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TLP241A,TLP241AF Photocouplers Photorelay TLP241A,TLP241AFTLP241A,TLP241AFTLP241A,TLP241AFTLP241A,TLP241AF Start of commercial production 2015-09 1. 1. 1. 1. ApplicationsApplicationsApplicationsApplications

  • Mechanical relay replacements
  • Security Systems
  • Measuring Instruments
  • Factory Automation (FA)
  • Amusement Equipment
  • Smart Meters
  • Electricity Meters 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP241A and TLP241AF photorelay consist of a photo MOSFET optically coupled to an infrared LED. They are housed in a 4-pin DIP package. They provide an isolation voltage of 5000 Vrms, making them suitable for applications that require reinforced insulation. 3. 3. 3. 3. FeaturesFeaturesFeaturesFeatures (1) Halogen-free For details, see "Devices in Halogen-Free Resin Packages" at the end of this datasheet. (2) Normally opened (1-Form-A) (3) OFF-state output terminal voltage: 40 V (min) (4) Trigger LED current: 3 mA (max) (5) ON-state current: 2.0 A (max) (6) ON-state resistance: 100 mΩ (max, t < 1 s) 150 mΩ (max, Continuous) (7) Isolation voltage: 5000 Vrms (min) (8) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 UL-recognized: UL 508, File No.E499232 (Note 1)(Note 1)(Note 1)(Note 1) VDE-approved: EN 60747-5-5, EN 62368-1 (Note 2)(Note 2)(Note 2)(Note 2) Note 1: Please refer Absolute Maximum Ratings (UL-recognized UL 508) for UL 508 products. Note 2: When an EN 60747-5-5 approved type is needed, please designate the Option (D4)Option (D4)Option (D4)Option (D4). 4. 4. 4. 4. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters Characteristics Creepage distances Clearance distances Internal isolation thickness 7.62-mm Pitch TLP241A 7.0 (min) 7.0 (min) 0.4 (min) 10.16-mm Pitch TLP241AF 8.0 (min) 8.0 (min) 0.4 (min) Unit mm 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF 5. 5. 5. 5. Packaging (Note)Packaging (Note)Packaging (Note)Packaging (Note) TLP241A 11-5B2S TLP241A(LF1,TP1) 11-5B201S TLP241A(LF5,TP5) 11-5B205S TLP241AF 11-5B202S TLP241AF(LF4,TP4) 11-5B204S Note: Through-hole type: TLP241A, TLP241AF Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 6. 6. 6. 6. Pin AssignmentPin AssignmentPin AssignmentPin Assignment 1: Anode 2: Cathode 3: Drain 4: Drain 7. 7. 7. 7. Internal CircuitInternal CircuitInternal CircuitInternal Circuit 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF 8. 8. 8. 8. Absolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, Taaaa = 25 = 25 = 25 = 25  )))) LED Detector Common Characteristics Input forward current Input forward current derating Input forward current (pulsed) Input reverse voltage Input power dissipation Input power dissipation derating Junction temperature OFF-state output terminal voltage ON-state current ON-state current derating ON-state current (pulsed) Output power dissipation Output power dissipation derating Junction temperature Storage temperature Operating temperature Lead soldering temperature Isolation voltage (Ta ≥ 25  ) (100 µs pulse, 100 pps) (Ta ≥ 25  ) (Ta ≥ 25  ) (t = 100 ms, Duty = 1/10) (Ta ≥ 25  ) (10 s) Symbol IF ∆IF/∆Ta IFP VR PD ∆PD/∆Ta Tj VOFF ION ∆ION/∆Ta IONP PO ∆PO/∆Ta Tj Tstg Topr Tsol BVS Note (Note 1) Rating -0.3 -0.5 125 2.0 -20 6.0 500 -5.0 125 -55 to 125 -40 to 85 260 5000 Unit mA mA/ A V mW mW/ V A mA/ A mW mW/ Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are shorted together. 9. 9. 9. 9. Recommended Operating Conditions (Note)Recommended Operating Conditions (Note)Recommended Operating Conditions (Note)Recommended Operating Conditions (Note) Characteristics Supply voltage Input forward current ON-state current Operating temperature Symbol VDD IF ION Topr Note Min -20 Typ. 7.5 Max 2.0 Unit V mA A Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF 10. 10. 10. 10. Absolute Maximum Ratings (UL-recognized: UL 508) (Note) (Unless otherwiseAbsolute Maximum Ratings (UL-recognized: UL 508) (Note) (Unless otherwiseAbsolute Maximum Ratings (UL-recognized: UL 508) (Note) (Unless otherwiseAbsolute Maximum Ratings (UL-recognized: UL 508) (Note) (Unless otherwise specified, Tspecified, Tspecified, Tspecified, Taaaa = 25 = 25 = 25 = 25  )))) LED Detector Common Characteristics Input forward current Input forward current derating Input forward current (pulsed) Input reverse voltage Input power dissipation Input power dissipation derating Junction temperature OFF-state output terminal voltage ON-state current ON-state current derating ON-state current (pulsed) Output power dissipation Output power dissipation derating Junction temperature Storage temperature Case temperature Operating temperature Lead soldering temperature Isolation voltage (Ta ≥ 25  ) (100 µs pulse, 100 pps) (Ta ≥ 25  ) (Ta ≥ 25  ) (t = 100 ms, duty = 1/10) (Ta ≥ 25  ) (10 s) Symbol IF ∆IF/∆Ta IFP VR PD ∆PD/∆Ta Tj VOFF ION ∆ION/∆Ta IONP PO ∆PO/∆Ta Tj Tstg Tc Topr Tsol BVS Note (Note 1) Rating -0.3 -0.5 105 2.0 -20 6.0 500 -5.0 105 -55 to 125 105 -40 to 85 260 5000 Unit mA mA/ A V mW mW/ V A mA/ A mW mW/ Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are shorted together. 11. 11. 11. 11. Recommended Operating Conditions (UL-recognized: UL 508) (Note)Recommended Operating Conditions (UL-recognized: UL 508) (Note)Recommended Operating Conditions (UL-recognized: UL 508) (Note)Recommended Operating Conditions (UL-recognized: UL 508) (Note) Characteristics Supply voltage Input forward current ON-state current Operating temperature Symbol VDD IF ION Topr Note (Note 1) (Note 1) Min -20 Typ. 7.5 Max 19.5 1.3 Unit V mA A Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. Note 1: The above recommended operating conditions are at Ta = 60  . However, within the derating range of the characteristic curves of "IF - Ta", "ION - Ta", it can be used up to 85  . 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF 12. 12. 12. 12. Electrical Characteristics (Unless otherwise specified, TElectrical Characteristics (Unless otherwise specified, TElectrical Characteristics (Unless otherwise specified, TElectrical Characteristics (Unless otherwise specified, Taaaa = 25 = 25 = 25 = 25  )))) LED Detector Characteristics Input forward voltage Input reverse current Input capacitance OFF-state current Output capacitance Symbol VF IR Ct IOFF COFF Note Test Condition IF = 10 mA VR = 5 V V = 0 V, f = 1 MHz VOFF = 40 V V = 0 V, f = 1 MHz Min 1.1 Typ. 1.27 300 Max 1.4 1000 Unit V µA pF nA pF 13. 13. 13. 13. Coupled Electrical Characteristics (Unless otherwise specified, TCoupled Electrical Characteristics (Unless otherwise specified, TCoupled Electrical Characteristics (Unless otherwise specified, TCoupled Electrical Characteristics (Unless otherwise specified, Taaaa = 25 = 25 = 25 = 25  )))) Characteristics Trigger LED current Return LED current ON-state resistance Symbol IFT IFC RON Note (Note 1) Test Condition ION = 1.0 A IOFF = 10 µA ION = 2.0 A, IF = 5 mA, t < 1 s ION = 2.0 A, IF = 5 mA, Continuous Min 0.1 Typ. 0.5 Max 100 150 Unit mA mΩ Note 1: Thermally saturated state. 14. 14. 14. 14. Isolation Characteristics (Unless otherwise specified, TIsolation Characteristics (Unless otherwise specified, TIsolation Characteristics (Unless otherwise specified, TIsolation Characteristics (Unless otherwise specified, Taaaa = 25 = 25 = 25 = 25  )))) Characteristics Total capacitance (input to output) Isolation resistance Isolation voltage Symbol CS RS BVS Note (Note 1) (Note 1) (Note 1) Test Condition VS = 0 V, f = 1 MHz AC, 60 s Min 1012 5000 Typ. 0.8 1014 Max Unit pF Ω Vrms Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are shorted together. 15. 15. 15. 15. Switching Characteristics (Unless otherwise specified, TSwitching Characteristics (Unless otherwise specified, TSwitching Characteristics (Unless otherwise specified, TSwitching Characteristics (Unless otherwise specified, Taaaa = 25 = 25 = 25 = 25  )))) Characteristics Turn-on time Turn-off time Symbol tON tOFF Note Test Condition See Fig. 15.1. RL = 200 Ω, VDD = 20 V, IF = 10 mA Min Typ. 2.8 0.3 Max Unit ms 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF 16. 16. 16. 16. Characteristics Curves (Note)Characteristics Curves (Note)Characteristics Curves (Note)Characteristics Curves (Note) 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF 17. 17. 17. 17. Soldering and StorageSoldering and StorageSoldering and StorageSoldering and Storage The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used.

  • When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. An Example of a Temperature Profile When Lead(Pb)-Free Solder Is UsedAn Example of a Temperature Profile When Lead(Pb)-Free Solder Is UsedAn Example of a Temperature Profile When Lead(Pb)-Free Solder Is UsedAn Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
  • When using soldering flow Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds. Mounting condition of 260  within 10 seconds is recommended. Flow soldering must be performed once.
  • When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not exceeding 350  Heating by soldering iron must be done only once per lead.
  • Avoid storage locations where devices may be exposed to moisture or direct sunlight.
  • Follow the precautions printed on the packing label of the device for transportation and storage.
  • Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %, respectively.
  • Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions.
  • Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads.
  • When restoring devices after removal from their packing, use anti-static containers.
  • Do not allow loads to be applied directly to devices while they are in storage.
  • If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF 18. 18. 18. 18. Land Pattern Dimensions (for reference only)Land Pattern Dimensions (for reference only)Land Pattern Dimensions (for reference only)Land Pattern Dimensions (for reference only) Unit: mm TLP241A (LF1), (TP1), (LF5), (TP5) TLP241AF (LF4), (TP4) 19. 19. 19. 19. Marking (Note)Marking (Note)Marking (Note)Marking (Note) TLP241A TLP241AF Note: A different marking is used for photocouplers that have been qualified according to option (D4) of EN 60747. 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF 20. 20. 20. 20. EN 60747-5-5 Option (D4) SpecificationEN 60747-5-5 Option (D4) SpecificationEN 60747-5-5 Option (D4) SpecificationEN 60747-5-5 Option (D4) Specification

  • Part number: TLP241A (Note 1)(Note 1)(Note 1)(Note 1)
  • The following part naming conventions are used for the devices that have been qualified according to option (D4) of EN 60747. Example: TLP241A(D4,TP1,F D4: EN 60747 option TP1: Tape type F: [[G]]/RoHS COMPATIBLE (Note 2)(Note 2)(Note 2)(Note 2) Note 1: Use TOSHIBA standard type number for safety standard application. e.g., TLP241A(D4,TP1,F → TLP241A Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF Table Table Table Table Insulation Related Specifications (Note)Insulation Related Specifications (Note)Insulation Related Specifications (Note)Insulation Related Specifications (Note) Insulation Related Parameters Minimum creepage distance Minimum clearance Minimum insulation thickness Comparative tracking index Symbol Cr Cl ti CTI TLP241A 7.0 mm 7.0 mm 0.4 mm 175 TLP241AF 8.0 mm 8.0 mm 0.4 mm 175 Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall take suitable measures. Note: This photocoupler is suitable for safe electrical isolationsafe electrical isolationsafe electrical isolationsafe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. TLP241A TLP241AF Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN 60747. 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF 21. 21. 21. 21. Ordering Information (Example of Item Name) Ordering Information (Example of Item Name) Ordering Information (Example of Item Name) Ordering Information (Example of Item Name) Item Name TLP241A(F TLP241A(LF1,F TLP241A(LF5,F TLP241A(TP1,F TLP241A(TP5,F TLP241A(D4,F TLP241A(D4,LF1,F TLP241A(D4,LF5,F TLP241A(D4,TP1,F TLP241A(D4,TP5,F TLP241AF(F TLP241AF(LF4,F TLP241AF(TP4,F TLP241AF(D4,F TLP241AF(D4LF4,F TLP241AF(D4TP4,F Packaging (Note 1) TH LF1 LF5 LF1 LF5 TH LF1 LF5 LF1 LF5 TH, Wide forming LF4, Wide forming LF4, Wide forming TH, Wide forming LF4, Wide forming LF4, Wide forming VDE Option EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 Packing (MOQ) Magazine (100 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1500 pcs) Tape and reel (1500 pcs) Magazine (100 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1500 pcs) Tape and reel (1500 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1000 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1000 pcs) Note 1: TH: Through-hole, LF: Lead forming for surface mount 22. 22. 22. 22. Devices in Halogen-Free Resin PackagesDevices in Halogen-Free Resin PackagesDevices in Halogen-Free Resin PackagesDevices in Halogen-Free Resin Packages  This product is Halogen-Free Toshiba Electronic Devices & Storage Corporation ("Toshiba") defines a "Halogen-Free resin semiconductor product" as a semiconductor product in which: (1) the encapsulating resins do not contain any of the following elements: bromine (Br), chlorine (Cl) and antimony (Sb), respectively, in an amount exceeding 0.09 weight percent, and do not contain chlorine and bromine in an aggregate amount exceeding 0.15 weight percent of the encapsulating resins, and/or (2) the resin portion(s) in printed circuit boards do not contain any of the following elements: bromine, chlorine and antimony, respectively, in an amount exceeding 0.09 weight percent, and do not contain chlorine and bromine in an aggregate amount exceeding 0.15 weight percent of the each resin portion(s) in printed circuit boards. For avoidance of doubt, "Halogen-Free resin semiconductor product" does not mean, and Toshiba does not make any warranty of any kind, that said semiconductor product is entirely free of antimony or of any of the following elements of the halogen family: bromine, chlorine, iodine (I), fluorine (F) and astatine (At). In addition, a Halogen-Free resin semiconductor product may contain antimony and/or any of the elements of the halogen family as mentioned in the above paragraph in one or more portion(s) of the semiconductor product other than the encapsulating resins and the resin portion(s) in printed circuit boards. The information provided herein is accurate as of the date that it was provided, to the best of the knowledge and belief of the Toshiba Electronic Devices & Storage Corporation ("Toshiba"), Toshiba bases such knowledge and belief on information provided by third parties, and Toshiba makes no representation or warranty as to the accuracy of such third party information. Toshiba has taken and will continue to take, reasonable steps to provide accurate information to its customers, but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF Package DimensionsPackage DimensionsPackage DimensionsPackage Dimensions Unit: mm TLP241A Weight: 0.26 g (typ.) Package Name(s) TOSHIBA: 11-5B2S 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF Package DimensionsPackage DimensionsPackage DimensionsPackage Dimensions Unit: mm TLP241A(LF1,TP1) Weight: 0.25 g (typ.) Package Name(s) TOSHIBA: 11-5B201S 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF Package DimensionsPackage DimensionsPackage DimensionsPackage Dimensions Unit: mm TLP241A(LF5,TP5) Weight: 0.25 g (typ.) Package Name(s) TOSHIBA: 11-5B205S 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF Package DimensionsPackage DimensionsPackage DimensionsPackage Dimensions Unit: mm TLP241AF Weight: 0.26 g (typ.) Package Name(s) TOSHIBA: 11-5B202S 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF Package DimensionsPackage DimensionsPackage DimensionsPackage Dimensions Unit: mm TLP241AF(LF4,TP4) Weight: 0.25 g (typ.) Package Name(s) TOSHIBA: 11-5B204S 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation

TLP241A,TLP241AF https://toshiba.semicon-storage.com/ RESTRICTIONS ON PRODUCT USERESTRICTIONS ON PRODUCT USERESTRICTIONS ON PRODUCT USERESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product".

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  • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 2020-02-17 Rev.7.0 ©2016-2020 Toshiba Electronic Devices & Storage Corporation