TLA08AAA NSC | Alldatasheet
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e) OQ or % 9° 250 - . NOTE 3 om OO I | 1 (0.5) DIMENSIONS ARE IN MILLIMETERS | DIMENSIONS IN ( ) FOR REFERENCE ONLY = (0.5) & a x LAND PATTERN RECOMMENDATION = X3 = SYMM 0.125 or TOP SIDE COATING 0.050 [ | NOTE 1 | BUMP * NOTE 2 | SYMM sn - | - “p57 & xt | 0.5 i 1 ' 19-06-07 Cc B A BUMP Al CORNER SILICON 0.265 ' : NOTE 4 0.215 OTES: UNLESS OTHERWISE SPECIFIED [@]0.005© |c[A© [B© 1. EPOXY COATING 2. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com). 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN A1_ 1S ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT - - TO TEXT ORIENTATION Tie & National Semiconductor 5. XXX_IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION THIN MICRO SMD, WHERE X1 1S PACKAGE WIDTH, X2 1S$ PACKAGE LENGTH AND X3 1S 8 BUMP(LARGE), PACKAGE HEIGHT (SEE TABLE, SHEET 2) rT | 4 0.5mm PITCH 6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION DD. | oS [ts [ro [cscownr-reaoaeax | c| im
[ey] bescmierion——SSCid meer | OS PACKAGE DIMENSIONS X41 X1 PACKAGE WIDTH X2 X2 PACKAGE LENGTH X3 X3 PACKAGE HEIGHT DESIGNATOR (430 um) DESIGNATOR (+30 um) DESIGNATOR (+75 4m) Poe te 00 a ~ >; = De Po 90590 a = = a a == 2 © = 1; po RS R895 THIN MICRO SMD,
8 BUMP(LARGE),
ee 0.5mm PITCH Ss Nanemmmemes hu