TLP2403

TLP2403 TOSHIBA | Alldatasheet

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Photocouplers GaAℓAs Infrared LED & Photo IC TLP2403TLP2403TLP2403TLP2403 1. 1. 1. 1. ApplicationsApplicationsApplicationsApplications

• High-Speed Digital Interfacing for Instrumentation and Control Devices
• Simplex/Multiplex Data Transmission 2. 2. 2. 2. GeneralGeneralGeneralGeneral The Toshiba TLP2403 consists of a high-output GaA ℓAs light-emitting diode coupled with a high-speed photo- diode-transistor chip. It is housed in the SO8 package. The TLP2403 uses a high-speed, high-gain detector element and thus is ideal for applications which require low- input current and high-speed data transmission. 3. 3. 3. 3. FeaturesFeaturesFeaturesFeatures (1) Package: SO8 (2) Operating temperature: -40 to 100 (3) Current transfer ratio: 400% (min) @IF = 0.5 mA (4) Maximum output current: 60 mA (5) Propagation delay time: tpHL = 2 µs (typ.), tpLH = 4 µs (typ.) @ RL = 4.7 kΩ, IF = 0.5 mA (6) Isolation voltage: 3750 Vrms (min) (7) Safety standards UL-approved: UL1577 File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349 VDE-approved: Option (V4) EN60747-5-2 (Note)(Note)(Note)(Note) Note: When an EN60747-5-2 approved type is needed, please designate the Option (V4)Option (V4)Option (V4)Option (V4). 4. 4. 4. 4. Packaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin Configuration 1: NC 2: Anode 3: Cathode 4: NC 5: GND (Emitter) 6: Output (Collector) 7: Base 8: VCC SO8 2010-09-06 Rev.1.0

1. 5. 5. 5. Internal CircuitInternal CircuitInternal CircuitInternal Circuit 6. 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of OperationPrinciple of Operation Characteristics Creepage distances Clearance Internal isolation thickness Min 4.0 4.0 Unit mm 2010-09-06 Rev.1.0

1. 7. 7. 7. Absolute Maximum Ratings (Note)Absolute Maximum Ratings (Note)Absolute Maximum Ratings (Note)Absolute Maximum Ratings (Note) Unless otherwise specified, Ta = 25 LED Detector Common Characteristics Forward current Forward current derating Pulse forward current Pulse forward current derating Transient pulse forward current Transient pulse forward current derating Reverse voltage Power dissipation Power dissipation derating Output current Output current derating Output voltage Supply voltage Emitter-base reverse voltage Output power dissipation Output power dissipation derating Operating temperature Storage temperature Lead soldering temperature Isolation voltage (Ta ≥ 85 ) (Ta ≥ 85 ) (Ta ≥ 85 ) (Ta ≥ 85 ) (Ta ≥ 25 ) (Ta ≥ 25 ) (10 s) AC, 1 min, R.H. ≤ 60% Symbol IF ∆IF/ IFP ∆IFP/ IFPT ∆IFPT/ VR PD ∆PD/ IO ∆IO/ VO VCC VEB PO ∆PO/ Topr Tstg Tsol BVS Note (Note 1) (Note 2) (Note 3) Rating -0.67 -1.0 -25 -1.0 -0.6 -0.5 to 18 -0.5 to 18 0.5 100 -1.0 -40 to 100 -55 to 125 260 3750 Unit mA mA/ mA mA/ A mA/ V mW mW/ mA mA/ V mW mW/ Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) ≤ 1 ms, duty = 50% Note 2: Pulse width (PW) ≤ 1 µs, 300 pps Note 3: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 8. 8. 8. 8. Recommended Operating Conditions (Note)Recommended Operating Conditions (Note)Recommended Operating Conditions (Note)Recommended Operating Conditions (Note) Characteristics Forward current Output current Supply voltage Operating temperature Symbol IF IO VCC Topr Note (Note 1) Min 0.5 -40 Typ. Max 100 Unit mA V Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this datasheet should also be considered. Note 1: Denotes the operating range, not the recommended operating condition. 2010-09-06 Rev.1.0

1. 9. 9. 9. Electrical Characteristics (Note)Electrical Characteristics (Note)Electrical Characteristics (Note)Electrical Characteristics (Note) Unless otherwise specified, Ta = 0 to 100 Characteristics Input forward voltage Input temperature coefficient of forward voltage Input reverse current Input capacitance High-level output current High-level supply current Low-level supply current Current transfer ratio Low-level output voltage Symbol VF ∆VF/∆Ta IR Ct IOH ICCH ICCL IO/IF VOL Note Test Circuit Test Condition IF = 1.6 mA, Ta = 25 IF = 1.6 mA VR = 5 V, Ta = 25 V = 0 V, f = 1 MHz, Ta = 25 VF = 0.8 V, VCC = VO = 18 V IF = 0 mA, VCC = 5 V, VO = Open IF = 1.6 mA, VCC = 5 V, VO = Open IF = 0.5 mA, VCC = 4.5 V, VO = 0.4 V IF = 1.6 mA, VCC = 4.5 V, VO = 0.4 V IF = 1.6 mA, VCC = 4.5 V, IOL = 6.4 mA IF = 5 mA, VCC = 4.5 V, IOL = 15 mA IF = 12 mA, VCC = 4.5 V, VO = 24 mA Min 1.30 0.1 400 500 Typ. 1.45 -1.8 0.1 0.01 1000 900 0.1 0.1 0.15 Max 1.70 100 1.5 0.4 0.4 0.4 Unit V mV/ µA pF µA µA mA V Note: All typical values are at Ta = 25 . 10. 10. 10. 10. Isolation CharacteristicsIsolation CharacteristicsIsolation CharacteristicsIsolation Characteristics Unless otherwise specified, Ta = 25 Characteristics Capacitance (input to output) Isolation resistance Isolation voltage Symbol CS RS BVS Note (Note 1) (Note 1) Test Conditions VS = 0 V, f = 1 MHz AC, 1 min AC, 1 s in oil DC, 1 min in oil Min 1×1012 3750 Typ. 0.8 1014 10000 10000 Max Unit pF Ω Vrms Vdc Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 2010-09-06 Rev.1.0

1. 11. 11. 11. Switching CharacteristicsSwitching CharacteristicsSwitching CharacteristicsSwitching Characteristics Unless otherwise specified, Ta = 0 to 100 , VCC = 5 V Characteristics Propagation delay time (H/L) Propagation delay time (L/H) Common-mode transient immunity at output high Common-mode transient immunity at output low Symbol tpHL tpLH CMH CML Note (Note 1) (Note 2) Test Circuit Fig. 12.1.1 Fig. 12.1.1 Fig. 12.1.2 Test Condition IF = 0.5 mA, RL = 4.7 kΩ, Ta = 25 IF = 0.5 mA, RL = 4.7 kΩ IF = 12 mA, RL = 270 Ω, Ta = 25 IF = 12 mA, RL = 270 Ω IF = 1.6 mA, RL = 2.2 kΩ, Ta = 25 IF = 1.6 mA, RL = 2.2 kΩ IF = 0.5 mA, RL = 4.7 kΩ, Ta = 25 IF = 0.5 mA, RL = 4.7 kΩ IF = 12 mA, RL = 270 Ω, Ta = 25 IF = 12 mA, RL = 270 Ω IF = 1.6 mA, RL = 2.2 kΩ, Ta = 25 IF = 1.6 mA, RL = 2.2 kΩ IF = 0 mA, RL = 2.2 kΩ, VCM = 10 V, VO(min) = 2 V IF = 1.6 mA, RL = 2.2 kΩ, VCM = 10 V, VO(max) = 0.8 V Min Typ. 0.3 0.3 0.5 0.5 4.5 4.5 500 -500 Max Unit µs µs V/µs Note 1: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic high state (VO > 2.0 V). Note 2: CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic low state (VO < 0.8 V). 2010-09-06 Rev.1.0

1. 12. 12. 12. Test Circuits and Characteristics CurvesTest Circuits and Characteristics CurvesTest Circuits and Characteristics CurvesTest Circuits and Characteristics Curves 2010-09-06 Rev.1.0

1. 13. 13. 13. Soldering and StorageSoldering and StorageSoldering and StorageSoldering and Storage The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. when Sn-Pb eutectic solder is usedwhen Sn-Pb eutectic solder is usedwhen Sn-Pb eutectic solder is usedwhen Sn-Pb eutectic solder is used when lead(Pb)-free solder is usedwhen lead(Pb)-free solder is usedwhen lead(Pb)-free solder is usedwhen lead(Pb)-free solder is used

• When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder) Apply preheating of 150 for 60 to 120 seconds. Mounting condition of 260 within 10 seconds is recommended. Flow soldering must be performed once.
• When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder) Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 Heating by soldering iron must be done only once per lead.
• Avoid storage locations where devices may be exposed to moisture or direct sunlight.
• Follow the precautions printed on the packing label of the device for transportation and storage.
• Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%, respectively.
• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions.
• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads.
• When restoring devices after removal from their packing, use anti-static containers.
• Do not allow loads to be applied directly to devices while they are in storage.
• If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 2010-09-06 Rev.1.0

1. 14. 14. 14. Land Pattern Dimensions for Reference OnlyLand Pattern Dimensions for Reference OnlyLand Pattern Dimensions for Reference OnlyLand Pattern Dimensions for Reference Only 15. 15. 15. 15. MarkingMarkingMarkingMarking 2010-09-06 Rev.1.0

1. 16. 16. 16. EN60747-5-2 Option (V4) SpecificationEN60747-5-2 Option (V4) SpecificationEN60747-5-2 Option (V4) SpecificationEN60747-5-2 Option (V4) Specification

• Part number: TLP2403 (Note)(Note)(Note)(Note)
• The following part naming conventions are used for the devices that have been qualified according to option (V4) of EN60747. Example: TLP2403(V4-TP, F) V4: EN60747 option specification TP: Standard taping name Note: Use TOSHIBA standard type number for safety standard application. e.g., TLP2403(V4-TP, F) → TLP2403 2010-09-06 Rev.1.0

Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e. g., at a standard distance between soldering eye centers of 3.5 mm). If this is not permissible, the user shall take suitable measures. Note: This photocoupler is suitable for safe electrical isolationsafe electrical isolationsafe electrical isolationsafe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Note: The above marking is applied to the photocouplers that have been qualified according to option (V4) of EN60747. 2010-09-06 Rev.1.0

Package DimensionsPackage DimensionsPackage DimensionsPackage Dimensions Unit: mm Weight: 0.11 g (typ.) Package Name(s) TOSHIBA: 11-5K1S Nickname: SO8 2010-09-06 Rev.1.0

RESTRICTIONS ON PRODUCT USERESTRICTIONS ON PRODUCT USERESTRICTIONS ON PRODUCT USERESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice.
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• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 2010-09-06 Rev.1.0