DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 3

Technical content

www.centralsemi.com R0 (5-May 2011) Package Details TLM2D3D6 Case Mechanical Drawing Mounting Pad Geometry (Dimensions in mm) Part Marking: Single Character Alpha/Numeric Code Lead Code: 1) Cathode 2) Anode

www.centralsemi.com R0 (5-May 2011) Package Details TLM2D3D6 Case Tape Dimensions and Orientation (Dimensions in mm) Tape Width: 8mm Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order Number, Quantity, Lot Number, Date Code, Ship Date and Marking Code. Packaging Base 7” Reel = 8,000 pcs. Reel Packing Information

Ordering Information

  • For devices taped and reeled on 7” reels, add TR suffix to part number.
  • All SMDs are available in small quantities for prototype and manual placement applications. Devices are taped in accordance with Electronic Industries Association Standard EIA-481-1-A Reel Size Reels per Box (Maximum) Parts per Box (Maximum) Box Dimensions Shipping Weight (Max.) INCH CM LB KG 108 72,000 144,000 320,000 864,000 9x9x5 9x9x9 21x9x9 27x9x17 23x23x13 23x23x23 53x23x23 69x23x43 Direction of Unreeling

Material Composition Specification TLM2D3D6 Case www.centralsemi.com R1 (3-June 2011) Component Material Material Substance CAS No. Substance (%wt) (µg) (%wt) (µg) (ppm) active device doped Si 6.92% 10 Si 7440-21-3 6.92% 10 69,247 bond wire gold 0.28% 0.4 Au 7440-57-5 0.28% 0.4 2,770 leadframe Cu alloy 27.44% 39.63 Cu 7440-50-8 27.23% 39.33 272,350 Sn 7440-31-5 0.07% 0.1 692 Zn 7440-66-6 0.07% 0.1 692 Cr 7440-47-3 0.07% 0.1 692 die attach silver epoxy 2.77% 4 Ag 7440-22-4 1.94% 2.8 19,389 epoxy resin Proprietary 0.83% 1.2 8,310 encapsulation* EMC GREEN 62.32% 90 silica (fused) 60676-86-0 52.97% 76.5 529,742 epoxy resin 29690-82-2 4.67% 6.75 46,742 phenol resin 9003-35-4 1.56% 2.25 15,581 carbon black 1333-86-4 0.19% 0.27 1,870 metal hydroxide 1309-42-8 2.93% 4.23 29,292 plating Ni/Pd/Au 0.26% 0.38 Ni 7440-02-0 0.25% 0.36 2,493 Pd 7440-05-3 0.01% 0.01 69 Au 7440-57-5 0.01% 0.01 69 *EMC GREEN molding compound is Halogen-Free. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is n o guarantee to completeness or accuracy, as some information is derived from data sources outside the company.