TLD26AH TSC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 6

Technical content

TLD26AH – TLD82AH Taiwan Semiconductor

1 Version: C2408

26V - 82V Surface Mount Transient Voltage Suppressor

FEATURES

  • AEC-Q101 qualified
  • Low leakage current: 1μA at 25 °C
  • TJ = 175°C capability suitable for high reliability and automotive requirement
  • Meets ISO7637-2 and ISO16750-2 surge specifications (varied by test conditions)
  • Meets IEC 61000-4-2 (Level: 4) / ISO 10605 (Level: L4)
  • Moisture sensitivity level: level 1, per J-STD-020
  • RoHS Compliant
  • Halogen-free

APPLICATIONS

  • Transient surge protection
  • Automotive load dump surge protection MECHANICAL DATA
  • Case: TO-263AB (D² PAK)
  • Molding compound meets UL 94V-0 flammability rating.
  • Terminal: Matte tin plated leads, solderable per J-STD-002
  • Meet JESD 201 class 2 whisker test.
  • Polarity: As circuit diagram
  • Weight: 1.44g (approximately) KEY PARAMETERS PARAMETER VALUE UNIT VWM 22 - 70 V VBR 26 - 82 V TJ MAX 175 °C Package TO-263AB (D² PAK) Configuration Single die TO-263AB (D² PAK) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL VALUE UNIT Junction temperature TJ -55 to +175 °C Storage temperature TSTG -55 to +175 °C THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-case thermal resistance RӨJC 0.33 °C/W Thermal Performance Note: With ideal heatsink.

TLD26AH – TLD82AH Taiwan Semiconductor

2 Version: C2408

ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) Part number Device marking Breakdown voltage VBR at IT (V) (Note 1) Test current IT (mA) Working stand-off voltage VWM (V) Maximum blocking leakage current IR at VWM (µA) (Note 1) Maximum VC at IPPM tp =8/20 (μs) Maximum VC at IPPM tp =10/1000 (μs) Maximum temp. coefficient of VBR αT (%/°C) (Note 2) Min Typ Max 25°C 175°C V A V A TLD82AH TLD82AH 77.8 82 86.0 1 70 1 100 135.0 550 113 35 0.105 Notes: 1. Pulse test with PW = 30ms 2. To calculate VBR vs. junction temperature, use the following formula: VBR at TJ = VBR at 25 °C x (1 + T x (TJ - 25))

ORDERING INFORMATION

ORDERING CODE(1) PACKAGE PACKING TLDxAH TO-263AB (D² PAK) 800 / Tape & Reel Notes: 1. "x" defines voltage from 26V (TLD26AH) to 82V (TLD82AH)

TLD26AH – TLD82AH Taiwan Semiconductor

3 Version: C2408

(TA = 25°C unless otherwise noted) Fig.1 Peak Pulse Power Derating Curve Fig.2 Non-Repetitive Peak Pulse Power vs. Pulse Time Fig.3 Typical Reverse Characteristics Fig.4 Typical Junction Capacitance Fig.5 Typical Transient Thermal Impedance 100 120 0 25 50 75 100 125 150 175 200 100 1000 10000 100000 1000000 1 10 100 1000 10000 TLD26AH 0.001 0.01 0.1 100 25 50 75 100 125 150 175 100 1000 10000 20 30 40 50 60 70 80 90 f=1.0MHz Vsig=50mVp-p Measured at zero bias Measured at VWM 0.1 0.2 0.3 0.4 PEAK PULSE POWER (W) PERCENT OF POWER PULSE POWER (%) PULSE TIME (μs) AMBIENT TEMPERATURE (°C) PULSE DURATION (s) CAPACITANCE (pF) REVERSE BREAKDOWN VOLTAGE (V) INSTANTANEOUS REVERSE CURRENT (μA) TEMPERATURE (°C) TRANSIENT THERMAL IMPEDANCE (°C/W)

TLD26AH – TLD82AH Taiwan Semiconductor

4 Version: C2408

10/1000µs Waveform as defined by R.E.A td tr = 10us 100 30ns 60ns tr = 0.7ns to 1.0ns CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.6 10/1000μs pulse waveform Fig.7 ESD pulse waveform PERCENT OF IPP (%) TIME (mS) PERCENT OF IPP (%) TIME

TLD26AH – TLD82AH Taiwan Semiconductor

5 Version: C2408

PACKAGE OUTLINE DIMENSIONS TO-263AB (D²PAK) GYWWF P/N P/N G YWW F = Device marking = Green compound = Date code = Factory code

TLD26AH – TLD82AH Taiwan Semiconductor

6 Version: C2408

Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life -saving, or life -sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale.