TL3016CDR TI | Alldatasheet
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TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Ultrafast Operation. . . 7.6 ns (Typ) /C0068Low Positive Supply Current 10.6 mA (Typ) /C0068Operates From a Single 5-V Supply or From a Split ± 5-V Supply /C0068Complementary Outputs /C0068Low Offset Voltage /C0068No Minimum Slew Rate Requirement /C0068Output Latch Capability /C0068Functional Replacement to the LT1016
description
The TL3016 is an ultrafast comparator designed to interface directly to TTL logic while operating from either a single 5-V power supply or dual ± 5-V supplies. It features extremely tight offset voltage and high gain for precision applications. It has complementary outputs that can be latched using the LATCH ENABLE terminal. Figure 1 shows the positive supply current of this comparator. The TL3016 only requires 10.6 mA (typical) to achieve a propagation delay of 7.6 ns. The TL3016 is a pin-for-pin functional replace- ment for the LT1016 comparator, offering higher speed operation but consuming half the power. AVAILABLE OPTIONS PACKAGED DEVICES CHIP TA SMALL OUTLINE † (D) TSSOP (PW) CHIP FORM ‡ (Y) 0°C to 70°C TL3016CD TL3016CPWLE TL3016Y –40°C to 85°C TL3016ID TL3016IPWLE — † The PW packages are available left-ended taped and reeled only. ‡ Chip forms are tested at TA = 25°C only. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. VCC+ IN+ IN– VCC– Q OUT Q OUT GND LATCH ENABLE D AND PW PACKAGE (TOP VIEW) Figure 1 – 50 – 25 0 25 50 75 100 125 POSITIVE SUPPLY CURRENT vs FREE-AIR TEMPERATURE – Positive Supply Current – mAICC TA – Free-Air Temperature – °C symbol (each comparator) IN+ IN– Q OUT Q OUT ÎÎÎÎÎ ÎÎÎÎÎ VCC = ± 5 V PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 2000, Texas Instruments Incorporated
TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
This chip displays characteristics similar to the TL3016C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 10 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJ max = 150°C TOLERANCES ARE ± 10%. ALL DIMENSIONS ARE IN MILS. TERMINALS 1 AND 6 CAN BE CONNECTED TO MULTIPLE PADS. Q OUT IN– IN+ LATCH ENABLE Q OUT (5) (2) (3) (1) (6) VCC+ GND (7) (8) VCC– (4) (1) (4) (3) (2) (5) (1) (1) (8) (7) (6) (6) (6) COMPONENT COUNT Bipolars 53 MOSFETs 49 Resistors 46 Capacitors 14
TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to network ground. 2. Differential voltages are at IN+ with respect to IN–. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR ABOVE T A = 25°C TA = 70°C POWER RATING D 725 mW 5.8 mW/°C 464 mW PW 525 mW 4.2 mW/°C 336 mW
TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000
4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics at specified operating free-air temperature, VDD = ±5 V, VLE = 0 (unless otherwise noted) PARAMETER TEST CONDITIONS † TL3016C TL3016I UNITPARAMETER TEST CONDITIONS † MIN TYP ‡ MAX MIN TYP ‡ MAX UNIT VIO Input offset voltage TA = 25°C 0.5 3 0.5 3 mVVIO Input offset voltage TA = full range 3.5 3.5 mV a VIO Temperature coefficient of input offset voltage –4.8 –4.5 mV/°C IIO Input offset current TA = 25°C 0.1 0.6 0.1 0.6 mAIIO Input offset current TA = full range 0.9 1.3 mA IIB Input bias current TA = 25°C 6 10 6 10 mAIIB Input bias current TA = full range 10 10 mA VICR Common-mode input VDD = ± 5 V –3.75 3.5 –3.75 3.5 VVICR voltage range VDD = 5 V 1.25 3.5 1.25 3.5 V CMRR Common-mode rejection ratio –3.75 ≤ VIC ≤ 3.5 V, TA = 25°C 80 97 80 97 dB kSVR Supply-voltage rejection Positive supply: 4.6 V ≤ +VDD ≤ 5.4 V, TA = 25°C 60 72 60 72 dBkSVR yg j ratio Negative supply: –7 V ≤ –VDD ≤ –2 V , TA = 25°C 80 100 80 100 dB VOL Low level output voltage I(sink) = 4 mA, TA = 25°C V+ ≤ 4.6 V, 500 600 500 600 mVVOL Low-level output voltage I(sink) = 10 mA, TA = 25°C V+ ≤ 4.6 V, 750 750 mV VOH High level output voltage V+ ≤ 4.6 V, TA = 25°C IO = 1 mA, 3.6 3.9 3.6 3.9 VVOH High-level output voltage V+ ≤ 4.6 V, TA = 25°C IO = 10 mA, 3.4 3.7 3.4 3.7 V IDD Positive supply current TA = full range 10.6 12.5 10.6 12.5 mAIDD Negative supply current TA = full range mA VIL Low-level input voltage (LATCH ENABLE) 0.8 0.8 V VIH High-level input voltage (LATCH ENABLE) 2 2 V IIL Low-level input current VLE = 0 0 1 0 1 mAIIL (LATCH ENABLE) VLE = 2 V 24 39 24 45 mA † Full range for the TL3016C is TA = 0°C to 70°C. Full range for the TL3016I is TA = –40°C to 85°C. ‡ All typical values are measures with TA = 25°C.
TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000 5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 switching characteristics, VDD = ±5 V, VLE = 0 (unless otherwise noted) PARAMETER TEST CONDITIONS † TL3016C TL3016I UNITPARAMETER TEST CONDITIONS † MIN TYP MAX MIN TYP MAX UNIT DVI = 100 mV, TA = 25°C 7.8 10 7.8 10 t d1 Propagation dela time‡ I , VOD = 5 mV TA = full range 7.8 11.2 7.8 12.2 nstpd1 Propagation delay time ‡ DVI = 100 mV, TA = 25°C 7.6 10 7.6 10 ns I , VOD = 20 mV TA = full range 7.6 11.2 7.6 12.2 tsk(p) Pulse skew (|tpd+ – tpd–|) DVI = 100 mV, TA = 25°C VOD = 5 mV, 0.5 0.5 ns tsu Setup time, LATCH ENABLE 2.5 2.5 ns † Full range for the TL3016C is 0°C to 70°C. Full range for the TL3016I is –40°C to 85°C. ‡ tpd1 cannot be measured in automatic handling equipment with low values of overdrive. The TL3016 is 100% tested with a 1-V step and 500-mV overdrive at TA = 25°C only. Correlation tests have shown that tpd1 limits given can be ensured with this test, if additional dc tests are performed to ensure that all internal bias conditions are correct. For low overdrive conditions, VOS is added to the overdrive. TYPICAL CHARACTERISTICS Table of Graphs FIGURE vs Input voltage 2 ICC Positive supply current vs Frequency 3 vs Free-air temperature 4 ICC Negative supply current vs Free-air temperature 5 vs Overdrive voltage 6 vs Supply voltage 7 tpd Propagation delay time vs Input impedance 8 vs Load capacitance 9 vs Free-air temperature 10 VIC Common-mode input voltage vs Free-air temperature 11 Input threshold voltage (LATCH ENABLE)vs Free-air temperature 12 VO Output voltage vs Output source current 13 VO O utput voltage vs Output sink current 14 II Input current (LATCH ENABLE) vs Input voltage 15
TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000
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– Positive Supply Current – mAICC 12345678 TA = –40°C TA = 85°C TA = 25°C VI – Input Voltage – V ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ VCC = ± 5 V TA = 25°C Figure 3 – Positive Supply Current – mA f – Frequency – MHz POSITIVE SUPPLY CURRENT vs FREQUENCY 01 0 1 102 ICC TA = –40°C TA = 85°C TA = 25°C ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ VCC = ± 5 V TA = 25°C Figure 4 – 50 – 25 0 25 50 75 100 125 POSITIVE SUPPLY CURRENT vs FREE-AIR TEMPERATURE – Positive Supply Current – mAICC TA – Free-Air Temperature – °C ÎÎÎÎÎ VCC = ± 5 V Figure 5 – 1.5 – 2.5 – 3 – 50 – 25 0 25 50 – 1 NEGATIVE SUPPLY CURRENT vs FREE-AIR TEMPERATURE 75 100 125 – 0.5 – 2 – Negative Supply Current – mAICC TA – Free-Air Temperature – °C ÎÎÎÎÎ ÎÎÎÎÎ VCC = ± 5 V
TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000
8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TA – Free-Air Temperature – °C Rising Edge Falling Edge – 50 – 25 0 25 50 – Propagation Delay Time – ns PROPAGATION DELAY TIME vs FREE-AIR TEMPERATURE 75 100 125 tpd ÎÎÎÎÎ ÎÎÎÎÎ VCC = ± 5 V Figure 11 – 50 – 25 0 25 50 – Common-Mode Input Voltage – V COMMON-MODE INPUT VOLTAGE vs FREE-AIR TEMPERATURE 75 100 125 TA – Free-Air Temperature – °C VIC ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ VCC = 5 V (Upper Limit) VCC = ± 5 V (Upper Limit) ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ VCC = 5 V (Lower Limit) ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ VCC = ± 5 V (Lower Limit) Figure 12 TA – Free-Air Temperature – °C 0.6 0.4 –50 –25 0 25 50 1.6 1.8 75 100 125 150 1.4 1.2 0.8 0.2 ÎÎÎÎ VCC = ± 5 V INPUT THRESHOLD VOLTAGE (LATCH ENABLE) vs FREE-AIR TEMPERATURE – Input Threshold Voltage (LATCH ENABLE) – VVIT Figure 13 3.8 051 0 4.6 4.8 15 20 – Output Voltage – V OUTPUT VOLTAGE vs OUTPUT SOURCE CURRENT VO IO(source) – Output Source Current – mA TA = –40°C TA = 85°C TA = 25°C 4.4 4.2 3.6 3.4 3.2 ÎÎÎÎÎ ÎÎÎÎÎ VCC = ± 5 V TA = 25°C
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) TL3016CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016CPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016CPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016CPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI TL3016CPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016CPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI TL3016IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL3016IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2010 Addendum-Page 1
Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2010 Addendum-Page 2
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL3016CDR SOIC D 8 2500 367.0 367.0 35.0 TL3016CPWR TSSOP PW 8 2000 367.0 367.0 35.0 TL3016IDR SOIC D 8 2500 367.0 367.0 35.0 TL3016IPWR TSSOP PW 8 2000 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2
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