TLBE1100B MARKTECH | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 10

Technical content

TL(BE,GTE,EGE)1100B(T11) 2006-06-01 1 TLBE1100B(T11), TLGTE1100B(T11), TLEGE1100B(T11) Panel Circuit Indicator

  • Surface-mount devices
  • Flat-top type
  • InGaN LEDs
  • High luminous intensity
  • Low drive current, high-intensity light emission
  • Colors: Blue λd=470nm(typ) Bluish Green λd=505nm(typ) Green λd=528nm(typ)
  • Pb free reflow soldering is possible
  • Applications: automotive use, message signboards, backlighting etc.
  • Standard embossed tape packing: T11 (2000/reel) 8-mm tape reel Color and Material Maximum Ratings (Ta = 25°C) Product Name Forward Current IF (mA) Please see Note 1 Reverse Voltage VR (V) Power Dissipation PD (mW) Operation Temperature Topr (°C) Storage Temperature Tstg (°C) TLBE1100B 129 TLGTE1100B 135 TLEGE1100B 30 4 132 −40~100 − 40~100 Note 1: Forward current derating TLBE1100B TLGTE1100B,TLEGE1100B Unit: mm JEDEC ― JEITA ― TOSHIBA 4-3R1 Weight: 0.035 g (typ.) Product Name Color Material TLBE1100B Blue TLGTE1100B Bluish green TLEGE1100B Green InGaN Ambient temperature Ta (°C) IF – Ta Allowable forward current I F ( m A ) 0 80 60 20 100 0 80 60 20 100 Ambient temperature Ta (°C) IF – Ta Allowable forward current I F ( m A ) For part availability and ordering information please call Toll Free: 800.984.5337 Website: www.marktechopto.com | Email: info@marktechopto.com

TL(BE,GTE,EGE)1100B(T11) 2006-06-01 2 Electrical Characteristics (Ta = 25°C) Forward Voltage VF Reverse Current IR Product Name Min Typ. Max I F Max V R TLBE1100B 2.8 3.2 4.3 TLGTE1100B 3.0 3.3 4.5 TLEGE1100B 2.9 3.4 4.4 20 10 4 Unit V mA µA V Optical Characteristics–1 (Ta = 25°C) Luminous Intensity IV Product Name Min Typ. Max I F Available Iv rank Please see Note 2 TLBE1100B 63 100 320 20 QA / RA / SA TLGTE1100B 160 300 800 20 SA / TA / UA TLEGE1100B 100 350 800 20 RA / SA / TA / UA Unit mcd mcd mcd mA Note 2: The specification as following table is used for Iv classification of LEDs in Toshiba facility. Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned. Iv rank Rank symbol Min Max QA 63 125 RA 100 200 SA 160 320 TA 250 500 UA 400 800 Unit mcd mcd Optical Characteristics–2 (Ta = 25°C) Emission Spectrum Peak Emission Wavelength λp ∆λ Dominant Wavelength λdProduct Name Min Typ. Max Typ. Min Typ. Max IF TLBE1100B ⎯ 468 ⎯ 25 463 470 477 TLGTE1100B ⎯ 496 ⎯ 30 496 505 514 TLEGE1100B ⎯ 523 ⎯ 35 518 528 537 Unit nm nm nm mA Note 3: Caution ESD withstand voltage according to MIL STD 883D, Method 3015.7 : ≥1000V When handling this LED, take the following measures to prevent the LED from being damaged or otherwise adversely affected. 1) Use a conductive tablemat and conductive floor mat, and ground the workbench and floor. 2) Operators handling laser diodes must be grounded via a high resistance (about 1MΩ). A conductive strap is good for this purpose. 3) Ground all tools including soldering irons.

TL(BE,GTE,EGE)1100B(T11) 2006-06-01 3 TLBE1100B 0.1 80 60 100 0.3 0.5 −20 0 40 IF = 20 mA Ta = 25°C 480 0.4 1.0 0.8 360 560 520 440400 600 0.6 0.2 Relative luminosity Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminosity I V Wavelength λ (nm) Relative Iv - λ 100 1 50 3 5 10 30 100 300 Ta = 25°C (typ.) Ta = 25°C Radiation pattern 30° 60° 90° 90° 30° 60° 80° 70° 50° 40° 20° 10° 70° 80° 50° 40° 20° 10° Ta = 25°C 100 3.0 3.4 (typ.) (typ.) (typ.) (typ.)

TL(BE,GTE,EGE)1100B(T11) 2006-06-01 4 TLGTE1100B Ta = 25°C 100 3.0 3.4 0.1 80 60 100 0.3 0.5 −20 0 40 IF = 20 mA Ta = 25°C 520 0.4 1.0 0.8 400 600 560 480440 640 0.6 0.2 Relative luminosity Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminosity I V Wavelength λ (nm) Relative Iv - λ Ta = 25°C Radiation pattern 30° 60° 90° 90° 30° 60° 80° 70° 50° 40° 20° 10° 70° 80° 50° 40° 20° 10° Ta = 25°C 1000 1 50 500 300 100 3 5 10 30 100 (typ.) (typ.) (typ.) (typ.) (typ.)

TL(BE,GTE,EGE)1100B(T11) 2006-06-01 5 TLEGE1100B Relative Iv - λ 0.1 80 60 100 0.3 0.5 −20 0 40 Ta = 25°C 1000 1 50 500 300 100 3 5 10 30 100 IF = 20 mA Ta = 25°C 520 0.4 1.0 0.8 400 600 560 480440 640 0.6 0.2 Relative luminosity Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminosity I V Wavelength λ (nm) Ta = 25°C Radiation pattern 30° 60° 90° 90° 30° 60° 80° 70° 50° 40° 20° 10° 70° 80° 50° 40° 20° 10° Ta = 25°C 100 3.0 3.4 (typ.) (typ.) (typ.) (typ.) (typ.)

TL(BE,GTE,EGE)1100B(T11) 2006-06-01 6 Packaging These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. This moisture proof bag may be stored unopene d within 12 months at the following conditions. Temperature: 5°C~30°C Humidity: 90% (max) 2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5°C to 30°C/60% RH or below. 3. If upon opening, the moisture in dicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60±5°C, for 12 to 24 hours. Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed. 4. Repeated baking can cause the pee ling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of laminate would be broken , the hermeticity would deteriorate. Therefore, do not throw or drop the packed devices. Mounting Method Soldering

  • Reflow soldering (example)
  • The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions.
  • Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package.
  • Second reflow soldering In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
  • Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron : 25 W Temperature : 300 °C or less Time : within 3 s
  • If the product needs to be performed by other soldering method (ex. wave soldering), please contact Toshiba sales representative. Recommended soldering pattern 1.65 1.15 2.41 Unit: mm 1.65 60~120 s 10 s max 240°C max 4°C/s max 140~160°C 4°C/s max Time (s) Package surface temperature ( °C) Temperature profile for Pb soldering (example) Time (s) Package surface temperature ( °C) Temperature profile for Pb-free soldering (example) 150~180°C 4°C/s max 5 s max 260°C max 4°C/s max 230°C 60~120 s (*) (*) (*) (*) (*) (*) (*) (*) max(*) max(*) max(*) 30~50s max(*) max(*)

TL(BE,GTE,EGE)1100B(T11) 2006-06-01 7 Cleaning When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition, using condition and etc. ASAHI CLEAN AK-225AES : (made by ASAHI GLASS) KAO CLEAN TROUGH 750H : (made by KAO) PINE ALPHA ST-100S : (made by ARAKAWA CHEMICAL) TOSHIBA TECHNOCARE : (made by GE TOSHIBA SILICONES) (FRW-17, FRW-1, FRV-100) Precautions when Mounting Do not apply force to the plastic part of the LED under high-temperature conditions. To avoid damaging the LED plastic, do not apply friction using a hard material. When installing the PCB in a product, ensure that the device does not come into contact with other cmponents. Tape Specifications 1. Product number format The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard Toshiba specifications) (1) Tape Type: T14 (4-mm pitch) (2) Example 2. Tape dimensions Unit: mm Symbol Dimension Tolerance Symbol Dimension Tolerance t 0.3 ±0.05 A 0 2.9 ±0.1 F 3.5 ±0.05 B 0 3.7 ±0.1 D1 1.5 ±0.1 K 0 2.3 ±0.1 TLBE1100B (T11) Tape type Toshiba product No. P D1 F E W Polarity t D

TL(BE,GTE,EGE)1100B(T11) 2006-06-01 8 3. Reel dimensions Unit: mm 4. Leader and trailer sections of tape Note1: Empty trailer section Note2: Empty leader section 9 ± 0.3 180 +0 φ60 φ13 11.4 ± 1.0 2 ± 0.5φ44 (Note 1) Leading part: 190 mm (min) 40 mm or more (Note 2) 40 mm or more

TL(BE,GTE,EGE)1100B(T11) 2006-06-01 9 5. Packing display (1) Packing quantity Reel 2,000 pcs Carton 10,000 pcs (2) Packing form: Each reel is sealed in an aluminum pack with silica gel. 6. Label format (1) Example: TLBE1100B (T11) P / N : TOSHIBA TYPE TLBE1100B ADDC (T11) Q’TY 2,000 pcs Lot Number Key code for TSB 32C 2000 (RANK SYMBOL) Use under 5-30degC/6-%RH within 168h SEAL DATE: [[G]]/RoHS COMPATIBLE DIFFUSED IN ***** *Y3804xxxxxxxxxxxxxxxxx* ASSEMBLED IN ***** (2) Label location Tape feel direction Label position Label position

  • Reel • Carton
  • The aluminum package in which the reel is supplied also has the label attached to center of one side.

TL(BE,GTE,EGE)1100B(T11) 2006-06-01 10

  • The information contained herein is subject to change without notice.
  • TOSHIBA is continually working to improve the quality an d reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inhe rent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within s pecified operating ranges as set forth in the most recent TOSHIBA products specific ations. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semicon ductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.
  • The TOSHIBA products listed in this document are inte nded for usage in general electronics applications (computer, personal equipment, office equipment, measuri ng equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunc tion or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control in struments, airplane or spaceship instruments, transportation instruments, traffic signa l instruments, combusti on control instruments, medical instruments, all types of safety devices, et c. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk.
  • The products described in this document shall not be used or embedded to any down stream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.
  • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. RESTRICTIONS ON PRODUCT USE