TLV61220 TI | Alldatasheet
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L1 4.7/c58H VBAT VOUT FB C2
10 F/c58
0.7V to VOUT 1.8V to 5.5V Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community TLV61220 SLVSB53A –MAY 2012–REVISED DECEMBER 2014 TLV61220Low-InputVoltageStep-UpConverterinThinSOT-23Package
1 Features 3 Description
The TLV61220 device provides a power-supply 1• Up to 95% Efficiency at Typical Operating solution for products powered by either a single-cell,Conditions two-cell, or three-cell alkaline, NiCd or NiMH, or one-• 5.5-μA Quiescent Current cell Li-Ion or Li-polymer battery. Possible output
- Startup Into Load at 0.7-V Input Voltage currents depend on the input-to-output voltage ratio. The boost converter is based on a hysteretic• Operating Input Voltage from 0.7 V to 5.5 V controller topology using synchronous rectification to• Pass-Through Function during Shutdown obtain maximum efficiency at minimal quiescent
- Minimum Switching Current 200 mA currents. The output voltage of the adjustable version can be programmed by an external resistor divider, or• Protections: is set internally to a fixed output voltage. The– Output Overvoltage converter can be switched off by a featured enable– Overtemperature pin. While being switched off, battery drain is minimized. The device is packaged in a 6-pin thin– Input Undervoltage Lockout SOT-23 package (DBV).• Adjustable Output Voltage from 1.8 V to 5.5 V spacer• Small 6-pin Thin SOT-23 Package Device Information(1)
2 Applications
PART NUMBER PACKAGE BODY SIZE (NOM)• Battery Powered Applications TLV61220 SOT (6) 2.90 mm x 1.60 mm – 1 to 3 Cell Alkaline, NiCd or NiMH (1) For all available packages, see the orderable addendum at– 1 Cell Li-Ion or Li-Primary the end of the datasheet.
- Solar or Fuel Cell Powered Applications
- Consumer and Portable Medical Products
- Personal Care Products
- White or Status LEDs
- Smartphones
4 Typical Application Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
SLVSB53A –MAY 2012–REVISED DECEMBER 2014 www.ti.com Table of Contents
5 Revision History
Changes from Original (May 2012) to Revision A Page
- Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
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6 Device Options
OUTPUT VOLTAGETA PACKAGE PART NUMBERDC/DC –40°C to 85°C Adjustable 6-Pin SOT-23 TLV61220DBV
7 Pin Configuration and Functions
6 Pins
NAME NO. EN 3 I Enable input (VBAT enabled, GND disabled) FB 4 I Voltage feedback for programming the output voltage GND 2 — IC ground connection for logic and power SW 1 I Boost and rectifying switch input VBAT 6 I Supply voltage VOUT 5 O Boost converter output Copyright © 2012–2014, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TLV61220
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8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN Input voltage on VBAT, SW, VOUT, EN, FB –0.3 7.5 V TJ Operating junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
8.2 ESD Ratings
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge VCharged-device model (CDM), per JEDEC specification JESD22- ±1500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
VIN Supply voltage at VIN 0.7 5.5 V TA Operating free air temperature range –40 85 °C TJ Operating virtual junction temperature range –40 125 °C
8.4 Thermal Information
THERMAL METRIC(1) DBV UNIT RθJA Junction-to-ambient thermal resistance 185.7 RθJC(top) Junction-to-case (top) thermal resistance 124.3 RθJB Junction-to-board thermal resistance 31.3 °C/W ψJT Junction-to-top characterization parameter 22.9 ψJB Junction-to-board characterization parameter 30.8 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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8.5 Electrical Characteristics
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature range of 25°C) (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DC/DC STAGE VIN Input voltage range 0.7 5.5 V VIN Minimum input voltage at startup RLoad ≥ 150 Ω 0.7 V VOUT TLV61220 output voltage range VIN < VOUT 1.8 5.5 V VFB TLV61220 feedback voltage 483 500 513 mV ILH Inductor current ripple 200 mA VOUT = 3.3 V, VIN = 1.2 V, TA = 25 °C 220 400 mA ISW switch current limit VOUT = 3.3 V, TA = -40°C to 85 °C 180 400 mA VOUT = 3.3 V, TA = 0°C to 85 °C 200 400 mA VOUT = 3.3 V 1000 mΩRectifying switch on resistance, HSD VOUT = 5 V 700 mΩ RDS(on) VOUT = 3.3 V 600 mΩ Main switch on resistance, LSD VOUT = 5 V 550 mΩ Line regulation VIN < VOUT 0.5% Load regulation VIN < VOUT 0.5% ShutdownISD VIN VEN = 0 V, VIN = 1.2 V, VOUT ≥ VIN 0.2 0.5 μAcurrent Leakage current into VOUT VEN = 0 V, VIN = 1.2 V, VOUT = 3.3 V 1 μA ILKG Leakage current into SW VEN = 0 V, VIN = 1.2 V, VSW = 1.2 V, VOUT ≥ VIN 0.01 0.2 μA TLV61220 Feedback inputIFB VFB = 0.5 V 0.01 μAcurrent IEN EN input current Clamped on GND or VIN (VIN < 1.5 V) 0.005 0.1 μA CONTROL STAGE 0.2 ×VIL EN input low voltage VIN ≤ 1.5 V VVIN 0.8 ×VIH EN input high voltage VIN ≤ 1.5 V VVIN VIL EN input low voltage 5 V > VIN > 1.5 V 0.4 V VIH EN input high voltage 5 V > VIN > 1.5 V 1.2 V Undervoltage lockout thresholdVUVLO VIN decreasing 0.5 0.7 Vfor turn off Overvoltage protection threshold 5.5 7.5 V Overtemperature protection 140 °C Overtemperature hysteresis 20 °C Copyright © 2012–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TLV61220
8.6 Typical Characteristics
Table 1. Table of Graphs Figure 2. Maximum Output Current vs Input VoltageFigure 1. Maximum Output Current vs Input Voltage Figure 3. Maximum Output Current vs Input Voltage Figure 4. Efficiency vs Output Current and Input Voltage
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Figure 11. Output Voltage vs Output Current and Input Voltage
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9 Parameter Measurement Information
Figure 12. Parameter Measurement Schematic
10 Detailed Description
10.1 Overview
10.2 Functional Block Diagram
10.3 Feature Description
10.3.1 Controller Circuit
Figure 13. Hysteretic Current Operation The output voltage VOUT is monitored via the feedback network which is connected to the voltage error amplifier. variations. It also allows using inductors and capacitors over a wide value range.
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www.ti.com SLVSB53A –MAY 2012–REVISED DECEMBER 2014 Feature Description (continued)
10.3.1.1 Startup
After the EN pin is tied high, the device starts to operate. In case the input voltage is not high enough to supply the control circuit properly a startup oscillator starts to operate the switches. During this phase the switching frequency is controlled by the oscillator and the maximum switch current is limited. As soon as the device has built up the output voltage to about 1.8 V, high enough for supplying the control circuit, the device switches to its normal hysteretic current mode operation. The startup time depends on input voltage and load current.
10.3.1.2 Operation at Output Overload
If in normal boost operation the inductor current reaches the internal switch current limit threshold the main switch is turned off to stop further increase of the input current. In this case the output voltage will decrease since the device can not provide sufficient power to maintain the set output voltage. If the output voltage drops below the input voltage the backgate diode of the rectifying switch gets forward biased and current starts flow through it. This diode cannot be turned off, so the current finally is only limited by the remaining DC resistances. As soon as the overload condition is removed, the converter resumes providing the set output voltage.
10.3.1.3 Undervoltage Lockout
An implemented undervoltage lockout function stops the operation of the converter if the input voltage drops below the typical undervoltage lockout threshold. This function is implemented in order to prevent malfunctioning of the converter.
10.3.1.4 Overvoltage Protection
If, for any reason, the output voltage is not fed back properly to the input of the voltage amplifier, control of the output voltage will not work anymore. Therefore an overvoltage protection is implemented to avoid the output voltage exceeding critical values for the device and possibly for the system it is supplying. For this protection the TLV61220 output voltage is also monitored internally. In case it reaches the internally programmed threshold of 6.5 V typically the voltage amplifier regulates the output voltage to this value. If the TLV61220 is used to drive LEDs, this feature protects the circuit if the LED fails.
10.3.1.5 Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC junction temperature. If the temperature exceeds the programmed threshold (see electrical characteristics table), the device stops operating. As soon as the IC temperature has decreased below the programmed threshold, it starts operating again. To prevent unstable operation close to the region of overtemperature threshold, a built-in hysteresis is implemented.
10.4 Device Functional Modes
10.4.1 Device Enable and Shutdown Mode
The device is enabled when EN is set high and shut down when EN is low. During shutdown, the converter stops switching and all internal control circuitry is turned off. In this case the input voltage is connected to the output through the back-gate diode of the rectifying MOSFET. This means that there always will be voltage at the output which can be as high as the input voltage or lower depending on the load. Copyright © 2012–2014, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: TLV61220
validate and test their design implementation to confirm system functionality.
11.1 Application Information
source with a typical output voltage between 0.7 V and 5.5 V can be used with the TLV61220.
11.2 Typical Application
Figure 14. Typical Application Circuit for Adjustable Output Voltage Option
11.2.1 Design Requirements
In this example, TLV61220 is used to design a 3.3-V power supply with up to 50-mA output current capability. 2 V to 3 V for one-cell coin cell battery input design. Table 2. TLV61220 3.3 V Output Design Requirements
11.2.2 Detailed Design Procedure
Table 3. List of Components
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11.2.2.1 Adjustable Output Voltage Version
11.2.2.2 Inductor Selection
SW. Inductor values of 4.7 μH show good performance over the whole input and output voltage range . Choosing other inductance values affects the switching frequency f proportional to 1/L as shown in Equation 2. therefore, with reduced switching losses. Using inductor values below 2.2 μH is not recommended. calculated. Equation 3 gives the peak current estimate. account that load transients and error conditions may cause higher inductor currents. inequation becomes false, discontinous operation is typically established. Table 4. List of Inductors
11.2.2.3 Capacitor Selection
11.2.2.3.1 Input Capacitor
11.2.2.3.2 Output Capacitor
the VOUT and GND pins of the IC. output capacitor value should be increased to avoid output voltage drops during fast load transients.
11.2.3 Application Curves
Figure 16. Line Transient ResponseFigure 15. Load Transient Response
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Figure 17. Start Up After Enable
12 Power Supply Recommendations
capacitors. An electrolytic or tantalum capacitor with a value of 47 µF is a typical choice.
13 Layout
13.1 Layout Guidelines
paths. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC. current. Assure that the ground traces are connected close to the device GND pin.
13.2 Layout Example
Figure 18. PCB Layout Recommendation
13.3 Thermal Considerations
dissipation limits of a given component. Three basic approaches for enhancing thermal performance are listed below.
- Improving the power-dissipation capability of the PCB design
- Improving the thermal coupling of the component to the PCB
- Introducing airflow in the system For more details on how to use the thermal parameters in the dissipation ratings table please check the Thermal Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application Note (SPRA953).
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14 Device and Documentation Support
14.1 Device Support
14.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
14.2 Documentation Support
14.2.1 Related Documentation
For related documentation see the following:
- Thermal Characteristics Application Note, SZZA017
- IC Package Thermal Metrics Application Note, SPRA953
14.3 Trademarks
All trademarks are the property of their respective owners.
14.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
14.5 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
15 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2012–2014, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Links: TLV61220
www.ti.com 7-Oct-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TLV61220DBVR Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 VUAI TLV61220DBVR.A Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 VUAI TLV61220DBVRG4 Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 VUAI TLV61220DBVRG4.A Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 VUAI TLV61220DBVT Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 VUAI TLV61220DBVT.A Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 85 VUAI (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
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PACKAGE MATERIALS INFORMATION www.ti.com 5-Nov-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 5-Nov-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV61220DBVR SOT-23 DBV 6 3000 208.0 191.0 35.0 TLV61220DBVRG4 SOT-23 DBV 6 3000 180.0 180.0 18.0 TLV61220DBVT SOT-23 DBV 6 250 210.0 185.0 35.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.22
0.08 TYP
0.25 3.0 2.6 2X 0.95 1.45 0.90 0.15
0.00 TYP
6X 0.50 0.25 0.6
0.3 TYP
0 TYP
1.9 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0006A SMALL OUTLINE TRANSISTOR 4214840/G 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side. 4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation. 5. Refernce JEDEC MO-178.
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
6X (1.1) 6X (0.6) (2.6) 2X (0.95) (R0.05) TYP 4214840/G 08/2024 SOT-23 - 1.45 mm max heightDBV0006A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.6) 2X(0.95) 6X (1.1) 6X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0006A SMALL OUTLINE TRANSISTOR 4214840/G 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4
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