TFMM5 VISHAY | Alldatasheet
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Technical content
Features
Photo detector and preamplifier in one package Output active low Internal filter for PCM frequency High immunity against ambient light High shielding against electric field disturbance
5 Volt supply voltage, low power consumption
TTL and CMOS compatibility Continuous transmission possible (tpi/T0.4) SMD Block Diagram 94 8136 PIN Input AGC Control Circuit Band Pass Demodu- lator 100 k V S OUT GND
TFMM5..0 Vishay Telefunken Rev. 3, 14-Sep-00 www.vishay.com Document Number 82003 2 (10) Absolute Maximum Ratings Tamb = 25/C0095C Parameter Test Conditions Symbol Value Unit Supply Current (Pin 2) IS 5 mA Output Current (Pin 3) IO 5 mA Junction Temperature Tj 100 C Storage Temperature Range Tstg –40...+85 C Operating Temperature Range Tamb –25...+85 C Power Consumption (Tamb 85 C) Ptot 50 mW Soldering Temperature t 10 s, 1 mm from case Tsd 230 C Basic Characteristics Tamb = 25/C0095C Parameter Test Conditions Symbol Min Typ Max Unit Supply Current (Pin 2) VS = 5 V, Ev = 0 ISD 0.4 0.5 0.8 mASu ly Current (Pin 2) VS = 5 V, Ev = 40 klx, sunlight ISH 1.0 mA Transmission Distance Ev = 0, test signal see fig.7, IR diode TSIP5201, IF = 1.5 A d 35 m Output Voltage Low (Pin 3)IOSL = 0.5 mA,Ee = 0.7 mW/m2, f = fo, tp/T = 0.4 VOSL 250 mV Irradiance (30 – 40 kHz) Pulse width tolerance: t =t i±160 /C0109s Ee min 0.6 mW/m 2 Irradiance (56 kHz) tpo = tpi±160 /C0109s, test signal (see fig.7) Ee min 0.8 mW/m 2 Irradiance Ee max 20 W/m 2 Directivity Angle of half transmission distanceϕ1/2 ±40 deg Application Circuit 94 8137 TSUS 5... TSIP 5... TFM. 5..0 4.7 /C0109F *) /C0109C >10 k optional 330 *) +5V **) *) only necessary to suppress power supply disturbances **) tolerated supply voltage range : 4.5V<VS <5.5V GND
TFMM5..0 Vishay Telefunken Rev. 3, 14-Sep-00 www.vishay.com Document Number 82003 6 (10) Dimensions in mm 15904
TFMM5..0 Vishay Telefunken 7 (10)Rev. 3, 14-Sep-00 www.vishay.comDocument Number 82003 Operating Instructions Reflow Soldering Reflow soldering must be done within 48 hoursstored under max. 30°C, 80% RH after opening envelop Recommended soldering paste (composition: SN 63%, Pb 37%) Melting temperature 178 to 192°C Apply solder paste to the specified soldering padsus- ing a dispenser or by screen printing. Recommended thickness of metal mask is 0.2 mmfor screen printing. The recommended reflow furnace is a combination- type with upper and lowewr heaters. Set the furnace temperatures for pre-heating and- heating in accordance with the reflow temperatureprofile as schown below. Excercise ex- treme care tokeep the maximum temperature below 230/C0095C. Thefollowing temperature profile means the temperature at the device surface. Since temperature difference occurs between the work and the surface of the circuit board depending on the pes of circuit board or reflow furnace, the operating conditions should be verified prior to start of operation. Handling after reflow should be done only after the work surface has been cooled off. Manual Soldering Use the 6/4 solder or the solder containing silver. Use a soldering iron of 25 W or smaller. Adjust the temperature of the soldering iron below 300/C0095C. Finish soldering within three seconds. Handle products only after the temperature is cooled off. Cleaning Perform cleaning after soldering strictly in conformance to the following conditions: Cleaning agent: 2-propanol (isopropyl alcohol). Commercially available grades (industrial use) should be used. Demineralized or distilled water having a resistivity of not less than 500 m corresponding to a conductivity of 2 mS/m. Temperature and time: 30 seconds under the temperature below 50/C0095C or 3 minutes below 30/C0095C. Ultrasonic cleaning: Below 20 W. 94 8625 max. 160°C full line : typical dotted line : process limits max. 240°C 2–4 K /s ca. 230°C 215 °C 10 s 100 150 200 250 300 0 50 100 150 200 250 Time ( s ) Temperature ( C )° max. 40 s Lead Temperature 90 – 120 s
TFMM5..0 Vishay Telefunken Rev. 3, 14-Sep-00 www.vishay.com Document Number 82003 8 (10) Taping Specifications (1) Shape and dimensions of reels (in accordance with EIAJRC-1009B); unit in mm ∅ 101 ∅ 332 328 ∅ 13.5 12.5 ∅ 24.8 23.2 2.6 1.4 Label 18.4 16.4 2.5 1.5 95 10204 (2) Dimensions of tape 8.4 8.2 3.7 12.1 11.9 0.35 0.25 8.8 8.6 R=0.80 0.75 1.85 1.65 16.3 15.7 2.05 1.95 4.1 3.9 Direction of Pulling Out 95 10200 7,6 7,4
TFMM5..0 Vishay Telefunken 9 (10)Rev. 3, 14-Sep-00 www.vishay.comDocument Number 82003 (3) Configuration of tapes 40 mm min. 40 mm min. 200 mm min. End Empty Parts mounted Empty Leader Start (4) Quantity 1000 pcs. per reel Packing (1) Dampproof packing Products will be packed in anti-humidity aluminium bags to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant with moisture indicators. In the event bags absorb moisture, the indicators change their color from blue to pink. Aluminiumbag Desiccant Label Reel 95 10203 (2) Recommended method of storage Dry box storage is recommended to prevent the parts from moisture absorption. The following conditions should be preserved if dry boxes are not available. Storage temperature: 10 – 30/C0095C Storage humidity: 60% RH max In case of moisture absorption the device will recover to the former conditon by drying under the following recommended conditions: taped version: 60 /C0095C/48 h untaped version: 125 /C0095C/2 h Lot Number 3 digits Last digit of calendar year Month code 5 18 Lot number is labeled on the aluminum bag and also indicated on the reverse side of each part.
TFMM5..0 Vishay Telefunken Rev. 3, 14-Sep-00 www.vishay.com Document Number 82003 10 (10) Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P .O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423