TEA1523P-N2112 PHILIPS | Alldatasheet
Document overview
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Technical content
- General description The TEA152x family STARplug is a Switched Mode Power Supply (SMPS) controller IC that operates directly from the rectified universal mains. It is implemented in the high-voltage EZ-HV SOI process, combined with a low-voltage Bipolar Complementary Metal-Oxide Semiconductor (BiCMOS) process. The device includes a high-voltage power switch and a circuit for start-up directly from the rectified mains voltage. A dedicated circuit for valley switching is built in, which makes a very efficient slim-line electronic power-plug concept possible. In its most basic version of application, the TEA152x family acts as a voltage source. Here, no additional secondary electronics are required. A combined voltage and current source can be realized with minimum costs for external components. Implementation of the TEA152x family renders an efficient and low cost power supply system. 2. Features and benefits Designed for general purpose supplies up to 30 W Integrated power switch: TEA1520x: 48 Ω; 650 V TEA1521x: 24 Ω; 650 V TEA1522x: 12 Ω; 650 V TEA1523P: 6.5 Ω; 650 V Operates from universal AC mains supplies (80 V to 276 V) Adjustable frequency for flexible design RC oscillator for load insensitive regulation loop constant Valley switching for minimum switch-on loss Frequency reduction at low power output makes low standby power possible (< 100 mW) Adjustable overcurrent protection Undervoltage protection Temperature protection Short-circuit winding protection Simple application with both primary and secondary (opto) feedback Available in DIP8 and SO14 packages TEA152x SMPS ICs for low-power systems Rev. 04 — 14 September 2010 Product data sheet
Microcontroller supplies in home applications and small portable equipment, etc. Table 1. Quick reference data
Table 2. Ordering information Pin numbers without parenthesis refer to DIP8 packages and within parenthesis refer to SO14 packages.
7.1 Pinning
7.2 Pin description
secondary sensing circuit and optocoupler feedback. Table 3. Pin description
Product data sheet Rev. 04 — 14 September 2010 5 of 20 NXP Semiconductors TEA152x SMPS ICs for low-power systems components RRC and CRC. This mode is called Pulse Width Modulation (PWM). Furthermore, a primary stroke is started only in a valley of the secondary ringing. This valley switching principle minimizes capacitive switch-on losses.
8.1 Start-up and Underoltage lockout
Initially, the IC is self supplying from the rectified mains voltage. The IC starts switching as soon as the voltage on pin VCC passes the VCC(startup) level. The supply is taken over by the auxiliary winding of the transformer as soon as VCC is high enough and the supply from the line is stopped for high efficiency operation. When for some reason the auxiliary supply is not sufficient, the high-voltage supply also supplies the IC. As soon as the voltage on pin VCC drops below the VCC(stop) level, the IC stops switching and restarts from the rectified mains voltage.
8.2 Oscillator
The frequency of the oscillator is set by the external resistor and capacitor on pin RC. The external capacitor is charged rapidly to the VRC(max) level and, starting from a new primary stroke, it discharges to the VRC(min) level. Because the discharge is exponential, the relative sensitivity of the duty factor to the regulation voltage at low duty factor is almost equal to the sensitivity at high duty factors. This results in a more constant gain over the duty factor range compared to PWM systems with a linear sawtooth oscillator. Stable operation at low duty factors is easily realized. For high efficiency, the frequency is reduced as soon as the duty factor drops below a certain value. This is accomplished by increasing the oscillator charge time. To ensure that the capacitor can be charged within the charge time, the value of the oscillator capacitor should be limited to approximately 1 nF.
8.3 Duty factor control
The duty factor is controlled by the internal regulation voltage and the oscillator signal on pin RC. The internal regulation voltage is equal to the external regulation voltage (−2.5 V) multiplied by the gain of the error amplifier (typically 20 dB which is 10×).
8.4 Valley switching
A new cycle is started when the primary switch is switched on (see Figure 4). After a certain time (determined by the oscillator voltage RC and the internal regulation level), the switch is turned off and the secondary stroke starts. The internal regulation level is determined by the voltage on pin REG. After the secondary stroke, the drain voltage shows an oscillation with a frequency of approximately: (1) where: L p = primary self-inductance Cp = parasitic capacitance on drain node 2 π× Lp Cp×()×
Product data sheet Rev. 04 — 14 September 2010 7 of 20 NXP Semiconductors TEA152x SMPS ICs for low-power systems
8.5 Demagnetization
The system operates in discontinuous conduction mode all the time. As long as the secondary stroke has not ended, the oscillator will not start a new primary stroke. During the first tsuppr seconds, demagnetization recognition is suppressed. This suppression may be necessary in applications where the transformer has a large leakage inductance and at low output voltages.
8.6 Minimum and maximum duty factor
The minimum duty factor of the switched mode power supply is 0 %. The maximum duty factor is set to 75 % (typical value at 100 kHz oscillation frequency).
8.7 OverCurrent Protection (OCP)
The cycle-by-cycle peak drain current limit circuit uses the external source resistor RI to measure the current. The circuit is activated after the leading edge blanking time tleb. The protection circuit limits the source voltage to Vsource(max), and thus limits the primary peak current.
8.8 Short-circuit winding protection
The short-circuit winding protection circuit is also activated after the leading edge blanking time. If the source voltage exceeds the short-circuit winding protection voltage Vswp, the IC stops switching. Only a power-on reset will restart normal operation. The short-circuit winding protection also protects in case of a secondary diode short circuit.
8.9 OverTemperature Protection (OTP)
An accurate temperature protection is provided in the device. When the junction temperature exceeds the thermal shutdown temperature, the IC stops switching. During thermal protection, the IC current is lowered to the start-up current. The IC continues normal operation as soon as the overtemperature situation has disappeared. Fig 5. Typical phase of drain ringing at switch-on (at N × Vo =8 0V ) 0 200 400 800 f (kHz) phase (deg) −20 −40 mgt424 600
Product data sheet Rev. 04 — 14 September 2010 8 of 20 NXP Semiconductors TEA152x SMPS ICs for low-power systems
8.10 OverVoltage Protection (OVP)
Overvoltage protection can be achieved in the application by pulling pin REG above its normal operation level. The current primary stroke is terminated immediately, and no new primary stroke is started until the voltage on pin REG drops to its normal operation level. Pin REG has an internal clamp. The current feed into this pin must be limited.
8.11 Output characteristics of complete power-plug
Typical characteristics:
- Output power: A wide range of output power levels can be handled by choosing the RDS(on) and package of the TEA152x family. Power levels up to 30 W can be realized.
- Accuracy: The accuracy of the complete converter, functioning as a voltage source with primary sensing, is approximately 8 % (mainly dependent on the transformer coupling). The accuracy with secondary sensing is defined by the accuracy of the external components. For safety requirements in case of optocoupler feedback loss, the primary sensing remains active when an overvoltage circuit is connected.
- Efficiency: An efficiency of 75 % at maximum output power can be achieved for a complete converter designed for universal mains.
- Ripple: A minimum ripple is obtained in a system designed for a maximum duty factor of 50 % under normal operating conditions, and a minimized dead time. The magnitude of the ripple in the output voltage is determined by the frequency and duty factor of the converter, the output current level and the value and ESR of the output capacitor.
8.12 Input characteristics of complete power-plug
Typical characteristics:
- The input voltage range comprises the universal AC mains (80 V to 276 V)
are 2500 V maximum, except pin DRAIN, which is 1000 V maximum. Table 4. Limiting values current driven and pins REG and AUX are not allowed to be voltage driven.
printed-circuit board. See the TEA152x application note for details. Table 5. Thermal characteristics Table 6. Characteristics positive when flowing into the IC; unless otherwise specified.
Table 6. Characteristics …continued positive when flowing into the IC; unless otherwise specified.
Product data sheet Rev. 04 — 14 September 2010 12 of 20 NXP Semiconductors TEA152x SMPS ICs for low-power systems 12. Application information Further application information can be found in the TEA152x application note. Fig 6. Primary sensed application; configuration for TEA152xP (DIP8) mgt425 TEA152xP DRAIN n.c.GND SOURCE AUX R2R1 D2 C6 - Ycap Z1 C5 CF2 LF CF1 mains Vo RAUX RI REG RC RRC CRC CVCC VCC
Product data sheet Rev. 04 — 14 September 2010 13 of 20 NXP Semiconductors TEA152x SMPS ICs for low-power systems 13. Package outline Fig 7. Package outline SOT97-1 (DIP8) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT97-1 99-12-27 03-02-13 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M ZHL mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max.wMEe1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 7.80 10.0 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.31 0.39 050G01 MO-001 SC-504-8 MH c (e )1 ME A L seating plane w M e D Z b E 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. pin 1 index DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
Product data sheet Rev. 04 — 14 September 2010 14 of 20 NXP Semiconductors TEA152x SMPS ICs for low-power systems Fig 8. Package outline SOT108-1 (SO14) UNIT A max. A1 A2 A3 bp cD (1) E(1) (1)eH E LL p QZ ywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 SOT108-1 X w M θ AA1 bp D HE Lp Q detail X E Z e c L v M A (A )3 A y 076E06 MS-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.0410.244 0.228 0.028 0.024 0.028 0.0120.01 0.25 0.01 0.0040.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
Table 7. Abbreviations Table 8. Revision history
- Table 1 “Quick reference data” updated
- Table 4 “Limiting values” updated TEA152X_3 20090323 Product data sheet - TEA152X_FAM_2 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors.
- Legal texts have been adapted to the new company name where appropriate.
- The minimum value of Tamb has changed in Table 1 and Table 4
- The minimum value of Tj has changed in Table 4 TEA152X_FAM_2 20060125 Product data sheet - TEA152X_FAMILY_1 TEA152X_FAMILY_1 20000908 Product specification - -
Product data sheet Rev. 04 — 14 September 2010 16 of 20 NXP Semiconductors TEA152x SMPS ICs for low-power systems 16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This docu ment contains the product specification.
Product data sheet Rev. 04 — 14 September 2010 17 of 20 NXP Semiconductors TEA152x SMPS ICs for low-power systems Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. STARplug — is a trademark of NXP B.V. EZ-HV — is a trademark of NXP B.V. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
Product data sheet Rev. 04 — 14 September 2010 19 of 20 continued >> NXP Semiconductors TEA152x SMPS ICs for low-power systems 19. Figures Fig 5. Typical phase of drain ringing at switch-on (at N × V Fig 6. Primary sensed app lication; configuration
NXP Semiconductors TEA152x SMPS ICs for low-power systems © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 September 2010 Document identifier: TEA152X Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 20. Contents 8.11 Output characteristics of complete power-plug. 8 8.12 Input characteristics of complete power-plug . . 8