TLC3016

TLV3502AIDG4 TI1 | Alldatasheet

Document overview

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Technical content

FEATURES

/C0068HIGH SPEED: 4.5ns /C0068RAIL-TO-RAIL I/O /C0068SUPPLY VOLTAGE: +2.7V to +5.5V /C0068PUSH-PULL CMOS OUTPUT STAGE /C0068SHUTDOWN (TLV3501 only) /C0068MICRO PACKAGES: SOT23-6 (single) SOT23-8 (dual) /C0068LOW SUPPLY CURRENT: 3.2mA

APPLICATIONS

/C0068AUTOMATIC TEST EQUIPMENT /C0068WIRELESS BASE STATIONS /C0068THRESHOLD DETECTOR /C0068ZERO-CROSSING DETECTOR /C0068WINDOW COMPARATOR TLV350x RELATED PRODUCTS FEATURES PRODUCT Precision Ultra-Fast, Low-Power Comparator TLC3016 Differential Output Comparator TL712 High-Speed Op Amp, 16-Bit Accurate, 150MHz OPA300 High-Speed Op Amp, Rail-to-Rail, 38MHz OPA350 High-Speed Op Amp with Shutdown, 250MHz OPA357

DESCRIPTION

The TLV350x family of push-pull output comparators feature a fast 4.5ns propagation delay and operation from +2.7V to +5.5V. Beyond-the-rails input common-mode range makes it an ideal choice for low-voltage applica- tions. The rail-to-rail output directly drives either CMOS or TTL logic. Microsize packages provide options for portable and space-restricted applications. The single (TLV3501) is available in SOT23-6 and SO-8 packages. The dual (TLV3502) comes in the SOT23-8 and SO-8 packages. Propagation Delay (ns) PROPAGATION DELAY vs OVERDRIVE VOLTAGE 0 100 40 60 8020 Overdrive Voltage (mV) Fall Rise VCM =1 V VS =5 V C LOAD =1 7 p F TLV3501 TLV3502 SBOS321D − MARCH 2005 − REVISED JULY 2005 4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages /C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 www.ti.com Copyright  2005, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners.

/C0084/C0076/C0086/C0051/C0053/C0048/C0049 /C0084/C0076/C0086/C0051/C0053/C0048/C0050 SBOS321D − MARCH 2005 − REVISED JULY 2005 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (1)Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2)Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should be current limited to 10mA or less. (3)Short-circuit to ground, one comparator per package. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING TLV3501 SOT23-6 DBV NXATLV3501 SOT23-6 DBV NXA TLV3501 SO-8 D TLV3501ATLV3501 SO-8 D TLV3501A TLV3502 SOT23-8 DCN NXCTLV3502 SOT23-8 DCN NXC TLV3502 SO-8 D TLV3502ATLV3502 SO-8 D TLV3502A (1)For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. PIN CONFIGURATIONS (1) Pin 1 of the SOT23-6 is determined by orienting the package marking as indicated on the diagram. (2) NC indicates no internal connection. SHDN OUT TLV3501 SOT23−6 (1) −IN +IN NXA SHDN OUT NC (2) NC (2) −IN +IN TLV3501 SO−8 OUT A OUT B TLV3502 SOT23−8, SO−8 +IN A −IN A +IN B −IN B A B

/C0084/C0076/C0086/C0051/C0053/C0048/C0049 /C0084/C0076/C0086/C0051/C0053/C0048/C0050 SBOS321D − MARCH 2005 − REVISED JULY 2005 www.ti.com

ELECTRICAL CHARACTERISTICS

Boldface limits apply over the specified temperature range, TA = −40°C to +125°C. At TA = +25°C and VS = +2.7V to +5.5V, unless otherwise noted. TLV3501, TLV3502 PARAMETER CONDITION MIN TYP MAX UNITS OFFSET VOLTAGE Input Offset Voltage(1) VOS VCM = 0V, IO = 0mA ±1 ±6.5 mV vs Temperature dV OS /dT T A = −40°C to +125°C ±5 µV/°C vs Power Supply PSRR V S = 2.7V to 5.5V 100 400 µV/V Input Hysteresis 6 mV INPUT BIAS CURRENT Input Bias Current IB VCM = VCC /2 ±2 ±10 pA Input Offset Current(2) IOS VCM = VCC /2 ±2 ±10 pA INPUT VOLTAGE RANGE Common-Mode Voltage Range VCM (V−) − 0.2V (V+) + 0.2V V Common-Mode Rejection CMRR V CM = −0.2V to (V+) + 0.2V 57 70 dB VCM = −0.2V to (V+) + 0.2V 55 dB INPUT IMPEDANCE Common-Mode 1013 2 Ω  pF Differential 1013 4 Ω  pF SWITCHING CHARACTERISTICS Propagation Delay Time(3) T(pd) ∆VIN = 100mV, Overdrive = 20mV 4.5 6.4 ns ∆VIN = 100mV, Overdrive = 20mV 7 ns ∆VIN = 100mV, Overdrive = 5mV 7.5 10 ns ∆VIN = 100mV, Overdrive = 5mV 12 ns Propagation Delay Skew(4) ∆t(SKEW) ∆VIN = 100mV, Overdrive = 20mV 0.5 ns Maximum Toggle Frequency fMAX Overdrive = 50mV, VS = 5V 80 MHz Rise Time(5) tR 1.5 ns Fall Time(5) tF 1.5 ns OUTPUT Voltage Output from Rail VOH , VOL IOUT = ±1mA 30 50 mV SHUTDOWN tOFF 30 ns tON 100 ns VL (comparator is enabled)(6) (V+) − 1.7V V VH (comparator is disabled)(6) (V+) − 0.9V V Input Bias Current of Shutdown Pin 2 pA IQSD (quiescent current in shutdown) 2 µA POWER SUPPLY Specified Voltage VS +2.7 +5.5 V Operating Voltage Range 2.2 to 5.5 V Quiescent Current IQ VS = 5V, VO = High 3.2 5 mA TEMPERATURE RANGE Specified Range −40 +125 °C Operating Range −40 +125 °C Storage Range −65 +150 °C Thermal Resistance /C0113JA SOT23-5 200 °C/W SOT23-8 200 °C/W SO-8 150 °C/W (1)VOS is defined as the average of the positive and the negative switching thresholds. (2)The difference between IB+ and IB−. (3)Propagation delay cannot be accurately measured with low overdrive on automatic test equipment. This parameter is ensured by characterization and testing at 100mV overdrive. (4)The difference between the propagation delay going high and the propagation delay going low. (5)Measured between 10% of VS and 90% of VS. (6)When the shutdown pin is within 0.9V of the most positive supply, the part is disabled. When it is more than 1.7V below the most positive supply, the part is enabled.

/C0084/C0076/C0086/C0051/C0053/C0048/C0049 /C0084/C0076/C0086/C0051/C0053/C0048/C0050 SBOS321D − MARCH 2005 − REVISED JULY 2005 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C, VS = +5V, and Input Overdrive = 100mV, unless otherwise noted. VOUT (V) V IN (V) OUTPUT RESPONSE FOR VARIOUS OVERDRIVE VOLTAGES (rising) −10 40 10 20 300 Time (ns) Input VOD = 100mV VOD = 50mV VOD = 20mV VOD =5 m V VOUT (V) V IN (V) OUTPUT RESPONSE FOR VARIOUS OVERDRIVE VOLTAGES (falling) −10 40 10 20 300 Time (ns) Input VOD = 100mV VOD = 50mV VOD =2 0 m V VOD =5 m V 5.0 4.5 4.0 3.5 3.0 Propagation Delay (ns) PROPAGATION DELAY vs TEMPERATURE (VOD =2 0 m V ) Rise Fall Temperature (/C0095C) −40 100 125−25 0 25 50 75 5.0 4.5 4.0 3.5 3.0 Propagation Delay (ns) PROPAGATION DELAY vs TEMPERATURE (VOD =5 0 m V ) Rise Fall Temperature (/C0095C) −40 100 125−25 0 25 50 75 Propagation Delay (ns) PROPAGATION DELAY vs CAPACITIVE LOAD (VOD = 20mV) Rise Fall Capacitive Load (pF) 01 0 0 20 40 60 80 PROPAGATION DELAY vs CAPACITIVE LOAD (VOD = 50mV) Rise Fall Propagation Delay (ns) Capacitive Load (pF) 01 0 0 20 40 60 80

/C0084/C0076/C0086/C0051/C0053/C0048/C0049 /C0084/C0076/C0086/C0051/C0053/C0048/C0050 SBOS321D − MARCH 2005 − REVISED JULY 2005 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = +5V, and Input Overdrive = 100mV, unless otherwise noted. Propagation Delay (ns) PROPAGATION DELAY vs SUPPLY VOLTAGE (VCM =1 V ,VOD = 20mV) 26 453 Supply Voltage (V) Rise Fall 110 Wake−Up Delay (ns) WAKE−UP DELAY vs TEMPERA TURE T emperature (/C0095C) −40 100 125−2 5 0 2 55 07 5 −10 VOUT (V) V IN (mV) RESPONSE TO 50MHz SINE WAVE (VDD =5 V ,VIN = 20mV PP ) 0 100 40 60 8020 Time (ns) VOUT (V) V IN (mV) RESPONSE TO 100MHz SINE WAVE (±2.5V dual supply into 50Ωoscilloscope input) Time (ns) 500 −500 0 2 4 6 8 10 12 14 16 18 20 4.0 3.8 3.6 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 Quiescent Current (mA) QUIESCENT CURRENT vs SUPPL Y VOLTAGE 26 453 Supply Voltage (V) 4.0 3.8 3.6 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 Quiescent Current (mA) QUIESCENT CURRENT vs TEMPERATURE −40 −25 0 125 50 75 10025 T emperature (/C0095C)

/C0084/C0076/C0086/C0051/C0053/C0048/C0049 /C0084/C0076/C0086/C0051/C0053/C0048/C0050 SBOS321D − MARCH 2005 − REVISED JULY 2005 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = +5V, and Input Overdrive = 100mV, unless otherwise noted. 3.5 3.0 2.5 2.0 1.5 1.0 0.5 Quiescent Current (mA) QUIESCENT CURRENT vs SHUTDOWN VOLTAGE 05 2341 Shutdown Voltage (V) (from on to off) (from off to on) 2.7V (from on to off) 2.7V (from off to on) Quiescent Current (mA) QUIESCENT CURRENT vs FREQUENCY 0 100 40 60 8020 Frequency (MHz) C LOAD =0 . 5 p F C LOAD = 10pF C LOAD = 20pF C LOAD = 50pF

www.ti.com 11-Apr-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples TLV3501AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 TLV 3501 TLV3501AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 NXA TLV3501AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 NXA TLV3501AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 NXA TLV3501AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 NXA TLV3501AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 TLV 3501 TLV3501AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 TLV 3501 TLV3501AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 TLV 3501 TLV3502AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 TLV 3502 TLV3502AIDCNR ACTIVE SOT-23 DCN 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 NXC TLV3502AIDCNRG4 ACTIVE SOT-23 DCN 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 NXC TLV3502AIDCNT ACTIVE SOT-23 DCN 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 NXC TLV3502AIDCNTG4 ACTIVE SOT-23 DCN 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 NXC TLV3502AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 TLV 3502 TLV3502AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 TLV 3502 TLV3502AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 TLV 3502 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.

www.ti.com 11-Apr-2013 Addendum-Page 2 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLV3502 :

• Automotive: TLV3502-Q1 NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV3501AIDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 TLV3501AIDBVT SOT-23 DBV 6 250 180.0 180.0 18.0 TLV3501AIDR SOIC D 8 2500 367.0 367.0 35.0 TLV3502AIDCNR SOT-23 DCN 8 3000 195.0 200.0 45.0 TLV3502AIDCNT SOT-23 DCN 8 250 195.0 200.0 45.0 TLV3502AIDR SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2

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