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Technical content
Features
120 Watts Peak Pulse Power per Line (tp=8/20μs)
Working voltages :36V Low leakage current ESD/TESD36EU IEC Compatibility IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC61000-4-4 (EFT) 40A (5/50ηs) Mechanical Characteristics Molding Compound Flammability Rating:L 94V-O Quantity Per Reel:5000pcs Reel Size:7 inch Lead Finish:Lead Free
Applications
Cellular Handsets and Accessories Portable Electronics Industrial Controls Set-Top Box Instrumentation Servers, Notebook, and Desktop PC Display Ports SOD-523 Pin Configuration
Maximum Ratings(@25 Unless Otherwise Specified)℃ Parameter Symbol Value Units Peak Pulse Power(tp=8/20μs waveform) Lead Soldering Temperature Operating Temperature Range Storage Temperature Range P PP TL TJ TSTG 120 260(10 sec.) -55~150 -55~150 Watts Maximum Ratings (T =25 unless otherwise noted )A ℃ Electrical Characteristics (Ta=25 unless otherwise specified)℃ Ratings and Characteristic Curves /UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI ESD/TESD36EU Parameter Symbol Conditions UnitsMin. Max. TESD36EU(Marking:Y15) Reverse Stand-off Voltage Breakdown Voltage Reverse Leakage Current Junction Capacitance Clamping Voltage IR CI/O VRWM VBR VC I= 1 m AT I =1A,tp=8/20μsPP I =2A,tp=8/20μsPP @VRWM V V V V μA F p0Vdc,f=1MHz Between I/O Pins and GND Fig.2 Pulse Waveform 501 0 3 0 150 Time( )μs 20 25 100 110 Percent of I PP t= I / 2d PP Waveform Parameters: tr=8μs t =20μs d e Fig.1 Power Derating Curve 250 500 T ,Ambient Temperature( )A ℃ 75 100 100 Peak Power Dissipation (%) 125 150 120
/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI Dimensions(SOD-523) SOD-523 Recommended Mounting Pad Layout 1.40 0.0547 0.40 0.0157 0.40
0.0157 Dimensions in ( )millimeters
K C A 1 2 B D DIM A B C D J K S Millimeters Min 1.10 0.70 0.50 0.25 0.07 0.15 1.50 Max 1.30 0.90 0.70 0.35 0.20 0.25 1.70 Min 0.043 0.028 0.020 0.010 0.0028 0.006 0.059 Max 0.051 0.035 0.028 0.014 0.0079 0.010 0.067 Inches ESD/TESD36EU