TLRK1100C

TLRK1100C MARKTECH | Alldatasheet

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Technical content

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 1HOL-0206 Tentative TLRK1100C(T11), TLRMK1100C(T11), TLSK1100C(T11) TLOK1100C(T11), TLYK1100C(T11) ༷ஈ֊Ͱಛੑ಺༰ ͍க͠·͢ɻ ɾThis material is technological examination material to aim at the product introduction. The change in the content of the characteristic might be accompanied at the final specification process. The final specification will be able to be gotten in the brokerage department when the product is designed and to get the confirmation.

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 2HOL-0206 Tentative TOSHIBA LED Lamps TLRK1100C(T11), TLRMK1100C(T11), TLSK1100C(T11), TLOK1100C(T11), TLYK1100C(T11) Panel Circuit Indicator

• Surface-mount devices
• Flat-top type
• InGaAℓP LEDs
• High luminous intensity
• Low drive current, high-intensity light emission
• Colors: Red, Orange, Yellow
• Pb-free reflow soldering is possible
• Applications: automotive use, message signboards, backlighting etc.
• Standard embossed tape packing: T11 (2000/reel) 8-mm tape reel Color and Material Unit: mm JEDEC ― JEITA ― TOSHIBA 4-3R1 Weight: 0.035 g (typ.) Product Name Color Material TLRK1100C Red TLRMK1100C Red TLSK1100C Red TLOK1100C Orange TLYK1100C Yellow InGaAℓP Preliminary

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 3HOL-0206 Tentative Maximum Ratings (Ta = 25°C) Product Name Forward Current IF (mA) Please see Note 1 Reverse Voltage VR (V) Power Dissipation PD (mW) Operation Temperature Topr (°C) Storage Temperature Tstg (°C) TLRK1100C TLRMK1100C TLSK1100C TLOK1100C TLYK1100C 40 4 100 −40~100 − 40~100 Note 1: Forward current derating Electrical Characteristics (Ta = 25°C) Forward Voltage VF Reverse Current IR Product Name Min Typ. Max I F Max V R TLRK1100C 1.8 2.1 2.4 TLRMK1100C 1.8 2.1 2.4 TLSK1100C 1.8 2.1 2.4 TLOK1100C 1.8 2.1 2.4 TLYK1100C 1.9 2.2 2.5 20 10 4 Unit V mA µA V Allowable forward current I F (mA) Ambient temperature Ta (°C) ) IF – Ta 0 20 40 60 80 100 120

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 4HOL-0206 Tentative Optical Characteristics–1 (Ta = 25°C) Luminous Intensity IV Product Name Min Typ. Max I F Available Iv rank Please see Note 2 TLRK1100C 100 300 500 20 RA / SA / TA TLRMK1100C 160 400 800 20 SA / TA / UA TLSK1100C 250 500 1250 20 TA / UA / VA TLOK1100C 250 500 1250 20 TA / UA / VA TLYK1100C 160 400 800 20 SA / TA / UA Unit mcd mcd mcd mA mA Note 2: The specification on t he above table is used for Iv classification of LEDs in Toshiba facility. Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned. Luminous Intensity IV Rank Min Max RA 100 200 SA 160 320 TA 250 500 UA 400 800 VA 630 1250 Unit mcd mcd Optical Characteristics–2 (Ta = 25°C) Emission Spectrum Peak Emission Wavelength λp ∆λ Dominant Wavelength λdProduct Name Min Typ. Max Typ. Min Typ. Max IF TLRK1100C ⎯ 644 ⎯ 14 624 630 638 TLRMK1100C ⎯ 636 ⎯ 14 620 626 634 TLSK1100C ⎯ 623 ⎯ 14 607 613 621 TLOK1100C ⎯ 612 ⎯ 14 599 605 613 TLYK1100C ⎯ 592 ⎯ 13 583 590 595 Unit nm nm nm mA The cautions

• This product is designed as a general display light source usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application (ex. Light source for sensor, optical communication and etc) except general display light source.

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 5HOL-0206 Tentative TLRK1100C Relative luminous intensity Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminous intensity I V Wavelength λ (nm) Wavelength characteristic Ta = 25°C Radiation pattern 100 30° 60° 90° 90° 30° 60° 80° 70° 50° 40° 20° 10° 70° 80° 50° 40° 20° 10° 580 620 640 660 700 0.2 0.4 0.6 0.8 1.0 IF = 20 mA Ta = 25°C 600 680 Ta = 25°C 1000 1 50 500 300 100 3 5 10 30 100 0.1 −25 50 0.3 0.5 0 100 25 75 (typ.) (typ.) (typ.) (typ.) (typ.)

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 6HOL-0206 Tentative TLRMK1100C Relative luminous intensity Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminous intensity I V Wavelength λ (nm) Wavelength characteristic Ta = 25°C Radiation pattern 100 580 620 640 660 700 0.2 0.4 0.6 0.8 1.0 IF = 20 mA Ta = 25°C 600 680 30° 60° 90° 90° 30° 60° 80° 70° 50° 40° 20° 10° 70° 80° 50° 40° 20° 10° Ta = 25°C 1000 1 50 500 300 100 3 5 10 30 100 0.1 −25 50 0.3 0.5 0 100 25 75 (typ.) (typ.) (typ.) (typ.) (typ.)

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 7HOL-0206 Tentative TLSK1100C IF – VF Relative luminous intensity Forward voltage V F (V) Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminous intensity I V Wavelength λ (nm) Wavelength characteristic Ta = 25°C Radiation pattern 100 560 600 620 640 680 0.2 0.4 0.6 0.8 1.0 IF = 20 mA Ta = 25°C 580 660 30° 60° 90° 90° 30° 60° 80° 70° 50° 40° 20° 10° 70° 80° 50° 40° 20° 10° Ta = 25°C 1000 1 50 500 300 100 3 5 10 30 100 0.1 −25 50 0.3 0.5 0 100 25 75 (typ.) (typ.) (typ.) (typ.) (typ.)

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 8HOL-0206 Tentative TLOK1100C Relative luminous intensity Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminous intensity I V Wavelength λ (nm) Wavelength characteristic Ta = 25°C Radiation pattern 100 540 580 600 620 660 0.2 0.4 0.6 0.8 1.0 IF = 20 mA Ta = 25°C 560 640 30° 60° 90° 90° 30° 60° 80° 70° 50° 40° 20° 10° 70° 80° 50° 40° 20° 10° Ta = 25°C 1000 1 50 500 300 100 3 5 10 30 100 0.1 −25 50 0.3 0.5 0 100 25 75 (typ.) (typ.) (typ.) (typ.) (typ.)

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 9HOL-0206 Tentative TLYK1100C IF – VF Relative luminous intensity Forward voltage V F (V) Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminous intensity I V Wavelength λ (nm) Wavelength characteristic 540 580 600 620 660 0.2 0.4 0.6 0.8 1.0 IF = 20 mA Ta = 25°C 560 640 Ta = 25°C Radiation pattern 100 30° 60° 90° 90° 30° 60° 80° 70° 50° 40° 20° 10° 70° 80° 50° 40° 20° 10° Ta = 25°C 1000 1 50 500 300 100 3 5 10 30 100 0.1 −25 50 0.3 0.5 0 100 25 75 (typ.) (typ.) (typ.) (typ.) (typ.)

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 10HOL-0206 Tentative Packaging These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. This moisture proof bag may be stored unopene d within 12 months at the following conditions. Temperature: 5°C~30°C Humidity: 90% (max) 2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5°C to 30°C/60% RH or below. 3. If upon opening, the moisture in dicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60±5°C, for 12 to 24 hours. Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed. 4. Repeated baking can cause the pee ling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of laminate would be broken , the hermeticity would deteriorate. Therefore, do not throw or drop the packed devices. Mounting Method Soldering

• Reflow soldering (example)
• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package.
• Second reflow soldering In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
• Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron : 25 W Temperature : 300 °C or less Time : within 3 s
• If the products need to be performe d by other soldering method (ex. wave soldering), please contact Toshiba sales representative. Recommended soldering pattern 1.65 1.15 2.41 Unit: mm 1.65 60~120 s 10 s max 240°C max 4°C/s max 140~160°C 4°C/s max Time (s) Package surface temperature ( °C) Temperature profile for Pb soldering (example) Time (s) Package surface temperature ( °C) Temperature profile for Pb-free soldering (example) 150~180°C 4°C/s max 5 s max 260°C max 4°C/s max 230°C 60~120 s (*) (*) (*) (*) (*) (*) (*) (*) max(*) max(*) max(*) 30~50s max(*) max(*)

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 11HOL-0206 Tentative Cleaning When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition, using condition and etc. ASAHI CLEAN AK-225AES : (made by ASAHI GLASS) KAO CLEAN TROUGH 750H : (made by KAO) PINE ALPHA ST-100S : (made by ARAKAWA CHEMICAL) TOSHIBA TECHNOCARE : (made by GE TOSHIBA SILICONES) (FRW-17, FRW-1, FRV-100) Precautions when Mounting Do not apply force to the plastic part of the LED under high-temperature conditions. To avoid damaging the LED plastic, do not apply friction using a hard material. When installing the PCB in a product, ensure that the device does not come into contact with other cmponents. Tape Specifications 1. Product number format The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard Toshiba specifications) (1) Tape Type: T11 (4-mm pitch) (2) Example 2. Tape dimensions Unit: mm Symbol Dimension Tolerance Symbol Dimension Tolerance t 0.3 ±0.05 A 0 2.9 ±0.1 F 3.5 ±0.05 B 0 3.7 ±0.1 D1 1.5 ±0.1 K 0 2.3 ±0.1 TLYK1100C (T11) Tape type Toshiba product No. P D1 F E W Polarity t D

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 12HOL-0206 Tentative 3. Reel dimensions Unit: mm 4. Leader and trailer sections of tape Note1: Empty trailer section Note2: Empty leader section 9 ± 0.3 180 +0 φ60 φ13 11.4 ± 1.0 2 ± 0.5φ44 (Note 1) Leading part: 190 mm (min) 40 mm or more (Note 2) 40 mm or more

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 13HOL-0206 Tentative 5. Packing form (1) Packing quantity Reel 2,000 pcs Carton 10,000 pcs (2) Packing form: Each reel is sealed in an aluminum pack with silica gel. 6. Label format (1) Example: TLYK1100C (T11) P / N : TOSHIBA TYPE TLYK1100C ADDC (T11) Q’TY 2,000 pcs Lot Number Key code for TSB 32C 2000 (RANK SYMBOL) Use under 5-30degC/60%RH within 168h SEAL DATE: [[G]]/RoHS COMPATIBLE DIFFUSED IN ***** *Y3804xxxxxxxxxxxxxxxxx* ASSEMBLED IN ***** (2) Label location Tape feel direction Label position Label position

• Reel • Carton
• The aluminum package in which the reel is supplied also has the label attached to center of one side.

TL(RK,RMK,SK,OK,YK)1100C(T11) 2007-04-19 14HOL-0206 Tentative

• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality an d reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inhe rent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within s pecified operating ranges as set forth in the most recent TOSHIBA products specific ations. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semicon ductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.
• The TOSHIBA products listed in this document are inte nded for usage in general electronics applications (computer, personal equipment, office equipment, measuri ng equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunc tion or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control in struments, airplane or spaceship instruments, transportation instruments, traffic signa l instruments, combusti on control instruments, medical instruments, all types of safety devices, et c. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any down stream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically.
• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. RESTRICTIONS ON PRODUCT USE