TLV3011AMDBVREP

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V IN+ DBV□PACKAGE (TOP□VIEW) TLV3011-EP TLV3012-EP SGLS349 OCTOBER 2006 NANOPOWER 1.8-V SOT23 COMPARATORS WITH VOLTAGE REFERENCE Battery-Powered Level Detection Controlled Baseline Data Acquisition One Assembly/Test Site System Monitoring One Fabrication Site Oscillators Extended Temperature Performance of Sensor Systems C to 125 C Smoke Detectors Enhanced Diminishing Manufacturing Light Sensors Sources (DMS) Support Alarms Enhanced Product-Change Notification Qualification Pedigree (1) Low Quiescent Current µ A (Max) The TLV3011 and TLV3012 are low-power, Integrated Voltage Reference 1.242 V open-drain output comparators. The devices feature Input Common-Mode Range 200 mV an uncommitted on-chip voltage reference, have Beyond Rails µ A (max) quiescent current, input common-mode range 200 mV beyond the supply rails, and Voltage Reference Initial Accuracy single-supply operation from 1.8 V to 5.5 The Open-Drain Logic Compatible Output integrated 1.242-V series voltage reference offers (TLV3011) low 100-ppm/ C (max) drift, is stable with up to Push-Pull Output (TLV3012) 10-nF capacitive load, and can provide up to 0.5 mA (typ) of output current. Low Supply Voltage 1.8 V to 5.5 V Fast Response Time µ s Propagation The TLV3011 and TLV3012 are available in the tiny SOT23-6 package for space-conservative designs. Delay With 100-mV Overdrive The devices are specified for the temperature range (TLV3011: R PULLUP k Ω of C to 125 Microsize Package: SOT23-6 (1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2006, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com PACKAGE ORDERING INFORMATION Pin Configurations OUT IN+ REF IN– BTV SOT23-6 TL V3011AMDBV OUT IN+ REF IN– TBD SOT23-6 TL V3012AMDBV (1) Note:□Pin□1□is□determined□by□orienting□package□marking□as□shown. Product□Preview (1) Top□View ABSOLUTE MAXIMUM RATINGS (1) TLV3011-EP TLV3012-EP SGLS349 OCTOBER 2006 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. T A PACKAGE (1) ORDERABLE PART NUMBER TOP SIDE MARKING -55 C TO 125 C DBV-SOT TLV3011AMDBVREP BTV DBV-SOT TLV3012AMDBVREP (2) TBD (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) Product Preview over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage V Voltage (2) 0.5 (V+) +0.5 V Signal input terminals Current (2) mA Output short circuit (3) Continous Operating temperature range 125 C T stg Storage temperature range 150 C T J Junction temperature 150 C Lead ambient temperature (soldering, 300 C ESD rating (Human-Body Model) 2000 V (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to the network ground terminal. (3) Short circuit to ground Submit Documentation Feedback

www.ti.com ELECTRICAL CHARACTERISTICS TLV3011-EP TLV3012-EP SGLS349 OCTOBER 2006 over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Offset Voltage V OS Input offset voltage V CM I O V 0.5 mV dV OS /dT Input offset voltage vs temperature T A C to 125 C µ C PSRR Power supply rejection ratio V S 1.8 V to 5.5 V 100 1000 µ V/V Input Bias Current I S Input bias current V CM V S pA I OS Input offset current V CM V S pA Input Voltage Range V CM Common-mode voltage range 0.2 (V+) 0.2 V V CM 0.2 V to (V+) 1.5 V CMRR Common-mode rejection ratio dB V CM 0.2 V to (V+) 0.2 V Input Impedance Common mode Ω pF Differential Ω pF Switching Characteristics f kHz, V STEP input overdrive mV Low to high f kHz, V STEP input overdrive 100 mV Propagation delay time µ s f kHz, V STEP 13.5 input overdrive mV High to low f kHz, V STEP 6.5 input overdrive 100 mV TLV3011 See (1) t r Rise time TLV3012 (2) C L pF 100 ns t f Fall time C L pF 100 ns Output V OL Voltage output low from rail V S V 160 200 mV Voltage output high TLV3012 (2) I OUT mA 200 mV from rail Short-circuit current TLV3012 (2) I OUT mA See Typical Characteristics Voltage Reference V OUT Output voltage 1.208 1.242 1.276 V Initial accuracy dV OUT T Temperature drift C T A 125 C 100 ppm/ C Sourcing mA I SOURCE 0.5 mA 0.36 dV OUT /dI LOAD Load regulation mV/mA Sinking mA I SINK 0.5 mA 6.6 I LOAD Output current 0.5 mA dV OUT /dV IN Line regulation 1.8 V V IN 5.5 V 100 µ V/V Noise Reference voltage noise f 0.1 Hz to Hz 0.2 mV PP Power Supply V S Specified voltage 1.8 5.5 V Operating voltage range 1.8 5.5 V I Q Quiescent current V S V O High 2.8 µ A (1) t r dependent on R PULLUP and C LOAD (2) Product Preview Submit Documentation Feedback

www.ti.com TYPICAL CHARACTERISTICS Quiescent Current – µA Temperature – ° C 3.8 3.6 3.4 3.2 2.8 2.6 2.4 2.2 -50 25 50 75 100-25 0 125 Quiescent Current – µA Output Transition Frequency – Hz 10010 1k 10k V = 5 VS V = 3 VS V = 1.8 VS TLV3011 R PULLUP = 1 MΩ Quiescent Current – µA Output Switching Frequency – Hz 10010 1k 10k 100k V = 5 VS V = 3 VS V = 1.8 VS TLV3012 -50 Input Bias Current – pA Temperature – ° C 25 50-25 0 75 100 125 TLV3011-EP TLV3012-EP SGLS349 OCTOBER 2006 ELECTRICAL CHARACTERISTICS (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Temperature Operating range 125 C Storage range 150 C Thermal resistance SOT23-6 200 C/W QUIESCENT CURRENT QUIESCENT CURRENT vs vs TEMPERATURE OUTPUT SWITCHING FREQUENCY Figure Figure QUIESCENT CURRENT INPUT BIAS CURRENT vs vs OUTPUT SWITCHING FREQUENCY TEMPERATURE Figure Figure Submit Documentation Feedback

www.ti.com V – Output Low – V OL Output Current – mA 4 62 V = 5 VS 8 10 12 0.25 0.20 0.15 0.10 0.05 V = 3 VS V = 1.8 VS (V – V ) – OH V S Output Current – mA 4 62 8 10 12 0.25 0.20 0.15 0.10 0.05 V = 5 VDD V = 3 VDD V = 1.8 VDD TLV3012 0.01 t sPLH – Propagation Delay – µ Capacitive Load – nF 1 100.1 100 1k V = 1.8 VS V = 5 VS V = 3 VS TLV3012 0.01 t – Propagation Delay – µsPHL Capacitive Load – nF 1 100.1 100 1k V = 5 VS V = 3 VS V = 1.8 VS t – Propagation Delay µsPLH Input Overdrive mV– 40 50 6010 20 30 70 90 80 100 V = 5 VS V = 3 VS V = 1.8 VS t sPHL – Propagation Delay – µ Input Overdrive – mV 40 50 6010 20 30 70 90 80 100 V = 1.8 VS V = 5 VS V = 3 VS TLV3011-EP TLV3012-EP SGLS349 OCTOBER 2006 TYPICAL CHARACTERISTICS (continued) OUTPUT LOW OUTPUT HIGH vs vs OUTPUT CURRENT OUTPUT CURRENT Figure Figure PROPAGATION DELAY PLH PROPAGATION DELAY PHL vs vs CAPACITIVE LOAD CAPACITIVE LOAD Figure Figure PROPAGATION DELAY PLH PROPAGATION DELAY PHL vs vs INPUT OVERDRIVE INPUT OVERDRIVE Figure Figure 10. Submit Documentation Feedback

www.ti.com -50 t – Propagation Delay – µsPLH Temperature – ° C 25 50-25 0 75 100 125 7.5 6.5 5.5 4.5 V = 1.8 VS V = 3 VS V = 5 VS t sPHL – Pr opagation Dela y – µ Temperature – ° C 7.5 6.5 5.5 4.5 V = 1.8 VS V = 5 VS V = 3 VS -50 25 50-25 0 75 100 125 500 mV/div

2 V/div

2 µs/div V = 2.5 VS VIN– VIN+ VOUT TLV3012 TLV3011 2 µs/div 500 mV/div 2V/div V = 2.5 VSVIN+ VIN– VOUT 2 µs/div 500 mV/div V = 0.9 VS VIN– VIN+ VOUT 2 µs/div 500 mV/div V = 0.9 VS VIN– VIN+ VOUT TLV3011-EP TLV3012-EP SGLS349 OCTOBER 2006 TYPICAL CHARACTERISTICS (continued) PROPAGATION DELAY PLH PROPAGATION DELAY PHL vs vs TEMPERATURE TEMPERATURE Figure 11. Figure 12. PROPAGATION DELAY PLH PROPAGATION DELAY PHL Figure 13. Figure 14. PROPAGATION DELAY PLH PROPAGATION DELAY PHL Figure 15. Figure 16. Submit Documentation Feedback

www.ti.com Reference Voltage – V Output Load Current, Sourcing – mA 1.24205 1.24200 1.24195 1.24190 1.24185 1.24180 1.24175 1.24170 1.24165 1.24160 Reference Voltage – V Output Load Current, Sinking – mA 1.250 1.249 1.248 1.247 1.246 1.245 1.244 1.243 1.242 1.241 Reference Voltage – V Temperature – ° C 1.250 1.245 1.240 1.235 1.230 1.225 1.220 1.215 1.210 -100 50 100-50 0 150 1.5 Short-Cir cuit Current – mA Supply Voltage – V Sink Source 3.52 2.5 4 4.5 5 5.5 140 120 100 TLV3012 Units Reference Voltage – V 500 450 400 350 300 250 200 150 100 TLV3011-EP TLV3012-EP SGLS349 OCTOBER 2006 TYPICAL CHARACTERISTICS (continued) REFERENCE VOLTAGE REFERENCE VOLTAGE vs vs OUTPUT LOAD CURRENT (SOURCING) OUTPUT LOAD CURRENT (SINKING) Figure 17. Figure 18. REFERENCE VOLTAGE SHORT-CIRCUIT CURRENT vs vs TEMPERATURE SUPPLY VOLTAGE Figure 19. Figure 20. REFERENCE VOLTAGE DISTRIBUTION Figure 21. Submit Documentation Feedback

www.ti.com APPLICATION INFORMATION Board Layout VIN– VIN+ VOUT 0.01 µF 10 µF R PULLUP (1) 10 kΩ REF 2 V- TLV301x (1) Use R with the TLV3011 only.PULLUP Open-Drain Output (TLV3011) External Hysteresis V =HYST V+ × R1 R + R1 2 TLV3011-EP TLV3012-EP SGLS349 OCTOBER 2006 The TLV3011 is a low-power, open-drain comparator with on-chip 1.242-V series reference. The open-drain output allows multiple devices to be driven by a single pullup resistor to accomplish an OR function, making the TLV3011 useful for logic applications. The TLV3012 comparator with on-chip 1.242-V series reference has a push-pull output stage optimal for reduced power budget current. A typical supply current of 2.8 µ A and small packaging combine with 1.8-V supply requirements to make the TLV3011 and TLV3012 optimal for battery and portable designs. Typical connections for the TLV3011 and TLV3012 are shown in Figure The TLV3011 is an open-drain output device. A pullup resistor must be connected between the comparator output and supply to enable operation. To minimize supply noise, power supplies should be capacitively decoupled by a 0.01- µ F ceramic capacitor in parallel with a µ F electrolytic capacitor. Comparators are sensitive to input noise and precautions such as proper grounding (use of ground plane), supply bypassing, and guarding of high-impedance nodes minimize the effects of noise and help to ensure specified performance. Figure 22. Basic Connections of the TLV3011 and TLV3012 The open-drain output of the TLV3011 is useful in logic applications. The value of the pullup resistor and supply voltage used affects current consumption due to additional current drawn when the output is in a low state. This effect can be seen in Figure Comparator inputs have no noise immunity within the range of specified offset voltage mV). For noisy input signals, the comparator output may display multiple switching as input signals move through the switching threshold. The typical comparator threshold of the TLV3011 and TLV3012 is 0.5 mV. To prevent multiple switching within the comparator threshold of the TLV3011 or TLV3012, external hysteresis may be added by connecting a small amount of feedback to the positive input. Figure shows a typical topology used to introduce hysteresis, described by this equation: Submit Documentation Feedback

www.ti.com TLV301x VIN VOUT R PULLUP (1) 5 V VREF R 1 39 kΩ 560 kΩ REF V = 0.38 VHYST (1) Use R with the TLV3011 only.PULLUP Battery Okay trip voltage = 1.242 Battery Okay 1 MΩ 2 MΩ R PULLUP (1) TLV301x When the battery voltage drops below 1.9 V, the Battery Okay output goes low. (1) Use R with the TLV3011 only.PULLUP REF1.242 V TLV3011-EP TLV3012-EP SGLS349 OCTOBER 2006 APPLICATION INFORMATION (continued) Figure 23. Adding Hysteresis V HYST sets the value of the transition voltage required to switch the comparator output by increasing the threshold region, thereby reducing sensitivity to noise. The low power consumption and 1.8-V supply voltage of the TLV3011 make it an excellent candidate for battery-powered applications. Figure shows the TLV3011 configured as a low battery level detector for a 3-V battery. Figure 24. TLV3011 Configured as Low Battery Level Detector Submit Documentation Feedback

www.ti.com Power-On Reset TLV301xC 10 nF DI R 1

1 MΩ R PULLUP

(1) 10 kΩ RESET MSP430 1.242 V REF (1) Use R with the TLV3011 only.PULLUP Relaxation Oscillator F = 724 Hz 2/3 (V+) 1/3 (V+) R 2 1 MΩ R 1 1 MΩ R 2 1 MΩ R 2 1 MΩ VOUT VC t C 1000 pF T1 T2 t TLV3012 TLV3011-EP TLV3012-EP SGLS349 OCTOBER 2006 APPLICATION INFORMATION (continued) The reset circuit shown in Figure provides a time-delayed release of reset to the MSP430 microcontroller. Operation of the circuit is based on a stabilization time constant of the supply voltage, rather than on a predetermined voltage value. The negative input is a reference voltage created by the internal voltage reference. The positive input is an RC circuit that provides a power-up delay. When power is applied, the output of the comparator is low, holding the processor in the reset condition. Only after allowing time for the supply voltage to stabilize does the positive input of the comparator become higher than the negative input, resulting in a high output state, releasing the processor for operation. The stabilization time required for the supply voltage is adjustable by the selection of the RC component values. Use of a lower-valued resistor in this portion of the circuit does not increase current consumption, because no current flows through the RC circuit after the supply has stabilized. Figure 25. TLV3011 or TLV3012 Configured as Power-Up Reset Circuit for the MSP430 The reset delay needed depends on the power-up characteristics of the system power supply. R and C are selected to allow enough time for the power supply to stabilize. D provides rapid reset if power is lost. In this example, the R C time constant is ms. The TLV3012 can be configured as a relaxation oscillator to provide a simple and inexpensive clock output (see Figure The capacitor is charged at a rate of T 0.69RC and discharges at a rate of 0.69RC. Therefore, the period is T 1.38RC. R may be a different value than R Figure 26. TLV3012 Configured as Relaxation Oscillator Submit Documentation Feedback

www.ti.com 21-May-2011 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TLV3011AMDBVREP ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart V62/07604-01XE ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLV3011-EP :

• Catalog: TLV3011 NOTE: Qualified Version Definitions:

www.ti.com 21-May-2011 Addendum-Page 2

• Catalog - TI's standard catalog product

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV3011AMDBVREP SOT-23 DBV 6 3000 203.0 203.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 Pack Materials-Page 2

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