TL851CD

TL851CDR TI1 | Alldatasheet

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SLSS004 – SEPTEMBER 1983 – REVISED MARCH 1988 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Designed for Use With the TL852 in Sonar Ranging Modules Like the SN28827 /C0068Operates With Single Supply /C0068Accurate Clock Output for External Use /C0068Synchronous 4-Bit Gain Control Output /C0068Internal 1.2-V Level Detector for Receive /C0068TTL-Compatible /C0068Interfaces to Electrostatic or Piezoelectric Transducers

description

The TL851 is an economical digital I2L ranging control integrated circuit designed for use with the Texas Instruments TL852 sonar ranging receiver integrated circuit. The TL851 is designed for distance measurement from six inches to 35 feet. The device has an internal oscillator that uses a low-cost external ceramic resonator. With a simple interface and a 420-kHz ceramic resonator, the device will drive a 50-kHz electrostatic transducer. The device cycle begins when Initiate (INIT) is taken to the high logic level. There must be at least 5 ms from initial power-up (V CC ) to the first initiate signal in order for all the device internal latches to reset and for the ceramic-resonator-controlled oscillator to stabilize. The device will transmit a burst of 16 pulses each time INIT is taken high. The oscillator output (OSC) is enabled by INIT. The oscillator frequency is the ceramic resonator frequency divided by 8.5 for the first 16 cycles (during transmit) and then the oscillator frequency changes to the ceramic resonator frequency divided by 4.5 for the remainder of the device cycle. When used with an external 420-kHz ceramic resonator, the device internal blanking disables the receive input (REC) for 3.8 ms after initiate to exclude false receive inputs that may be caused by transducer ringing. The internal blanking feature also eliminates echos from objects closer than 1.3 feet from the transducer. If it is necessary to detect objects closer than 1.3 feet, then the internal blanking may be shortened by taking the blanking inhibit (BINH) high, enabling the receive input. The blanking input (BLNK) may be used to disable the receive input and reset ECHO to a low logic level at any time during the device cycle for selective echo exclusion or for a multiple-echo mode of operation. The device provides a synchronous 4-bit gain control output (12 steps) designed to control the gain of the TL852 sonar ranging receiver integrated circuit. The digital gain control waveforms are shown in Figure 2 with the nominal transition times from INIT listed in the Gain Control Output Table. The threshold of the internal receive level detector is 1.2 V. The TL851 operates over a supply voltage range of 4.5 V to 6.8 V and is characterized for operation from 0°C to 40°C. Copyright  1988, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. VCC XMIT GND GCD GCA GCB GCC REC BLNK BINH INIT FILT XTAL2 XTAL1 OSC ECHO N PACKAGE (TOP VIEW)

SLSS004 – SEPTEMBER 1983 – REVISED MARCH 1988

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

NUMBER GCD GCC GCB GCA TIME (ms) FROM INITIATE↑† L L L L L L L L H H H H L L L L H H H H L L L L L L L H L L H H L L H H L H L H L H L H L H L H 2.38 ms 5.12 ms 7.87 ms 10.61 ms 13.35 ms 16.09 ms 18.84 ms 21.58 ms 27.07 ms 32.55 ms 38.04 ms INIT ↓ † This is the time to the end of the indicated step and assumes a nominal 420-kHz ceramic resonator. functional block diagram Transmit EnableCT ≤16 CT > 16CLR Gain Step Counter + 8.5 + 4.5 CLR Frequency Divider G 420-kHz Oscillator S R S R Blanking Latch 1.2 V Echo Latch ECHO GCA GCB GCC GCD OSC XMIT VCCFILT XTAL1 XTAL2 INIT BINH BLNK REC GND Internal Blanking Filtered Supply CT ≥ 208

SLSS004 – SEPTEMBER 1983 – REVISED MARCH 1988 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond those indicated in the recommended operating conditions section of this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: For operation above 25°C, derate linearly at the rate of 9.2 mW/°C. recommended operating conditions MIN MAX UNIT Supply voltage, VCC 4.5 6.8 V High-level input voltage, VIH BLNK, BINH, INIT 2.1 V Low-level input voltage, VIL BLNK, BINH, INIT 0.6 V Delay time, power up to INIT high 5 ms Operating free-air temperature, TA 0 40 °C electrical characteristics over recommended ranges of supply voltage and operating free-air temperature PARAMETER TEST CONDITIONS MIN TYP ‡ MAX UNIT Input current BLNK, BINH, INIT VI = 2.1 V 1 mA High-level output current, IOH ECHO, OSC, GCA, GCB, GCC, GCD VOH = 5.5 V 100 mA Low-level output current, IOH ECHO, OSC, GCA, GCB, GCC, GCD IOL = 1.6 mA 0.4 V On-state output current SMIT output VO = 1 V –140 mA Internal blanking interval REC input 2.38§ ms Frequency during 16pulse transmitperiod OSC output 49.4§ kHzFrequency during 16-pulse transmit period XMIT output 49.4§ kHz Frequency after 16pulse transmitperiod OSC output 93.3§ kHzFrequency after 16-pulse transmit period XMIT output 0 kHz Supply current ICC During transmit period 260 mASupply current, ICC After transmit period 55 mA ‡ Typical values are at VCC = 5 V and TA = 25°C. § These typical values apply for a 420-kHz ceramic resonator.

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Figure 1. Digital Gain Control Waveforms

16 Pulses

Figure 2. Example of Single-Echo-Mode Cycle When Used With the

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TL851CD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL851CN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL851CN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL851CNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL851CNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI PACKAGE OPTION ADDENDUM www.ti.com 31-Jul-2006 Addendum-Page 1

to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 31-Jul-2006 Addendum-Page 2

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL851CDR SOIC D 16 2500 367.0 367.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2

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