TL712_06 TI | Alldatasheet

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/C0084/C0076/C0055/C0049/C0050 /C0068/C0073/C0070/C0070/C0069/C0082/C0069/C0078/C0084/C0073/C0065/C0076 /C0067/C0079/C0077/C0080/C0065/C0082/C0065/C0084/C0079/C0082 SLCS002D − JUNE 1983 − REVISED AUGUST 2003 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Operates From a Single 5-V Supply /C00680-V to 5.5-V Common-Mode Input Voltage Range /C0068Self-Biased Inputs /C0068Complementary 3-State Outputs /C0068Enable Capability /C0068Hysteresis...5 m V T y p /C0068Response Times . . . 25 ns Typ description/ordering information The TL712 is a high-speed comparator fabricated with bipolar Schottky process technology. The circuit has differential analog inputs and complementary 3-state TTL-compatible logic outputs with symmetrical switching characteristics. When the output enable (OE) is low, both outputs are in the high-impedance state. This device operates from a single 5-V supply and is useful as a disk memory read-chain data comparator.

ORDERING INFORMATION

TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP (P) Tube of 50 TL712CP TL712CP SOIC (D) Tube of 75 TL712CD TL712C 0°C to 70°C SOIC (D) Reel of 2500 TL712CDR TL712C 0°C to 70°C SOP (PS) Reel of 2000 TL712CPSR T712 TSSOP (PW) Tube of 150 TL712CPW T712TSSOP (PW) Reel of 2000 TL712CPWR T712 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. symbol (positive logic) OE IN− IN+ OUT− OUT+ Copyright  2003, Texas Instruments Incorporated/C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 NC IN− IN+ OE VCC OUT− OUT+ GND D, P, PS, OR PW PACKAGE (TOP VIEW) NC−No internal connection Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

/C0084/C0076/C0055/C0049/C0050 /C0068/C0073/C0070/C0070/C0069/C0082/C0069/C0078/C0084/C0073/C0065/C0076 /C0067/C0079/C0077/C0080/C0065/C0082/C0065/C0084/C0079/C0082 SLCS002D − JUNE 1983 − REVISED AUGUST 2003

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schematics of inputs and outputs EQUIVALENT OF EACH DIFFERENTIAL INPUT VCC Input 4 kΩ Nom 960 Ω Nom 960 Ω Nom VCC 8.3 kΩ Nom OE VCC 85 Ω Nom Output EQUIVALENT OF EACH ENABLE INPUT TYPICAL OF ALL OUTPUTS absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the “recommended operating conditions” section of this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to the network ground. 2. Differential voltage values are at IN+ with respect to IN−. 3. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 4. The package thermal impedance is calculated in accordance with JESD 51-7.

/C0084/C0076/C0055/C0049/C0050 /C0068/C0073/C0070/C0070/C0069/C0082/C0069/C0078/C0084/C0073/C0065/C0076 /C0067/C0079/C0077/C0080/C0065/C0082/C0065/C0084/C0079/C0082 SLCS002D − JUNE 1983 − REVISED AUGUST 2003 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 recommended operating conditions MIN NOM MAX UNIT VCC Supply voltage 4.75 5 5.25 V VIC Common-mode input voltage 0 5.5 V IOH High-level output current −1 mA IOL Low-level output current 16 mA TA Operating free-air temperature 0 70 °C electrical characteristics at VCC = 5 V, TA = 25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VT Threshold voltage (VT+ and VT− ) VICR = 0 to 5 V −100† 100 mV Vhys Hysteresis (VT+ − VT− ) 5 mV VOH High-level output voltage VID = 100 mV, IOH = −1 mA 2.7 3.5 V VOL Low-level output voltage VID = − 100 mV, IOL = 16 mA 0.4 0.5 V IOZ Off-state output current VO = 2.4 V −20 µA II Enable current VI = 5.5 V 100 µA IIH High-level enable current VIH = 2.7 V 20 µA IIL Low-level enable current VIL = 0.4 V −360 µA ri Differential input resistance 4 kΩ ro Output resistance 100 Ω IOS Short-circuit output current −15 −85 mA ICC Supply current VID = 0, No load 17 20 mA † The algebraic convention, where the more-negative limit is designated as minimum, is used in this data sheet for input threshold voltage levels only. switching characteristics, VCC = 5 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT tPLH Propagation delay time, low-to-high-level output TTL load, See Note 5 and Figure 1 25 ns tPHL Propagation delay time, high-to-low-level output TTL load, See Note 5 and Figure 1 25 ns NOTE 5: The response time specified is for a 100-mV input step with 5-mV overdrive (105 mV total) and is the interval between the input step function and the instant when the output crosses 2.5 V.

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NOTE A: All diodes are 1N4148 or equivalent. Figure 1. TTL Output Load Circuit

/C0084/C0076/C0055/C0049/C0050 /C0068/C0073/C0070/C0070/C0069/C0082/C0069/C0078/C0084/C0073/C0065/C0076 /C0067/C0079/C0077/C0080/C0065/C0082/C0065/C0084/C0079/C0082 SLCS002D − JUNE 1983 − REVISED AUGUST 2003 5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYPICAL CHARACTERISTICS VO 50 Ω 50 Ω VIC 0 40 80 120 140 1.7 1.65 1.6 1.55 1.5 t − Time − ns COMMON-MODE PULSE RESPONSE VO − Output Voltage − V V IC− Common-Mode Input Voltage VCC = 5 V TA = 25°C 20 60 100 160 Figure 4

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TL712CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL712CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL712CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL712CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL712CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL712CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL712CPSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL712CPSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL712CPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL712CPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL712CPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL712CPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 Addendum-Page 1

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 Addendum-Page 2

MPDI001A – JANUARY 1995 – REVISED JUNE 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.015 (0,38) Gage Plane 0.325 (8,26) 0.300 (7,62) 0.010 (0,25) NOM MAX 0.430 (10,92) 4040082/D 05/98 0.200 (5,08) MAX 0.125 (3,18) MIN 0.355 (9,02) 0.020 (0,51) MIN 0.070 (1,78) MAX 0.240 (6,10) 0.260 (6,60) 0.400 (10,60) 0.015 (0,38) 0.021 (0,53) Seating Plane M0.010 (0,25) 0.100 (2,54) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

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