SINGLE CELL HIGH EFFICIENT STEP-UP CONVERTER IN 6 PIN SC-70 PACKAGE* (Rev. A)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SLVSAF0,A]
- PDF pages: 21
Technical content
L 10µF 4.7 µH VIN VOUT FB 10µF EN GND TLV61225 VOUT 3.3 V
0.8 V to VOUT
Sample & Buy T echnical Documents Tools & Software Support & Community TLV61225 SLVSAF0A – AUGUST 2010– REVISED MAY 2015 TLV61225Single-CellHigh-EfficientStep-UpConverterin6-PinSC-70Package
1 Features 3 Description
The TLV61225 device provides a power-supply 1• Up to 94% Efficiency at Typical Operating solution for products powered by either a single-cellConditions or 2-cell alkaline or NiMH, or 1-cell Li-primary battery.• 5-μA Quiescent Current Possible output currents depend on the input-to-
- Operating Input Voltage from 0.7 V to 3.3 V output voltage ratio. The boost converter is based on a hysteretic controller topology using synchronous• Pass-Through Function During Shutdown rectification to obtain maximum efficiency at minimal• Output Current of More Than 40-mA From a 1.2-V quiescent currents. The output voltage of this deviceInput is set internally to a fixed output voltage of 3.3 V. The
- Typical Switch Current Rating 400 mA converter can be switched off by a featured enable pin. While being switched off, battery drain is• Output Overvoltage Protection minimized. The device is offered in a 6-pin SC-70• Overtemperature Protection package (DCK) measuring 2 mm × 2 mm to enable
- Fixed 3.3-V Output Voltage small circuit layout size.
- Small 6-Pin SC-70 Package Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM)2 Applications TLV61225 SOT (6) 2.00 mm × 1.25 mm• Battery-Powered Applications (1) For all available packages, see the orderable addendum at– 1- to 2- Cell NiMH or Alkaline the end of the data sheet. – 1-Cell Li-Primary
- Consumer and Portable Medical Products
- Personal Care Products Typical Application Schematic An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
SLVSAF0A –AUGUST 2010– REVISED MAY 2015 www.ti.com Table of Contents
4 Revision History
Changes from Original (August 2010) to Revision A Page
- Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
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L VIN EN VOUT FB TLV61225 www.ti.com SLVSAF0A – AUGUST 2010– REVISED MAY 2015
5 Pin Configuration and Functions
(Top View) Pin Functions PIN I/O DESCRIPTION NAME NO. EN 6 I Enable input (1: enabled, 0: disabled). Must be actively tied high or low. FB 2 I Output voltage sense input. Must be connected to VOUT. GND 3 — Control / logic and power ground L 5 I Connection for Inductor VIN 1 I Boost converter input voltage VOUT 4 O Boost converter output voltage
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Voltage(2) VIN, L, VOUT, EN, FB –0.3 7.5 V Temperature Operating junction temperature, TJ –40 150 °C Storage, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network ground terminal.
6.2 ESD Ratings
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2000 Charged-device model (CDM), per JEDEC specification JESD22- 1500V(ESD) Electrostatic discharge VC101(2) Machine model (MM) 200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
VIN Supply voltage at VIN 0.7 3.3 V TA Operating free air temperature –40 85 °C TJ Operating virtual junction temperature –40 125 °C Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TLV61225
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6.4 Thermal Information
THERMAL METRIC(1) DCK (SOT) UNIT
6 PINS
RθJA Junction-to-ambient thermal resistance 231.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 55.8 °C/W RθJB Junction-to-board thermal resistance 77.3 °C/W ψJT Junction-to-top characterization parameter 0.7 °C/W ψJB Junction-to-board characterization parameter 76.4 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature range of 25°C) (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DC-DC STAGE VIN Input voltage range 0.7 3.3 V Maximum minimum input voltageVIN RLoad ≥ 150 Ω, TA = 25°C 0.7 Vfor start-up VOUT TLV61225 output voltage VIN < VOUT 3.13 3.3 3.43 V ILH Inductor current ripple 200 mA ISW switch current limit VOUT = 3.3 V, VIN = 1.2 V 160 400 mA RDSon_HSD Rectifying switch ON-resistance VOUT = 3.3 V 1000 mΩ RDSon_LSD Main switch ON-resistance VOUT = 3.3 V 600 mΩ Line regulation VIN < VOUT 0.5% Load regulation VIN < VOUT 0.5% VIN 0.5 1 μAQuiescentIQ IO = 0 mA, VEN = VIN = 1.2 V, VOUT = 3.3 Vcurrent VOUT 5 10 μA ShutdownISD VIN VEN = 0 V, VIN = 1.2 V, VOUT ≥ VIN 0.2 1 μAcurrent ILKG_VOUT Leakage current into VOUT VEN = 0 V, VIN = 1.2 V, VOUT = 3.3 V 1 μA ILKG_L Leakage current into L VEN = 0 V, VIN = 1.2 V, VL = 1.2 V, VOUT ≥ VIN 0.01 0.7 μA IEN EN input current Clamped on GND or VIN (VIN < 1.5 V) 0.005 0.1 μA CONTROL STAGE VIN ≤ 1.5 V 0.2 × VVIL Maximum EN input low voltage VIN VIN ≤ 1.5 V 0.8 × VVIH Minimum EN input high voltage VIN VIL Maximum EN input low voltage VIN > 1.5 V 0.4 V VIH Minimum EN input high voltage VIN > 1.5 V 1.2 V VUVLO Undervoltage lockout threshold VIN decreasing 500 mV for turnoff Undervoltage lockout hysteresis 50 mV Overvoltage protection threshold 5.5 7.5 V Overtemperature protection 140 °C Overtemperature hysteresis 20 °C
6.6 Dissipation Ratings
POWER RATING DERATING FACTOR ABOVEPACKAGE TA ≤ 25°C TA = 25°C DCK 444 mW 4.44 mW/°C
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6.7 Typical Characteristics
Table 1. Table of Graphs Figure 1. Minimum of Maximum Output Current vs Input Figure 2. Efficiency vs Output Current Figure 3. Efficiency vs Input Voltage Figure 4. No Load Application Input Current vs Input
Figure 6. Output Voltage vs Input Voltage, Device DisabledFigure 5. Output Voltage vs Output Current
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7 Detailed Description
7.1 Overview
power MOSFETs are used to achieve power switching.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Controller Circuit
Figure 7. Hysteretic Current Operation internal voltage reference and adjusts the required offset of the inductor current accordingly.
SLVSAF0A –AUGUST 2010– REVISED MAY 2015 www.ti.com Feature Description (continued)
7.3.2 Start-Up
After the EN pin is tied high, the device starts to operate. If the input voltage is not high enough to supply the control circuit properly, a start-up oscillator starts to operate the switches. During this phase the switching frequency is controlled by the oscillator and the maximum switch current is limited. As soon as the device has built up the output voltage to about 1.8 V (high enough for supplying the control circuit) the device switches to its normal hysteretic current mode operation. The start-up time depends on input voltage, load current and output capacitance.
7.3.3 Operation at Output Overload
If the inductor current is in normal boost operation, the current reaches the internal switch current limit threshold. When the threshold is reached, the main switch is turned off to stop further increase of the input current. The output voltage decreases because with limited input current is no longer possible to provide sufficient power to the output to maintain the programmed output voltage. If the output voltage drops below the input voltage, the back-gate diode of the rectifying switch gets forward- biased and current starts flowing through it. This diode cannot be turned off, so the current finally is only limited by the remaining DC resistances. As soon as the output load decreases to a value the converter can supply, the converter resumes normal operation providing the set output voltage.
7.3.4 Undervoltage Lockout
An implemented undervoltage lockout function (UVLO) stops the operation of the converter if the input voltage drops below the typical UVLO threshold. This function is implemented to prevent malfunctioning of the converter and protect batteries against deep discharge.
7.3.5 Overvoltage Protection
If, for any reason, the output voltage is not fed back properly to the input of the voltage amplifier, control of the output voltage will not work anymore. Therefore, overvoltage protection is implemented to avoid the output voltage exceeding critical values for the device and possibly for the system it is supplying. For this protection the TLV61225 output voltage is also monitored internally. If the output voltage of the device reaches the internally programmed threshold, the voltage amplifier regulates the output voltage to this value.
7.3.6 Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC junction temperature. If the temperature exceeds the programmed threshold (see Electrical Characteristics), the device stops operating. As soon as the IC temperature has decreased below the programmed threshold, it starts operating again. To prevent unstable operation close to the region of overtemperature threshold, a built-in hysteresis is implemented.
7.4 Device Functional Modes
7.4.1 Device Enable and Shutdown Modes
The device is enabled when the EN pin is set high and shut down when the EN pin is low. During shutdown, the converter stops switching and all internal control circuitry is turned off. In this case, the input voltage is connected to the output through the back-gate diode of the rectifying MOSFET. This means that voltage will always exist at the output, which can be as high as the input voltage or lower depending on the load.
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8 Application and Implementation
validate and test their design implementation to confirm system functionality.
8.1 Application Information
other voltage source with a typical output voltage from 0.7 V to 3.3 V can be used with the TLV61225.
8.2 Typical Application
Figure 8. Typical Application Schematic
8.2.1 Design Requirements
In this example, TLV61225 is used to design a 3.3-V power supply with up to 15-mA output current capability. Alkaline battery input design. Table 2. List of Components
8.2.2 Detailed Design Procedure
8.2.2.1 Programming the Output Voltage
sense the output voltage. To configure the devices properly, the FB pin must be connected directly to VOUT.
8.2.2.2 Inductor Selection
and pin L. Inductor values of 4.7 μH show good performance over the whole input and output voltage range.
given switching frequency, input and output voltage the required inductance can be estimated using Equation 1. frequency and less switching losses. TI does not recommend using inductor values below 2.2 μH. Table 3. List of Inductors
8.2.2.3 Capacitor Selection
8.2.2.3.1 Input Capacitor
possible to the VIN and GND pins of the IC.
8.2.2.3.2 Output Capacitor
large capacitor. Place this small capacitor as close as possible to the VOUT and GND pins of the IC.
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8.2.3 Application Curves
Figure 9. Output Voltage Ripple Figure 10. Load Transient Response Figure 11. Line Transient Response Figure 12. Output Voltage vs Output Current and Input
9 Power Supply Recommendations
The power supply can be 1-cell or 2-cell alkaline, NiCd or NiMH batteries. capacitors. An electrolytic or tantalum capacitor with a value of 47 µF is a typical choice.
10 Layout
10.1 Layout Guidelines
input and output capacitor, as well as the inductor should be placed as close as possible to the IC. ground current. Assure that the ground traces are connected close to the device GND pin.
10.2 Layout Example
Figure 13. PCB Layout Suggestion
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10.3 Thermal Consideration
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power- dissipation limits of a given component. Three basic approaches for enhancing thermal performance are listed below.
- Improving the power-dissipation capability of the PCB design
- Improving the thermal coupling of the component to the PCB
- Introducing airflow in the system For more details on how to use the thermal parameters in the dissipation ratings table, check the Thermal Characteristics Application Note (SZZA017) and the Semiconductor and IC Package Thermal Metrics Application Note (SPRA953). Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Links: TLV61225
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation, see the following:
- Thermal Characteristics Application Note, SZZA017
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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www.ti.com 3-Mar-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLV61225DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 QUL TLV61225DCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 QUL (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
www.ti.com 3-Mar-2015 Addendum-Page 2 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 3-Mar-2015 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV61225DCKR SC70 DCK 6 3000 203.0 203.0 35.0 TLV61225DCKT SC70 DCK 6 250 203.0 203.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 3-Mar-2015 Pack Materials-Page 2
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