TLUR124 TOSHIBA | Alldatasheet
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PANEL CIRCUIT INDICATOR Unit in mm © All Plastic Mold Type 4 ~— ‘'TL™128 : Colored Transparent Lens FH q TLU124 : Colored Diffused Lens 4 i © Low Drive Current, High Intensity Light Emission. ——} Recommended Forward Current : Ip=5~10mA (DO) some Ea ¢ All Plastic Molded Lens, Provides an Excellent ON-OFF es acs 3 Contrast Ratio. + { ¢ Fast Response Time, Capable of Pulse Operation. es TLGI29A/TLGI24A TOSHIBA 4-481A Weight : 0.145 ‘TLUR123 /TLUR124 GaAtAs Lourizs/turiza | cap MAXIMUM RATINGS (Ta = 25°C) Forward | Reverse Power Operating n Storage PRODUCT NAME Current | Voltage | Dissipation | Tepperauire | Tenperature Irma) | VR | Po@W | n-Co) Tyg O) TLG128A/TLGI24A [2 [4 fof =20~75 [= 80~100 | [muvizsrmvies fs Pato 20-75 [30-100 | [morsrrois fs | to 20-75 | 20-100 | [musizsmsiza fs fa | to | 0-75 | 20100 | TLURLIS /TLURIZ [2 fs [6 =20~75 [= 80-100 | [aurizs/rumiza To aT oo = 20-75 [20-100 | © fork atari ate a nS eee ak ee Lon t ‘Giang tome foe rer gee, ce ‘anion which matncton ofthe f TOS rose TOSHIBA CORPORATION
SEMICONDUCTOR TH ai2a upanee TVS TOSHIBA TECHNICAL DATA ’ " ELECTRO-OPTICAL CHARACTERISTICS (Ta = 25°C) 123A 123 SERIES (Colored Teansparent Lens) on pronucrxamn | seucmoa | wiensin’ iy | vortnee yp Jeumnent Ip [uaa | was [a5 [v0 | 25 | 10 [wo [aus] aa [a] 5] 4 | [movies [ses [sa [0 [05 | 50 [0 [205 | a0 | a0 | a00 | | [rusia [ws [aos [a0 | as [as [205 | a0 | a0 [100 | | [munis | ean [a5 | a0 | so | 20 | oo [urs] a9 | a0 | 100 | a | [rurize | wo [i000 [os | as [io fais|aa [a] so] | Sa 124A 124 SERIES (Colored Lusterless Lens) an PRODUCT NAME SPECTRUM INTENSITY Iy | VOLTAGE Vg |CURRENT IR| [ares [ses [a5 [20[ 08 | 50 [a0 [ass aa ta] s [4] [movies | sas [oa [0 | oa | 40 [10 [205] 28 | 20 | 100 | «| [mois [eo [a5 [0 [ oa | 40 [0 [205 | a8 | 20 | 100 | + | [sie eas | ao [as [25 | 10 [as [20s] an | a0 | 100 | 4 | [munis ean [a5 0 | 80 | a0 | a furs | aa | a0 | 100 | 4 | [unis | ww [i000 [ea | 25 [io [ais] aa] a | 5 | 4 | ST 1. Soldering temperature : 260°C MAX. Soldering time : 3s MAX. (Soldering portion of lead: up to 2mm from the body of the device) 2. If the lead is formed, the lead should be formed at distance of 5mm from the body of the device. Foor n CORPORATION
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