TLR341G_16 ROHM | Alldatasheet
Document overview
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Technical content
Features
Low Operating Supply Voltage Output Full Swing / Input Ground Sense High Large Signal Voltage Gain Low Input Bias Current Low Supply Current Low Input Offset Voltage
Applications
Consumer Electronics Buffer Sensor Amplifier Mobile Equipment Battery-Operated Equipment Key Specifications Operating Supply Voltage (Single Supply): +1.8V to +5.5V Supply Current: TLR341G 75uA (Typ) TLR342xxx 150uA (Typ) TLR344xxx 300uA (Typ) Voltage Gain (RL=2kΩ): 105dB (Typ) Temperature Range: -40°C to +85°C Input Offset Voltage: 4mV (Max) Input Bias Current: 1pA (Typ) Gain Bandwidth: 2.3MHz (Typ) Slew Rate: 1.2V/µs (Typ) Turn-on Time from Shutdown: 1.2µs (Typ) Packages W(Typ) x D(Typ) x H(Max) SSOP6 2.90mm x 2.80mm x 1.25mm SOP8 5.00mm x 6.20mm x 1.71mm SOP-J8 4.90mm x 6.00mm x 1.65mm TSSOP-B8 3.00mm x 6.40mm x 1.20mm TSSOP-B8J 3.00mm x 4.90mm x 1.10mm SOP14 8.70mm x 6.20mm x 1.71mm SOP-J14 8.65mm x 6.00mm x 1.65mm TSSOP-B14J 5.00mm x 6.40mm x 1.20mm Pin Configuration TLR341G : SSOP6 Pin No. Pin Name 1 +IN
2 VSS
4 OUT
5 SHDN
6 VDD
Note: Please refer to Electrical Characteristics regarding to Shutdown Voltage Range. ○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays. 3 4 1 5 OUT +IN -IN VSS VDD 3 4 1 6 OUT +IN -IN VSS VDD
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Pin Configuration – continued TLR342F : SOP8 TLR342FJ : SOP-J8 TLR342FVT : TSSOP-B8 TLR342FVJ : TSSOP-B8J TLR344F : SOP14 TLR344FJ : SOP-J14 TLR344FVJ : TSSOP-B14J Pin No. Pin Name
1 OUT1
4 VSS
7 OUT2
8 VDD
Pin No. Pin Name
4 VDD
8 OUT3
11 VSS
14 OUT4
- + CH4 - + CH3 CH2 - + - + OUT4 OUT3 -IN4 +IN4 VSS +IN3 -IN3 OUT1 OUT2 -IN1 +IN1 +IN2 -IN2 OUT2 VSS VDD OUT1 -IN1 +IN1 +IN2 -IN2 CH2 - + CH1 - +
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Absolute Maximum Ratings (TA=25°C) Parameter Symbol Rating Unit TLR341G TLR342xxx TLR344xxx Supply Voltage VDD-VSS +7 V Power Dissipation PD SSOP6 0.67(Note 1,9) - - W SOP8 - 0.68(Note 2,9) - SOP-J8 - 0.67(Note 3,9) - TSSOP-B8 - 0.62(Note 4,9) - TSSOP-B8J - 0.58(Note 5,9) - SOP14 - - 0.56(Note 6,9) SOP-J14 - - 1.02(Note 7,9) TSSOP-B14J - - 0.84(Note 8,9) Differential Input Voltage(Note 10) VID VDD - VSS V Input Common-mode Voltage Range VICM (VSS-0.3) to (VDD+0.3) V Input Current (Note 11) II ±10 mA Operating Voltage Vopr +1.8 to +5.5 V Operating Temperature Topr -40 to +85 °C Storage Temperature Tstg -55 to +150 °C Maximum Junction Temperature Tjmax +150 °C (Note 1) Power dissipation is reduced by 5.4mW/°C above TA=25C. (Note 2) Power dissipation is reduced by 5.5mW/°C above TA=25C. (Note 3) Power dissipation is reduced by 5.4mW/°C above TA=25C. (Note 4) Power dissipation is reduced by 5.0mW/°C above TA=25C. (Note 5) Power dissipation is reduced by 4.7mW/°C above TA=25C. (Note 6) Power dissipation is reduced by 4.5mW/°C above TA=25C. (Note 7) Power dissipation is reduced by 8.2mW/°C above TA=25C. (Note 8) Power dissipation is reduced by 6.8mW/°C above TA=25C. (Note 9) Mounted on a FR4 glass epoxy PCB (70mm×70mm×1.6mm). (Note 10) Differential Input Voltage is the voltage difference between the inverting and non-inverting inputs. The input pin voltage is set to more than VSS. (Note 11) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The da mage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.
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Electrical Characteristics
○TLR341G (Unless otherwise specified VDD=+1.8V, VSS=0V, VSHDN =VDD) Parameter Symbol Temperature Range Limits Unit Conditions Min Typ Max Input Offset Voltage(Note 12,13) VIO 25°C - 0.3 4 mV - Full Range - - 4.5 Input Offset Voltage Drift(Note 12,13) ΔVIO/ΔT Full Range - 1.9 - μV/°C - Input Bias Current(Note 12) IB 25°C - 1 200 pA - Input Offset Current(Note 12) IIO 25°C - 1 200 pA - Supply Current(Note 13) IDD 25°C - 70 150 μA - Full Range - - 200 Shutdown Current IDD_SD 25°C - 0.2 1000 nA Common-mode Rejection Ratio CMRR 25°C 65 90 - dB VICM=0V to 0.7V Power Supply Rejection Ratio PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V Input Common-mode Voltage Range VICM 25°C 0 - 0.8 V CMRR ≥ 60 dB Large Signal Voltage Gain Av 25°C 70 110 - dB RL=10kΩ, VRL=0.9V 65 100 - RL=2kΩ, VRL=0.9V Maximum Output Voltage(High) VOH 25°C VDD-0.05 VDD-0.03 - V RL=2kΩ, VRL=0.9V VDD-0.02 VDD-0.01 - RL=10kΩ, VRL=0.9V Maximum Output Voltage(Low) VOL 25°C - 0.022 0.055 V RL=2kΩ, VRL=0.9V - 0.014 0.02 RL=10kΩ, VRL=0.9V Output Source Current(Note 14) ISOURCE 25°C 6 8 - mA VOUT=0V, Short Current Output Sink Current(Note 14) ISINK 25°C 10 13 - mA VOUT=1.8V, Short Current Slew Rate SR 25°C - 1.2 - V/μs RL=10kΩ, V+IN=0.7VP-P Gain Bandwidth GBW 25°C - 2.2 - MHz CL=200pF, RL=100kΩ Unity Gain Frequency fT 25°C - 1.2 - MHz CL=200pF, RL=100kΩ Phase Margin θM 25°C - 55 - deg CL=20pF, RL=100kΩ Gain Margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input Referred Noise Voltage VN 25°C - 33 - HznV/ f=1kHz Total Harmonic Distortion + Noise THD+N 25°C - 0.012 - % f=1kHz, RL=600Ω AV=0dB, DIN-AUDIO Turn-on Time from Shutdown tON 25°C - 1.8 - μs - Shutdown Voltage Range VSHDN_H 25°C 1.5 - 1.8 V (Note 15) VSHDN_L 0 - 0.5 V (Note 16) (Note 12) Absolute value (Note 13) Full Range: TA=-40°C to +85°C (Note 14) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. (Note 15) This voltage range means active condition. (Note 16) This voltage range means shutdown condition. VSHDN =0V
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Electrical Characteristics – continued ○TLR341G (Unless otherwise specified VDD=+5V, VSS=0V, VSHDN =VDD) Parameter Symbol Temperature Range Limits Unit Conditions Min Typ Max Input Offset Voltage(Note 17,18) VIO 25°C - 0.3 4 mV - Full Range - - 4.5 Input Offset Voltage Drift(Note 17,18) ΔVIO/ΔT Full Range - 1.9 - μV/°C - Input Bias Current(Note 17) IB 25°C - 1 200 pA - Input Offset Current(Note 17) IIO 25°C - 1 200 pA - Supply Current(Note 18) IDD 25°C - 75 150 μA - Full Range - - 200 Shutdown Current IDD_SD 25°C - 0.2 1000 nA Common-mode Rejection Ratio CMRR 25°C 75 90 - dB VICM=0V to 3.9V Power Supply Rejection Ratio PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V Input Common-mode Voltage Range VICM 25°C 0 - 4.0 V CMRR ≥70 dB Large Signal Voltage Gain Av 25°C 80 110 - dB RL=10kΩ, VRL=2.5V 75 105 - RL=2kΩ, VRL=2.5V Maximum Output Voltage(High) VOH 25°C VDD-0.06 VDD-0.03 - V RL=2kΩ, VRL=2.5V VDD-0.02 VDD-0.01 - RL=10kΩ, VRL=2.5V Maximum Output Voltage(Low) VOL 25°C - 0.04 0.06 V RL=2kΩ, VRL=2.5V - 0.02 0.03 RL=10kΩ, VRL=2.5V Output Source Current(Note 19) ISOURCE 25°C 60 100 - mA VOUT=0V, Short Current Output Sink Current(Note 19) ISINK 25°C 80 120 - mA VOUT=5V, Short Current Slew Rate SR 25°C - 1.2 - V/μs RL=10kΩ, V+IN=2VP-P Gain Bandwidth GBW 25°C - 2.3 - MHz CL=200pF, RL=100kΩ Unity Gain Frequency fT 25°C - 1.3 - MHz CL=200pF, RL=100kΩ Phase Margin θM 25°C - 55 - deg CL=20pF, RL=100kΩ Gain Margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input Referred Noise Voltage VN 25°C - 33 - HznV/ f=1kHz Total Harmonic Distortion + Noise THD+N 25°C - 0.012 - % V+IN=1VP-P, f=1kHz RL=600Ω, AV=0dB, DIN-AUDIO Turn-on Time from Shutdown tON 25°C - 1.2 - μs - Shutdown Voltage Range VSHDN_H 25°C 4.5 - 5.0 V (Note 20) VSHDN_L 0 - 0.8 V (Note 21) (Note 17) Absolute value (Note 18) Full Range: TA=-40°C to +85°C (Note 19) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the r ise in IC temperature caused by the heat generated inside the IC. (Note 20) This voltage range means active condition. (Note 21) This voltage range means shutdown condition. VSHDN =0V
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Electrical Characteristics – continued ○TLR342xxx (Unless otherwise specified VDD=+1.8V, VSS=0V) Parameter Symbol Temperature Range Limit Unit Conditions Min Typ Max Input Offset Voltage(Note 22,23) VIO 25°C - 0.3 4 mV - Full Range - - 4.5 Input Offset Voltage Drift (Note22,23) ΔVIO/ΔT Full Range - 1.9 - μV/°C - Input Bias Current(Note 22) IB 25°C - 1 200 pA - Input Offset Current(Note 22) IIO 25°C - 1 200 pA - Supply Current(Note 23) IDD 25°C - 150 300 μA - Full Range - - 400 Common-mode Rejection Ratio CMRR 25°C 65 90 - dB VICM=0V to 0.7V Power Supply Rejection Ratio PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V Input Common-mode Voltage Range VICM 25°C 0 - 0.8 V CMRR ≥ 60 dB Large Signal Voltage Gain Av 25°C 70 110 - dB RL=10kΩ, VRL=0.9V 65 100 - RL=2kΩ, VRL=0.9V Maximum Output Voltage(High) VOH 25°C VDD-0.05 VDD-0.03 - V RL=2kΩ, VRL=0.9V VDD-0.02 VDD-0.01 - RL=10kΩ, VRL=0.9V Maximum Output Voltage(Low) VOL 25°C - 0.022 0.055 V RL=2kΩ, VRL=0.9V - 0.014 0.02 RL=10kΩ, VRL=0.9V Output Source Current(Note 24) ISOURCE 25°C 6 8 - mA VOUT=0V, Short Current Output Sink Current(Note 24) ISINK 25°C 10 13 - mA VOUT=1.8V, Short Current Slew Rate SR 25°C - 1.2 - V/μs RL=10kΩ, V+IN=0.7VP-P Gain Bandwidth GBW 25°C - 2.2 - MHz CL=200pF, RL=100kΩ Unity Gain Frequency fT 25°C - 1.2 - MHz CL=200pF, RL=100kΩ Phase Margin θM 25°C - 55 - deg CL=20pF, RL=100kΩ Gain Margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input Referred Noise Voltage VN 25°C - 33 - HznV/ f=1kHz Total Harmonic Distortion + Noise THD+N 25°C - 0.012 - % f=1kHz, RL=600Ω AV=0dB, DIN-AUDIO Channel Separation CS 25°C - 110 - dB AV=40dB, VOUT=1Vrms (Note 22) Absolute value (Note 23) Full Range: TA=-40°C to +85°C (Note 24) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Electrical Characteristics – continued ○TLR342xxx (Unless otherwise specified VDD=+5V, VSS=0V) Parameter Symbol Temperature Range Limit Unit Conditions Min Typ Max Input Offset Voltage(Note 25,26) VIO 25°C - 0.3 4 mV - Full Range - - 4.5 Input Offset Voltage Drift(Note 25,26) ΔVIO/ΔT Full Range - 1.9 - μV/°C - Input Bias Current(Note 25) IB 25°C - 1 200 pA - Input Offset Current(Note 25) IIO 25°C - 1 200 pA - Supply Current(Note 26) IDD 25°C - 150 300 μA - Full Range - - 400 Common-mode Rejection Ratio CMRR 25°C 75 90 - dB VICM=0V to 3.9V Power Supply Rejection Ratio PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V Input Common-mode Voltage Range VICM 25°C 0 - 4.0 V CMRR ≥70 dB Large Signal Voltage Gain Av 25°C 80 110 - dB RL=10kΩ, VRL=2.5V 75 105 - RL=2kΩ, VRL=2.5V Maximum Output Voltage(High) VOH 25°C VDD-0.06 VDD-0.03 - V RL=2kΩ, VRL=2.5V VDD-0.02 VDD-0.01 - RL=10kΩ, VRL=2.5V Maximum Output Voltage(Low) VOL 25°C - 0.04 0.06 V RL=2kΩ, VRL=2.5V - 0.02 0.03 RL=10kΩ, VRL=2.5V Output Source Current(Note 27) ISOURCE 25°C 60 100 - mA VOUT=0V, Short Current Output Sink Current(Note 27) ISINK 25°C 80 120 - mA VOUT=5V, Short Current Slew Rate SR 25°C - 1.2 - V/μs RL=10kΩ, V+IN=2VP-P Gain Bandwidth GBW 25°C - 2.3 - MHz CL=200pF, RL=100kΩ Unity Gain Frequency fT 25°C - 1.3 - MHz CL=200pF, RL=100kΩ Phase Margin θM 25°C - 55 - deg CL=20pF, RL=100kΩ Gain Margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input Referred Noise Voltage VN 25°C - 33 - HznV/ f=1kHz Total Harmonic Distortion + Noise THD+N 25°C - 0.012 - % V+IN=1VP-P, f=1kHz RL=600Ω, AV=0dB, DIN-AUDIO Channel Separation CS 25°C - 110 - dB AV=40dB, VOUT=1Vrms (Note 25) Absolute value (Note 26) Full Range: TA=-40°C to +85°C (Note 27) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Electrical Characteristics – continued ○TLR344xxx (Unless otherwise specified VDD=+1.8V, VSS=0V) Parameter Symbol Temperature Range Limit Unit Conditions Min Typ Max Input Offset Voltage(Note 28,29) VIO 25°C - 0.3 4 mV - Full Range - - 4.5 Input Offset Voltage Drift(Note 28,29) ΔVIO/ΔT Full Range - 1.9 - μV/°C - Input Bias Current(Note 28) IB 25°C - 1 200 pA - Input Offset Current(Note 28) IIO 25°C - 1 200 pA - Supply Current(Note 29) IDD 25°C - 280 600 μA - Full Range - - 800 Common-mode Rejection Ratio CMRR 25°C 65 90 - dB VICM=0V to 0.7V Power Supply Rejection Ratio PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V Input Common-mode Voltage Range VICM 25°C 0 - 0.8 V CMRR ≥ 60 dB Large Signal Voltage Gain Av 25°C 70 110 - dB RL=10kΩ, VRL=0.9V 65 100 - RL=2kΩ, VRL=0.9V Maximum Output Voltage(High) VOH 25°C VDD-0.05 VDD-0.03 - V RL=2kΩ, VRL=0.9V VDD-0.02 VDD-0.01 - RL=10kΩ, VRL=0.9V Maximum Output Voltage(Low) VOL 25°C - 0.022 0.055 V RL=2kΩ, VRL=0.9V - 0.014 0.02 RL=10kΩ, VRL=0.9V Output Source Current(Note 30) ISOURCE 25°C 6 8 - mA VOUT=0V, Short Current Output Sink Current(Note 30) ISINK 25°C 10 13 - mA VOUT=1.8V, Short Current Slew Rate SR 25°C - 1.2 - V/μs RL=10kΩ, V+IN=0.7VP-P Gain Bandwidth GBW 25°C - 2.2 - MHz CL=200pF, RL=100kΩ Unity Gain Frequency fT 25°C - 1.2 - MHz CL=200pF, RL=100kΩ Phase Margin θM 25°C - 55 - deg CL=20pF, RL=100kΩ Gain Margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input Referred Noise Voltage VN 25°C - 33 - HznV/ f=1kHz Total Harmonic Distortion + Noise THD+N 25°C - 0.012 - % f=1kHz, RL=600Ω AV=0dB, DIN-AUDIO Channel Separation CS 25°C - 110 - dB AV=40dB, VOUT=1Vrms (Note 28) Absolute value (Note 29) Full Range: TA=-40°C to +85°C (Note 30) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Electrical Characteristics – continued ○TLR344xxx (Unless otherwise specified VDD=+5V, VSS=0V) Parameter Symbol Temperature Range Limit Unit Conditions Min Typ Max Input Offset Voltage(Note 31,32) VIO 25°C - 0.3 4 mV - Full Range - - 4.5 Input Offset Voltage Drift(Note 31,32) ΔVIO/ΔT Full Range - 1.9 - μV/°C - Input Bias Current(Note 31) IB 25°C - 1 200 pA - Input Offset Current(Note 31) IIO 25°C - 1 200 pA - Supply Current(Note 32) IDD 25°C - 300 600 μA - Full Range - - 800 Common-mode Rejection Ratio CMRR 25°C 75 90 - dB VICM=0V to 3.9V Power Supply Rejection Ratio PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V Input Common-mode Voltage Range VICM 25°C 0 - 4.0 V CMRR ≥70 dB Large Signal Voltage Gain Av 25°C 80 110 - dB RL=10kΩ, VRL=2.5V 75 105 - RL=2kΩ, VRL=2.5V Maximum Output Voltage(High) VOH 25°C VDD-0.06 VDD-0.03 - V RL=2kΩ, VRL=2.5V VDD-0.02 VDD-0.01 - RL=10kΩ, VRL=2.5V Maximum Output Voltage(Low) VOL 25°C - 0.04 0.06 V RL=2kΩ, VRL=2.5V - 0.02 0.03 RL=10kΩ, VRL=2.5V Output Source Current(Note 33) ISOURCE 25°C 60 100 - mA VOUT=0V, Short Current Output Sink Current(Note 33) ISINK 25°C 80 120 - mA VOUT=5V, Short Current Slew Rate SR 25°C - 1.2 - V/μs RL=10kΩ, V+IN=2VP-P Gain Bandwidth GBW 25°C - 2.3 - MHz CL=200pF, RL=100kΩ Unity Gain Frequency fT 25°C - 1.3 - MHz CL=200pF, RL=100kΩ Phase Margin θM 25°C - 55 - deg CL=20pF, RL=100kΩ Gain Margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input Referred Noise Voltage VN 25°C - 33 - HznV/ f=1kHz Total Harmonic Distortion + Noise THD+N 25°C - 0.012 - % V+IN=1VP-P, f=1kHz RL=600Ω, AV=0dB, DIN-AUDIO Channel Separation CS 25°C - 110 - dB AV=40dB, VOUT=1Vrms (Note 31) Absolute value (Note 32) Full Range: TA=-40°C to +85°C (Note 33) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute Maximum Ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the VDD pin and VSS pin without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between non-inverting and inverting pins without damaging the IC. (3) Input Common-mode Voltage Range (VICM) Indicates the maximum voltage that can be applied to the non -inverting and inverting pins without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Power Dissipation (PD) Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C (normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical Characteristics (1) Input Offset Voltage (VIO) Indicates the voltage difference between non -inverting pin and inverting pins. It can be translated into the inp ut voltage difference required for setting the output voltage at 0V. (2) Input Offset Voltage drift (VIO/T) Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation. (3) Input Offset Current (IIO) Indicates the difference of input bias current between the non-inverting and inverting pins. (4) Input Bias Current (IB) Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the non-inverting and inverting pins. (5) Supply Current (IDD) Indicates the current that flows within the IC under specified no-load conditions. (6) Shutdown current (IDD_SD) Indicates the current when the circuit is shutdown. (7) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL) Indicates the voltage range of the output under specified load condition. It is typically divi ded into maximum output voltage high and low. Maximum o utput voltage high indicates the upper limit of output voltage. Maximum o utput voltage low indicates the lower limit. (8) Large Signal Voltage Gain (AV) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non -inverting pin and inverting pin. It is normally the amplifying rate (gain) with reference to DC voltage. AV = (Output Voltage) / (Differential Input Voltage) (9) Input Common-mode Voltage Range (VICM) Indicates the input voltage range where IC normally operates. (10) Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common-mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input Common-mode voltage)/(Input offset fluctuation) (11) Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR = (Change of power supply voltage)/(Input offset fluctuation) (12) Output Source Current/ Output Sink Current (ISOURCE / ISINK) The maximum current that can be output from the IC under specific output conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. (13) Slew Rate (SR) Indicates the ratio of the change in output voltage with time when a step input signal is applied. (14) Unity Gain Frequency (fT) Indicates a frequency where the voltage gain of operational amplifier is 1. (15) Gain Bandwidth (GBW) The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Description of Electrical Characteristics - continued (16) Phase Margin (θM) Indicates the margin of phase from 180 degree phase lag at unity gain frequency. (17) Gain Margin (GM) Indicates the difference between 0dB and the gain where operational amplifier has 180 degree phase delay. (18) Input Referred Noise Voltage (VN) Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input pin. (19) Total Harmonic Distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. (20) Channel Separation (CS) Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. (21) Turn On Time From Shutdown (tON) Indicates the time from applying the voltage to shutdown terminal until the IC is active. (22) Turn On Voltage / Turn Off Voltage (VSHDN_H/ VSHDN_L) The IC is active if the shutdown terminal is applied more than Turn On Voltage (VSHDN_H). The IC is shutdown if the shutdown terminal is applied less than Turn Off Voltage (VSHDN_L).
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Application Information
NULL method condition for Test Circuit 1 VDD, VSS, EK, VICM Unit:V Parameter VF SW1 SW2 SW3 VDD VSS EK VICM Calculation Input Offset Voltage VF1 ON ON OFF 5 0 -2.5 2.5 1 Large Signal Voltage Gain VF2 ON ON ON 5 0 -0.5 2.5 2 VF3 -3.5 Common-mode Rejection Ratio (Input Common-mode Voltage Range) VF4 ON ON OFF 5 0 -2.5 VF5 3 Power Supply Rejection Ratio VF6 ON ON OFF 1.8 0 -0.9 0.5 4 VF7 5 － Calculation－ 1. Input Offset Voltage (VIO) 2. Large Signal Voltage Gain (AV) 3. Common-mode Rejection Ratio (CMRR) 4. Power Supply Rejection Ratio (PSRR) Figure 73. Test Circuit 1
potential within the in-phase input voltage range (VICM). mode input voltage range of the electric characteristics.
- Power Supply(single/dual)
operational amplifiers can be used as dual supply operational amplifiers as well. smaller than 0.1µF between output pin and VSS pin.
- Oscillation by Output Capacitor
protect the IC from abnormaly noise. either shutdown or active, or even oscillating between the two modes. Figure 78. Example of Application Circuit
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx I/O Equivalent Circuit Symbol Pin No. Equivalent Circuit TLR341G TLR342xxx TLR344xxx +IN 9,10,12,13 OUT 4 1,7 1,7,8,14 VDD 6 8 4 SHDN 5 - -
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 82(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (Tjmax), and power dissipation (PD). θJA = (Tjmax－TA) / PD °C/W The derating curve in Figure 82(b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary ev en when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 82 (c), (d), and (e) shows an example of the derating curve for TLR341G, TLR342xxx, and TLR344xxx, respectively. 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 Power Dissipation [W] Ambient Temperature [°C] 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 Power Dissipation [W] Ambient Temperature [°C] (d) TLR342xxx θJA=(Tjmax-TA)/ PD °C/W Ambient Temperature TA [ °C ] Chip Surface Temperature TJ [ °C ] (a) Thermal Resistance (b) Derating Curve Ambient Temperature TA [ °C ] Power Dissipation of LSI [W] PDmax θJA2 < θJA1 0 50 75 100 125 150 25 θJA2 θJA1 Tjmax Power Dissipation of IC TLR342FJ(Note 36) TLR342FVT(Note 37) TLR342FVJ(Note 38) TLR342F(Note 35) (c) TLR341G TLR341G (Note 34)
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx When using the unit above TA =25°C, subtract the value above per Celsius degree. Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3%) is mounted. (Note 34) (Note 35) (Note 36) (Note 37) (Note 38) (Note 39) (Note 40) (Note 41) Unit Figure 82.Thermal Resistance and Derating Curve 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 125 150 Power Dissipation [W] Ambient Temperature [°C] TLR344F(Note 39) (e) TLR344xxx TLR344FJ(Note 40) TLR344FVJ(Note 41)
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electroly tic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the applicatio n board to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded , the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the PD rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground , power supply and output pin . Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant e ffect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply volt age is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC.
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Physical Dimension, Tape and Reel Information
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Physical Dimension, Tape and Reel Information – continued (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 (Max 5.35 (include.BURR))
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Physical Dimension, Tape and Reel Information – continued Package Name SOP-J8
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Physical Dimension, Tape and Reel Information – continued Package Name TSSOP-B8
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Physical Dimension, Tape and Reel Information – continued Package Name TSSOP-B8J
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Physical Dimension, Tape and Reel Information – continued (UNIT : mm) PKG : SOP14 Drawing No. : EX113-5001 (Max 9.05 (include.BURR))
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Physical Dimension, Tape and Reel Information – continued Package Name SOP-J14
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Physical Dimension, Tape and Reel Information – continued Package Name TSSOP-B14J
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx
Ordering Information
G : SSOP6 F : SOP8 : SOP14 FJ : SOP-J8 : SOP-J14 FVT : TSSOP-B8 FVJ : TSSOP-B8J : TSSOP-B14J Packaging and forming specification TR: Embossed tape and reel (SSOP6) E2: Embossed tape and reel (SOP8, SOP-J8, TSSOP-B8, TSSOP-B8J, SOP14, SOP-J14, TSSOP-B14J) Line-up Topr Channels Package Orderable Part Number -40°C to +85°C 1ch SSOP6 Reel of 3000 TLR341G-TR 2ch SOP8 Reel of 2500 TLR342F-E2 SOP-J8 Reel of 2500 TLR342FJ-E2 TSSOP-B8 Reel of 2500 TLR342FVT-E2 TSSOP-B8J Reel of 2500 TLR342FVJ-E2 4ch SOP14 Reel of 2500 TLR344F-E2 SOP-J14 Reel of 2500 TLR344FJ-E2 TSSOP-B14J Reel of 2500 TLR344FVJ-E2
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx Marking Diagram Part Number Marking SSOP6(TOP VIEW) LOT Number 1PIN MARK SOP8(TOP VIEW) Part Number Marking LOT Number 1PIN MARK SOP-J8(TOP VIEW) Part Number Marking LOT Number 1PIN MARK TSSOP-B8(TOP VIEW) Part Number Marking LOT Number 1PIN MARK TSSOP-B8J(TOP VIEW) Part Number Marking LOT Number 1PIN MARK SOP14(TOP VIEW) Part Number Marking LOT Number 1PIN MARK SOP-J14(TOP VIEW) Part Number Marking LOT Number 1PIN MARK TSSOP-B14J (TOP VIEW) Part Number Marking LOT Number 1PIN MARK
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx 2.4 1.0 0.95 0.6 0.95 Marking Diagram – continued Land Pattern Data All dimensions in mm Package Land pitch e Land space MIE Land length ≧ℓ2 Land width SSOP6 0.95 2.4 1.0 0.6 SOP8 SOP14 1.27 4.60 1.10 0.76 SOP-J8 SOP-J14 1.27 3.9 1.35 0.76 TSSOP-B8 TSSOP-B14J 0.65 4.60 1.20 0.35 TSSOP-B8J 0.65 3.20 1.15 0.35 Product Name Package Type Marking TLR341 G SSOP6 BC TLR342 F SOP8 T342 FJ SOP-J8 T342 FVT TSSOP-B8 T342 FVJ TSSOP-B8J T342 TLR344 F SOP14 TLR344F FJ SOP-J14 TLR344FJ FVJ TSSOP-B14J T344 SOP8, SOP-J8, TSSOP-B8, TSSOP-B8J, SOP14, SOP-J14, TSSOP-B14J MIE b2 e SSOP6
www.rohm.com TSZ02201-0RAR0G200720-1-2 TSZ22111･15･001 TLR341G TLR342xxx TLR344xxx
Revision History
29.Aug.2014 001 New Release 19.Mar.2015 002 Add TLR342FJ, TLR342FVT, TLR342FVJ, TLR344F 14.Oct.2015 003 Add TLR344FJ and TLR344FVJ 03.Feb.2016 004 Add TLR341G
Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability ( such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( “Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail -safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below . Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions . If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no -clean type fluxes, cleanin g residue of flux is recommended); or Washing our Products by using water or water -soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on -board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady -state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation d epending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under devian t condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface -mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface -mount products , please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use . Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and stor age so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e .g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information an d data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatso ever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.
Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.
Minimum Package Quantity 3000 Packing Type Taping Constitution Materials List inquiry RoHS Yes TLR341G - Web Page