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/c109 Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community TLV700 SLVSA00E –SEPTEMBER 2009–REVISED APRIL 2015 TLV700200-mA,Low-IQ, Low-DropoutRegulatorforPortableDevices
1 Features 3 Description
The TLV700 series of low-dropout (LDO) linear 1• Very Low Dropout: regulators are low quiescent current devices with– 43 mV at IOUT = 50 mA, VOUT = 2.8 V excellent line and load transient performance. These – 85 mV at IOUT = 100 mA, VOUT = 2.8 V LDOs are designed for power-sensitive applications. A precision bandgap and error amplifier provides– 175 mV at IOUT = 200 mA, VOUT = 2.35 V overall 2% accuracy. Low output noise, very high• 2% Accuracy power-supply rejection ratio (PSRR), and low dropout
- Low IQ: 31 μA voltage make this series of devices ideal for most battery-operated handheld equipment. All device• Available in Fixed-Output Voltages from 1.2 V to versions have thermal shutdown and current limit for4.8 V safety.• High PSRR: 68 dB at 1 kHz Furthermore, these devices are stable with an• Stable With Effective Capacitance of 0.1 μF(1) effective output capacitance of only 0.1 μF. This• Thermal Shutdown and Overcurrent Protection feature enables the use of cost-effective capacitors
- Available in 1.5-mm × 1.5-mm SON-6, SOT23-5, that have higher bias voltages and temperature and SC-70 Packages derating. The devices regulate to specified accuracy with no output load.(1) See the Input and Output Capacitor Requirements. The TLV700 series of LDOs are available in 1.5-mm 2 Applications × 1.5-mm SON-6, SOT-5, and SC70 packages.
- Wireless Handsets Device Information(1)
- Smart Phones, PDAs PART NUMBER PACKAGE BODY SIZE (NOM)
- ZigBee® Networks SC70 (5) 2.00 mm × 1.25 mm
- Bluetooth® Devices TL700xx SOT (5) 2.90 mm × 1.60 mm
- Li-Ion Operated Handheld Products WSON (6) 1.50 mm × 1.50 mm
- WLAN and Other PC Add-on Cards (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Circuit An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
SLVSA00E –SEPTEMBER 2009–REVISED APRIL 2015 www.ti.com Table of Contents
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (October 2012) to Revision E Page
- Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Changes from Revision C (July 2011) to Revision D Page Changes from Revision B (December, 2010) to Revision C Page Changes from Revision A (April, 2010) to Revision B Page
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Product Folder Links: TLV700
www.ti.com SLVSA00E –SEPTEMBER 2009–REVISED APRIL 2015 Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TLV700
(1) IN GND EN OUT N/C (1) IN GND EN 3 4 EN N/C (1) N/C (1) IN GND OUT TLV700 SLVSA00E –SEPTEMBER 2009–REVISED APRIL 2015 www.ti.com
5 Pin Configuration and Functions
(1) No connection. Pin Functions PIN I/O DESCRIPTION NAME WSON SC70 SOT Input pin. A small, 1-μF ceramic capacitor is recommended from this pin to ground IN 1 1 1 I to assure stability and good transient performance. See Input and Output Capacitor Requirements for more details. GND 2 2 2 — Ground pin Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V EN 6 3 3 I puts the regulator into shutdown mode and reduces operating current to 1 μA, nominal. NC 4, 5 4 4 — No connection. This pin can be tied to ground to improve thermal dissipation. Regulated output voltage pin. A small, 1-μF ceramic capacitor is needed from this OUT 3 5 5 O pin to ground to assure stability. See Input and Output Capacitor Requirements for more details.
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Product Folder Links: TLV700
www.ti.com SLVSA00E –SEPTEMBER 2009–REVISED APRIL 2015
6 Specifications
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN –0.3 6 Voltage VEN –0.3 6(2) V VOUT –0.3 6 Maximum output current IOUT Internally limited Output short-circuit duration Indefinite Operating junction, TJ –55 150 Temperature °C Storage, Tstg –55 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) VEN absolute maximum rating is VIN + 0.3 V or 6 V, whichever is less.
6.2 ESD Ratings
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge VCharged device model (CDM), per JEDEC specification JESD22-C101, ±500all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN 2 5.5 V VOUT 1.2 4.8 V IOUT 0 200 mA
6.4 Thermal Information
THERMAL METRIC(1) DCK [SC70] DDC [SOT] DSE [WSON] UNIT
5 PINS 5 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 307.6 235.9 321.3 RθJC(top) Junction-to-case (top) thermal resistance 79.1 61.9 207.9 RθJB Junction-to-board thermal resistance 93.7 54 281.5 °C/W ψJT Junction-to-top characterization parameter 1.3 0.8 42.4 ψJB Junction-to-board characterization parameter 92.8 53.4 284.8 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a 142.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TLV700
SLVSA00E –SEPTEMBER 2009–REVISED APRIL 2015 www.ti.com
6.5 Electrical Characteristics
At VIN = VOUT(nom) + 0.3 V or 2 V (whichever is greater); IOUT = 10 mA, VEN = 0.9 V, COUT = 1 μF, and TJ = –40°C to +125°C, unless otherwise noted. Typical values are at TJ = 25°C. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIN Input voltage range 2 5.5 V VOUT DC output accuracy –40°C ≤ TJ ≤ +125°C –2% 2% VOUT(nom) + 0.3 V ≤ VIN ≤ 5.5 V,ΔVOUT(ΔVIN) Line regulation 1 5 mVIOUT = 10 mA ΔVOUT(ΔIOUT) Load regulation 0 mA ≤ IOUT ≤ 200 mA 1 15 mV VIN = 0.98 × VOUT(nom), IOUT = 50 mA, 43VOUT = 2.8 V VIN = 0.98 × VOUT(nom), IOUT = 100 mA,VDO Dropout voltage(1) 85 mVVOUT = 2.8 V VIN = 0.98 × VOUT(nom), IOUT = 200 mA, 175 250VOUT = 2.35 V ICL Output current limit VOUT = 0.9 × VOUT(nom) 220 860 mA IOUT = 0 mA 31 55 IGND Ground pin current μA IOUT = 200 mA, VIN = VOUT + 0.5 V 270 VEN ≤ 0.4 V, VIN = 2 V 400 nA ISHDN Ground pin current (shutdown) VEN ≤ 0.4 V, 2 V ≤ VIN ≤ 4.5 V 1 2 μA VIN = 2.3 V, VOUT = 1.8 V,PSRR Power-supply rejection ratio 68 dBIOUT = 10 mA, f = 1 kHz BW = 100 Hz to 100 kHz,Vn Output noise voltage 48 μVRMSVIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA tSTR Start-up time(2) COUT = 1 μF, IOUT = 200 mA 100 μs VEN(high) Enable pin high (enabled) 0.9 VIN V VEN(low) Enable pin low (disabled) 0 0.4 V IEN Enable pin current VIN = VEN = 5.5 V 0.04 0.5 μA UVLO Undervoltage lockout VIN rising 1.9 V Shutdown, temperature increasing 160 Tsd Thermal shutdown temperature °C Reset, temperature decreasing 140 TJ Operating junction temperature –40 125 °C (1) VDO is measured for devices with VOUT(nom) ≥ 2.35 V. (2) Start-up time = time from EN assertion to 0.98 × VOUT(nom).
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Product Folder Links: TLV700
40 C/c45
6.6 Typical Characteristics
VEN = VIN, COUT = 1 μF, unless otherwise noted. Typical values are at TJ = 25°C. Figure 1. TLV70018 Line Regulation Figure 2. TLV70018 Line Regulation Figure 3. TLV70018 Load Regulation Figure 4. Dropout Voltage vs Input Voltage Figure 5. Dropout Voltage vs Output Current, VOUT = 4.8 V Figure 6. TLV70018 Output Voltage vs Temperature
VEN = VIN, COUT = 1 μF, unless otherwise noted. Typical values are at TJ = 25°C. Figure 8. TLV70018 Ground Pin Current vs LoadFigure 7. TLV70018 Ground Pin Current vs Input Voltage Figure 9. TLV70018 Ground Pin Current vs Temperature Figure 10. TLV70018 Shutdown Current vs Input Voltage Figure 11. TLV70018 Power-Supply Ripple Rejection vs Figure 12. TLV70018 Power-Supply Ripple Rejection vs
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VEN = VIN, COUT = 1 μF, unless otherwise noted. Typical values are at TJ = 25°C. Figure 19. TLV70018 Line Transient Response Figure 20. TLV70018 VIN Ramp-Up, Ramp-Down Response
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TLV700xx□Series TLV700 www.ti.com SLVSA00E –SEPTEMBER 2009–REVISED APRIL 2015
7 Detailed Description
7.1 Overview
The TLV700 series of LDO linear regulators are low quiescent current devices with excellent line and load transient performance. These LDOs are designed for power-sensitive applications. A precision bandgap and error amplifier provides overall 2% accuracy. Low output noise, very high PSRR, and low dropout voltage make this series of devices ideal for most battery-operated handheld equipment. All device versions have integrated thermal shutdown, current limit, and undervoltage lockout (UVLO).
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Internal Current Limit
The TLV700 internal current limit helps to protect the regulator during fault conditions. During current limit, the output sources a fixed amount of current that is largely independent of the output voltage. In such a case, the output voltage is not regulated, and is VOUT = ICL × RLOAD. The PMOS pass transistor dissipates (VIN – VOUT) × ICL until thermal shutdown is triggered and the device turns off. As the device cools down, it is turned on by the internal thermal shutdown circuit. If the fault condition continues, the device cycles between current limit and thermal shutdown. See Thermal Protection for more details. The PMOS pass element in the TLV700 has a built-in body diode that conducts current when the voltage at OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is anticipated, external limiting to 5% of the rated output current is recommended.
7.3.2 Shutdown
The enable pin (EN) is active high. The device is enabled when voltage at EN pin goes above 0.9 V. The device is turned off when the EN pin is held at less than 0.4 V. When shutdown capability is not required, EN can be connected to the IN pin. Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: TLV700
7.3.3 Dropout Voltage
behaves as a resistor in dropout. As with any linear regulator, PSRR and transient response are degraded as (VIN – VOUT) approaches dropout. This effect is shown in Figure 12 in Typical Characteristics.
7.3.4 Undervoltage Lockout (UVLO)
The TLV700 uses a UVLO circuit to keep the output shut off until internal circuitry is operating properly.
7.4 Device Functional Modes
7.4.1 Normal Operation
- The input voltage is greater than the nominal output voltage added to the dropout voltage.
- The output current is less than the current limit.
- The input voltage is greater than the UVLO voltage.
7.4.2 Dropout Operation
the LDO. Line or load transients in dropout may result in large output voltage deviations. Table 1 lists the conditions that lead to the different modes of operation. Table 1. Device Functional Mode Comparison
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8 Application and Implementation
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.2 Typical Application
Figure 21 shows a typical application circuit. Figure 21. Typical Application Circuit
8.2.1 Design Requirements
Table 2 lists the design parameters. Table 2. Design Parameters
8.2.2 Detailed Design Procedure
8.2.2.1 Input and Output Capacitor Requirements
variation in value and equivalent series resistance (ESR) over temperature. However, the TLV700 is designed to be stable with an effective capacitance of 0.1 μF or larger at the output. smaller footprint capacitors that have higher derating in size- and space-constrained applications.
source. If source impedance is more than 2 Ω, a 0.1-μF input capacitor may be necessary to ensure stability.
8.2.2.2 Transient Response
but increases the duration of the transient response.
8.2.3 Application Curves
Figure 23. TLV70018 Line Transient ResponseFigure 22. TLV70018 Load Transient Response
9 Power Supply Recommendations
start-up or load transient events.
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10 Layout
10.1 Layout Guidelines
pin of the device. High ESR capacitors may degrade PSRR performance.
10.2 Layout Examples
Figure 24. Layout Example for the DCK and DDC Package Figure 25. Layout Example for the DSE Package
10.3 Thermal Protection
protection is triggered; use worst-case loads and signal conditions. the highest expected ambient temperature and worst-case load.
P =□(V V ) I/c45 /c180D IN OUT OUT TLV700 SLVSA00E –SEPTEMBER 2009–REVISED APRIL 2015 www.ti.com Thermal Protection (continued) The internal protection circuitry of the TLV700 has been designed to protect against overload conditions. The protection circuitry was not intended to replace proper heatsinking. Continuously running the TLV700 into thermal shutdown degrades device reliability.
10.4 Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in the PCB layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. Performance data for JEDEC low and high-K boards are given in Thermal Information. Using heavier copper increases the effectiveness in removing heat from the device. The addition of plated through-holes to heat-dissipating layers also improves heatsink effectiveness. Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of the output current and the voltage drop across the output pass element, as shown in Equation 1. (1)
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Product Folder Links: TLV700
11 Device and Documentation Support
11.1 Device Support
11.1.1 Development Support
11.1.1.1 Evaluation Modules
- TLV70033EVM-503
- TLV70018EVM-503
- TLV70028EVM-463 These EVMs can be requested at the Texas Instruments website through the product folders or purchased directly from the TI eStore.
11.1.1.2 Spice Models
11.1.2 Device Nomenclature
Table 3. Ordering Information(1) TLV700xx yyyz XX is nominal output voltage (for example, 28 = 2.8 V). YYY is the package designator. Z is tape and reel quantity (R = 3000, T = 250). device product folder at www.ti.com. (2) Output voltages from 1.2 V to 4.8 V in 50-mV increments are available. Contact factory for details and availability.
11.2 Documentation Support
11.2.1 Related Documentation
- Using the TLV700xxEVM-463 Evaluation Module, SLUU390
- Using the TLV700xxEVM-503 Evaluation Module, SLUU391
11.3 Trademarks
Bluetooth is a registered trademark of Bluetooth SIG. ZigBee is a registered trademark of the ZigBee Alliance. All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
This glossary lists and explains terms, acronyms, and definitions.
SLVSA00E –SEPTEMBER 2009–REVISED APRIL 2015 www.ti.com
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Product Folder Links: TLV700
www.ti.com 7-Oct-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TLV70012DCKR Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ODT TLV70012DCKR.B Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 ODT TLV70012DCKT Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ODT TLV70012DCKT.B Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 ODT TLV70012DDCR Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 ODO TLV70012DDCR.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ODO TLV70012DDCRG4 Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ODO TLV70012DDCRG4.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ODO TLV70012DDCT Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 ODO TLV70012DDCT.B Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ODO TLV70012DSER Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NH TLV70012DSER.B Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 NH TLV70012DSET Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NH TLV70012DSET.B Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 NH TLV70013DDCR Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 SAH TLV70013DDCR.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SAH TLV70013DDCRG4 Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SAH TLV70013DDCRG4.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SAH TLV70013DDCT Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 SAH TLV70013DDCT.B Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SAH Addendum-Page 1
www.ti.com 7-Oct-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TLV70015DCKR Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ODU TLV70015DCKR.B Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 ODU TLV70015DCKT Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ODU TLV70015DCKT.B Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 ODU TLV70015DDCR Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 ODP TLV70015DDCR.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ODP TLV70015DDCT Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 ODP TLV70015DDCT.B Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ODP TLV70015DSER Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NJ TLV70015DSER.B Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 NJ TLV70015DSET Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NJ TLV70015DSET.B Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 NJ TLV70018DCKR Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ODV TLV70018DCKR.B Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 ODV TLV70018DCKRG4 Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 ODV TLV70018DCKRG4.B Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 ODV TLV70018DCKT Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ODV TLV70018DCKT.B Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 ODV TLV70018DDCR Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 ODK TLV70018DDCR.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes SN Level-2-260C-1 YEAR -40 to 125 ODK TLV70018DDCT Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 ODK TLV70018DDCT.B Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes SN Level-2-260C-1 YEAR -40 to 125 ODK TLV70018DSER Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NK TLV70018DSER.B Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 NK TLV70018DSET Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 85 NK Addendum-Page 2
www.ti.com 7-Oct-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TLV70018DSET.B Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 NK TLV70019DDCR Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 SCJ TLV70019DDCR.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SCJ TLV70019DDCT Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 SCJ TLV70019DDCT.B Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SCJ TLV70022DDCR Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 SCI TLV70022DDCR.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SCI TLV70022DDCT Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 SCI TLV70022DDCT.B Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SCI TLV70025DCKR Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 QTP TLV70025DCKR.B Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 QTP TLV70025DCKRG4 Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 QTP TLV70025DCKRG4.B Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 QTP TLV70025DCKT Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 QTP TLV70025DCKT.B Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 QTP TLV70025DDCR Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 DAU TLV70025DDCR.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes SN Level-2-260C-1 YEAR -40 to 125 DAU TLV70025DDCT Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 DAU TLV70025DDCT.B Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes SN Level-2-260C-1 YEAR -40 to 125 DAU TLV70025DSER Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 QY TLV70025DSER.B Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 QY TLV70025DSET Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 QY Addendum-Page 3
www.ti.com 7-Oct-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TLV70025DSET.B Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 QY TLV70028DCKR Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ODW TLV70028DCKR.B Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 ODW TLV70028DCKRG4 Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 ODW TLV70028DCKRG4.B Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 ODW TLV70028DCKT Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ODW TLV70028DCKT.B Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 ODW TLV70028DDCR Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 ODL TLV70028DDCR.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes SN Level-2-260C-1 YEAR -40 to 125 ODL TLV70028DDCT Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 ODL TLV70028DDCT.B Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes SN Level-2-260C-1 YEAR -40 to 125 ODL TLV70028DSER Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NL TLV70028DSER.B Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 NL TLV70028DSET Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NL TLV70028DSET.B Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 NL TLV70029DSER Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 QJ TLV70029DSER.B Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 QJ TLV70029DSET Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 QJ TLV70029DSET.B Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 QJ TLV70030DCKR Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ODR TLV70030DCKR.B Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 ODR TLV70030DCKRG4 Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 ODR TLV70030DCKRG4.B Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 ODR TLV70030DCKT Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ODR TLV70030DCKT.B Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 ODR TLV70030DDCR Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 ODM Addendum-Page 4
www.ti.com 7-Oct-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TLV70030DDCR.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes SN Level-2-260C-1 YEAR -40 to 125 ODM TLV70030DDCT Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 ODM TLV70030DDCT.B Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes SN Level-2-260C-1 YEAR -40 to 125 ODM TLV70030DSER Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NP TLV70030DSER.B Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 NP TLV70030DSET Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NP TLV70030DSET.B Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 NP TLV70031DSER Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 C4 TLV70031DSER.B Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 C4 TLV70031DSET Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 C4 TLV70031DSET.B Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 C4 TLV70032DDCR Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 SCH TLV70032DDCR.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SCH TLV70032DDCT Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 SCH TLV70032DDCT.B Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SCH TLV70033DCKR Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ODS TLV70033DCKR.B Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 ODS TLV70033DCKRG4 Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 ODS TLV70033DCKRG4.B Active Production SC70 (DCK) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 ODS TLV70033DCKT Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ODS TLV70033DCKT.B Active Production SC70 (DCK) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 ODS TLV70033DDCR Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 ODN TLV70033DDCR.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes SN Level-2-260C-1 YEAR -40 to 125 ODN Addendum-Page 5
www.ti.com 7-Oct-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TLV70033DDCT Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 ODN TLV70033DDCT.B Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes SN Level-2-260C-1 YEAR -40 to 125 ODN TLV70033DSER Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NR TLV70033DSER.B Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 NR TLV70033DSERG4.B Active Production WSON (DSE) | 6 3000 | LARGE T&R - Call TI Call TI -40 to 125 TLV70033DSET Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NR TLV70033DSET.B Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 NR TLV70036DDCR Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 SCG TLV70036DDCR.B Active Production SOT-23- THIN (DDC) | 5 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SCG TLV70036DDCT Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-2-260C-1 YEAR -40 to 125 SCG TLV70036DDCT.B Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SCG TLV70036DDCTG4 Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SCG TLV70036DDCTG4.B Active Production SOT-23- THIN (DDC) | 5 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 SCG TLV70036DSER Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 UG TLV70036DSER.B Active Production WSON (DSE) | 6 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 UG TLV70036DSET Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 UG TLV70036DSET.B Active Production WSON (DSE) | 6 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 UG (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. Addendum-Page 6
www.ti.com 7-Oct-2025 (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLV700 :
- Automotive : TLV700-Q1 NOTE: Qualified Version Definitions:
- Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 7
PACKAGE MATERIALS INFORMATION www.ti.com 23-Jul-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant TLV70012DDCR SOT-23- THIN TLV70012DDCRG4 SOT-23- THIN TLV70012DDCT SOT-23- THIN TLV70012DDCT SOT-23- THIN TLV70012DDCT SOT-23- THIN TLV70013DDCR SOT-23- THIN TLV70013DDCRG4 SOT-23- THIN Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-Jul-2025 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant TLV70013DDCT SOT-23- THIN TLV70015DDCR SOT-23- THIN TLV70015DDCT SOT-23- THIN TLV70018DDCR SOT-23- THIN TLV70018DDCT SOT-23- THIN TLV70019DDCR SOT-23- THIN TLV70019DDCT SOT-23- THIN TLV70022DDCR SOT-23- THIN TLV70022DDCT SOT-23- THIN TLV70025DDCR SOT-23- THIN TLV70025DDCT SOT-23- THIN Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-Jul-2025 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant TLV70028DDCR SOT-23- THIN TLV70028DDCT SOT-23- THIN TLV70030DDCR SOT-23- THIN TLV70030DDCT SOT-23- THIN TLV70032DDCR SOT-23- THIN TLV70032DDCT SOT-23- THIN TLV70033DDCR SOT-23- THIN TLV70033DDCT SOT-23- THIN TLV70036DDCR SOT-23- THIN TLV70036DDCT SOT-23- THIN Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION www.ti.com 23-Jul-2025 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant TLV70036DDCTG4 SOT-23- THIN Pack Materials-Page 4
PACKAGE MATERIALS INFORMATION www.ti.com 23-Jul-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV70012DCKR SC70 DCK 5 3000 210.0 185.0 35.0 TLV70012DCKT SC70 DCK 5 250 210.0 185.0 35.0 TLV70012DDCR SOT-23-THIN DDC 5 3000 210.0 185.0 35.0 TLV70012DDCRG4 SOT-23-THIN DDC 5 3000 406.0 348.0 63.0 TLV70012DDCT SOT-23-THIN DDC 5 250 210.0 185.0 35.0 TLV70012DDCT SOT-23-THIN DDC 5 250 202.0 201.0 28.0 TLV70012DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0 TLV70012DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70012DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70013DDCR SOT-23-THIN DDC 5 3000 210.0 185.0 35.0 TLV70013DDCRG4 SOT-23-THIN DDC 5 3000 202.0 201.0 28.0 TLV70013DDCT SOT-23-THIN DDC 5 250 210.0 185.0 35.0 TLV70015DCKR SC70 DCK 5 3000 210.0 185.0 35.0 TLV70015DCKT SC70 DCK 5 250 210.0 185.0 35.0 TLV70015DDCR SOT-23-THIN DDC 5 3000 210.0 185.0 35.0 TLV70015DDCT SOT-23-THIN DDC 5 250 210.0 185.0 35.0 TLV70015DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70015DSET WSON DSE 6 250 183.0 183.0 20.0 Pack Materials-Page 5
PACKAGE MATERIALS INFORMATION www.ti.com 23-Jul-2025 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV70018DCKR SC70 DCK 5 3000 210.0 185.0 35.0 TLV70018DCKRG4 SC70 DCK 5 3000 180.0 180.0 18.0 TLV70018DCKRG4 SC70 DCK 5 3000 183.0 183.0 20.0 TLV70018DCKT SC70 DCK 5 250 210.0 185.0 35.0 TLV70018DCKT SC70 DCK 5 250 180.0 180.0 18.0 TLV70018DDCR SOT-23-THIN DDC 5 3000 210.0 185.0 35.0 TLV70018DDCT SOT-23-THIN DDC 5 250 210.0 185.0 35.0 TLV70018DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70018DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70019DDCR SOT-23-THIN DDC 5 3000 210.0 185.0 35.0 TLV70019DDCT SOT-23-THIN DDC 5 250 210.0 185.0 35.0 TLV70022DDCR SOT-23-THIN DDC 5 3000 210.0 185.0 35.0 TLV70022DDCT SOT-23-THIN DDC 5 250 210.0 185.0 35.0 TLV70025DCKR SC70 DCK 5 3000 210.0 185.0 35.0 TLV70025DCKRG4 SC70 DCK 5 3000 180.0 180.0 18.0 TLV70025DCKRG4 SC70 DCK 5 3000 200.0 183.0 25.0 TLV70025DCKT SC70 DCK 5 250 210.0 185.0 35.0 TLV70025DDCR SOT-23-THIN DDC 5 3000 210.0 185.0 35.0 TLV70025DDCT SOT-23-THIN DDC 5 250 210.0 185.0 35.0 TLV70025DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70025DSER WSON DSE 6 3000 203.0 203.0 35.0 TLV70025DSET WSON DSE 6 250 203.0 203.0 35.0 TLV70025DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70028DCKR SC70 DCK 5 3000 210.0 185.0 35.0 TLV70028DCKRG4 SC70 DCK 5 3000 180.0 180.0 18.0 TLV70028DCKRG4 SC70 DCK 5 3000 183.0 183.0 20.0 TLV70028DCKT SC70 DCK 5 250 210.0 185.0 35.0 TLV70028DDCR SOT-23-THIN DDC 5 3000 210.0 185.0 35.0 TLV70028DDCT SOT-23-THIN DDC 5 250 210.0 185.0 35.0 TLV70028DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70028DSER WSON DSE 6 3000 205.0 200.0 33.0 TLV70028DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70028DSET WSON DSE 6 250 205.0 200.0 33.0 TLV70029DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70029DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70030DCKR SC70 DCK 5 3000 210.0 185.0 35.0 TLV70030DCKRG4 SC70 DCK 5 3000 183.0 183.0 20.0 TLV70030DCKRG4 SC70 DCK 5 3000 200.0 183.0 25.0 TLV70030DCKRG4 SC70 DCK 5 3000 180.0 180.0 18.0 TLV70030DCKT SC70 DCK 5 250 210.0 185.0 35.0 TLV70030DDCR SOT-23-THIN DDC 5 3000 210.0 185.0 35.0 TLV70030DDCT SOT-23-THIN DDC 5 250 210.0 185.0 35.0 TLV70030DSER WSON DSE 6 3000 183.0 183.0 20.0 Pack Materials-Page 6
PACKAGE MATERIALS INFORMATION www.ti.com 23-Jul-2025 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV70030DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70031DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70031DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70032DDCR SOT-23-THIN DDC 5 3000 210.0 185.0 35.0 TLV70032DDCT SOT-23-THIN DDC 5 250 210.0 185.0 35.0 TLV70033DCKR SC70 DCK 5 3000 210.0 185.0 35.0 TLV70033DCKRG4 SC70 DCK 5 3000 183.0 183.0 20.0 TLV70033DCKRG4 SC70 DCK 5 3000 180.0 180.0 18.0 TLV70033DCKT SC70 DCK 5 250 210.0 185.0 35.0 TLV70033DDCR SOT-23-THIN DDC 5 3000 210.0 185.0 35.0 TLV70033DDCT SOT-23-THIN DDC 5 250 210.0 185.0 35.0 TLV70033DSER WSON DSE 6 3000 205.0 200.0 33.0 TLV70033DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70033DSET WSON DSE 6 250 183.0 183.0 20.0 TLV70033DSET WSON DSE 6 250 205.0 200.0 33.0 TLV70036DDCR SOT-23-THIN DDC 5 3000 210.0 185.0 35.0 TLV70036DDCT SOT-23-THIN DDC 5 250 210.0 185.0 35.0 TLV70036DDCTG4 SOT-23-THIN DDC 5 250 213.0 191.0 35.0 TLV70036DSER WSON DSE 6 3000 183.0 183.0 20.0 TLV70036DSET WSON DSE 6 250 183.0 183.0 20.0 Pack Materials-Page 7
www.ti.com PACKAGE OUTLINE C 0.22
0.08 TYP
0.15 2.4 1.8 2X 0.65 1.3
1.1 MAX
0.1
0.0 TYP
5X 0.33 0.15 NOTE 5
0.1 C A B
0.46
0.26 TYP
0 TYP
1.3 4X 0 -12 4X 4 -15 A 2.15 1.85 B1.4 1.1 (0.9) (0.15) (0.1) SOT - 1.1 max heightDCK0005A SMALL OUTLINE TRANSISTOR 4214834/G 11/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-203. 4. Support pin may differ or may not be present. 5. Lead width does not comply with JEDEC. 6. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25mm per side 0.1 C SCALE 5.600
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
5X (0.95) 5X (0.4) (2.2) (1.3) 2X (0.65) (R0.05) TYP 4214834/G 11/2024 SOT - 1.1 max heightDCK0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 7. Publication IPC-7351 may have alternate designs. 8. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.2) (1.3) 2X(0.65) 5X (0.95) 5X (0.4) (R0.05) TYP SOT - 1.1 max heightDCK0005A SMALL OUTLINE TRANSISTOR 4214834/G 11/2024 NOTES: (continued) 9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 10. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:18X SYMM PKG 3 4
www.ti.com PACKAGE OUTLINE C 0.20
0.12 TYP
0.25 GAGE PLANE 3.05 2.55 1.1 0.7 0.1 5X 0.5 0.3
0.2 C A B
0.6
0.3 TYP
1.9 0 -8 TYP 0.95 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (0.2) (0.15) SOT-23 - 1.1 max heightDDC0005A SMALL OUTLINE TRANSISTOR 4220752/C 08/2024 SEATING PLANE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC MO-193. 4. Support pin may differ or may not be present. 0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT 5X (1.1) 5X (0.6) (2.7) 4X (0.95) (R0.05) TYP 4220752/C 08/2024 SOT-23 - 1.1 max heightDDC0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPLOSED METAL SHOWN SCALE:15X SYMM 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDERMASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.7) 4X(0.95) 5X (1.1) 5X (0.6) (R0.05) TYP SOT-23 - 1.1 max heightDDC0005A SMALL OUTLINE TRANSISTOR 4220752/C 08/2024 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X SYMM SYMM 3 4
www.ti.com PACKAGE OUTLINE C 0.05 0.005X 0.6 0.4 (0.2) TYP
0.8 MAX
6X 0.3 0.2 0.7 0.5 2X 1 4X 0.5 B 1.55 1.45 A 1.55 1.45 WSON - 0.8 mm max heightDSE0006A PLASTIC SMALL OUTLINE - NO LEAD 4220552/B 01/2024 PIN 1 INDEX AREA SEATING PLANE 0.08 C 3 4 0.05 C PIN 1 ID NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. SCALE 6.000
www.ti.com EXAMPLE BOARD LAYOUT (0.8) 4X 0.5 (1.2)
0.05 MIN
0.05 MAX
6X (0.25) (R0.05) TYP 5X (0.7) WSON - 0.8 mm max heightDSE0006A PLASTIC SMALL OUTLINE - NO LEAD 4220552/B 01/2024 PKG SYMM LAND PATTERN EXAMPLE SCALE:40X NOTES: (continued) 3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). SOLDER MASK OPENING SOLDER MASK METAL UNDER PADS 1-3 SOLDER MASK DEFINED METALSOLDER MASK OPENING SOLDER MASK DETAILS PADS 4-6 NON SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN (0.8) 5X (0.7) 4X (0.5) (1.2) 6X (0.25) (R0.05) TYP WSON - 0.8 mm max heightDSE0006A PLASTIC SMALL OUTLINE - NO LEAD NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:40X PKG 3 4 SYMM
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