TL4050A20QDBZTQ1

TL4050-Q1 Precision Micropower Shunt Voltage Reference (Rev. F)

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SLOS588,F]
• PDF pages: 20

Technical content

DCK (SC-70) PACKAGE (TOP VIEW) ANODE NC CATHODE NC NC NC – No internal connection DBZ (SOT-23-3) PACKAGE (TOP VIEW) /c171Pin 3 is attached to Substrate and must be connected to ANODE or left open. TL4050-Q1 www.ti.com SLOS588F –JUNE 2008–REVISED APRIL 2013 PRECISIONMICROPOWERSHUNTVOLTAGEREFERENCE Check forSamples: TL4050-Q1 1FEATURES CapacitorRequired

• AvailableinExtended Temperature Range:• QualifiedforAutomotive Applications –40°C to125°C• FixedOutput Voltagesof2.048V,2.5V, 4.096V,5 V APPLICATIONS• TightOutput Tolerancesand Low Temperature
• Data-AcquisitionSystemsCoefficient
• Power Suppliesand Power-Supply Monitors– Max 0.1%,50 ppm/ °C – A Grade
• Instrumentationand TestEquipment– Max 0.2%,50 ppm/ °C – B Grade
• Process Controls– Max 0.5%,50 ppm/ °C – C Grade
• PrecisionAudio• Low Output Noise:41 μVRMS Typ
• Automotive Electronics• Wide OperatingCurrentRange: 60 μA Typ to15 mA • Energy Management
• StableWith AllCapacitiveLoads; No Output • Battery-PoweredEquipment

DESCRIPTION

The TL4050-Q1 familyofshuntvoltagereferencesareversatileeasy-to-usereferencessuitablefora wide array ofapplications.The two-terminalfixed-outputdevicerequiresno externalcapacitorsforoperationand isstable with allcapacitiveloads.Additionally,the referenceofferslow dynamic impedance, low noise,and low temperaturecoefficientto ensure a stableoutputvoltageover a wide range of operatingcurrentsand temperatures. The TL4050-Q1 is availablein threeinitialtolerances,rangingfrom 0.1% (maximum) forthe A grade to 0.5% (maximum) fortheC grade.Thus,a greatdealofflexibilityisavailabletodesignersinchoosingthebest cost-to-performanceratiofortheirapplications.Packaged inthe space-savingSOT-23-3 and SC-70 packages and requiringa minimum currentof45 μA (typical),theTL4050-Q1 alsoisidealforportableapplications. The TL4050x-Q1 characterizationisforoperationoveran ambienttemperaturerangeof–40°C to125°C. PACKAGE AND ORDERING INFORMATION For themost-currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthis document,orsee theTIWeb siteatwww.ti.com. Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com/packaging. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2008–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SLOS588F –JUNE 2008–REVISED APRIL 2013 www.ti.com FUNCTIONAL BLOCK DIAGRAM ABSOLUTE MAXIMUM RATINGS (1) overfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT IZ Continuouscathodecurrent –10 20 mA TJ Operatingvirtualjunctiontemperature 150 °C Tstg Storagetemperaturerange –65 150 °C (1) Stressesbeyond thoselistedunderAbsoluteMaximum Ratingsmay cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunderRecommended Operating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability.

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www.ti.com SLOS588F –JUNE 2008–REVISED APRIL 2013 THERMAL INFORMATION TL4050-Q1 THERMAL METRIC (1) DBZ DCK UNIT

3 PINS 5 PINS

θJA Junction-to-ambientthermalresistance(2) 331.1 289.9 °C/W θJCtop Junction-to-case(top)thermalresistance(3) 107.5 56.4 °C/W θJB Junction-to-boardthermalresistance(4) 63.4 93 °C/W ψJT Junction-to-topcharacterizationparameter(5) 4.9 0.7 °C/W ψJB Junction-to-boardcharacterizationparameter(6) 61.7 91.4 °C/W θJCbot Junction-to-case(bottom)thermalresistance(7) N/A N/A °C/W (1) Formore informationabouttraditionaland new thermalmetrics,see theIC Package ThermalMetricsapplicationreport,SPRA953 . (2) The junction-to-ambientthermalresistanceundernaturalconvectionisobtainedina simulationon a JEDEC-standard,high-Kboard,as specifiedinJESD51-7,inan environmentdescribedinJESD51-2a. (3) The junction-to-case(top)thermalresistanceisobtainedby simulatinga coldplateteston thepackage top.No specificJEDEC- standardtestexists,buta closedescriptioncan be foundintheANSI SEMI standardG30-88. (4) The junction-to-boardthermalresistanceisobtainedby simulatinginan environmentwitha ringcoldplatefixturetocontrolthePCB temperature,as describedinJESD51-8. (5) The junction-to-topcharacterizationparameter,ψJT,estimatesthejunctiontemperatureofa deviceina realsystemand isextracted fromthesimulationdataforobtainingθJA,usinga proceduredescribedinJESD51-2a (sections6 and 7). (6) The junction-to-boardcharacterizationparameter,ψJB,estimatesthejunctiontemperatureofa deviceina realsystemand isextracted fromthesimulationdataforobtainingθJA ,usinga proceduredescribedinJESD51-2a (sections6 and 7). (7) The junction-to-case(bottom)thermalresistanceisobtainedby simulatinga coldplateteston theexposed (power)pad.No specific JEDEC standardtestexists,buta closedescriptioncan be foundintheANSI SEMI standardG30-88. Spacer RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT IZ Cathode current (1) 15 mA Itemperature –40 85 TA Free-airtemperature °C Q temperature –40 125 (1) See parametrictables Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3

/C0068VZ /C0068IZ TL4050-Q1 SLOS588F –JUNE 2008–REVISED APRIL 2013 www.ti.com TL4050x20-Q1 ELECTRICAL CHARACTERISTICS atextendedtemperaturerange,fullrangeTA = –40°C to125°C (unlessotherwisenoted) TL4050A20-Q1 TL4050B20-Q1 TL4050C20-Q1 PARAMETER TEST CONDITIONS TA UNIT MIN TYP MAX MIN TYP MAX MIN TYP MAX Reverse VZ breakdown IZ = 100 μA 25°C 2.048 2.048 2.048 V voltage 25°C 41 60 41 60 41 60Minimum IZ,min cathode μAFull 65 65 65current range IZ = 10 mA 25°C ±20 ±20 ±20Average temperature IZ = 1 mA 25°C ±15 ±15 ±15 coefficientofαVZ ppm/°C25°C ±15 ±15 ±15reverse breakdown IZ = 100 μA Full ±50 ±50 ±50voltage range IZ,min < IZ < 1 mAbreakdown Full 1.2 1.2 1.2voltage range change with mV 25°C 2.3 6 2.3 6 2.3 6cathode current 1 mA < IZ < 15 mA Full 8 8 8change range Reverse IZ = 1 mA, ZZ dynamic f= 120 Hz, 25°C 0.3 0.3 0.3 Ω impedance IAC = 0.1IZ Wideband IZ = 100 μA,eN 25°C 34 34 34 μVRMSnoise 10 Hz ≤ f≤ 10 kHz Long-term stabilityof t= 1000 h, reverse TA = 25°C ± 0.1°C, 120 120 120 ppm breakdown IZ = 100 μA voltage ThermalVHYST ΔTA = –40°C to125°C 0.7 0.7 0.7 mVhysteresis(1) (1) Thermalhysteresisisdefinedas VZ,25°C (aftercyclingto–40°C) – VZ,25°C (aftercyclingto125°C).

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/C0068VZ /C0068IZ TL4050-Q1 www.ti.com SLOS588F –JUNE 2008–REVISED APRIL 2013 TL4050x25-Q1 ELECTRICAL CHARACTERISTICS atextendedtemperaturerange,fullrangeTA = –40°C to125°C (unlessotherwisenoted) TL4050B25-Q1 PARAMETER TEST CONDITIONS TA UNIT MIN TYP MAX VZ Reversebreakdown voltage IZ = 100 μA 25°C 2.5 V 25°C –5 5Reversebreakdown voltageΔVZ IZ = 100 μA mVtolerance Fullrange –18 18 25°C 41 60 IZ,min Minimum cathodecurrent μA Fullrange 65 IZ = 10 mA 25°C ±20 Averagetemperature IZ = 1 mA 25°C ±15 αVZ coefficientofreverse ppm/°C 25°C ±15breakdown voltage IZ = 100 μA Fullrange ±50 25°C 0.3 0.8 IZ,min < IZ < 1 mAReversebreakdown voltage Fullrange 1.2 change withcathode mV 25°C 2.3 6currentchange 1 mA < IZ < 15 mA Fullrange 8 IZ = 1 mA,ReversedynamicZZ f= 120 Hz, 25°C 0.3 Ωimpedance IAC = 0.1IZ IZ = 100 μA,eN Wideband noise 25°C 41 μVRMS10 Hz ≤ f≤ 10 kHz t= 1000 h,Long-termstabilityof TA = 25°C ± 0.1°C, 120 ppmreversebreakdown voltage IZ = 100 μA VHYST Thermalhysteresis(1) ΔTA = –40°C to125°C 0.7 mV (1) Thermalhysteresisisdefinedas VZ,25°C (aftercyclingto–40°C) – VZ,25°C (aftercyclingto125°C). Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5

/C0068VZ /C0068IZ TL4050-Q1 SLOS588F –JUNE 2008–REVISED APRIL 2013 www.ti.com TL4050x41-Q1 ELECTRICAL CHARACTERISTICS atextendedtemperaturerange,fullrangeTA = –40°C to125°C (unlessotherwisenoted) TL4050B41-Q1 PARAMETER TEST CONDITIONS TA UNIT MIN TYP MAX VZ Reversebreakdown voltage IZ = 100 μA 25°C 4.096 V 25°C –8.2 8.2Reversebreakdown voltageΔVZ IZ = 100 μA mVtolerance Fullrange –29 29 25°C 52 68 IZ,min Minimum cathodecurrent μA Fullrange 78 IZ = 10 mA 25°C ±30 Averagetemperature IZ = 1 mA 25°C ±20 αVZ coefficientofreverse ppm/°C 25°C ±20breakdown voltage IZ = 100 μA Fullrange ±50 25°C 0.2 0.9 IZ,min < IZ < 1 mAReversebreakdown voltage Fullrange 1.2 change withcathode mV 25°C 2 7currentchange 1 mA < IZ < 15 mA Fullrange 10 IZ = 1 mA,ReversedynamicZZ f= 120 Hz, 25°C 0.5 Ωimpedance IAC = 0.1IZ IZ = 100 μA,eN Wideband noise 25°C 93 μVRMS10 Hz ≤ f≤ 10 kHz t= 1000 h,Long-termstabilityof TA = 25°C ± 0.1°C, 120 ppmreversebreakdown voltage IZ = 100 μA VHYST Thermalhysteresis(1) ΔTA = –40°C to125°C 1.148 mV (1) Thermalhysteresisisdefinedas VZ,25°C (aftercyclingto–40°C) – VZ,25°C (aftercyclingto125°C).

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/C0068VZ /C0068IZ TL4050-Q1 www.ti.com SLOS588F –JUNE 2008–REVISED APRIL 2013 TL4050x50-Q1 ELECTRICAL CHARACTERISTICS atextendedtemperaturerange,fullrangeTA = –40°C to125°C (unlessotherwisenoted) TL4050A50-Q1 TL4050B50-Q1 TL4050C50-Q1 PARAMETER TEST CONDITIONS TA UNIT MIN TYP MAX MIN TYP MAX MIN TYP MAX Reverse VZ breakdown IZ = 100 μA 25°C 5 5 5 V voltage 25°C –5 5 –10 10 –25 25Reverse ΔVZ breakdown IZ = 100 μA mVFull –30 30 –35 35 –50 50voltagetolerance range 25°C 56 74 56 74 56 74 MinimumIZ,min μAFullcathodecurrent 90 90 90range IZ = 10 mA 25°C ±30 ±30 ±30Average temperature IZ = 1 mA 25°C ±20 ±20 ±20 coefficientofαVZ ppm/°C25°C ±20 ±20 ±20reverse breakdown IZ = 100 μA Full ±50 ±50 ±50voltage range 25°C 0.2 1 0.2 1 0.2 1 IZ,min < IZ < 1 mAReverse Full 1.4 1.4 1.4breakdown range voltagechange mV 25°C 2 8 2 8 2 8withcathode currentchange 1 mA < IZ < 15 mA Full 12 12 12range IZ = 1 mA,ReversedynamicZZ f= 120 Hz, 25°C 0.5 0.5 0.5 Ωimpedance IAC = 0.1IZ IZ = 100 μA,eN Wideband noise 25°C 93 93 93 μVRMS10 Hz ≤ f≤ 10 kHz Long-term stabilityof t= 1000 h, reverse TA = 25°C ± 0.1°C, 120 120 120 ppm breakdown IZ = 100 μA voltage ThermalVHYST ΔTA = –40°C to125°C 1.4 1.4 1.4 mVhysteresis(1) (1) Thermalhysteresisisdefinedas VZ,25°C (aftercyclingto–40°C) – VZ,25°C (aftercyclingto125°C). Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7

Reverse Voltage (V) Reverse Current – A V = 2.5 VKA V = 10 VKA 1 10 100 1k 10k 100k Frequency – Hz V = 10 VKA V = 2.5 VKA Noise Voltage – µV/ Hz /c214 0.1 100 1000 100 1k 10k 100k 1M Frequency – Hz Output Impedance – /c87 I = I + 100 µAZ Z(MIN) V = 10 VKA V = 2.5 VKA 0.1 100 1000 100 1k 10k 100k 1M Frequency – Hz Output Impedance – /c87 I = 1 mAZ V = 10 VKA V = 2.5 VKA TL4050-Q1 SLOS588F –JUNE 2008–REVISED APRIL 2013 www.ti.com TYPICAL CHARACTERISTICS OUTPUT IMPEDANCE OUTPUT IMPEDANCE versus versus FREQUENCY FREQUENCY Figure1. Figure2. REVERSE CHARACTERISTICS NOISE VOLTAGE AND versus MINIMUM OPERATING CURRENT FREQUENCY Figure3. Figure4.

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-100 0 100 200 300 400 V = 10 VKA Time – µs Voltage – V -20 0 20 40 60 80 Time – µs Voltage – V V = 2.5 VKA TL4050-Q1 www.ti.com SLOS588F –JUNE 2008–REVISED APRIL 2013 TYPICAL CHARACTERISTICS (continued) LARGE SIGNAL PULSE RESPONSE LARGE SIGNAL PULSE RESPONSE Figure5. Figure6. Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9

2.2 /c109F CLK DB0 DB1 DB2 DB3 DB4 VDIG BUSY WR CS RD 3.2-MHz Clock BUSY Output Write Input Read Input 5-V Analog Supply 10 /c109F + +0.1 /c109F ADS7842 TL4050B41-Q1 909

0 V to VREF

SLOS588F –JUNE 2008–REVISED APRIL 2013 www.ti.com

APPLICATION INFORMATION

Figure7. Start-UpTestCircuit Output Capacitor The TL4050-Q1 does not requirean outputcapacitoracrosscathodeand anode forstability.However, inan applicationusingan outputbypasscapacitor,theTL4050-Q1 isstablewithallcapacitiveloads. SOT-23-3 Pin Connections There isa parasiticSchottkydiodeconnectedbetween pins2 and 3 oftheSOT-23-3 packaged device.Thus, pin3 oftheSOT-23-3 package must be leftfloatingorconnectedtopin2. Use With ADCs or DACs The designoftheTL4050x41-Q1 isas a cost-effectivevoltagereference,as requiredin12-bitdata-acquisition systems.For 12-bitsystemsoperatingfrom5-V supplies,such as theADS7842 (seeFigure8),theTL4050x41- Q1 (4.096V) permitsoperationwithan LSB of1 mV. Figure8. Data-AcquisitionCircuitWith TL4050x41-Q1

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/C0466V S /C0042V Z/C0467 (IL /C0041IZ) TL4050-Q1 www.ti.com SLOS588F –JUNE 2008–REVISED APRIL 2013 Cathode and Load Currents Ina typicalshunt-regulatorconfiguration(seeFigure9),an externalresistor,R S,connectsbetween thesupply and the cathodeof the TL4050-Q1. Properchoiceof R S isessential,as R S setsthe totalcurrentavailableto supplytheload(IL) and biastheTL4050-Q1 (IZ).Inallcases,IZ must staywithina specifiedrange forproper operationofthereference.Takingintoconsiderationone extremeinthevariationoftheloadand supplyvoltage (maximum IL and minimum VS),R S must be smallenough tosupplytheminimum IZ requiredforoperationofthe regulator,as givenby data-sheetparameters.At theotherextreme,maximum VS and minimum IL,R S must be largeenough tolimitIZ tolessthanitsmaximum-ratedvalueof15 mA. Equation1 calculatesR S: (1) Figure9. Shunt Regulator Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11

www.ti.com 15-Apr-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples TL4050A50QDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLGU TL4050A50QDCKRQ1 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 7GU TL4050B25QDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLHU TL4050B25QDCKRQ1 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 7HU TL4050B41QDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TMXU TL4050B50QDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TLJU TL4050B50QDCKRQ1 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 7JU TL4050C20QDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TMYU TL4050C50QDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 TKZU (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

www.ti.com 15-Apr-2013 Addendum-Page 2 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TL4050A50-Q1, TL4050B25-Q1, TL4050B41-Q1, TL4050B50-Q1, TL4050C50-Q1 :

• Catalog: TL4050A50 , TL4050B25 , TL4050B41 , TL4050B50 , TL4050C50 NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL4050A50QDBZRQ1 SOT-23 DBZ 3 3000 203.0 203.0 35.0 TL4050A50QDCKRQ1 SC70 DCK 5 3000 203.0 203.0 35.0 TL4050B25QDBZRQ1 SOT-23 DBZ 3 3000 203.0 203.0 35.0 TL4050B25QDCKRQ1 SC70 DCK 5 3000 203.0 203.0 35.0 TL4050B41QDBZRQ1 SOT-23 DBZ 3 3000 203.0 203.0 35.0 TL4050B50QDBZRQ1 SOT-23 DBZ 3 3000 203.0 203.0 35.0 TL4050B50QDCKRQ1 SC70 DCK 5 3000 203.0 203.0 35.0 TL4050C20QDBZRQ1 SOT-23 DBZ 3 3000 203.0 203.0 35.0 TL4050C50QDBZRQ1 SOT-23 DBZ 3 3000 203.0 203.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 Pack Materials-Page 2

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