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Features

For surface mounted applications in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Repetition Rate (duty cycle):0.01% Fast response time: typically less than 1.0ps from 0 Volts to V(BR) for unidirectional types Typical IR less than 2µA above 10V High Temperature solderting: 260°C/10 seconds at terminals Plastic package has Underwriters Laboratory Flammability 94V-O Pb-free plated TECD(2000W) Series Mechanical Data Devices For Bipolar Application For Bidirectional use C or CA Suffix for types TECD6.0 thru types TECD60 (e.g. TECD6.0C , TECD60CA) Electrical characteristics apply in both directions Maximum Ratings And Characteristics Ratings at 25 ambient temperature unless otherwise specified.℃ Notes : 1.Non-repetitive current pulse , per Fig. 3 and derated above TA = 25 per Fig. 2 .℃ 2.Mounted on 8.0mm x 8.0mm Copper Pads to each terminal 3.8.3ms single half sine-wave , or equivalent square wave, Duty cycle = 4 pulses per minutes maximum. Peak Pulse Power Dissipation on 10/1000µs waveform (Note 1,2 ,FIG.1) Peak Pulse Current of on 10/1000µs waveform (Note 1,FIG.3) Peak Forward Surge Current,8.3ms Single Half Sine-Wave Superimposed on Rated Load,(JEDEC Method) (Note2,3) Operating junction and Storage Temperature Range RATING SYMBOL VALUE UNITS P PPM IPPM IFSM T, TJS T G Minimum 2000 SEE TABLE 1 -55 to +150 300 Watts Amps Amps Case: JEDEC DO-214AB. Molded plastic over glass passivated junction Terminals: Solderable per MIL-STD-750,Method 2026 Polarity: Color band denoted positive end (cathode) except Bidirectional 16mm tape (EIA STD RS-481)Standard Packaging: 0.007ounce,0.21gramWeight:

/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI Dimensions (DO-214AB)

Electrical Characteristics

0.126 3.20() 0.112 2.85() 0.280(7.11) 0.260(6.60) 0.245(6.22) 0.220(5.60) Cathode Band 0.118(3.00) 0.081(2.06) 0.329 8.35() 0.305 7.75() 0.069 1.75() 0.059 1.50() 0.067 1.70() 0.030 0.76() DO-214AB(SMC J-Bend) Dimensions in inches and(millimeters) TECD(2000W) Series TECD6.0A TECD8.0A TECD12A TECD15A TECD16A TECD20A TECD22A TECD26A TECD28A TECD30A TECD33A TECD36A TECD40A TECD58A TECD60A TECD Part Number Device Marking Code Reverse Stand-Off Voltage V (V) RWM V (V)Min.BR V (V)Max.BR Test Current IT(mA) Maximum Clamping Voltage @Ipp Vc(V) Peak Pulse Current Ipp(A) Reverse Leakage @VRWM I(A )R μUNI-Polar UNI BI-Polar BI 12K 15K 16K 20K 22K 26K 28K 30K 33K 36K 40K 58K 60K 12L 15L 16L 20L 22L 26L 28L 30L 33L 36L 40L 58L 60L 6.0 8.0 12.0 15.0 16.0 20.0 22.0 26.0 28.0 30.0 33.0 36.0 40.0 58.0 60.0 6.67 8.89 13.30 16.70 17.80 22.20 24.40 28.90 31.10 33.30 36.70 40.00 44.40 64.40 66.70 7.37 9.83 14.70 18.50 19.70 24.50 26.90 31.90 34.40 36.80 40.60 44.20 49.10 71.20 73.70 10.3 13.6 19.9 24.4 26.0 32.4 35.5 42.1 45.4 48.4 53.3 58.1 64.5 93.6 96.8 349.5 264.7 180.9 147.5 138.5 111.1 101.4 85.5 79.3 74.4 67.5 62.0 55.7 38.5 37.2 200 Breakdown Voltage T TECD6.0CA TECD8.0CA TECD12CA TECD15CA TECD16CA TECD20CA TECD22CA TECD26CA TECD28CA TECD30CA TECD33CA TECD36CA TECD40CA TECD58CA TECD60CA For bidirectional type having V of 10 volts and less, the I limit is double. WRM R For parts with A , the V is ±5%BR

/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI Characteristic Curves (TA=25 unless otherwise noted)℃ Fig.1 Peak Pulse Power Rating Fig.2 Pulse Derating Cruve Fig.3 Pulse Waveform Fig.4 Typical Junction Capacitance 00 1.0 2.0 4.03.0 10/1000 sec Waveformμ. as defined by R.E.A Half Value IPPM tr=10uS Peak Value I PPM T= 2 5J ℃ Pulse width(td) is defined ad the Point where the Peak Current Decays to 50% of I PPM 100 150 I -Peak Pulse Current(%) IPPM RSM t-Time(mS) td 02 5 5 0 7 5 100 125 150 175 200 100 T -Ambient Temperature( )A ℃Peak Pulse Power(P ) or Current(I ) PP PPM Derating in Percentage,% Copper Pad Areas P -Peak Pulse Power (kW) PPM 0.1μs 10μs 10ms 0.1 100 td - Pulse Width (sec.) 1.0μs 100μs 1.0m s C -Junction Capacitance(pF) J 1 10 10010 100 1000 V -Reverse Stand-off Voltage(V)WM 500 TJ=25 ℃ f=1.0MH Z Vsig=50mVp-p Uni-Directional Bi-Directional 10000 V= 0R V =RatedR Stand-Off Voltage Non-repetitive pulse waveform shown in Fig.3 TA = 25°C Fig.5 Typ.Transient Thermal Impedance Fig.6 Maximum Non-Repetitive Forward Surge Current 0.001 0.1 0.1 1 100010 1.0 100 Transient Thermal Impedance(C/W) tp-Pulse Duration(sec) 0.01 100 Peak Forward Surge Current(A) 1 10 100 100 300 Number of Cycles at 60H Z 8.3mS single half sine-wave (JEDEC Method) 150 200 250 TECD(2000W) Series

/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI Marking Code Tape And Reel Specification Recommended Soldering Conditions Recommended Conditions Reflow Soldering ts tP tL Time time to peak temperature (t 25 to peak)℃ Temperature T (min)s T (max)s TL TP Preheat Ramp-down Ramp-up Critical Zone Tt o TLP Re”ow Condition Pb-Free assembly (see Fig.1) Pre Heat -Temperature Min(T ) s(min) -Temperature Max(T ) s(max) -Time(Min to Max)(t ) s Average ramp up rate (Liquidus Temp(T ) to peak)L T to T -Ramp-up Rates(max) L Re”ow -Temperature(T )(Liquidus)L -Temperature(t )L Peak Temp(T )P Time within 5 of actual Peak Temp(t )℃ P Ramp-down Rate Time 25 to Peak Temp(T )℃ P Do not exceed +150 ℃ +200 ℃ 60-180secs 3 /sec.Max.℃ 3 /sec.Max.℃ +217 ℃ 60-150secs +260(+0/-5) ℃ 30 secs.Max. 6 /sec.Max.℃ 8 min.Max. +260 ℃ Cathode Band 6 K ** Marking Code Logo Date Code 6 L Marking Code Logo Date Code 0.157 (4.0) 0.63 (16.0) 0.315 (8.0) 0.65 (16.4) Symbol Ea Per Reel REEL DIA (mm) Industry Standard TECD* 500 178 EIA RS-481 7 0(178). TECD(2000W) Series