TL022C_14 TI1 | Alldatasheet
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TL022C, TL022M DUAL LOW-POWER OPERATIONAL AMPLIFIERS SLOS076 – SEPTEMBER 1973 – REVISED SEPTEMBER 1990 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Very Low Power Consumption /C0068Power Dissipation With ± 2-V Supplies 170 µW Typ /C0068Low Input Bias and Offset Currents /C0068Output Short-Circuit Protection /C0068Low Input Offset Voltage /C0068Internal Frequency Compensation /C0068Latch-Up-Free Operation /C0068Popular Dual Operational Amplifier Pinout TL022M IS NOT RECOMMENDED FOR NEW DESIGNS
description
The TL022 is a dual low-power operational amplifier designed to replace higher power devices in many applications without sacrificing system performance. High input impedance, low supply currents, and low equivalent input noise voltage over a wide range of operating supply voltages result in an extremely versatile operational amplifier for use in a variety of analog applications including battery-operated circuits. Internal frequency compensation, absence of latch-up, high slew rate, and output short-circuit protection assure ease of use. The TL022C is characterized for operation from 0°C to 70°C. The TL022M is characterized for operation over the full military temperature range of –55°C to 125°C. AVAILABLE OPTIONS VIOmax PACKAGE TA VIOmax AT 25°C SMALL OUTLINE CERAMIC DIP PLASTIC DIP CERAMIC FLAT PACKAT 25 C (D) (JG) (P) CERAMIC FLAT PACK (U) 0°C to 70°C 5 mV TL022CD — TL022CP — –55°C to 125°C 5 mV — TL022MJG — TL022MU The D package is available taped and reeled. Add the suffix R to the device type (i.e. TL022CDR). Copyright 1990, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. symbol (each amplifier) 1OUT 1IN– 1IN+ GND VCC 2OUT 2IN– 2IN+ TL022M ...J G PACKAGE TL022C ...D O R P PACKAGE (TOP VIEW) NC 1OUT 1IN– 1IN+ VCC – NC VCC+ 2OUT 2IN– 2IN+ TL022M ...U PACKAGE (TOP VIEW) IN+ OUT IN–
TL022C, TL022M DUAL LOW-POWER OPERATIONAL AMPLIFIERS SLOS076 – SEPTEMBER 1973 – REVISED SEPTEMBER 1990
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
VCC– IN– IN+ OUT absolute maximum ratings over operating free-air temperature range (unless otherwise noted) TL022C TL022M UNIT Supply voltage, VCC+ (see Note 1) 18 22 V Supply voltage, VCC– (see Note 1) –18 –22 V Differential input voltage (see Note 2) ± 30 ± 30 V Input voltage (any input, see Notes 1 and 3) ± 15 ± 15 V Duration of output short circuit (see Note 4) unlimited unlimited Continuous total dissipation See Dissipation Rating Table Operating free-air temperature range 0 to 70 –55 to 125 °C Storage temperature range –65 to 150 –65 to 150 °C Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds JG or U package 300 °C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds D or P package 260 °C NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC– . 2. Differential voltages are at IN+ with respect to IN–. 3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less. 4. The output may be shorted to ground or either power supply. For the TL022M only, the unlimited duration of the short circuit applies at (or below) 125°C case temperature or 75°C free-air temperature. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR DERATE ABOVE T A TA = 70°C POWER RATING TA = 125°C POWER RATING D 680 mW 5.8 mW/°C 33°C 464 mW — JG 680 mW 8.4 mW/ °C6 9 °C 672 mW 210 mW P 680 mW 8.0 mW/ °C6 5 °C 640 mW — U 675 mW 5.4 mW/°C 25°C 432 mW 135 mW
TL022C, TL022M DUAL LOW-POWER OPERATIONAL AMPLIFIERS SLOS076 – SEPTEMBER 1973 – REVISED SEPTEMBER 1990 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 recommended operating conditions MIN MAX UNIT Supply voltage, VCC+ 5 15 V Supply voltage, VCC– –5 –15 V electrical characteristics at specified free-air temperature, VCC ± = ±15 V (unless otherwise noted) PARAMETER TEST CONDITIONS † TL022C TL022M UNITPARAMETER TEST CONDITIONS † MIN TYP MAX MIN TYP MAX UNIT VIO Input offset voltage VO = 0, 25°C 1 5 1 5 mVVIO Input offset voltage O , R S = 50 Ω Full range 7.5 6 mV IIO Input offset current VO =0 25°C 15 80 5 40 nAIIO Input offset current VO = 0 Full range 200 100 nA IIB Input bias current VO =0 25°C 100 250 50 100 nAIIB Input bias current VO = 0 Full range 400 250 nA VICR Common-mode input 25°C ± 12 ± 13 ± 12 ± 13 VVICR voltage range Full range ± 12 ± 12 V VO(PP) Maximum peak-to-peak R L = 10 kΩ 25°C 20 26 20 26 VVO(PP) output voltage swing R L ≥ 10 kΩ Full range 20 20 V AVD Large-signal differehtialR L ≥ 10 kΩ, 25°C 60 80 72 86 dBAVD gg voltage amplification L , VO = ± 10 V Full range 60 66 dB B1 Unity-gain bandwidth 25°C 0.5 0.5 MHz CMRR Common-mode rejection VIC = VICRmin, 25°C 60 72 60 72 dBCMRR j ratio IC ICR , R S = 50 Ω Full range 60 60 dB kSVS Supply voltage sensitivityVCC = ± 9 V to ± 15 V, 25°C 30 200 30 150 µV/VkSVS yg y (ΔVIO/ΔVCC ) CC , R S = 50 Ω Full range 200 150 µV/V Eilt i t i A2 0 d BVn Equivalent input noise voltage AVD = 20 dB, B=1H z f = 1 kHz 25°C 50 50 nV/Hzvoltage B = 1 Hz, IOS Short-circuit output current 25°C ± 6 ± 6 mA ICC Supply current (both VO =0 No load 25°C 130 250 130 250 µAICC amplifiers) VO = 0, No load Full range 250 250 µA PD Total dissipation VO =0 No load 25°C 3.9 7.5 3.9 6 mWPD (both amplifiers) VO = 0, No load Full range 7.5 6 mW † All characteristics are measured under open-loop conditions with zero common-mode input voltage unless otherwise specified. Full range for TL022C is 0°C to 70°C and for TL022M is –55°C to 125°C. operating characteristics, VCC ± = ±15 V, TA = 25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tr Rise time VI=2 0m V R L =1 0kΩ C L= 100pF See Figure 1 0.3 µs Overshoot factor VI = 20 mV , R L = 10 kΩ , C L= 100 pF, See Figure 1 SR Slew rate at unity gain VI = 10 V, R L = 10 kΩ, C L= 100 pF, See Figure 1 0.5 V/µs
4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Figure 1. Rise Time, Overshoot Factor, and Slew Rate
www.ti.com 10-Jun-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TL022CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TL022C TL022CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TL022C TL022CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TL022C TL022CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TL022C TL022CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TL022C TL022CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TL022C TL022CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TL022C TL022CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TL022C TL022CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TL022C TL022CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 TL022C TL022CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TL022CP TL022CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TL022CP TL022CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TL022CP TL022CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TL022CP TL022CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TL022CP TL022CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 TL022CP TL022CPSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 T022
www.ti.com 10-Jun-2014 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TL022CPSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 T022 TL022CPSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 T022 TL022CPSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 T022 TL022CPSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 T022 TL022CPSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 T022 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
www.ti.com 10-Jun-2014 Addendum-Page 3 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL022CDR SOIC D 8 2500 340.5 338.1 20.6 TL022CPSR SO PS 8 2000 367.0 367.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2
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