TLSD03GU SPSEMI | Alldatasheet
Document overview
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Technical content
APPLICATIONS
◆ High-Speed data lines ◆ Cellular handsets AND accessories ◆ Universal Serial Bus (USB) port protection ◆ Portable instrumentation ◆ LAN / WAN equipment ◆ Peripherals IEC COMPATIBILITY ◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) ◆ IEC61000-4-4 (EFT) 40A (5/50ηs) ◆ IEC61000-4-5 (Lightning) 12A (8/20µs) SOT-23 PIN CONFIGURATION LOW CAPACITANCE TVS DIODE FOR HIGH SPEED DATA INTERFACES
FEATURES
◆ 300 Watts Peak Pulse Power per Line (tp=8/20µs) ◆ Protects one I/O line ◆ Low clamping voltage ◆ Working voltages: 3.3, 5, 8, 12. 15, 24, 36V ◆ Low leakage current MECHANICAL CHARACTERISTICS ◆ JEDEC SOT-23 Package ◆ Molding Compound Flammability Rating : UL 94V-O ◆ Weight 8 Millgrams (Approximate) ◆ Quantity Per Reel : 3,000pcs ◆ Reel Size : 7 inch ◆ Lead Finish : Lead Free PIN CONFIGURATION ESD/TLSD** Series
(V) (V) @1A (µA) (pF) 19.0 23.0 LC12DT3 TLA 12.0 13.3 V C I T T L 260 (10 sec.) ℃ DEVICE CHARACTERISTICS V B PART NUMBER DEVICE MARKING Lead Soldering Temperature Operating Temperature Range SYMBOL VALUE V RWM
500 Watts
ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified) V C I R C T Storage Temperature Range T STG -55 ~ 150 ℃ UNITS Peak Pulse Power (tp=8/20µs waveform) T J -55 ~ 150 ℃ MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified) P PP TLSD03GU TL3 3.0 4.0 1 7.0 10.9 43 125 5 ESD/T LSD** Series TLSD05GU TL5 5.0 6.0 1 9.8 13.5 42 20 5 TLSD08GU TL8 8.0 8.5 1 13.4 16.9 34 10 5 TLSD12GU TLA 12.0 13.3 1 19.0 25.9 21 1 5 TLSD15GU TLB 15.0 16.7 1 24.0 30.0 17 1 5 TLSD24GU TLD 24.0 26.7 1 43.0 49.0 12 1 5 TLSD36GU TLH 36.0 40.0 1 51.0 76.8 9 1 5
SOT-23 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT ESD/T L SD** Series