TFHP TTELEC | Alldatasheet

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Thin Film High Power AlN Chip TFHP Series General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc BI Technologies IRC Welwyn www.ttelectronics.com/resistors 01.25 Electrical Data Features:

  • Power rating 6W in 2512 size
  • Power rating 2W in 1206 size
  • Aluminium nitride substrate
  • Large termination soldering area
  • Precision to 0.1%, 25ppm/°C All parts are Pb-free and comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3) Physical Data Construction A thin-film material is selectively deposited on an aluminium nitride substrate together with metallic contacts at each end of the resistor. The unadjusted resistors are heat treated to give the required TCR and stability, then a precisely controlled laser trim process adjusts the resistance value. Epoxy protection is applied, and wrap-around terminations are added and tin (Sn) plated. Each resistor is measured immediately before packing into tape. Marking TFHP resistors are marked white on black with 3 or 4 characters indicating ohmic value.

Thin Film High Power AlN Chip TFHP Series General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc BI Technologies IRC Welwyn www.ttelectronics.com/resistors 01.25 Performance Data Thermal Performance Data Temperature Derating Chip Surface Temperature Packaging TFHP resistors are packed in tape which is paper for 1206 and plastic for 2512, on 178mm reels. For full details of tape and reel dimensions see https://www.ttelectronics.com/ttelectronics/media/productfiles/applicationnotes/ps001-packing-of-general-purpose-chip-resistors.pdf Ordering Procedure Example: TFHP2512D-1K54FT4 (2512, 25ppm/°C, 1.54 kilohms ±1%, Pb-free ) Mounting The above chip surface temperature readings were made by thermal camera under room temperature conditions with the component mounted at the centre of a 40 x 90mm test board with double sided 70µm (2oz) copper connected with thermal vias.