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DFN1006 package low capacitance type All specifications are subject to change without notice. Features 1 1. RoHS compliant and halogen-free 2 2. Working voltage: 5V 3 3. Low capacitance: 10pF 4 4. Low clamping voltage 5 5. Low leakage current 6 6. IEC 61000-4-2 (ESD) ±30KV (air), ±30KV (contact) 7 Recommended Applications 11 1. Cell Phone Handsets and Accessories 12 2. Notebooks, Desktops and Servers 13 3. PCI express, SATA, USB 2.0,DVI, Display port 14 4. Portable Instrumentation 15 Mechanical Data 19 1. Case: DFN1006(0402), molded plastic meets UL flammability rating 94V-0 20 2. Terminal: Au planted, solderable per MIL-STD-750, method 2026 21 3. Meets MSL level 1, per J-STD-020 22 Part Number Code 26 T E L D 1 0 2 0 5 1 0 0 B 1 2 3 4 5 6 7 8 9 10 11 12 13 Product Series TE THINKING ESD Transient Voltage Suppression Diodes Reverse Stand off Voltage(VRWM ) 05 5V Junction Capacitance(Cj) 0R5 0.5pF 030 3.0pF 03D 3.3pF 100 10pF Type code D Standard Capacitance >10pF L Low Capacitance >1pF, ≦10pF U Ultra-low Capacitance ≦1pF Package SD32 SOD-323, 2pins ST23 SOT-23, 3pins D102 DFN1006, 2pins Type Code U Uni-directional B Bi-directional,
DFN1006 package low capacitance type All specifications are subject to change without notice. Structures and Dimensions 43 Schematic & PIN Configuration 50 Maximum Rating (Rating at 25℃ ambient temperature unless otherwise noted) 56 Parameter Symbol Value Unit Peak pulse power (tp= 8/20μs waveform) PPPM 138 W Peak Pulse Current (tp= 8/20μs waveform) IPP 7.9 A ESD per IEC61000-4-2 (Air) ESD per IEC61000-4-2 (Contact) VESD ±30 ±30 KV Operating junction temperature TJ -55~+125 ºC Storage temperature range TSTG -55~+150 ºC DFN1006(0402) Unit: mm (inch)
DFN1006 package low capacitance type All specifications are subject to change without notice. Electrical Characteristics (TA=25℃ unless otherwise noted) 64 Parameter Symbol Condition Min. Typ. Max. Unit Reverse Stand-off Voltage VRWM - 5 V Breakdown Voltage VBR IR =1mA 6.0 8.5 V Reverse Leakage Current IR VRWM=5V 0.05 μ A Clamping Voltage Vc Ipp =1A, tp= 8/20μs Ipp=7.9A, tp= 8/20μs 17.5 V Junction Capacitance Cj Between I/O Pin and GND VR=0V，f=1MHz 10 20 pF
DFN1006 package low capacitance type All specifications are subject to change without notice. Soldering Recommendation 134 135 136 137 138 139 140
DFN1006 package low capacitance type All specifications are subject to change without notice. Recommended Soldering Pad Dimensions 141 142 143 144 Package Type A B C D DFN1006 1.3 0.3 0.5 0.7 145 146 Packaging 147 148 160 161 162 163 164 165 166 167 168 169 170 171 Symbol DFN1006 (Unit: mm) A0 0.67 ± 0.10 B0 1.12 ± 0.10 K0 0.60 ± 0.10 D0 1.50 ± 0.10 E 1.75 ± 0.10 F 3.50 ± 0.10 P0 4.00 ± 0.10 P1 4.00 ± 0.10 P2 2.00 ± 0.10 T 0.22 ± 0.05 W 8.00 ± 0.20 d1 MIN. 54.00 d0 13.00 ± 0.20 w1 MAX. 13.50 Unit: mm
DFN1006 package low capacitance type All specifications are subject to change without notice. 172 Quantity 173 174 Package Type Marking Code Reel Size (inch) Reel (Kpcs) DFN1006 E5 7’’ 5 175 176 Warehouse Storage Conditions of product 177
- Storage condition: 178 1.Storage Temperature: -10℃~+40℃ 179 2.Relatiive Humidity: ≦75%RH 180 3.Keep away from corrosive atmosphere and sunlight. 181
- Period of Storage: 1 year. 182 183