www.ti.com SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 TYPICAL CHARACTERISTICS (continued) Over operatingtemperaturerange(TJ = –40°C to+125°C),VIN = VOUT(TYP) + 0.5V or2.0V,whicheverisgreater; IOUT = 10 mA, VEN = VIN,C OUT = 1.0mF,unlessotherwisenoted.TypicalvaluesareatTJ = +25°C. TLV70018 TLV70018 OUTPUT SPECTRAL NOISE DENSITY vs OUTPUT POWER-SUPPLY RIPPLE REJECTION vs INPUT VOLTAGE VOLTAGE Figure15. Figure16. TLV70018 TLV70018 LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE Figure17. Figure18. TLV70018 TLV70018 LOAD TRANSIENT RESPONSE LINE TRANSIENT RESPONSE Figure19. Figure20. Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9

1□V/div 5□mV/div 1□ms/div VOUT VIN 2.7□V 2.3□V I 1□mAOUT = 1□V/div 10□mV/div 1□ms/div VOUT VIN5.5□V 2.1□V I 200□mAOUT = 1□V/div 200□ms/div VOUT VIN I 1□mAOUT = TLV700xx TLV701xx SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) Over operatingtemperaturerange(TJ = –40°C to+125°C),VIN = VOUT(TYP) + 0.5V or2.0V,whicheverisgreater; IOUT = 10 mA, VEN = VIN,C OUT = 1.0mF,unlessotherwisenoted.TypicalvaluesareatTJ = +25°C. TLV70018 TLV70018 LINE TRANSIENT RESPONSE LINE TRANSIENT RESPONSE Figure21. Figure22. TLV70018 VIN RAMP UP, RAMP DOWN RESPONSE Figure23.

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/c116= (120 R ) (120□+□R ) L L /c183 /c183COUT TLV700xx TLV701xx www.ti.com SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010

APPLICATION INFORMATION

The TLV700xx/TLV701xx belongto a new familyof next-generationvalueLDO regulators.These devices Board Layout Recommendations toImprove consume low quiescentcurrentand deliverexcellent PSRR and Noise Performance connection for the output capacitorshould beInputand Output CapacitorRequirements connecteddirectlytotheGND pinofthedevice.High 1.0-mF X5R- and X7R-type ceramic capacitorsare ESR capacitorsmay degradePSRR performance. recommended because these capacitors have minimal variationin value and equivalentseries InternalCurrentLimit resistance(ESR) overtemperature. The TLV700xx/TLV701xx internalcurrentlimithelps However, the TLV700xx/TLV701xx are designed to toprotecttheregulatorduringfaultconditions.During be stablewithan effectivecapacitanceof 0.1 mF or currentlimit,the outputsources a fixedamount of largerat the output.Thus, the deviceisstablewith currentthat is largelyindependentof the output capacitorsofotherdielectrictypesas well,as longas voltage.In such a case, the outputvoltageis not the effectivecapacitance under operating bias regulated,and isVOUT = ILIMIT × R LOAD . The PMOS voltageand temperatureisgreaterthan0.1mF. This pass transistordissipates(VIN – VOUT ) × ILIMIT until effectivecapacitancerefersto the capacitancethat thermalshutdown istriggeredand the deviceturns the LDO sees under operatingbias voltageand off.As thedevicecoolsdown, itisturnedon by the temperatureconditions;thatis,thecapacitanceafter internalthermalshutdown circuit.Ifthefaultcondition takingboth bias voltageand temperaturederating continues,the device cyclesbetween currentlimit intoconsideration.In additionto allowingthe use of and thermalshutdown.See the Thermal Information cheaperdielectrics,thiscapabilityofbeingstablewith sectionformore details. 0.1-mF effectivecapacitancealsoenablestheuse of The PMOS pass elementintheTLV700xx/TLV701xxsmallerfootprintcapacitorsthathave higherderating has a built-inbody diodethatconductscurrentwheninsize-and space-constrainedapplications. the voltageat OUT exceeds the voltageat IN.This Note thatusinga 0.1-mF ratedcapacitorattheoutput currentisnot limited,so ifextendedreversevoltage of the LDO does not ensure stabilitybecause the operationisanticipated,externallimitingto5% ofthe effectivecapacitanceunder the specifiedoperating ratedoutputcurrentisrecommended. conditionswould be lessthan0.1mF.Maximum ESR shouldbe lessthan200 m Ω. Shutdown Although an input capacitoris not requiredfor The enable pin (EN) is activehigh.The deviceis stability,itisgood analogdesignpracticetoconnect enabled when voltageat EN pin goes above 0.9V. a 0.1-mF to1.0-mF, low ESR capacitoracrosstheIN Thisrelativelylowervalueofvoltagerequiredtoturn pin and GND in of the regulator.This capacitor theLDO on can be exploitedtopower theLDO witha counteractsreactiveinput sources and improves GPIO of recentprocessorswhose GPIO Logic 1 transientresponse, noise rejection,and ripple voltagelevelislowerthantraditionalmicrocontrollers. rejection.A higher-valuecapacitormay be necessary The deviceisturnedOFF when theEN pinisheldat iflarge,fastrise-timeloadtransientsare anticipated, less than 0.4V. When shutdown capabilityis not or ifthe deviceis not locatedcloseto the power required,EN can be connectedtotheIN pin. source.Ifsource impedance is more than 2 Ω, a The TLV701 has an internalactivepull-downcircuitry0.1-mF inputcapacitormay be necessaryto ensure thatdischargestheoutputwitha timeconstantof:stability. with:

• R L = Load resistance
• C OUT = Outputcapacitor (1) Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11

P =□(V V ) I/c45 /c180D IN OUT OUT TLV700xx TLV701xx SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com Dropout Voltage For good reliability,thermalprotectionshouldtrigger atleast+35°C above themaximum expectedambientThe TLV700xx/TLV701xx use a PMOS pass condition of the particularapplication.Thistransistortoachievelow dropout.When (VIN – VOUT ) configurationproduces a worst-case junctionis lessthan the dropoutvoltage(VDO) , the PMOS temperatureof +125°C at the highest expectedpass deviceisinthe linearregionof operationand ambienttemperatureand worst-caseload.the input-to-outputresistanceis the R DS(ON) of the PMOS pass element.VDO scalesapproximatelywith The internal protection circuitry of the outputcurrentbecause thePMOS devicebehaves as TLV700xx/TLV701xx has been designed to protect a resistorindropout. againstoverloadconditions.Itwas not intendedto replaceproperheatsinking.ContinuouslyrunningtheAs with any linearregulator,PSRR and transient TLV700xx/TLV701xx intothermalshutdown degradesresponseare degraded as (VIN – VOUT ) approaches devicereliability.dropout.This effectis shown in Figure15 in the TypicalCharacteristicssection. Power Dissipation TransientResponse The abilitytoremove heatfromthedieisdifferentfor each package type, presenting differentAs with any regulator,increasingthe size of the considerationsin the printedcircuitboard (PCB)outputcapacitorreducesover-/undershootmagnitude layout.The PCB area around thedevicethatisfreebutincreasesthedurationofthetransientresponse. ofothercomponents moves theheatfromthedevice totheambientair.PerformancedataforJEDEC lowUndervoltageLockout (UVLO) and high-K boards are given in the Dissipation Ratingstable.Using heaviercopper increasestheThe TLV700xx/TLV701xx use an undervoltage effectivenessinremovingheat from the device.Thelockoutcircuittokeep theoutputshutoffuntilinternal additionof platedthrough-holesto heat-dissipatingcircuitryisoperatingproperly. layersalsoimprovesheatsinkeffectiveness. Thermal Information Power dissipationdepends on inputvoltageand load conditions.Power dissipation(PD) is equal to theThermal protectiondisablesthe output when the productof the outputcurrentand the voltagedropjunctiontemperaturerisesto approximately+160°C, across the output pass element, as shown inallowingthe device to cool. When the junction Equation2.temperaturecools to approximately+140°C, the outputcircuitryisagainenabled.Dependingon power (2) dissipation,thermal resistance,and ambient temperature,thethermalprotectioncircuitmay cycle Package Mountingon and off.Thiscyclinglimitsthe dissipationof the Solder pad footprintrecommendations for theregulator,protectingitfrom damage as a resultof TLV700xx/TLV701xx are availablefrom the Texasoverheating. temperatureuntilthe thermalprotectionistriggered; use worst-caseloadsand signalconditions.

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www.ti.com SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 (1) PublicationIPC-7351isrecommended foralternatedesigns. (2) For more information,refertoTIapplicationnotesSCBA017 and SLUA271 (Quad FlatpackNo-Lead LogicPackages and QFN/SON PCB Attachment, respectively)forspecificthermalinformation,via requirements,and additional recommendations for board layout.These documents are availableat the Texas Instrumentsweb site (http://www.ti.com)by searchingfortheliteraturenumber. (3) Laser-cuttingapertureswithtrapedzoidalwallsand alsoroundingcornerswillofferbetterpasterelease.Customers shouldcontacttheirboard assembly siteforstencildesignrecommendations.Referto IPC-7525 forstencildesign considerations. (4) Customersshouldcontacttheirboardfabricationsiteforminimum soldermask tolerancesbetween signalpads. Figure24. Recommended Land PatternforDSE Package Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13

Example□Board□Layout Stencil□Openings Based□on□Stencil□Thickness of□0,127□mm□(.005□in) TLV700xx TLV701xx SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com (1) Alllineardimensionsareinmillimeters. (2) Customers shouldplacea noteon thecircuitboard fabricationdrawingnottoalterthecentersoldermask defined pad. (3) PublicationIPC-7351isrecommended foralternatedesigns. (4) Laser-cuttingapertureswithtrapedzoidalwallsand alsoroundingcornerswillofferbetterpasterelease.Customers shouldcontacttheirboardassemblysiteforstencildesignrecommendations.Example stencildesignbased on a 50% volumetricloadsolderpaste.RefertoIPC-7525forotherstencilrecommendations. Figure25. Recommended Land PatternforDDC Package

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Example□Board□Layout Stencil□Openings Based□on□Stencil□Thickness of□0,127□mm□(.005□in) TLV700xx TLV701xx www.ti.com SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 (1) Alllineardimensionsareinmillimeters. (2) Customers shouldplacea noteon thecircuitboard fabricationdrawingnottoalterthecentersoldermask defined pad. (3) PublicationIPC-7351isrecommended foralternatedesigns. (4) Laser-cuttingapertureswithtrapedzoidalwallsand alsoroundingcornerswillofferbetterpasterelease.Customers shouldcontacttheirboardassemblysiteforstencildesignrecommendations.Example stencildesignbased on a 50% volumetricloadsolderpaste.RefertoIPC-7525forotherstencilrecommendations. Figure26. Recommended Land PatternforDCK Package Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 15

SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com (1) Alllineardimensionsareinmillimeters. (2) Smalloutlineno-lead(SON) package configuration. Figure27. DSE Package Dimensions

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www.ti.com SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 (1) Alllineardimensionsareinmillimeters. (2) Body dimensionsdo notincludemold flashorprotrusion. (3) FallswithinJEDEC MO-193 variationAB (pin5). Figure28. DDC Package Dimensions Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 17

SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010 www.ti.com (1) Alllineardimensionsareinmillimeters. (2) Body dimensionsdo notincludemold flashorprotrusion.Mold flashand protrusionshallnotexceed 0,15perside. (3) FallswithinJEDEC MO-203 variationAA. Figure29. DCK Package Dimensions

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www.ti.com SLVSA00A –SEPTEMBER 2009–REVISED APRIL 2010

REVISION HISTORY

NOTE: Page numbers forpreviousrevisionsmay differfrompage numbers inthecurrentversion. Changes from Original(September,2009)toRevisionA Page Copyright© 2009–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 19

www.ti.com 25-Aug-2010 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TLV70012DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TLV70012DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples TLV70012DDCR ACTIVE SOT DDC 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Contact TI Distributor or Sales Office TLV70012DDCT ACTIVE SOT DDC 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples TLV70012DSER ACTIVE WSON DSE 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples TLV70012DSET ACTIVE WSON DSE 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TLV70015DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples TLV70015DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TLV70015DDCR ACTIVE SOT DDC 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples TLV70015DDCT ACTIVE SOT DDC 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples TLV70015DSER ACTIVE WSON DSE 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples TLV70015DSET ACTIVE WSON DSE 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TLV70018DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office TLV70018DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TLV70018DDCR ACTIVE SOT DDC 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Contact TI Distributor or Sales Office TLV70018DDCT ACTIVE SOT DDC 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples TLV70018DSER ACTIVE WSON DSE 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

www.ti.com 25-Aug-2010 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TLV70018DSET ACTIVE WSON DSE 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TLV70025DCKR PREVIEW SC70 DCK 5 3000 TBD Call TI Call TI Samples Not Available TLV70025DCKT PREVIEW SC70 DCK 5 250 TBD Call TI Call TI Samples Not Available TLV70025DDCR ACTIVE SOT DDC 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Contact TI Distributor or Sales Office TLV70025DDCT ACTIVE SOT DDC 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples TLV70025DSER ACTIVE WSON DSE 6 3000 TBD Call TI Call TI Purchase Samples TLV70025DSET ACTIVE WSON DSE 6 250 TBD Call TI Call TI Request Free Samples TLV70028DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office TLV70028DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TLV70028DDCR ACTIVE SOT DDC 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Contact TI Distributor or Sales Office TLV70028DDCT ACTIVE SOT DDC 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples TLV70028DSER ACTIVE WSON DSE 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TLV70028DSET ACTIVE WSON DSE 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples TLV70029DSER ACTIVE WSON DSE 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TLV70029DSET ACTIVE WSON DSE 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples TLV70030DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office TLV70030DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TLV70030DDCR ACTIVE SOT DDC 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Contact TI Distributor or Sales Office TLV70030DDCT ACTIVE SOT DDC 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples

www.ti.com 25-Aug-2010 Addendum-Page 3 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TLV70030DSER ACTIVE WSON DSE 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples TLV70030DSET ACTIVE WSON DSE 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TLV70033DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office TLV70033DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TLV70033DDCR ACTIVE SOT DDC 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Contact TI Distributor or Sales Office TLV70033DDCT ACTIVE SOT DDC 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples TLV70033DSER ACTIVE WSON DSE 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples TLV70033DSET ACTIVE WSON DSE 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

www.ti.com 25-Aug-2010 Addendum-Page 4 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLV70033 :

• Automotive: TLV70033-Q1 NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 Pack Materials-Page 1

(mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV70012DCKR SC70 DCK 5 3000 202.0 201.0 28.0 TLV70012DCKT SC70 DCK 5 250 202.0 201.0 28.0 TLV70012DDCR SOT DDC 5 3000 406.0 348.0 63.0 TLV70012DDCT SOT DDC 5 250 202.0 201.0 28.0 TLV70015DCKR SC70 DCK 5 3000 203.0 203.0 35.0 TLV70015DCKT SC70 DCK 5 250 203.0 203.0 35.0 TLV70015DDCR SOT DDC 5 3000 195.0 200.0 45.0 TLV70015DDCT SOT DDC 5 250 195.0 200.0 45.0 TLV70018DCKR SC70 DCK 5 3000 203.0 203.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 Pack Materials-Page 2

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV70018DCKT SC70 DCK 5 250 203.0 203.0 35.0 TLV70018DDCR SOT DDC 5 3000 195.0 200.0 45.0 TLV70018DDCT SOT DDC 5 250 195.0 200.0 45.0 TLV70025DDCR SOT DDC 5 3000 195.0 200.0 45.0 TLV70025DDCT SOT DDC 5 250 195.0 200.0 45.0 TLV70028DCKR SC70 DCK 5 3000 203.0 203.0 35.0 TLV70028DCKT SC70 DCK 5 250 203.0 203.0 35.0 TLV70028DDCR SOT DDC 5 3000 195.0 200.0 45.0 TLV70028DDCT SOT DDC 5 250 195.0 200.0 45.0 TLV70030DCKR SC70 DCK 5 3000 203.0 203.0 35.0 TLV70030DCKT SC70 DCK 5 250 203.0 203.0 35.0 TLV70030DDCR SOT DDC 5 3000 195.0 200.0 45.0 TLV70030DDCT SOT DDC 5 250 195.0 200.0 45.0 TLV70033DCKR SC70 DCK 5 3000 203.0 203.0 35.0 TLV70033DCKT SC70 DCK 5 250 203.0 203.0 35.0 TLV70033DDCR SOT DDC 5 3000 195.0 200.0 45.0 TLV70033DDCT SOT DDC 5 250 195.0 200.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 Pack Materials-Page 3

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