TEMD6200FX01_V01 VISHAY | Alldatasheet

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Technical content

www.vishay.com Vishay Semiconductors Rev. 1.5, 08-Apr-14 1 Document Number: 81812 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Ambient Light Sensor

DESCRIPTION

TEMD6200FX01 is a high speed and high sensitive PIN photodiode in a miniature flat plastic package. It is spectral sensitivity is closely matched to the human eye.

FEATURES

  • Package type: Surface mount  Package form: 0805  Dimensions (L x W x H in mm): 2 x 1.25 x 0.85
  • Radiant sensitive area (in mm 2): 0.27
  • AEC-Q101 qualified
  • High photo sensitivity  Adapted to human eye responsivity
  • Angle of half sensitivity: ϕ = ± 60°  Floor life: 168 h, MS L 3, acc. J-STD-020  Material categorization: For definitions of compliance please see www.vishay.com/doc?99912

APPLICATIONS

  • Automotive sensors
  • Ambient light sensors
  • Backlight dimming
  • Mobil phones
  • Notebooks
  • Computers Note
  • Test condition see table “Basic Characteristics” Note
  • MOQ: Minimum order quantity PRODUCT SUMMARY COMPONENT Ira (μA) ϕ (deg) λ0.5 (nm) TEMD6200FX01 0.04 ± 60 430 to 610

ORDERING INFORMATION

ORDERING CODE PACKAGING REMARKS PACKAGE FORM TEMD6200FX01 Tape and reel MOQ: 3000 pcs, 3000 pcs/reel 0805 ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage V R 16 V Power dissipation T amb ≤ 55 °C P V 100 mW Junction temperature T j 100 °C Operating temperature range T amb -40 to +100 °C Storage temperature range T stg -40 to +100 °C Soldering temperature In accordance with fig. 6 T sd 260 °C Thermal resistance junction/ambient R thJA 270 K/W

www.vishay.com Vishay Semiconductors Rev. 1.5, 08-Apr-14 2 Document Number: 81812 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Fig. 1 - Reverse Dark Current vs. Ambient Temperature Fig. 2 - Reverse Light Current vs. Illuminance Fig. 3 - Diode Capacitance vs. Reverse Voltage Fig. 4 - Relative Spectral Sensitivity vs. Wavelength BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Breakdown voltage IR = 100 μA, E = 0 lx V (BR) 16 V Reverse dark current VR = 10 V, E = 0 lx I ro 0.1 5 nA Diode capacitance VR = 0 V, f = 1 MHz, E = 0 lx C D 60 pF VR = 5 V, f = 1 MHz, E = 0 lx C D 24 pF Reverse light current Ee = 1 mW/cm2, λ = 550 nm, VR = 5 V Ira 1μ A EV = 100 lx, CIE illuminant A Ira 0.03 0.04 0.09 μA Angle of half sensitivity ϕ ± 60 deg Wavelength of peak sensitivity λp 540 nm Range of spectral bandwidth λ0.5 430 to 610 nm Rise time UR = 5 V, RL = 50 Ω, TLMW3300 t r 150 ns Fall time UR = 5 V, RL = 50 Ω, TLMW3300 t f 150 ns 0.01 0.1 100 1000 18818 02 0 4 0 6 0 80 100 Tamb - Ambient Temperature (°C) Iro - Reverse Dark Current (nA) VR = 5 V 20093 0.001 0.01 0.1 10 100 1000 10000 EV - Illuminance (lx) Ira - Photocurrent (µA) CIE illuminant A VR = 5 V 20094 01 0 2 0 3 0 V R - Reverse Voltage (V) CD - Diode Capacitance (pF) E0 = 0 f = 1 MHz 0.0 0.2 0.4 0.6 0.8 1.0 400 600 800 1000 Wavelength (nm) Relative Spectral Sensitivity Photodiode human eye 20047

www.vishay.com Vishay Semiconductors Rev. 1.5, 08-Apr-14 3 Document Number: 81812 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Fig. 5 - Relative Radiant Sensitivity vs. Angular Displacement SOLDER PROFILE Fig. 6 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 DRYPACK Devices are packed in moistu re barrier bags (MBB) to prevent the products from mo isture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Time between soldering and re moving from MBB must not exceed the time indicated in J-STD-020: Moisture sensitivity: Level 3 Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % DRYING In case of moisture absorpt ion devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions: 192 h at 40 °C (+ 5 °C), RH < 5 % or 0.4 0.2 0 Srel - Relative Sensitivity 94 8318 0.6 0.9 0.8 30° 10° 20° 40° 50° 60° 70° 80° 0.7 1.0 ϕ - Angular Displacement 100 150 200 250 300 0 50 100 150 200 250 300 Time (s) Temperature (°C) 240 °C 245 °C max. 260 °C max. 120 s max. 100 s 217 °C max. 30 s max. ramp up 3 °C/s max. ramp down 6 °C/s 19841 255 °C

www.vishay.com Vishay Semiconductors Rev. 1.5, 08-Apr-14 4 Document Number: 81812 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGE DIMENSIONS in millimeters BLISTER TAPE DIMENSIONS in millimeters 20018 21501

www.vishay.com Vishay Semiconductors Rev. 1.5, 08-Apr-14 5 Document Number: 81812 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 REEL DIMENSIONS in millimeters of the wheel is supplier specific. Form of the leave open Issue: 2; 26.04.10 Drawing-No.: 9.800-5096.01-4 specifications according to DIN technical drawings Ø 177.8 max. Ø 55 min. 8.4 +2.5 8.4 +0.15 14.4 max. Ø 13 + 0.5 - 0.2 1.5 min. Ø 20.2 min. Z Z 2:1 20875

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