TLP2710 TOSHIBA | Alldatasheet
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Photocouplers GaAℓAs Infrared LED & Photo IC TLP2710TLP2710TLP2710TLP2710 Start of commercial production 2015-05 1. 1. 1. 1. ApplicationsApplicationsApplicationsApplications
- Programmable Logic Controllers (PLCs)
- Battery Management System (BMS)
- Industrial Inverters 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP2710 is a 5-Mbps low-power photocoupler in the small SO6L package. It is housed in a thin SO6L package of 2.3 mm (max). The TLP2710 has guaranteed the isolation voltage 5 kVrms and compliant with international safety standards for reinforced insulation. The TLP2710 consumes supply current (I DDL/IDDH) of only 0.3 mA maximum over the entire operating temperature range of -40 to 125 and operates at a supply voltage as low as 2.7 V, contributing to a reduction in power consumption of various systems. The input forward current can be less than 1 mA maximum, allowing direct drive by a microcontroller. The detector has a totem-pole output stage with current sourcing and sinking capabilities. The TLP2710 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of ±25 kV/µs. 3. 3. 3. 3. FeaturesFeaturesFeaturesFeatures (1) Package: SO6L (2) Data transfer rate: 5 MBd (typ.) (NRZ) (3) Supply current: 0.3 mA (max) (4) Threshold input current: 1.0 mA (max) (5) Supply voltage: 2.7 V to 5.5 V (6) Operating temperature: -40 to 125 (7) Propagation delay time: 250 ns (max) (8) Pulse width distortion: 30 ns (max) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN60747-5-5, EN60065, EN60950-1, EN 62368-1 (Note 1)(Note 1)(Note 1)(Note 1) Note 1: When a VDE approved type is needed, please designate the Option (D4)Option (D4)Option (D4)Option (D4). 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
- 4. 4. 4. Packaging (Note)Packaging (Note)Packaging (Note)Packaging (Note) TLP2710 11-4N1A TLP2710(LF4) 11-4N101A Note: Lead-formed product: (LF4) 5. 5. 5. 5. Pin AssignmentPin AssignmentPin AssignmentPin Assignment 1: Anode 2: N.C. 3: Cathode 4: GND 5: VO (Output) 6: VDD 6. 6. 6. 6. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4. 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
- 7. 7. 7. Principle of OperationPrinciple of OperationPrinciple of OperationPrinciple of Operation Input H L LED ON OFF Output H L Characteristics Creepage distances Clearance distances Internal isolation thickness Dimension (min) 8.0 8.0 0.4 Unit mm 8. 8. 8. 8. Absolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, Taaaa = 25 = 25 = 25 = 25 )))) LED Detector Common Characteristics Input forward current Input forward current (pulsed) Input forward current derating (pulsed) Peak transient input forward current Peak transient input forward current derating Input power dissipation Input power dissipation derating Input reverse voltage Output current Output voltage Supply voltage Output power dissipation Output power dissipation derating Operating temperature Storage temperature Lead soldering temperature Isolation voltage (Ta ≥ 110 ) (Ta ≥ 110 ) (Ta ≥ 110 ) (Ta ≥ 110 ) (10 s) Symbol IF IFP ∆IFP/∆Ta IFPT ∆IFPT/∆Ta PD ∆PD/∆Ta VR IO VO VDD PO ∆PO/∆Ta Topr Tstg Tsol BVS Note (Note 1) (Note 2) Rating -25 -0.5 -0.5 -40 to 125 -55 to 125 260 5000 Unit mA mA/ A mA/ mW mW/ V mA V mW mW/ Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) ≤ 1 µs, 300 pps Note 2: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
- 9. 9. 9. Recommended Operating Conditions (Note)Recommended Operating Conditions (Note)Recommended Operating Conditions (Note)Recommended Operating Conditions (Note) Characteristics Input on-state current Input off-state voltage Supply voltage Operating temperature Symbol IF(ON) VF(OFF) VDD Topr Note (Note 1) (Note 1) (Note 2) (Note 2) Min 2.7 -40 Typ. 3.3 / 5 Max 0.8 5.5 125 Unit mA V V Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. Note: A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a high- gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. Note 1: The rise and fall times of the input on-current should be less than 0.5 µs. Note 2: Denotes the operating range, not the recommended operating condition. 10. 10. 10. 10. Electrical Characteristics (Note)Electrical Characteristics (Note)Electrical Characteristics (Note)Electrical Characteristics (Note) Characteristics Input forward voltage Input forward voltage temperature coefficient Input reverse current Input capacitance Low-level output voltage High-level output voltage Low-level supply current High-level supply current Threshold input current (L/H) Symbol VF ∆VF/∆Ta IR Ct VOL VOH IDDL IDDH IFLH Test Circuit Fig. 13.1.1 Fig. 13.1.2 Fig. 13.1.3 Fig. 13.1.4 Test Condition IF = 2 mA IF = 2 mA, Ta = 25 IF = 2 mA VR = 5 V, Ta = 25 V = 0 V, f = 1 MHz, Ta = 25 IO = 20 µA, VF = 0.8 V IO = 3.2 mA, VF = 0.8 V IO = -20 µA, IF = 2 mA IO = -3.2 mA, IF = 2 mA IF = 0 mA IF = 2 mA IO = -3.2 mA, VO > VDD - 1 V Min 1.2 1.4 VDD - 0.1 VDD - 1.0 Typ. 1.53 -1.58 VDD - 0.01 VDD - 0.25 Max 1.9 1.7 0.1 0.4 0.3 0.3 1.0 Unit V mV/ µA pF V mA Note: All typical values are at VDD = 5 V, Ta = 25 , unless otherwise noted. 11. 11. 11. 11. Isolation Characteristics (Unless otherwise specified, TIsolation Characteristics (Unless otherwise specified, TIsolation Characteristics (Unless otherwise specified, TIsolation Characteristics (Unless otherwise specified, Taaaa = 25 = 25 = 25 = 25 )))) Characteristics Total capacitance (input to output) Isolation resistance Isolation voltage Symbol CS RS BVS Note (Note 1) (Note 1) (Note 1) Test Condition VS = 0 V, f = 1 MHz AC, 60 s Min 1 × 1012 5000 Typ. 0.8 1014 Max Unit pF Ω Vrms Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
- 12. 12. 12. Switching Characteristics (Note)Switching Characteristics (Note)Switching Characteristics (Note)Switching Characteristics (Note) Characteristics Propagation delay time (L/H) Propagation delay time (H/L) Pulse width distortion Propagation delay skew (device to device) Propagation delay time (L/H) Propagation delay time (H/L) Pulse width distortion Propagation delay skew (device to device) Propagation delay time (L/H) Propagation delay time (H/L) Pulse width distortion Propagation delay skew (device to device) Rise time Fall time Common-mode transient immunity at output high Common-mode transient immunity at output low Symbol tpLH tpHL |tpHL-tpLH| tpsk tpLH tpHL |tpHL-tpLH| tpsk tpLH tpHL |tpHL-tpLH| tpsk tr tf CMH CML Note (Note 1) (Note 1), (Note 2) (Note 1) (Note 1), (Note 2) (Note 1) (Note 1), (Note 2) (Note 1) Test Circuit Fig. 13.1.5 Fig. 13.1.6 Fig. 13.1.5 Fig. 13.1.7 Test Condition VIN = 3.3 V, RT = 820 Ω VIN = 5 V, RT = 1.6 kΩ IF = 2 mA, R = 100 Ω VIN = 0 → 3.3 V, RT = 820 Ω, VDD = 5 V VIN = 3.3 → 0 V, RT = 820 Ω, VDD = 5 V VIN = 3.3 V / 5 V, VDD = 3.3 V / 5 V, VCM = 1000 Vp-p, Ta = 25 Min -65 -65 -65 ±25 Typ. ±40 Max 250 250 250 250 250 250 Unit ns kV/µs Note: All typical values are at VDD = 5 V, Ta = 25 , unless otherwise noted. Note: Recommendation input resistance conditions VIN = 3.3 V : R1 = R2 = 430 Ω VIN = 5 V : R1 = R2 = 820 Ω Note 1: f = 250 kHz, duty = 50 %, input current tr = tf = 5 ns, CL is approximately 15 pF which includes probe and stray wiring capacitance. Note 2: The propagation delay skew, t psk, is equal to the magnitude of the worst-case difference in t pHL and/or tpLH that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc). 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
- 13. 13. 13. Test Circuits and Characteristics CurvesTest Circuits and Characteristics CurvesTest Circuits and Characteristics CurvesTest Circuits and Characteristics Curves 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
- 14. 14. 14. Soldering and StorageSoldering and StorageSoldering and StorageSoldering and Storage The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used.
- When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. An Example of a Temperature Profile When Lead(Pb)-free Solder Is UsedAn Example of a Temperature Profile When Lead(Pb)-free Solder Is UsedAn Example of a Temperature Profile When Lead(Pb)-free Solder Is UsedAn Example of a Temperature Profile When Lead(Pb)-free Solder Is Used
- When using soldering flow Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds. Mounting condition of 260 within 10 seconds is recommended. Flow soldering must be performed once.
- When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 Heating by soldering iron must be done only once per lead.
- Avoid storage locations where devices may be exposed to moisture or direct sunlight.
- Follow the precautions printed on the packing label of the device for transportation and storage.
- Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %, respectively.
- Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions.
- Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads.
- When restoring devices after removal from their packing, use anti-static containers.
- Do not allow loads to be applied directly to devices while they are in storage.
- If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
- 15. 15. 15. Land Pattern Dimensions (for reference only)Land Pattern Dimensions (for reference only)Land Pattern Dimensions (for reference only)Land Pattern Dimensions (for reference only) Unit: mm TLP2710 Lead Forming Option (standard)Lead Forming Option (standard)Lead Forming Option (standard)Lead Forming Option (standard) TLP2710(LF4) 16. 16. 16. 16. MarkingMarkingMarkingMarking 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
- 17. 17. 17. EN60747-5-5 Option (D4) SpecificationEN60747-5-5 Option (D4) SpecificationEN60747-5-5 Option (D4) SpecificationEN60747-5-5 Option (D4) Specification
- Part number: TLP2710 (Note 1)(Note 1)(Note 1)(Note 1)
- The following part naming conventions are used for the devices that have been qualified according to option (D4) of EN60747. Example: TLP2710(D4-TP,E D4: EN60747 option TP: Tape type E: [[G]]/RoHS COMPATIBLE (Note 2)(Note 2)(Note 2)(Note 2) Note 1: Use TOSHIBA standard type number for safety standard application. e.g., TLP2710(D4-TP,E → TLP2710 Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
Note: This photocoupler is suitable for safe electrical isolationsafe electrical isolationsafe electrical isolationsafe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747. 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
- 18. 18. 18. Specifications for Embossed-Tape PackingSpecifications for Embossed-Tape PackingSpecifications for Embossed-Tape PackingSpecifications for Embossed-Tape Packing Package Name SO6L / SO6L(LF4) Product Type Long creepage mini flat coupler Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification is as below. Example) TLP2710(TP,E Part number: TLP2710 Tape type: TP [[G]]/RoHS COMPATIBLE: E (Note 1)(Note 1)(Note 1)(Note 1) Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Tape Type TP / TP4 Division Packing Amount (A unit per reel) 1500 Device orientation in the carrier cavities as shown in the following figure. Orientation of Device in Relation to Direction of Tape MovementOrientation of Device in Relation to Direction of Tape MovementOrientation of Device in Relation to Direction of Tape MovementOrientation of Device in Relation to Direction of Tape Movement Characteristics Occurrences of 2 more successive empty cavities Single empty cavity Standard 0 device 6 devices (max) per reel Remarks Within any given 40-mm section of tape, not including leader and trailer Not including leader and trailer The start of the tape has 14 or more empty holes. The end of the tape has 34 or more empty holes and a cover tape of 30 mm or longer. 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
Tape material: Plastic (for protection against static electricity) Table Table Table Table Tape Dimensions (unit: mm, tolerance: Tape Dimensions (unit: mm, tolerance: Tape Dimensions (unit: mm, tolerance: Tape Dimensions (unit: mm, tolerance: ±±±±0.1)0.1)0.1)0.1) Symbol A B D E F G K Dimension (standard) 10.4 4.24 7.5 1.75 12.0 4.0 2.7 2.4 Dimension (LF4) 11.55 4.24 7.5 1.75 16.0 4.0 2.8 2.4 Remark Center line of embossed cavity and sprocket hole Distance between tape edge and sprocket hole center Cumulative error +0.1/-0.3 per 10 empty cavities holes Cumulative error +0.1/-0.3 per 10 sprocket holes Internal space 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
Material: Plastic (for protection against static electricity) Table Table Table Table Reel Dimensions (unit: mm)Reel Dimensions (unit: mm)Reel Dimensions (unit: mm)Reel Dimensions (unit: mm) Symbol A B C E U Dimension φ330 ± 2.0 φ100 ± 1.0 φ13 ± 0.5 2.0 ± 0.5 4.0 ± 0.5 17.4 ± 1.0 21.4 ± 1.0 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
1 reel/carton (unit: mm)1 reel/carton (unit: mm)1 reel/carton (unit: mm)1 reel/carton (unit: mm) Note: Taping reel diameter: φ330 mm (1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc. (2) Reel: The label provides the part number, the taping name, quantity, lot number, etc. 19. 19. 19. 19. Ordering Information (Example of Item Name)Ordering Information (Example of Item Name)Ordering Information (Example of Item Name)Ordering Information (Example of Item Name) Item Name TLP2710(E TLP2710(TP,E TLP2710(D4,E TLP2710(D4-TP,E TLP2710(LF4,E TLP2710(TP4,E TLP2710(D4-LF4,E TLP2710(D4-TP4,E Packaging LF4, Wide forming LF4, Wide forming LF4, Wide forming LF4, Wide forming VDE Option EN60747-5-5 EN60747-5-5 EN60747-5-5 EN60747-5-5 Packing (MOQ) Magazine (125 pcs) Tape and reel (1500 pcs) Magazine (125 pcs) Tape and reel (1500 pcs) Magazine (125 pcs) Tape and reel (1500 pcs) Magazine (125 pcs) Tape and reel (1500 pcs) 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
Package DimensionsPackage DimensionsPackage DimensionsPackage Dimensions Unit: mm TLP2710 Weight: 0.126 g (typ.) Package Name(s) TOSHIBA: 11-4N1A 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
Package DimensionsPackage DimensionsPackage DimensionsPackage Dimensions Unit: mm TLP2710(LF4) Weight: 0.126 g (typ.) Package Name(s) TOSHIBA: 11-4N101A 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation
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- Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 2018-03-09 Rev.6.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation