TLGU1100 TOSHIBA | Alldatasheet
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TOSHIBA TL(SU,OU, YU,GU,PGU)1100(T09) TOSHIBA LED LAMP TLSU1100 (TO9), TLOU1100 (T09), TLYU1100 (TO9) TLGU1100 (T09), TLPGU1100 (T09) PANEL CIRCUIT INDICATOR Unit in mm rotary Sp} © Surface Mount Device moc roson 3.2 © 3.2(L) x 2.8(W) x 1.9 (H) mm Size Z i ] © Flat-top Type OE 3) -| a] © InGaA¢P LED ILA e Line-up . ; \\ camooe noe Colors : Red, Orange, Yellow, Green, Pure Green ! iF 1 e Available of Automounting Machine Use. CH: 5 e Low Drive Current, High Intensity Light Emission ast © Clear luminescence is obtained. ao © High Operating Temperature : Topr-Tstg —40~100°C rr © — Reflow soldering is possible 1 TE a” @ Standard embossed taping i 8mm Pitch : TO9 (1000 pes/ reel) 1. ANODE © Applications : Automotive use, Message Signboard, Backlight, 2. CATHODE ORANGE: #02 mm ete. JEDEC = COLOR MATERIAL TOSHIBA - | TLSU1100 | Red | InGaaeP Weight : 35mg TLYU1100 InGaA¢P TLGU1100 InGaA¢P TLPGU1100 InGaAeP MAXIMUM RATINGS (Ta = 25°C) FORWARD REVERSE POWER OPERATING STORAGE Promer CURRENT VOLTAGE | DISSIPATION | TEMPERATURE | TEMPERATURE Ip (mA) VR (V) Pp (mW) Topr (CC) Tstg CC) Tusui00 =f 30 | TLouiio0 [30 | TLyvii00 [300 | | —40~100 —40~100 | TLGuii00 [30 [-repcuii0s [30 | 4 [4 1 2001-06-01
TOSHIBA TL(SU,OU, YU,GU,PGU)1100(T09) ELECTRICAL CHARACTERISTICS (Ta = 25°C) REVERSE PRODUCT FORWARDS UnAGE CURRENT NAME IR MIN | TYP. | MAX MAX [aryuri00[— [21 | 25 [20 | 50 | 4 OPTICAL CHARACTERISTICS-1 (Ta = 25°C) LUMINOUS INTENSITY PRODUCT ly [aiyuri00 [153 50 | — | 20 OPTICAL CHARACTERISTICS-2 (Ta = 25°C) Peak Emissione USSION SPECTRUM PROOGS | Wavelength > | 4% | wavelength 2a MIN | TYP. | MAX | TYP. MIN | TYP. | MAX [unr] am | am | am [ma] (Note) : This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light. 2 2001-06-01
TOSHIBA TL(SU,OU, YU,GU,PGU)1100(T09) TLSU1100 100) eels 200) Wv - Ip pees] op eee lll Cl ge a sce e z= 50) 7 LIM 2 a “ES 7S SSS == ee | | En ay a ee || ‘4 3 Zz A § ‘TLi7vT tT TT ty yy B PR : FORWARD VOLTAGE Ve w , FORWARD CURRENT Ip (mA) RELATIVE LUMINOUS INTENSITY — : ‘SSeS . Pesee FAA pFSESESERSS eee ee ee | E Cee E Z Vr BESS SSE Cec eoeocrcd eee go AA
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et TTI TT ty (Coe 25 0 25 50 15 100 560, 580 600 620 640 660 680, CASE TEMPERATURE Te (°C) WAVELENGTH A (nm) RADIATION PATTERN 2 Ip — Ta 40) mse TTT ETT TTT TT Qeceeeenene BA Re . g \\ fete FE LSP CAO BE UTNE CXS Coy LAPS . z ALD HERO BFP woh. PERSE RI We 3 1d TRS “ETT TT TAT onl TTP ROR eg wl HSS, 68 LET ET EN TY 0 02 04 06 08 10 0 20 40 60 80 100 120 AMBIENT TEMPERATURE Ta (°C) 3 2001-06-01
TOSHIBA TL(SU,OU, YU,GU,PGU)1100(T09) TLOU1100 100 eels 200) Wv - Ip peeeeesssee |g te TM Ul LEY ET | A | | BL ff e [Au Th er ae SSS eee eel | BECP Ete Lye ELE LE 8 PARE Ve 18 2.0 22 24 2.6 1 bd 5 10 bad bad 100 FORWARD VOLTAGE Vp (V) FORWARD CURRENT Ip (mA) ly -Te RELATIVE RON ONS INTENSITY - i a SS 10 P ESESESESES og | wee EHH e ftp rp ere 2 TP CLE ULL e TTT] TTT TT Tt | z E E CoD 2 CCC 3 0s i a 2 ft te Peer BEE Bf 2 COCOONS et TTI TT ty (Oe EN 25 0 25 50 15 100 540, 560 580 600 620 640 660, CASE TEMPERATURE Te (°C) WAVELENGTH A (nm) RADIATION PATTERN 2 Ip — Ta 40; Ta = 25°0 » ELIE TTT : B COCCEOPAE EO wie g \\ fete FE LSP CAO BE UTNE OPo Col DAKE 5 ALP SEB BPC LP OK SATE RRR Oe TIRES PO, B “CO NY
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wl HSS, 68 LET ET EN TY 0 02 04 06 08 10 0 20 40 60 80 100 120 AMBIENT TEMPERATURE Ta (°C) 4 2001-06-01
TOSHIBA TL(SU,OU, YU,GU,PGU)1100(T09) TLYU1100 ee A ee A Sa 7 2 ah _ LILI Vet tty f / 3 | Bj _—— a Se eeeenee 2 ZC ir pli tiei cid. CLUE TT] FORWARD VOLTAGE Vp (V) ' conan connenr ‘e an 100 RELATIVE LUMINOUS INTENSITY — 10 _Ww-t 10 WAVELENGTH PEERS AB Be EEC Beene ee 4 a ee eee eee ee ee 2 COCO CESSESERS | HEE Zz 03) 5 \\ evET TT ET T_T Tt 3 02 5 a CTV et TTI TT ty aes 25 0 25 50 15 100 540, 560 580 600 620 640 660, CASE TEMPERATURE Te (°C) WAVELENGTH A (nm) RADIATION PATTERN 2 ‘0 Ip — Ta Ta= 25% » ELIE TTT PCoCoCoAET 10° o 10° a . NA, Re . Fa \\ fete FE SPR Oe BCC ARES TARS SB EPEC LTRS SRR OC Ve AL TAA ST Pye TERRES, CCEA wl HSS, 68 LET ET EN TY 0 02 04 06 08 10 0 20 40 60 80 100 120 AMBIENT TEMPERATURE Ta (°C) 5 2001-06-01
TOSHIBA TL(SU,OU, YU,GU,PGU)1100(T09) TLGU1100 a oe w We DRESSERS > ATR & [77 z iV eRe ae ee eel) oo 3 fA ee ee 2 el ee SEE) § tH ly -Te RELATIVE RON ONS INTENSITY - 2 . "FERAL eee] Bee eC WL e ttl iii} 3 (seseeeee é _——— = 2 of ae ee | ee] | | TTT Ty] yf = 02 Y N 3 ge | _i|A7 TN | a LL ET TT try (E47 25 0 25 50 15 100 540, 560, 580 600 620 CASE TEMPERATURE Te (°C) WAVELENGTH A (nm) RADIATION PATTERN 2 Ip — Ta mse = TTTTIT [111 Boo 10° oO 10° a . Ww Re . Fa \\ wf te ge Fe SPA eB EN APSE Se BES NCED woh L PLR SSSR Re LER TPS PELLET AT wot TERRI Ve N “Tose 8 COC 0 02 04 06 08 1.0 0 20 40 60 80 100 120 AMBIENT TEMPERATURE Ta (°C) 6 2001-06-01
TOSHIBA TL(SU,OU, YU,GU,PGU)1100(T09) TLPGU1100 Ip - Ve lv - IF 100 109) <= asee , Sees | fe SSS PSS ’ pe fe Let | » FEE el | Zz eB PL et FP a ae ee 2 2 ae ea g See seeeee 5 me plpvritditvis LAU ETE | FORWARD VOLTAGE Vp (V) ' conan connenr ‘e an 10 RELATIVE LUMINOUS INTENSITY — rs ae . ES S| ppp -EEEHAY ee 4 a e ELE] a | FEERSRSS OHA Sc a | 2 \\ SS i -EEpARNC ttt ttt tT IT | (oa a 25 0 25 50 15 100 520, 540 560 580 600, CASE TEMPERATURE Te (°C) WAVELENGTH A (nm) RADIATION PATTERN 2 Ip — Ta 40) Ta= 25 » ELIE TTT Peco . BA Re . g \\ PR Re og TIA Oe s LETTE T TT ALT Wiggs Oanen ne CONC: FLAS STEEP AY ELLE TIN TU 109 LPAI REPOD \\z0? 3 10] wh TERR =F EL ETT ETE ATT LOTSA, «6 8 LL EET TT TIN J 0 02 04 06 08 10 0 20 40 60 80 100 120 AMBIENT TEMPERATURE Ta (°C) 7 2001-06-01
TOSHIBA TL(SU,OU, YU,GU,PGU)1100(T09) SOLDERING Reflow soldering Temperature profile t 10s max 240°C max —— a) 140-160°C. é ~ #C/s ag ac/smax | ™™ Se Bs 60-1208 g$ & a3 Time (s) — Recommended soldering pattern 165 | 115 | 1.65 (Unit in mm) 1 f 1 7 i T 4.45 RECOMMENDATION FOR MANUAL SOLDERING Soldering iron : Less than 25 W Temperature : Lower than 300°C Time : Within 3s POST SOLDERING CLEANING When cleaning after soldering is needed, the following condition must be adhered to. Cleaning solvents : AK225 or Alcohol Temperature : 50°C (max) for 30s (max) or 30°C (max) for 3 minutes (max) Ultrasonic : 800 W max 8 2001-06-01
TOSHIBA TL(SU,OU, YU,GU,PGU)1100(T09) PACKAGING This LED device is packed in an aluminum envelope with silica-gel to avoid moisture absorption. The optical characteristics may be affected by exposure to moisture in the air before soldering and it should be stored under the following conditions. Temperature : 5~380°C Relative Humidity : 60% or lower Baking is required if the device have been stored unopened for more than 6 month or if the aluminum envelope has been opened for more than 168h. Recommended baking condition is 60°C for 12h minimum in the dry atmosphere. PRECAUTION FOR MOUNTING Do not apply force to the plastic part of the LED in high temperature conditions. Do not apply friction using hard materials for avoid injuring the plastic part of the LED. Keep the LED away from any other parts when assembling boards into the set. TAPING SPECIFICATIONS 1. Taping Number (1) Name: TO9 (2) Example : TLSU1100 (TO09) Tape Specification ‘Device Identifier 2. Dimension of tape (Unit in mm) DIMENSIONS | TOLERANCE DIMENSIONS | TOLERANCE ee [Bo [37 | #01 +0.1/-0 Po a) D t Po | —| f- r 1 3B O-4+-O-F* | 7 fo] Pal ; [Po UW ! L] a Di Polarity Ao 9 2001-06-01
TOSHIBA TL(SU,OU, YU,GU,PGU)1100(T09) 3. Dimension of reel (Unit in mm) 1340.3 4 1 | 4.15.44 1.0 | g) 2 Lu (| DSS | LD _. OA aa 7 rr 4, Leading part (Unit in mm) | Boos o oC] [Over 40mm Over 40 mm Leading Part 190mm min 10 2001-06-01
TOSHIBA TL(SU,OU, YU,GU,PGU)1100(T09) 6. Packing Form (1) Number of Devices per Reel and Carton TO00 devioes 5000 devices (2) Packing : Silica gel and reel are packed into sealed aluminum pack. 7. Notation Method (1) Example : TLSU1100 (T09) P/N: TLSU1100 NOTE (rank symbol) Lot Number (2) Label location : Reel Carton Tape Feed Direction i \\ | | ) abel position Label position Aluminum pack : Attached to center of one side 11 2001-06-01
TOSHIBA TL(SU,OU, YU,GU,PGU)1100(T09) RESTRICTIONS ON PRODUCT USE ooo7o7eac @ TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. @ The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. @ Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. @ The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. @ The information contained herein is subject to change without notice. 12 2001-06-01