TLBD1050 MARKTECH | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 11
Technical content
TLBD1050(T20),TLEGD1050(T20) 2007-5-17 1 TOSHIBA LED Lamp Panel Circuit Indicator
- Ó3.6mmtransparent lens top type
- Colors : BlueÉd470 nm (typ.) : GreenÉd528 nm (typ.)
- Clear luminescence is obtained.
- High Operating Temperature
- Can be mounted using surface mounter.
- Reflow Soldering is possible.
- Standard Embossed Taping 8 mm pitch : T20(400pcs/Reel)
- Applications : message signboards, backlighting, amusement, etc Color and Material unitFmm JEDEC JEITA Product Name Color Material TLBD1050 Blue InGaN TLEGD1050 Green InGaN
TLBD1050(T20),TLEGD1050(T20) 2007-5-17 2 Maximum Ratings (Ta = 25°C) Electrical Characteristics (Ta = 25°C) Forward Voltage V F Reverse Current IR Product Name Min. Typ. Max IF Max. VR TLBD1050 2.7 3.3 4.0 TLEGD1050 2.7 3.3 4.0 20 10 4 Unit V mA µA V Product Name Forward Current IF(mA) Reverse Voltage VR(V) Power Dissipation PD(mW) Operating Temperature Topr() Storage Temperature Tstg() TLBD1050 30 4 120 − 40~85 − 40~110 TLEGD1050 30 4 120 − 40~100 − 40~110 Allowable forward current I F (mA) Ambient temperature Ta ( °C) IF – Ta 0 20 40 60 80 100 120
TLBD1050(T20),TLEGD1050(T20) 2007-5-17 3 Optical Characteristics-1 (Ta = 25°C) Luminous Intensity IV Product Name Min Typ Max IF Corresponding brightness rank signiNote 1j TLBD1050 153 400 20 | TLEGD1050 476 1300 20 | Unit mcd mcd mcd mA Note 1: The brightness rank classification executes based on the following rank table, and is classified by the reel. However, the delivery ratio of each classification is not defined. Optical Characteristics-2 (Ta = 25°C) Emission Spectrum Peak Emission Wavelength λ p Δ λ Dominant Wavelength λ d Product Name Min Typ Max Typ Min Typ Max IF TLBD1050 468 25 463 470 479 TLEGD1050 518 35 518 528 540 Unit nm nm nm mA Note 2: Caution
- ESD withstand voltage according to MIL STD 883D, Method 3015.7 : =1000V
- When handling this LED, take the following measures to prevent the LED from being damaged or otherwise adversely affected. 1) Use a conductive tablemat and conductive floor mat, and ground the workbench and floor. 2) Operators handling laser diodes must be grounded via a high resistance (about 1MO). A conductive strap is good for this purpose. 3) Ground all tools including soldering irons.
- This product is designed as general display light source usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application (ex. Light source for sensor , optical communication and etc) .
TLBD1050(T20),TLEGD1050(T20) 2007-5-17 4 TLBD1050 IF – VF 300 Ta = 25°C 400 500 600 700 0.4 0.6 0.8 1.0 0.2 100 Ta = 25°C Ta = 25°C Forward voltage V F (V) Forward current I F (mA) IV – Tc 0.1 100 0.3 0.5 − 20 0 Relative luminous intensity I V Case temperature Tc ( °C) Wavelength λ ( nm) Relative luminous intensity – wavelength Radiation pattern Relative luminous intensity IV – IF Ta = 25°C 1000 500 300 100 100 Luminous intensity I V (mcd) Forward current I F (mA)
TLBD1050(T20),TLEGD1050(T20) 2007-5-17 5 TLEGD1050 IF – VF 300 Ta = 25°C 400 500 600 700 0.4 0.6 0.8 1.0 0.2 100 5.0 Ta = 25°C Ta = 25°C Forward voltage V F (V) Forward current I F (mA) IV – Tc 0.1 100 0.3 0.5 − 20 0 Relative luminous intensity I V Case temperature Tc ( °C) Wavelength λ ( nm) Radiation pattern Relative luminous intensity IV – IF Ta = 25°C 100 10000 5000 3000 1000 300 500 100 Luminous intensity I V (mcd) Forward current I F (mA) Relative luminous intensity – wavelength
TLBD1050(T20),TLEGD1050(T20) 2007-5-17 6 Packaging These LED devices are packed in an aluminum envelope with silica gel and a moisture indicator to prevent moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions. Temperature: 5°C~30°C Humidity: 90% (max) 2. After the moisture-proof bag has been opened, the devices should be assembled within 72 hours in an environment of 5°C to 30°C/70% RH or below. 3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color changes to pink) or the expiration date has passed, the devices should be baked while packed in the tape reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60 ±5°C, for 12 to 24 hours. Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label. 4. Repeated baking may cause the peeling strength of the tape to change, leading to trouble in mounting. Also, be sure to prevent damage to the device from static electricity during the baking process. 5. Any breakage in the laminate packing material will cause the hermetically of the product to deteriorate. Do not toss or drop the packed devices. Mounting Method Soldering
- Reflow soldering (example)
- The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions.
- Perform the first reflow soldering in accordance with the above temperature profile and within 72 h ours of opening the package.
- Second time reflow In case of second reflow soldering should be performed within 72 h ours of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 5\`30°C, 70% RH max
- Do not perform flow soldering.
- Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron: Less than 25 W Temperature : Less than 350°C or less Time : within 3 s ( Up to 1time per place) 60~120 s 10 s max 240°C max 4°C/s max 140~160°C 4°C/s max Time (s) Package surface temperature ( °C) Temperature profile for Pb soldering (example) Time (s) Package surface temperature ( °C) Temperature profile for Pb-free soldering (example) 150~180°C 4°C/s max 5 s max 260°C max 4°C/s max 230°C 60~120 s (*) (*) (*) (*) (*) (*) (*) (*) max(*) max(*) max(*) 30~50s max(*) max(*)
TLBD1050(T20),TLEGD1050(T20) 2007-5-17 7 Recommended soldering pattern Cleaning When cleaning is required after soldering , Toshiba recommends the following cleaning solvents. Our dipping tests (carried out under the recommended conditions) confirm that these solvents have no effect on semiconductor devices. In selecting the cleaning solvent you will actually use, be sure to take into account the cleaning conditions and usage conditions. Cleaning Solvent Manufacturer ASAHI CLEAN AK -225AES ASAHI GLASS KAO CLEANTHROUGH 750H KAO PINE ALPHA ST -100S ARAKAWA CHEMICAL TOSHIBA TECHNOCARE GE TOSHIBA SILICONES (FRW -17, FRW-1, FRV-100) Precautions When Mounting Do not apply force to plastic parts of the LED under high-temperature conditions. The LED plastic is easily scratched. Avoid friction between plastic parts and hard objects or materials. When installing the PCB in a product, ensure that the device does not come into contact with other components. Tape Specifications This specification lays out the 8 mm pitch embossed-tape packing requirements for 5.2 mm (L) × 5.2 mm (W) × 4.0 mm (H) size surface-mount LED lamp. 1. Product number format The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (This method, however, does not apply to products whose electrical characteristics differ from standard Toshiba specifications.) (1) Tape Type: T20 (8-mm pitch) (2) Example Tape type 2. Related Matters (1) Electro-optical Characteristics Please refer to the each technical datasheet for electro -optical characteristics of tape packed products. (2) Handling Precautions Tape material protected against static electricity. However, static electricity m ay occur depending on quantity of charged static electricity and a device may attach to a tape, or a device may be unstable when peeling a tape cover. (a) In process, taping materials may sustain an electrostatic charge, use an ionizer to neutralize the ions. (b) For transport and temporary storage of devices, use containers (boxes, jigs, bags) that are made of anti-static materials or of materials that dissipate electrostatic electricity. 2.45 1.3 2.7 Unit: mm 2.45 TLBD1050 (T20) Toshiba product No.
TLBD1050(T20),TLEGD1050(T20) 2007-5-17 8 3. Tape Dimensions Unit in mm Symbol Dimension Tolerance Symbol Dimension Tolerance 4. Reel Dimensions Unit in mm A0 P D1 F E W POLARITY t D 13 ± 0.3 180 +0 − 4 φ 60 φ 13 15.4 ± 1.0 2 ± 0.5 φ 44
TLBD1050(T20),TLEGD1050(T20) 2007-5-17 9 5. Leader and Trailer Note1: Empty trailer section Note2: Empty leader section 6DPacking display iPjPacking quantity Tape type Reel Carton No. Item @ Reel A Silica gel B Indicator C Aluminum pack D Cushion E Carton iQjPacking form: Each reel is sealed in an aluminum pack with silica gel. Bar-code label A comment Bar-code label (Note 1) Leading part 190 mm (min) 40 mm or more (Note 2) 40 mm or more
TLBD1050(T20),TLEGD1050(T20) 2007-5-17 10 7DLabel format See below for how to decipher the Lot Number. P/NF TYPE TLBD1050 ADDC (T20) peTY 400pcs 400 TOSHIBA Lot. Number & Symbol for control (Rank symbol) Use under 5-30degC/70%RH within 72h mmGnn/ RoHS COMPATIBLE *(Y)380 400 Symbol for control SEALED May,17,2007 DIFFUSED IN USA ASSEMBLED IN JAPAN iQjLabel location *The Lot Number includes the following information. Example: 270
7 E 2 G → “Packaged May 17, 2007”
a: Domestic ID b: Last digit of the year (CE): “0” (Y2000), “1” (Y2001), “2” (Y2002) ~ “9” (Y2009) Repeated for each decade c: Month: “A” (Jan), “B” (Feb), “C” (Mar) ~ “L” (Dec) d: Decade of the month: “1” (First), “2” (Middle), “3” (Last) e: Day in d above: “A” (1st), “B” (2nd), “C” (3rd) ~ “J” (9th), “K” (10th) “L” denotes the 31st of the month “I” is not used to denote a day in this date system Tape reel direction Label position Label position
- Reel • Carton
- The aluminum package in which the reel is supplied also has a copy of the label attached to the center of one side.
TLBD1050(T20),TLEGD1050(T20) 2007-5-17 11
- The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent righ ts of TOSHIBA or others.
- TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physica l stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system , and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “ Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
- The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ( “Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transport ation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk.
- TOSHIBA products s hould not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations.
- GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. 030619EAC RESTRICTIONS ON PRODUCT USE