TLV3012 BURR-BROWN | Alldatasheet

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Nanopower, 1.8V, SOT23 Comparator with Voltage Reference

DESCRIPTION

The TLV3011 is a low-power, open-drain output comparator; the TLV3012 is a push-pull output comparator. Both feature an uncommitted on-chip voltage reference. Both have 5µA (max) quiescent current, input common-mode range 200mV beyond the supply rails, and single-supply operation from 1.8V to 5.5V. The integrated 1.242V series voltage reference offers low 100ppm/°C (max) drift, is stable with up to 10nF capacitive load, and can provide up to 0.5mA (typ) of output current. The TLV3011 and TLV3012 are available in the tiny SOT23-6 package for space-conservative designs. It is also available in the SC70 package for even greater board area savings. Both versions are specified for the temperature range of –40°C to +125°C.

FEATURES

G LOW QUIESCENT CURRENT: 5 µA (max) G INTEGRATED VOLTAGE REFERENCE: 1.242V G INPUT COMMON-MODE RANGE: 200mV Beyond Rails G VOLTAGE REFERENCE INITIAL ACCURACY: 1% G OPEN-DRAIN LOGIC COMPATIBLE OUTPUT: TLV3011 G PUSH-PULL OUTPUT: TLV3012 G LOW-SUPPLY VOLTAGE: 1.8V to 5.5V G FAST RESPONSE TIME: 6 µs Propagation Delay with 100mV Overdrive (TLV3011: RPULL-UP = 10kΩ ) G MicroSIZE PACKAGES: SOT23-6 and SC70-6

APPLICATIONS

G BATTERY-POWERED LEVEL DETECTION G DATA ACQUISITION G SYSTEM MONITORING G OSCILLATORS G SENSOR SYSTEMS: Smoke Detectors, Light Sensors, Alarms www.ti.com PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SBOS300B – FEBRUARY 2004 – REVISED JUNE 2004 All trademarks are the property of their respective owners. TLV3011 and TLV3012 RELATED PRODUCTS PRODUCT FEATURES TLV349x 1.2 µA, 1.8V to 5.5V Push-Pull Comparator TLV370x 560nA, 2.5V to 16V Push-Pull CMOS Output Comparator TLV340x 550nA, 2.5V to 16V Open-Drain Comparator REF IN− OUT IN+ TLV3011 TLV3012

TLV3011, TLV3012 SBOS300B www.ti.com NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. In put signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground. PIN CONFIGURATIONS ABSOLUTE MAXIMUM RATINGS (1) Top View NOTE: Pin 1 is determined by orienting package marking as shown. For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. PACKAGE/ORDERING INFORMATION ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. OUT IN+ REF IN− ALR SOT23-6 TLV3011AIDBV OUT IN+ REF IN− ALS SOT23-6 TLV3012AIDBV REF IN− OUT IN+ SC70-6 TLV3011AIDCK AJX 1 REF IN− OUT IN+ SC70-6 TLV3012AIDCK ALT

TLV3011, TLV3012 SBOS300B www.ti.com ELECTRICAL CHARACTERISTICS: V S = +1.8V to +5.5V Boldface limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, VOUT = VS, unless otherwise noted; for TLV3011, RPULL-UP = 10kΩ connected to VS. TLV3011, TLV3012 PARAMETER CONDITION MIN TYP MAX UNITS OFFSET VOLTAGE Input Offset Voltage V OS VCM = 0V, IO = 0V 0.5 12 mV vs Temperature dV OS /dT T A = –40°C to +125°C ±12 µV/°C vs Power Supply PSRR V S = 1.8V to 5.5V 100 1000 µV/V INPUT BIAS CURRENT Input Bias Current I B VCM = VS/2 ±1 ±10 pA Input Offset Current I OS VCM = VS/2 ±1 ±10 pA INPUT VOLTAGE RANGE Common-Mode Voltage Range V CM (V–) – 0.2V (V+) + 0.2V V Common-Mode Rejection Ratio CMRR V CM = –0.2V to (V+) – 1.5V 60 74 dB VCM = –0.2V to (V+) + 0.2V 54 62 dB INPUT IMPEDANCE Common-Mode 1013 2 Ω pF Differential 1013 4 Ω pF SWITCHING CHARACTERISTICS f = 10kHz, VSTEP = 1V Propagation Delay Time, Low-to-High t(PLH) Input Overdrive = 10mV 12 µs Input Overdrive = 100mV 6 µs Propagation Delay Time, High-to-Low t(PHL) Input Overdrive = 10mV 13.5 µs Input Overdrive = 100mV 6.5 µs Rise Time, TLV3011 t R See Note 1 Rise Time, TLV3012 C L = 10pF 100 ns Fall Time t F C L = 10pF 100 ns OUTPUT VS = 5V Voltage Output Low from Rail V OL IOUT = –5mA 160 200 mV Voltage Output High From Rail, TLV3012 I OUT = 5mA 90 200 mV Short-Circuit Current, TLV3012 See Typical Characteristics VOLTAGE REFERENCE VIN = 5V Initial Accuracy V OUT 1.230 1.242 1.254 V ±1% Temperature Drift dV OUT /dT –40°C ≤ TA ≤ 125°C 40 100 ppm/ °C Load Regulation Sourcing dV OUT /dILOAD 0mA < ISOURCE ≤ 0.5mA 0.36 1 mV/mA Sinking 0mA < I SINK ≤ 0.5mA 6.6 mV/mA Output Current I LOAD 0.5 mA Line Regulation dV OUT /dVIN 1.8V ≤ VIN ≤ 5.5V 10 100 µV/V NOISE Reference Voltage Noise f = 0.1Hz to 10Hz 0.2 mV PP POWER SUPPLY Specified Voltage V S 1.8 5.5 V Operating Voltage Range 1.8 5.5 V Quiescent Current I Q VS = 5V, VO = High 2.8 5 µA TEMPERATURE RANGE Specified Range –40 +125 °C Operating Range –55 +150 °C Storage Range –55 +150 °C Thermal Resistance, θJA SOT23-6 200 °C/W SC70-6 250 °C/W NOTE: (1) tR dependent on RPULL-UP and CLOAD .

TLV3011, TLV3012 SBOS300B www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ , and Input Overdrive = 100mV, unless otherwise noted. QUIESCENT CURRENT vs TEMPERATURE Quiescent Current (µA) Temperature (°C) 3.8 3.6 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 –50 25 50 75 100–25 0 125 QUIESCENT CURRENT vs OUTPUT SWITCHING FREQUENCY Quiescent Current (µA) Output Transition Frequency (Hz) 10010 1k 10k VS = 5V VS = 3V VS = 1.8V TLV3011 R PULL-UP = 1MΩ QUIESCENT CURRENT vs OUTPUT SWITCHING FREQUENCY Quiescent Current (µA) Output Transition Frequency (Hz) 10010 1k 10k 100k VS = 5V VS = 3V VS = 1.8V TLV3012 INPUT BIAS CURRENT vs TEMPERATURE –50 Input Bias Current (pA) Temperature (°C) 25 50–25 0 75 100 125 OUTPUT LOW vs OUTPUT CURRENT VOL (V) Output Current (mA) 462 VS = 5V 81 0 1 2 0.25 0.20 0.15 0.10 0.05 VS = 3VVS = 1.8V OUTPUT HIGH vs OUTPUT CURRENT VS – VOH (V) Output Current (mA) 462 8 10 12 0.25 0.20 0.15 0.10 0.05 VDD = 5V VDD = 3V VDD = 1.8V TLV3012

TLV3011, TLV3012 SBOS300B www.ti.com TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ , and Input Overdrive = 100mV, unless otherwise noted. PROPAGATION DELAY (t PLH ) vs CAPACITIVE LOAD 0.01 tPLH (µs) Capacitive Load (nF) 11 00.1 100 1k VS = 1.8V VS = 5V VS = 3V TLV3012 PROPAGATION DELAY (t PHL ) vs CAPACITIVE LOAD 0.01 tPHL (µs) Capacitive Load (nF) 11 00.1 100 1k VS = 5VVS = 3V VS = 1.8V PROPAGATION DELAY (t PLH ) vs INPUT OVERDRIVE tPLH (µs) Input Overdrive (mV) 40 50 6010 20 30 70 90 80 100 VS = 5V VS = 3V VS = 1.8V PROPAGATION DELAY (t PHL ) vs INPUT OVERDRIVE tPHL (µs) Input Overdrive (mV) 40 50 6010 20 30 70 90 80 100 VS = 1.8V VS = 5V VS = 3V PROPAGATION DELAY (t PLH ) vs TEMPERATURE –50 tPLH (µs) Temperature (°C) 25 50–25 0 75 100 125 8.0 7.5 7.0 6.5 6.0 5.5 5.0 4.5 4.0 VS = 1.8V VS = 3V VS = 5V PROPAGATION DELAY (t PHL ) vs TEMPERATURE tPHL (µs) Temperature (°C) 8.0 7.5 7.0 6.5 6.0 5.5 5.0 4.5 4.0 VS = 1.8V VS = 5V VS = 3V –50 25 50–25 0 75 100 125

TLV3011, TLV3012 SBOS300B www.ti.com TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ , and Input Overdrive = 100mV, unless otherwise noted. PROPAGATION DELAY (t PLH ) 500mV/div2V/div 2µs/div VS = ±2.5V VIN– VIN+ VOUT TLV3012 TLV3011 PROPAGATION DELAY (t PHL ) 2µs/div 500mV/div2V/div VS = ±2.5VVIN+ VIN– VOUT PROPAGATION DELAY (t PLH ) 2µs/div 500mV/div2V/div VS = ±0.9V VIN– VIN+ VOUT PROPAGATION DELAY (t PHL ) 2µs/div 500mV/div2V/div VS = ±0.9V VIN– VIN+ VOUT REFERENCE VOLTAGE vs OUTPUT LOAD CURRENT (Sourcing) Reference Voltage (V) Output Load Current, Sourcing (mA) 1.24205 1.24200 1.24195 1.24190 1.24185 1.24180 1.24175 1.24170 1.24165 1.24160 REFERENCE VOLTAGE vs OUTPUT LOAD CURRENT (Sinking) Reference Voltage (V) Output Load Current, Sinking (mA) 1.250 1.249 1.248 1.247 1.246 1.245 1.244 1.243 1.242 1.241

TLV3011, TLV3012 SBOS300B www.ti.com TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ , and Input Overdrive = 100mV, unless otherwise noted. REFERENCE VOLTAGE vs TEMPERATURE Reference Voltage (V) Temperature (°C) 1.250 1.245 1.240 1.235 1.230 1.225 1.220 1.215 1.210 –100 50 100–50 0 150 SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE 1.5 Short-Circuit Current (mA) Supply Voltage (V) 3.0 Sink Source 140 120 100 TLV3012 REFERENCE VOLTAGE DISTRIBUTION Reference Voltage (V) Volts 500 450 400 350 300 250 200 150 100 1.230 1.232 1.234 1.236 1.238 1.240 1.242 1.244 1.246 1.248 1.250 1.252 1.254

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TLV3011AIDBVR ACTIVE SOT-23 DBV 6 3000 TBD CU NIPDAU Level-1-235C-UNLIM TLV3011AIDBVT ACTIVE SOT-23 DBV 6 250 TBD CU NIPDAU Level-1-235C-UNLIM TLV3011AIDCKR ACTIVE SC70 DCK 6 3000 TBD A42 SNPB Level-1-240C-UNLIM TLV3011AIDCKT ACTIVE SC70 DCK 6 250 TBD A42 SNPB Level-1-240C-UNLIM TLV3012AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV3012AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV3012AIDBVT ACTIVE SOT-23 DBV 6 250 TBD CU NIPDAU Level-1-235C-UNLIM TLV3012AIDCKR ACTIVE SC70 DCK 6 3000 TBD A42 SNPB Level-1-240C-UNLIM TLV3012AIDCKT ACTIVE SC70 DCK 6 250 TBD A42 SNPB Level-1-240C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2005 Addendum-Page 1

MPDS114 – FEBRUARY 2002 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DCK (R-PDSO-G6) PLASTIC SMALL-OUTLINE PACKAGE 0,15 Gage Plane 0,10 M0,100,65 0°–8° 0,46 0,26 0,13 NOM 4093553-3/D 01/02 0,15 0,30 1,40 1,10 2,40 1,80 2,15 1,85 1 3 1,10 0,80 0,10 0,00 Seating Plane NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. Falls within JEDEC MO-203

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