TLV3012

TLV3011, TLV3012, TLV3011B and TLV3012B Low-Power Comparators With Integrated 1.24 V Voltage Reference datasheet (Rev. C)

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SBOS300,C]
• PDF pages: 43

Technical content

TLV3011, TLV3012, TLV3011B and TLV3012B Low-Power Comparators With Integrated

1.24 V Voltage Reference

1 Features

• Low quiescent current: 3.1 μA (maximum, "B" version)
• Integrated voltage reference: 1.242 V
• Input common-mode range: 200 mV beyond rails
• Voltage reference initial accuracy: 1%
• Fail-safe inputs ("B" version)
• Power-on-reset ("B" version)
• Integrated hysteresis ("B" version)
• Open drain output option (TLV3011x)
• Push-pull output option (TLV3012x)
• Fast response time: 6 uS
• Low supply voltage = 1.65 V to 5.5 V ("B" version)

2 Applications

• Lane departure warning
• Cluster
• Toll tag
• Asset tracking
• Battery management systems

3 Description

The TLV3011 is a low-power, open-drain output comparator; the TLV3012 is a push-pull output comparator. Both devices feature an uncommitted on- chip voltage reference and have a 5 μA (maximum) quiescent current, an input common-mode range 200 mV beyond the supply rails, and single-supply operation from 1.8 V to 5.5 V. The integrated 1.242 V series voltage reference offers low 100 ppm/°C (maximum) drift, is stable with up to 10 nF capacitive load, and can provide up to 0.5 mA (typical) of output current. The TLV3011B and TLV3012B "B" versions add power-on-reset (POR), fail-safe inputs, built-in hysteresis, a lower minimum supply voltage of 1.65 V and a 3.1 μA maximum quiescent current. The family is available in both the tiny SOT23-6 package for space-conservative designs, and in the SC-70 package for even greater board area savings. All versions are specified for the temperature range of –40°C to +125°C. Device Information PART NUMBER PACKAGE (1) BODY SIZE (NOM) TLV3011, TLV3012, TLV3011B, TLV3012B SOT-23 (6) 2.90 mm × 1.60 mm SC-70 (6) 2.00 mm × 1.25 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Reference Voltage (V) Units 500 1000 1500 2000 2500 3000

9860 Units

V S = 5.5V No Load TLV3012B Reference Voltage Distribution TLV3012B Reference Voltage vs Temperature TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

6.1 Absolute Maximum Ratings- TLV3011 and

6.2 Absolute Maximum Ratings - TLV3011B and

6.8 Switching Characteristics - TLV3011 and

6.9 Electrical Characteristics - TLV3011B and

6.10 Switching Characteristics - TLV3011B and

8 Typical Characteristics - TLV3011B and TLV3012B ...15 11.1 Receiving Notification of Documentation Updates.. 29

12 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (June 2004) to Revision C (April 2023) Page

• Converted to TI format. Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Changes from Revision A (May 2004) to Revision B (June 2004) Page Changes from Revision * (February 2004) to Revision A (May 2004) Page TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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5 Pin Configuration and Functions

+ 5 Figure 5-1. DCK, DBV Package 6-Pin SC-70, SOT-23 Top View Table 5-1. Pin Functions PIN I/O DESCRIPTION NO. NAME

1 OUT O Comparator Output

2 V– - Negative (lowest) power supply

3 IN+ I Non-inverting comparator input

4 IN– I Inverting comparator input

5 REF O Reference Output

6 V+ - Positive (highest) power supply

www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

6 Specifications

6.1 Absolute Maximum Ratings- TLV3011 and TLV3012

Over operating free-air temperature range (unless otherwise noted)(1). MIN MAX UNIT Supply voltage 7 V Signal input pins Voltage(2) –0.5 (V+) +0.5 V Current(2) ±10 mA Output short circuit(3) Continuous Operating temperature –40 125 °C TJ Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to the network ground pin. (3) Short circuit to ground

6.2 Absolute Maximum Ratings - TLV3011B and TLV3012B

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage: VS = (V+) – (V–) –0.5 7 V Input pins (IN+, IN–) from (V–)(2) –0.5 7 V Output (OUT) (Open-Drain) from (V–)(3) –0.5 7 V Output (OUT) (Push-Pull) from (V–) –0.5 (V+) + 0.5 V Output short circuit current(4) 10 mA Junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. (2) Input pins are diode-clamped to (V–). Inputs (IN+, IN–) can be greater than (V+) as long as within the –0.5 V to 7 V range. Inputs beyond –0.3 V must be current-limited to less than –10 mA, while inputs beyond 7 V must be externally voltage clamped. (3) Output (OUT) for open drain can be greater than (V+) and inputs (IN+, IN–) as long as it is within the –0.5 V to 7 V range (4) Short-circuit to (V–) or (V+).

6.3 ESD Ratings

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) ±1000 (1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process. TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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6.4 Thermal Information - TLV3011 and TLV3012

THERMAL METRIC(1) TLV3011, TLV3012 UNITDCK (SC-70) DBV (SOT-23)

6 PINS 6 PINS

RθJA Junction-to-ambient thermal resistance 179.4 191.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 141.3 123.9 °C/W RθJB Junction-to-board thermal resistance 71.2 38.7 °C/W ψJT Junction-to-top characterization parameter 53.6 21.2 °C/W ψJB Junction-to-board characterization parameter 71.0 38.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance - - °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Thermal Information- TLV3011B and TLV3012B

THERMAL METRIC(1) TLV3011B, TLV3012B UNITDCK (SC-70) DBV (SOT-23) RθJA Junction-to-ambient thermal resistance 169.8 162.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 120.5 78.8 °C/W RθJB Junction-to-board thermal resistance 63.2 42.1 °C/W ψJT Junction-to-top characterization parameter 45.9 21.2 °C/W ψJB Junction-to-board characterization parameter 63.0 41.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance - - °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.

6.6 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage: VS = (V+) – (V–) 1.8 5.5 V Supply voltage: VS = (V+) – (V–) B-Versions 1.65 5.5 V Input voltage range from (V–) –0.2 (V+) + 0.2 V Output voltage range from (V–) for open drain –0.2 (V+) V Output voltage range from (V–) for open drain B-Versions –0.2 5.5 V Ambient temperature, TA –40 125 °C www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

6.7 Electrical Characteristics - TLV3011 and TLV3012

VS = 1.8 V to 5.5 V, at TA = 25°C, VOUT = VS, unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE VOS Input offset voltage VCM = 0 V, IO = 0 V 0.5 15 mV dVOS/dT Input offset voltage vs temperature TA = –40°C to +125°C ±12 μV/°C PSRR Power supply rejection ratio VS = 1.8 V to 5.5 V 100 1000 μV/V INPUT BIAS CURRENT IB Input bias current VCM = VS/2 ±10 pA IOS Input offset current VCM = VS/2 ±10 pA INPUT VOLTAGE RANGE VCM Common-mode voltage range (V–) – 0.2 (V+) + 0.2 V CMRR Common-mode rejection ratio VCM = –0.2 V to (V+) – 1.5 V 60 74 dB VCM = –0.2 V to (V+) + 0.2 V 54 62 INPUT IMPEDANCE Common mode 1013 ∥ 2 Ω ∥ pF Differential 1013 ∥ 4 Ω ∥ pF OUTPUT VOL Voltage output low from rail VS = 5 V, IOUT = –5 mA 160 200 mV VOH Voltage output high from rail VS = 5 V, IOUT = 5 mA 90 200 mV Short-circuit current See Typical Characteristics VOLTAGE REFERENCE VOUT Output voltage 1.208 1.242 1.276 V Initial accuracy ±1% dVOUT/dT Temperature drift –40°C ≤ TA ≤ 125°C 40 100 ppm/°C dVOUT/ dILOAD Load regulation, sourcing 0 mA < ISOURCE ≤ 0.5 mA 0.36 1 mV/mA Load regulation, sinking 0 mA < ISINK ≤ 0.5 mA 6.6 ILOAD Output current 0.5 mA dVOUT/dVIN Line regulation 1.8 V ≤ VIN ≤ 5.5 V 10 100 μV/V NOISE Reference voltage noise f = 0.1 Hz to 10 Hz 0.2 mVPP POWER SUPPLY VS Specified voltage 1.8 5.5 V Operating voltage range 1.8 5.5 V IQ Quiescent current VS = 5 V, VO = High 2.8 5 μA TEMPERATURE Operating range –40 125 °C Storage range –65 150 °C TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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6.8 Switching Characteristics - TLV3011 and TLV3012

over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Propagation delay time, low to high f = 10 kHz, VSTEP = 1 V, input overdrive = 10 mV 12 μs f = 10 kHz, VSTEP = 1 V, input overdrive = 100 mV 6 Propagation delay time, high to low f = 10 kHz, VSTEP = 1 V, input overdrive = 10 mV 13.5 μs f = 10 kHz, VSTEP = 1 V, input overdrive = 100 mV 6.5 tr Rise time CL = 10 pF 100 ns tf Fall time CL = 10 pF 100 ns www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

6.9 Electrical Characteristics - TLV3011B and TLV3012B

For VS (TOTAL SUPPLY VOLTAGE) = (V+) – (V–) = 1.8V and 5.5V, VCM = VS /2 at TA = 25°C (Unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE VOS Input offset voltage VCM = (V–) –6 ±0.3 6 mV VOS Input offset voltage VCM = (V–) TA = –40°C to +125°C –9 9 mV dVIO/dT Input offset voltage drift VCM = (V–) TA = –40°C to +125°C ±12 µV/°C PSRR power supply rejection ratio VCM = (V–) VS = 1.65 V to 5.5 V TA = –40°C to +125°C 100 1000 µV/V VHYS Input hysteresis voltage TA = –40°C to +125°C 2 6 8 mV INPUT BIAS CURRENT IB Input bias current VCM = VS /2 –10((1)) ±4.5 10((1)) pA IOS Input offset current VCM = VS /2 –10((1)) ±1 10((1)) pA INPUT COMMON MODE RANGE VCM-Range Common-mode voltage range VS = 1.8 V to 5.5 V (V–) – 0.2 (V+) + 0.2 V CMRR Common mode rejection ratio VCM = (V–) + 1.5V to (V+) + 0.2V VS = 5.5 V 60 74 dB CMRR Common mode rejection ratio VCM = (V–) - 0.2V to (V+) + 0.2V VS = 5.5 V 54 62 dB RCM Input Common Mode Resistance 1013 Ω CIC Input Common Mode Capacitance 2 pF INPUT IMPEDANCE RDM Input Differential Mode Resistance 1013 Ω CID Input Differential Mode Capacitance 4 pF OUTPUT VOL Voltage swing from (V–) VS = 5 V ISINK = 5 mA TA = –40°C to +125°C 160 200 mV VOH Voltage swing from (V+) (for Push-Pull only) VS = 5 V ISOURCE = 5 mA TA = –40°C to +125°C 90 200 mV VOLTAGE REFERENCE VOUT Reference Voltage 1.223 1.242 1.260 V Accuracy ±0.25% ±1.5% dVOUT/dT Temperature Drift TA = –40°C to +125°C 40 100 ppm/℃ dVOUT/ dILOAD Load Regulation, Sourcing 0 mA < ISOURCE ≤ 0.5 mA 0.36 1((1)) mV/mA Load Regulation, Sinking 0 mA < ISINK ≤ 0.5 mA 6.6 mV/mA ILOAD Output Current 0.5 mA dVOUT/dVS Line Regulation 1.65 V ≤ VS ≤ 5.5 V 10 100((1)) µV/V Vnoise Noise f = 0.1 Hz to 10 Hz 0.2 mVPP TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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6.9 Electrical Characteristics - TLV3011B and TLV3012B (continued)

For VS (TOTAL SUPPLY VOLTAGE) = (V+) – (V–) = 1.8V and 5.5V, VCM = VS /2 at TA = 25°C (Unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLY IQ Quiescent current per comparator Output is logic high 2.4 3.1 µA IQ Quiescent current per comparator Output is logic high TA = –40°C to +125°C 3.6 µA (1) Ensured by characterization www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

6.10 Switching Characteristics - TLV3011B and TLV3012B

For VS (TOTAL SUPPLY VOLTAGE) = (V+) – (V–) = 1.8 V and 5.5 V, VCM = VS / 2 at TA = 25°C (Unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OUTPUT TPD-LH Propagation delay time, low-to- high (push-pull output) f = 10 kHz, VSTEP = 200mV, VOD = 100 mV, CL = 10 pF 2 4 µs TPD-HL Propagation delay time, high- to-low f = 10 kHz, VSTEP = 200mV, VOD = 100 mV, CL = 10 pF 2 4 µs TRISE Output Rise Time, 20% to 80%, push-pull output CL = 10 pF 10 ns TFALL Output Fall Time, 80% to 20% CL = 10 pF 10 ns TFALL Output Fall Time, 80% to 20%, open-drain output RL = 10 kΩ, CL = 10 pF 10 ns tON Power on-time 1.9 ms TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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7 Typical Characteristics - TLV3011 and TLV3012

At TA = 25°C, VS = 1.8 V to 5.5 V, and Input Overdrive = 100 mV, unless otherwise noted. Quiescent Current – µA Temperature – °C 3.8 3.6 3.4 3.2 2.8 2.6 2.4 2.2 -50 25 50 75 100-25 0 125 Figure 7-1. Quiescent Current vs Temperature Quiescent Current – µA Output Switching Frequency – Hz 10010 1k 10k 100k V = 5 VS V = 3 VS V = 1.8 VS TLV3012 Figure 7-2. Quiescent Current vs Output Switching Frequency -50 Input Bias Current – pA Temperature – °C 25 50-25 0 75 100 125 Figure 7-3. Input Bias Current vs Temperature V – Output Low – V OL Output Current – mA 4 62 V = 5 VS 8 10 12 0.25 0.20 0.15 0.10 0.05 V = 3 VS V = 1.8 VS Figure 7-4. Output Low vs Output Current (V – V ) – OH V S Output Current – mA 4 62 8 10 12 0.25 0.20 0.15 0.10 0.05 V = 5 VDD V = 3 VDD V = 1.8 VDD TLV3012 Figure 7-5. Output High vs Output Current 0.01 t sPLH – Propagation Delay – µ Capacitive Load – nF 1 100.1 100 1k V = 1.8 VS V = 5 VS V = 3 VS TLV3012 Figure 7-6. Propagation Delay (tPLH) vs Capacitive Load www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

7 Typical Characteristics - TLV3011 and TLV3012 (continued)

At TA = 25°C, VS = 1.8 V to 5.5 V, and Input Overdrive = 100 mV, unless otherwise noted. 0.01 t – Propagation Delay – µsPHL Capacitive Load – nF 1 100.1 100 1k V = 5 VS V = 3 VS V = 1.8 VS Figure 7-7. Propagation Delay (tPHL) vs Capacitive Load t – Propagation Delay µsPLH Input Overdrive mV– 40 50 6010 20 30 70 90 80 100 V = 5 VS V = 3 VS V = 1.8 VS Figure 7-8. Propagation Delay (tPLH) vs Input Overdrive t sPHL – Propagation Delay – µ Input Overdrive – mV 40 50 6010 20 30 70 90 80 100 V = 1.8 VS V = 5 VS V = 3 VS Figure 7-9. Propagation Delay (tPHL) vs Input Overdrive -50 t – Propagation Delay – µsPLH Temperature – °C 25 50-25 0 75 100 125 7.5 6.5 5.5 4.5 V = 1.8 VS V = 3 VS V = 5 VS Figure 7-10. Propagation Delay (tPLH) vs Temperature t sPHL – Propagation Delay – µ Temperature – °C 7.5 6.5 5.5 4.5 V = 1.8 VS V = 5 VS V = 3 VS -50 25 50-25 0 75 100 125 Figure 7-11. Propagation Delay (tPHL) vs Temperature 500 mV/div

2 V/div

2 µs/div V = 2.5 VS VIN– VIN+ VOUT TLV3012 TLV3011 Figure 7-12. Propagation Delay (tPLH) TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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At TA = 25°C, VS = 1.8 V to 5.5 V, and Input Overdrive = 100 mV, unless otherwise noted. 2 µs/div 500 mV/div V = 2.5 VSVIN+ VIN– VOUT Figure 7-13. Propagation Delay (tPHL) 2 µs/div 500 mV/div V = 0.9 VS VIN– VIN+ VOUT Figure 7-14. Propagation Delay (tPLH) 2 µs/div 500 mV/div V = 0.9 VS VIN– VIN+ VOUT Figure 7-15. Propagation Delay (tPHL) Reference Voltage – V Output Load Current, Sourcing – mA 1.24205 1.24200 1.24195 1.24190 1.24185 1.24180 1.24175 1.24170 1.24165 1.24160 Figure 7-16. Reference Voltage vs Output Load Current (Sourcing) Reference Voltage – V Output Load Current, Sinking – mA 1.250 1.249 1.248 1.247 1.246 1.245 1.244 1.243 1.242 1.241 Figure 7-17. Reference Voltage vs Output Load Current (Sinking) Reference Voltage – V Temperature – °C 1.250 1.245 1.240 1.235 1.230 1.225 1.220 1.215 1.210 -100 50 100-50 0 150 Figure 7-18. Reference Voltage vs Temperature www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

At TA = 25°C, VS = 1.8 V to 5.5 V, and Input Overdrive = 100 mV, unless otherwise noted. 1.5 Short-Circuit Current – mA Supply Voltage – V Sink Source 3.52 2.5 4 4.5 5 5.5 140 120 100 TLV3012 Figure 7-19. Short-Circuit Current vs Supply Voltage Units Reference Voltage – V 500 450 400 350 300 250 200 150 100 Figure 7-20. Reference Voltage Distribution TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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8 Typical Characteristics - TLV3011B and TLV3012B

For VS (Total Supply Voltage) = (V+) – (V–) = +5V, VCM = VS /2 at TA = 25°C , RPULLUP = 1MΩ to V+, CL = 15pF, VOD = 100mV unless otherwise noted. Output Sinking Current (mA) Output Swing from V- (mV) 100 200 300 500 1000 2000 3000 5000 125°C 25°C -40°C Figure 8-1. Output Swing vs. Output Sinking Current - 1.8V Output Sourcing Current (mA) Output Swing from V+ (mV) 100 200 300 500 1000 2000 3000 5000 Push-Pull Output Only No Load 125°C 25°C -40°C Figure 8-2. Output Swing vs. Output Sourcing Current - 1.8V Output Sinking Current (mA) Output Swing from V- (mV) 100 200 300 500 1000 2000 3000 5000 125°C 25°C -40°C Figure 8-3. Output Swing vs. Output Sinking Current - 3.3V Output Sourcing Current (mA) Output Swing from V+ (mV) 100 200 300 500 1000 2000 3000 5000 Push-Pull Output Only No Load 125°C 25°C -55°C Figure 8-4. Output Swing vs. Output Sourcing Current - 3.3V Figure 8-5. Output Swing vs. Output Sinking Current - 5V Output Sourcing Current (mA) Output Swing from V+ (mV) 100 200 300 500 1000 2000 3000 5000 Push-Pull Output Only No Load 125°C 25°C -40°C Figure 8-6. Output Swing vs. Output Sourcing Current - 5V www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

8 Typical Characteristics - TLV3011B and TLV3012B (continued)

For VS (Total Supply Voltage) = (V+) – (V–) = +5V, VCM = VS /2 at TA = 25°C , RPULLUP = 1MΩ to V+, CL = 15pF, VOD = 100mV unless otherwise noted. Temperature (°C) Total Quiecent Current (  A) -40 -25 -10 5 20 35 50 65 80 95 110 125 1.50 1.75 2.00 2.25 2.50 2.75 3.00 3.25 3.50 1.8 V 3.3 V 5 V Figure 8-7. Supply Current vs. Temperature Supply Voltage (V) Total Quiecent Current (  A) 1.50 1.75 2.00 2.25 2.50 2.75 3.00 3.25 3.50 -20° -40° 25°C 85°C 125°C 55°C Figure 8-8. Supply Current vs. Supply Voltage Input Voltage from V- (V) Total Quiecent Current (  A) 1.50 1.75 2.00 2.25 2.50 2.75 3.00 3.25 3.50 -40°C -20°C 25°C 85°C 125°C Figure 8-9. Supply Current vs. Common Mode - 3.3V Input Voltage from V- (V) Total Quiecent Current (  A) 1.50 1.75 2.00 2.25 2.50 2.75 3.00 3.25 3.50 -40°C -20°C 25°C 85°C 125°C Figure 8-10. Supply Current vs. Common Mode - 1.8V Input Voltage from V- (V) Total Quiecent Current (  A) 1.50 1.75 2.00 2.25 2.50 2.75 3.00 3.25 3.50 -40°C -20°C 25°C 85°C 125°C Figure 8-11. Supply Current vs. Common Mode - 5V Overdrive (mV) Propagation Delay, TPHL (  s) 5 6 7 8 10 20 30 40 50 70 100 200 300 500 1.8V 3.3V Figure 8-12. High to Low Propagation Delay vs. Overdrive TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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For VS (Total Supply Voltage) = (V+) – (V–) = +5V, VCM = VS /2 at TA = 25°C , RPULLUP = 1MΩ to V+, CL = 15pF, VOD = 100mV unless otherwise noted. Overdrive (mV) Propagation Delay, TPLH (  s) 5 6 7 8 10 20 30 40 50 70 100 200 300 500 0.5 0.7 1.8V 3.3V Figure 8-13. Low to High Propagation Delay vs. Overdrive Figure 8-14. High to Low Propagation Delay vs. Temperature Temperature (°C) Propagation Dealy, TPLH (  s) -40 -25 -10 5 20 35 50 65 80 95 110 125 1.2 1.4 1.6 1.8 V OD = 100mV 5V 3.3V 1.8V Figure 8-15. Low to High Propagation Delay vs. Temperature Figure 8-16. Reference Voltage vs. Temperature Refernce Output Sourcing Current (mA) Reference Output Voltage (V) 1.2390 1.2391 1.2392 1.2393 1.2394 1.2395 1.2396 1.2397 1.2398 1.2399 1.2400 1.8 V 3.3 V 5 V Figure 8-17. Reference Voltage vs. Reference Output Sourcing Current Refernce Output Sinking Current (mA) Reference Output Voltage (V) 1.2400 1.2401 1.2402 1.2403 1.2404 1.2405 1.2406 1.2407 1.2408 1.2409 1.2410 1.8 V 3.3 V 5 V Figure 8-18. Reference Voltage vs. Reference Output Sinking Current www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

For VS (Total Supply Voltage) = (V+) – (V–) = +5V, VCM = VS /2 at TA = 25°C , RPULLUP = 1MΩ to V+, CL = 15pF, VOD = 100mV unless otherwise noted. Toggle Frequency (Hz) Total Supply Current (  A) 1 2 3 4 5 7 10 20 50 100 200 1000 10000 5000050000 C L = 15pF R PULLUP = 1M  Pullup current not included 3.3V 1.8V Figure 8-19. Supply Current vs. Toggle Frequency - Open Drain Output Toggle Frequency (Hz) Total Supply Current (  A) 1 2 3 4 5 7 10 20 50 100 200 1000 10000 5000050000 C L = 15pF5V 3.3V 1.8V Figure 8-20. Supply Current vs. Toggle Frequency - Push-Pull Output Temperature (°C) Typical Hysteresis (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 4.5 5.5 6.5 3.3V 1.8V Figure 8-21. Hysteresis Voltage vs. Temperature Input Common Mode Voltage (V) Typical Hysteresis Voltage (V) 4.5 5.5 6.5 7.5 8.5 125°C 85°C 25°C -40°C Figure 8-22. Hysteresis Voltage vs. Common Mode, 1.8V Input Common Mode Voltage (V) Typical Hysteresis Voltage (V) 4.5 5.5 6.5 7.5 8.5 125°C 85°C 25°C -40°C TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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For VS (Total Supply Voltage) = (V+) – (V–) = +5V, VCM = VS /2 at TA = 25°C , RPULLUP = 1MΩ to V+, CL = 15pF, VOD = 100mV unless otherwise noted. Supply Voltage (V) Hysteresis Voltage (mV) 4.5 5.5 6.5 7.5 125°C 85°C 25°C -55°C Figure 8-25. Hysteresis Voltage vs. Supply Voltage Temperature (°C) Offset Voltage (mV) -55 -35 -15 5 25 45 65 85 105 125 -2.5 -1.5 -0.5 0.5 1.5 2.5

7 Individual Units

V S = 1.8V Figure 8-26. Offset Voltage vs. Temperature, 1.8 V Temperature (°C) Offset Voltage (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 -2.5 -1.5 -0.5 0.5 1.5 2.5 V S = 3.3V Common Mode Voltage (V) Offset Voltage (mV) -3.00 -2.50 -2.00 -1.50 -1.00 -0.50 0.00 0.50 1.00 1.50 2.00 2.50 3.00 V S = 5V, T A = 25°C www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

For VS (Total Supply Voltage) = (V+) – (V–) = +5V, VCM = VS /2 at TA = 25°C , RPULLUP = 1MΩ to V+, CL = 15pF, VOD = 100mV unless otherwise noted. Common Mode Voltage (V) Offset Voltage (mV) -3.00 -2.50 -2.00 -1.50 -1.00 -0.50 0.00 0.50 1.00 1.50 2.00 2.50 3.00 V S = 5V, T A = 25°C Figure 8-31. Offset Voltage vs. Common Mode Voltage, 5 V Supply Voltage (V) Offset Voltage (mV) -3.00 -2.50 -2.00 -1.50 -1.00 -0.50 0.00 0.50 1.00 1.50 2.00 2.50 3.00 V S = 5V, T A = 125°C Figure 8-32. Offset Voltage vs. Supply Voltage, 125°C Supply Voltage (V) Offset Voltage (mV) -3.00 -2.50 -2.00 -1.50 -1.00 -0.50 0.00 0.50 1.00 1.50 2.00 2.50 3.00 V S = 5V, T A = 25°C Figure 8-33. Offset Voltage vs. Supply Voltage, 25°C Supply Voltage (V) Offset Voltage (mV) -3.00 -2.50 -2.00 -1.50 -1.00 -0.50 0.00 0.50 1.00 1.50 2.00 2.50 3.00 T A = -40°C Figure 8-34. Offset Voltage vs. Supply Voltage, -40°C TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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9 Detailed Description

9.1 Overview

The TLV301xB is a MicroPower comparator with an integrated reference that is well suited for compact, low- current, precision voltage detection applications. With a high-accuracy, internal reference of 1.242 V and 3.1 uA of quiescent current, the TLV301xB enables power conscious systems to monitor and respond quickly to fault conditions.

9.2 Functional Block Diagram

1.242V Reference

9.3 Feature Description

The TLV301x is comprised of a rail-to-rail input comparator with open-drain or push-pull output options and a voltage reference that is externally available.

9.4 Device Functional Modes

The TLV301x requires an operating voltage between 1.8 V and 5.5 V for the comparator output to reflect the voltage applied to the inputs. Similarly, the reference output (REF) will also be valid over the same operating voltage range. The "B" versions add hysteresis, power on reset, fail-safe inputs and a 1.65 V minimum supply voltage.

9.4.1 Open Drain Output (TLV3011 and TLV3011B)

The TLV3011 features an Open-Drain (sinking only) output that allows multiple devices to be driven by a single pull-up resistor to accomplish an OR function, making the TLV3011 useful for logic applications. The value of the pull-up resistor and supply voltage used will affect current consumption due to additional current drawn when the output is in a low state. This effect can be seen in the typical curve Quiescent Current vs Output Switching Frequency. For the TLV3011, the pull-up voltage must be less than, or equal to, the V+ supply voltage (VPULLUP ≤ V+). The TLV3011B may be pulled-up to any voltage up to 5.5V, regardless of the supply voltage.

9.4.2 Push-Pull Output (TLV3012 and TLV3012B)

The TLV3012 has a "Push-Pull" output capable of both sinking and sourcing current. The push-pull output stage is optimal for reduced power budget applications by eliminating the need for a pull-up resistor and features no shoot-through current. Do not tie push-pull outputs together.

9.4.3 Voltage Reference

The integrated 1.242-V voltage reference offers low 100-ppm/°C (maximum) drift provided on a seporate output pin that allows use of external dividers or to provide a reference voltage for other external circuitry. The reference is stable with up to a 10-nF capacitive load and can sink or source up to 500µA (typical) of output current. www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

9.4.4 TLV3011B and TLV3012B Fail-Safe inputs

The TLV3011B and TLV3012B inputs are Fail-Safe up to 5.5V independent of V+ voltage. Fail-Safe is defined as maintaining the same high input impedance when V+ is unpowered or within the recommended operating ranges. The Fail-Safe inputs can be any value between 0 V and 5.5 V, even while V+ is zero or ramping up or down. This feature avoids power sequencing issues as long as the input voltage range and supply voltage are within the specified ranges. This is possible since the inputs are not clamped to V+ and the input current maintains its value even when a higher voltage is applied to the inputs. As long as one of the input pins remains within the valid input range, and the supply voltage is valid and not in POR, the output state will be correct. The following is a summary of the TLV3011B and TLV3012B device input voltage excursions and their outcomes: 1. When both IN- and IN+ are within the specified input voltage range: a. If IN- is higher than IN+ and the offset voltage, the output is low. b. If IN- is lower than IN+ and the offset voltage, the output is high. 2. When IN- is higher than the specified input voltage range and IN+ is within the specified voltage range, the output is low. 3. When IN+ is higher than the specified input voltage range and IN- is within the specified input voltage range, the output is high 4. When IN- and IN+ are both outside the specified input voltage range, the output state is indeterminate (random). Do not operate in this region. Because the inputs do not have upper ESD diode clamps to V+, input voltages must be externally clamped to below 5.5 V if the source could possibly exceed 5.5 V. A current limiting resistor in series with the input is also recommend in case of input transients.

9.4.5 TLV3011B and TLV3012B Power On Reset

The TLV3011B and TLV3012B have an internal Power-on-Reset (POR) circuit for known start-up or power-down conditions. While the power supply (V+) is ramping up or ramping down, the POR circuitry will be activated for up to 1.9ms after the minimum supply voltage threshold is crossed, or immediately when the supply voltage drops below minimum supply. When the supply voltage is equal to or greater than the minimum supply voltage, and after the delay period, the comparator output reflects the state of the differential input (V ID). This delay is long enough to allow the reference output to stabilize with up to a 10nF capacitive load. During the POR period (ton), the outputs will be the following:

• The open drain output TLV3011B will be high (Hi-Z).
• The push-pull output TLV3012B will be low (sinking). Power On Reset Time (tON) VOH / 2 VOL OUT VS +1.5V Figure 9-1. Power-On Reset Example Timing Diagram for Push-Pull Output Note that it the nature of an open collector output that the output will rise with the pull-up voltage during the HI-Z POR period. TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

10.1 Application Information

The TLV301x and TLV301xB comparator family with on-chip 1.242-V series reference with the choice of either open-drain or push-pull output stages. A typical supply current of 2.4 μA and small packaging combine with 1.65-V supply requirements to make the TLV301xB devices optimal for battery and portable designs. Figure 10-1 shows the typical connections for the TLV3012 device. VIN– VIN+ VOUT 0.01 µF 10 µF RPULLUP (1) 10 kΩ REF 2 V- TLV301x (1) Use R with the TLV3011 only.PULLUP Figure 10-1. Basic Connections

10.1.1 External Hysteresis

Comparator inputs have no noise immunity within the range of the specified offset voltage. For noisy input signals, the comparator output may display multiple switching as input signals move through the switching threshold. The typical comparator threshold of the TLV3012 device is ±0.5 mV. To prevent multiple switching within the comparator threshold of the TLV3012 device, external hysteresis may be added by connecting a small amount of feedback to the positive input. Figure 10-2 shows a typical topology used to introduce hysteresis, described by Equation 1. V =HYST V+ × R1 R1 + R2 (1) TLV301x VIN VOUT RPULLUP (1) 5 V VREF 39 kΩ 560 kΩ REF V = 0.38 VHYST (1) Use R with the TLV3011 only.PULLUP Figure 10-2. Adding Hysteresis www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

The VHYST voltage sets the value of the transition voltage required to switch the comparator output by increasing the threshold region, thereby reducing sensitivity to noise.

10.1.2 TLV3011B and TLV3012B Hysteresis

The TLV3011B and TLV3012B have typically 6mV of built-in hysteresis. External hysteresis can still be added as explained in the previous section.

10.2 Typical Application

10.2.1 Under-Voltage Detection

Under-voltage detection is frequently required to alert the system that a battery voltage has dropped below the usable voltage level. Figure 23 shows a simple under-voltage detection circuit using the TLV3012 which is configured as a non-inverting comparator with the integrated 1.242 V reference is externally connected to the inverting input pin (IN-). 1.242 V ALERT Micro- Controller V+R1 VBATT TLV3012 Figure 10-3. Under-Voltage Detection

10.2.1.1 Design Requirements

For this design, follow these design requirements:

• Operate from power supply that powers the microcontroller.
• Under-voltage alert is active low.
• Logic low output when VBAT is less than 2.0V.

10.2.1.2 Detailed Design Procedure

Configure the circuit as shown in Figure 10-3 . Connect (V+) to V BAT which also powers the microcontroller. Resistors R1 and R 2 create the under-voltage alert level of 2.0 V. When the battery voltage sags down to 2.0 V, the resistor divider voltage crosses V REF, the 1.242 V reference threshold of the TLV3012. This causes the comparator output to transition from a logic high to a logic low. The push-pull output of the TLV3012 is selected since the comparator operating voltage is shared with the microcontroller which is receiving the under-voltage alert signal. Equation 2 is derived from the analysis of Figure 10-3. (2) where TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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• R1 and R2 are the resistor values for the resistor divider connected to IN+
• VBAT is the voltage source that is being monitored for an undervoltage condition.
• VREF is the falling edge threshold where the comparator output changes state from high to low Rearranging Equation 2 and solving for R1 yields Equation 3. (3) For the specific undervoltage detection of 2.0 V using the TLV3012, the following results are calculated. (4) where
• R2 is set to 1 MΩ
• VBAT is set to 2.0 V
• VREF is set to1.242 V Choose RTOTAL (R1 + R2) such that the current through the divider is at least 100 times higher than the input bias current (IBIAS). The resistors can have high values to minimize current consumption in the circuit without adding significant error to the resistive divider. www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 25 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

10.2.1.3 Application Curve

T Time (s) IN 0.00 2.00 VBAT 0.00 3.30 Vout 3.30 1.242 2.00 OUT (V) IN+ (V) VBAT (V) Time (s) 0.00 Figure 10-4.

10.3 System Examples

10.3.1 Power-On Reset

The reset circuit shown in Figure 10-5 provides a time-delayed release of reset to the MSP430™ microcontroller. Operation of the circuit is based on a stabilization time constant of the supply voltage, rather than on a predetermined voltage value. The negative input is a reference voltage created by the internal voltage reference. The positive input is an RC circuit that provides a power-up delay. When power is applied, the output of the comparator is low, holding the processor in the reset condition. Only after allowing time for the supply voltage to stabilize does the positive input of the comparator become higher than the negative input, resulting in a high output state, releasing the processor for operation. The stabilization time required for the supply voltage is adjustable by the selection of the RC component values. Use of a lower-valued resistor in this portion of the circuit does not increase current consumption, because no current flows through the RC circuit after the supply has stabilized. TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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1 MΩ RPULLUP

(1) 10 kΩ RESET MSP430 1.242 V REF (1) Use R with the TLV3011 only.PULLUP Figure 10-5. TLV3012 Configured as Power-Up Reset Circuit for the MSP430™ Microcontroller The reset delay needed depends on the power-up characteristics of the system power supply. R 1 and C 1 are selected to allow enough time for the power supply to stabilize. D 1 provides rapid reset if power is lost. In this example, the R1 × C1 time constant is 10 ms.

10.3.2 Relaxation Oscillator

The TLV3012 device can be configured as a relaxation oscillator to provide a simple and inexpensive clock output (see Figure 10-6). The capacitor is charged at a rate of T = 0.69RC and discharges at a rate of 0.69RC. Therefore, the period is T = 1.38RC. R1 may be a different value than R2. F = 724 Hz 2/3 (V+) 1/3 (V+) 1 MΩ 1 MΩ 1 MΩ 1 MΩ VOUT VC t C 1000 pF T1 T2 t TLV3012 Figure 10-6. TLV3012 Configured as Relaxation Oscillator

10.4 Power Supply Recommendations

The TLV3012 has a recommended operating voltage range (V S) of 1.8 V to 5.5 V. V S is defined as (V+) – (V-). Therefore, the supply voltages used to create V S can be single-ended or bipolar. For example, single-ended supply voltages of 5 V and 0 V and bipolar supply voltages of +2.5 V and –2.5 V create comparable operating voltages for V S. However, when bipolar supply voltages are used, it is important to realize that the reference (REF) and logic low level of the comparator output is referenced to (V-). Output capacitive loading and output toggle rate will cause the average supply current to rise over the quiescent current in the EC Table.

10.5 Layout

10.5.1 Layout Guidelines

To minimize supply noise, power supplies should be capacitively decoupled by a 0.1- μF ceramic capacitor. Comparators are sensitive to input noise and precautions such as proper grounding (use of ground plane), www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 27 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

supply bypassing, and guarding of high-impedance nodes minimize the effects of noise and help to ensure specified performance.

10.5.2 Layout Example

V S GND GND OUT SOT-23 Figure 10-7. Layout Example TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 www.ti.com

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11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

11.3 Trademarks

MSP430™ is a trademark of Texas Instruments. TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com TLV3011, TLV3012, TLV3011B, TLV3012B SBOS300C – FEBRUARY 2004 – REVISED APRIL 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 29 Product Folder Links: TLV3011 TLV3012 TLV3011B TLV3012B

www.ti.com 9-Jan-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TLV3011AIDBVR Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALR TLV3011AIDBVR.A Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALR TLV3011AIDBVR.B Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALR TLV3011AIDBVRG4 Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 ALR TLV3011AIDBVRG4.A Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 ALR TLV3011AIDBVRG4.B Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 ALR TLV3011AIDBVT Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALR TLV3011AIDBVT.A Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALR TLV3011AIDBVT.B Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALR TLV3011AIDBVTG4 Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALR TLV3011AIDCKR Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 AJX TLV3011AIDCKR.A Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 AJX TLV3011AIDCKR.B Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 AJX TLV3011AIDCKT Active Production SC70 (DCK) | 6 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 AJX TLV3011AIDCKT.A Active Production SC70 (DCK) | 6 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 AJX TLV3011AIDCKT.B Active Production SC70 (DCK) | 6 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 AJX TLV3011BIDBVR Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 31KF TLV3011BIDBVR.A Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 31KF TLV3011BIDCKR Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 1O8 TLV3011BIDCKR.A Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 1O8 TLV3012AIDBVR Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALS TLV3012AIDBVR.A Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALS TLV3012AIDBVR.B Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALS TLV3012AIDBVRG4 Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALS TLV3012AIDBVT Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALS TLV3012AIDBVT.A Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALS TLV3012AIDBVT.B Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALS TLV3012AIDBVTG4 Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 ALS TLV3012AIDCKR Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ALT Addendum-Page 1

www.ti.com 9-Jan-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TLV3012AIDCKR.A Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 ALT TLV3012AIDCKR.B Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 ALT TLV3012AIDCKT Active Production SC70 (DCK) | 6 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 ALT TLV3012AIDCKT.A Active Production SC70 (DCK) | 6 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 ALT TLV3012AIDCKT.B Active Production SC70 (DCK) | 6 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 ALT TLV3012BIDBVR Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 31LF TLV3012BIDBVR.A Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 31LF TLV3012BIDCKR Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 1O9 TLV3012BIDCKR.A Active Production SC70 (DCK) | 6 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 1O9 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 2

www.ti.com 9-Jan-2026 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLV3011, TLV3011B, TLV3012, TLV3012B :

• Automotive : TLV3011-Q1 , TLV3011B-Q1 , TLV3012-Q1 , TLV3012B-Q1
• Enhanced Product : TLV3011-EP , TLV3012-EP NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 3-Jul-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 3-Jul-2026 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 3-Jul-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV3011AIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0 TLV3011AIDBVRG4 SOT-23 DBV 6 3000 210.0 185.0 35.0 TLV3011AIDBVT SOT-23 DBV 6 250 210.0 185.0 35.0 TLV3011AIDBVT SOT-23 DBV 6 250 180.0 180.0 18.0 TLV3011AIDCKR SC70 DCK 6 3000 180.0 180.0 18.0 TLV3011AIDCKT SC70 DCK 6 250 180.0 180.0 18.0 TLV3011AIDCKT SC70 DCK 6 250 180.0 180.0 18.0 TLV3011BIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0 TLV3011BIDCKR SC70 DCK 6 3000 180.0 180.0 18.0 TLV3012AIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0 TLV3012AIDBVT SOT-23 DBV 6 250 210.0 185.0 35.0 TLV3012AIDCKR SC70 DCK 6 3000 180.0 180.0 18.0 TLV3012AIDCKR SC70 DCK 6 3000 180.0 180.0 18.0 TLV3012AIDCKR SC70 DCK 6 3000 210.0 185.0 35.0 TLV3012AIDCKT SC70 DCK 6 250 180.0 180.0 18.0 TLV3012AIDCKT SC70 DCK 6 250 210.0 185.0 35.0 TLV3012AIDCKT SC70 DCK 6 250 180.0 180.0 18.0 TLV3012BIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0 Pack Materials-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 3-Jul-2026 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV3012BIDCKR SC70 DCK 6 3000 180.0 180.0 18.0 Pack Materials-Page 4

www.ti.com PACKAGE OUTLINE C 0.22

0.08 TYP

0.25 3.0 2.6 2X 0.95 1.45 0.90 0.15

0.00 TYP

6X 0.50 0.25 0.6

0.3 TYP

0 TYP

1.9 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0006A SMALL OUTLINE TRANSISTOR 4214840/G 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side. 4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation. 5. Refernce JEDEC MO-178.

0.2 C A B

0.1 C SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

0.07 MIN

6X (1.1) 6X (0.6) (2.6) 2X (0.95) (R0.05) TYP 4214840/G 08/2024 SOT-23 - 1.45 mm max heightDBV0006A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (2.6) 2X(0.95) 6X (1.1) 6X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0006A SMALL OUTLINE TRANSISTOR 4214840/G 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4

www.ti.com PACKAGE OUTLINE C 0.22 0.15 2.4 1.8 4X 0.65 1.1 0.8 0.1

0.0 TYP

6X 0.30 0.15 NOTE 5 0.46

0.26 TYP

1.3 4X 0 -12 4X 4 -15 A 2.15 1.85 B1.4 1.1 SOT - 1.1 max heightDCK0006A SMALL OUTLINE TRANSISTOR 4214835/D 11/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. 4. Falls within JEDEC MO-203 variation AB. INDEX AREA PIN 1 NOTE 5

0.1 C A B

0.1 C SCALE 5.600

www.ti.com EXAMPLE BOARD LAYOUT 6X (0.9) 6X (0.4) (2.2) 4X (0.65) (R0.05) TYP 4214835/D 11/2024 SOT - 1.1 max heightDCK0006A SMALL OUTLINE TRANSISTOR NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (2.2) 4X(0.65) 6X (0.9) 6X (0.4) (R0.05) TYP SOT - 1.1 max heightDCK0006A SMALL OUTLINE TRANSISTOR 4214835/D 11/2024 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:18X SYMM PKG 3 4

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