TEA1083A

TEA1083 PHILIPS | Alldatasheet

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Product specification File under Integrated circuits, IC03A March 1994 INTEGRATED CIRCUITS TEA1083; TEA1083A Call progress monitor for line powered telephone sets

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A

FEATURES

• Internal supply – Optimum current split-up – Low constant current (adjustable) in transmission IC – Nearly all line current available for monitoring – Stabilized supply voltage
• Loudspeaker amplifier with a fixed gain of 35 dB
• Volume controlled by potentiometer
• Power-down input (TEA1083A only)
• Loudspeaker enable input. GENERAL DESCRIPTION The TEA1083/83A is a bipolar IC which has been designed for use in line powered telephone sets. It is intended to offer a monitoring facility of the line signal via a loudspeaker during on-hook dialling. The TEA1083/83A is intended for use in conjunction with a transmission circuit of the TEA1060 family. The device uses a part of the available line current via the internal supply circuit. The loudspeaker amplifier, which consists of a preamplifier and a power amplifier, amplifies the received line signals from the transmission circuit when enabled via the LSE input. The loudspeaker amplifier can also be used to amplify dialling tones from the dialler IC. The power amplifier contains a push-pull output stage to drive the loudspeaker in a Single Ended Load (SEL) configuration. The internal voltage stabilizer can be used to supply external devices. By activating the power-down (PD) input of the TEA1083A, the current consumption of the circuit will be reduced, this enables pulse dialling or flash (register recall). An internal start circuit ensures normal start-up of the transmission IC. QUICK REFERENCE DATA

ORDERING INFORMATION

1. SOT97-1; 1998 Jun 18. 2. SOT38-1; 1998 Jun 18. 3. SOT162-1; 1998 Jun 18. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT I SUP input current range 3.0 − 120 mA VBB stabilized supply current − 2.95 − V ISUP current consumption PD = HIGH; TEA1083A only − 50 −µ A G v voltage gain of loudspeaker amplifier − 35 − dB ISUP minimum input current P O = 10 mW (typ) into 50Ω− 10 − mA Tamb operating ambient temperature range −25 −+ 75 °C EXTENDED TYPE NUMBER PACKAGE PINS PIN POSITION MATERIAL CODE TEA1083 8 DIL PLASTIC SOT97D (1) TEA1083A 16 DIL PLASTIC SOT38 (2) TEA1083AT 16 SOL PLASTIC SOT162AG (3)

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A Fig.1 Block diagram (TEA1083). handbook, full pagewidth MGR045 SUPPLY PRE- AMPLIFIER START- CIRCUIT POWER AMPLIFIER ENABLE CIRCUIT SUP SREF 4LSI1 5LSI2 6LSE

7 QLS

Fig.2 Block diagram (TEA1083A/AT). handbook, full pagewidth MGR046 SUPPLY PD PRE- AMPLIFIER START- CIRCUIT POWER AMPLIFIER ENABLE CIRCUIT SUP 3, 5, 6, 7, 10, 11, 14 n.c. SREF PD 8LSI1 9LSI2 13LSE

15 QLS

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A Fig.3 Pin configuration (TEA1083). handbook, halfpage MGR047 TEA1083 VBB QLSSUP LSE LSI2LSI1 SREF VSS Fig.4 Pin configuration (TEA1083A/AT). handbook, halfpage TEA1083A TEA1083AT MGR048 VSS SUP n.c. SREF n.c. n.c. n.c. LSI1 LSI2 n.c. n.c. PD LSE n.c. QLS VBB PINNING SYMBOL PIN DIL16 PIN DIL8 DESCRIPTION VSS 1 1 negative supply terminal SUP 2 2 positive supply terminal n.c. 3 − not connected SREF 4 3 supply reference input n.c. 5 − not connected n.c. 6 − not connected n.c. 7 − not connected LSI1 8 4 loudspeaker amplifier input 1 LSI2 9 5 loudspeaker amplifier input 2 n.c. 10 − not connected n.c. 11 − not connected PD 12 − power-down input LSE 13 6 loudspeaker enable input n.c. 14 − not connected QLS 15 7 loudspeaker amplifier output V BB 16 8 stabilized supply voltage

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A Table 1 Comparison of the TEA108X family. PRODUCT CONDITIONS TEA1083 TEA1083A TEA1085/85A Application area note 1 call progress monitoring listening-in PD facility − XX MUTE or LSE facility note 2 X X X Dynamic limiter −− X Howling limiter −− X V BB setting −− X SEL note 3 X X X BTL note 3 −− X Number of pins note 4 8 16 24 Notes 1. A call progress monitor is recommended by the European Telecommunications Standards Institute (ETSI) for telephone sets with automatic on-hook dialling facilities so that audible, or visual, progress of a call attempt can be monitored. In accordance with the ETSI (at a frequency of 440 Hz and a line level of 20 dBm (600Ω )), a minimum level of 50 dBA shall be guaranteed at a distance of 50 cm from the set. This corresponds to a minimum level of approximately 100 mV (RMS) (P O ≥ 0.2 mW) across a loudspeaker; Philips type AD2071/Z50. A listening-in set has to offer the user more facilities e.g. howling limiting to reduce annoying loudspeaker and line signals. Dynamic limiting of the loudspeaker signal, with respect to supply conditions, can also be required. Acoustic output levels for listening-in sets are approximately 70 to 75 dBA. This corresponds to a loudspeaker level of approximately 1 mV (RMS) O ≈ 20 mW). 2. The MUTE function of the TEA1085A has a logic input; the MUTE function of the TEA1085 has a toggle input. 3. SEL: loudspeaker connected in a single-ended-load configuration BTL: loudspeaker connected in a bridge-tied-load configuration 4. Consult the product specification for the package outline/s. FUNCTIONAL DESCRIPTION The TEA1083/83A is normally used in conjunction with a transmission circuit of the TEA1060 family. The circuit must be connected between the positive line terminal (pin 2) and pin SLPE of the transmission IC. The transmission characteristics (impedance, gain settings, etc.) are not affected. An interconnection between the TEA1083/83A and a member of the TEA1060 family is illustrated in Fig.5. Supplies SUP, SREF, V BB and VSS In Fig.6 the line current is divided into ITR for the transmission IC and ISUP for the monitoring circuit TEA1083/83A. ITR is constant: ITR =V int / R20 ISUP =I line− ICC − ITR Where:

• Vint is an internal temperature compensated reference voltage of 500 mV (typ) between pins SUP and SREF
• R20 is a resistor connected between SUP and SREF
• ICC is the internal current consumption of the TEA106X (approximately 1 mA). A practical value for resistor R20 is 150Ω ; this produces a current of approximately 3.3 mA (typ) for ITR and ISUP is approximately equal to Iline− 4.3 mA.

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A The circuit stabilizes its own supply voltage at VBB . Transistor TR1 provides the supplies for the internal circuits. Transistor TR2 is used to minimize signal distortion on the line by momentarily diverting the input current to V SS whenever the instantaneous value of the voltage at VSUP drops below the supply voltage VBB . VBB is fixed to a typical value of 2.95 V. The supply at V BB is decoupled with respect to VSS by a 220 µF capacitor (C20). The DC voltage (VSUP − VSS ) is determined by the transmission IC and Vint; thus VSUP − VSS = VLN −SLPE + Vint. The reference voltage of the transmission IC has to be adjusted to a level where V SUP − VBB (max) is greater than 400 mV. The minimum voltage space between SUP and V BB (400 mV) is required to maintain a 'high' efficiency of the internal supply for mean speech levels. VBB (max) is the specified maximum level. The internal current consumption of the TEA1083/83A (ISUP0 ) is typically 2.5 mA (where VSUP − VSS = 3.6 V). The current ISUP0 consists of currents IBIAS (approximately 0.4 mA) for the circuitry connected to SUP and IBB0 (approximately 2.1 mA) for the internal circuitry connected to V BB (see Fig.6). LOUDSPEAKER AMPLIFIER (LSI1/LSI2 and QLS) The TEA1083/83A has symmetrical inputs at LSI1 and LSI2. The input signal is normally taken from the earpiece output of the transmission circuit (see Fig.5) and/or from the signal output of the DTMF generator via a resistive attenuator. The attenuation factor must be chosen in accordance with the output levels from the transmission IC and/or DTMF generator and, in accordance with the required output power and permitted signal distortion from the loudspeaker signal. The output QLS drives the loudspeaker as a single-ended load. The output stage has been optimized for use with a 50 Ω loudspeaker (e.g. Philips type AD2071). The loudspeaker amplifier is enabled when the LSE input goes HIGH. The gain of the amplifier is fixed at 35 dB. Volume control of the loudspeaker signal can be obtained by using a level control at the input (see Fig.5). The maximum voltage swing at the QLS output is V O(p-p) = 2.5 V (typical with 50Ω load). The input level VLSI is approximately 16 mV(rms) and the supply current ISUP > 11 mA. In this condition the signal is limited by the available voltage space (VBB ). Higher input levels and/or lower supply currents will result in an increase of the harmonic distortion due to signal clipping. With a limit of 2.5 V (p-p), the maximum output swing is dependent on the supply current and loudspeaker impedance. It can be approximated, for low distortions, by the following equation: V O(p-p) =2 × (ISUP −ISUPO )×π× R LS Where;

• VO(p-p) = the peak-to-peak level of the loudspeaker
• R LS = the loudspeaker impedance
• ISUPO = 2.5 mA (typ.) POWER-DOWN INPUT (PD) During pulse dialling or register recall (timed loop break) the telephone line is interrupted, thereby breaking the supply current to the transmission IC. The capacitor connected to V BB provides the supply for the TEA1083/83A during the supply breaks. By making the PD input HIGH during the loop break, the requirement on the capacitor is eased and, consequently, the internal current consumption I BB0 (see Fig.5) is reduced from 2.1 mA to 400µA typically. Transistors TR1 and TR2 are inhibited during power-down and the bias current is reduced from approximately 400µA to approximately 50µA with V SUP = 3.6 V in the following equation: ISUP(PD) = IBIAS(PD) = (VSUP − 2Vd)/Ra Where 3.6< VSUP < VBB + 3V 2Vd is the voltage drop across 2 internal diodes (approximately 1.3 V) Ra is an internal resistor (typical 50 kΩ ) LOUDSPEAKER ENABLE INPUT (LSE) The LSE input has a pull-down structure. It switches the loudspeaker amplifier, in the monitoring condition, by applying a HIGH level at the input. The amplifier is in the standby condition when LSE is LOW (input open-circuit or connected to V SS ).

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A Fig.5 Interconnection with a transmission IC of the TEA106X family. handbook, full pagewidth MGR049 TEA106x VCC LN VEE SLPE QR IR MIC TEA1083 TEA1083A SREF SUP V BB VSSLSI1 LSI2 LSE QLS PD line Fig.6 Supply arrangement. handbook, full pagewidth MGR050 TEA106x VCC LN VEE VEE SLPE TEA1083 TEA1083A VSS VBB Iline ITR SUP C28 ISUPVSUP IBBO IBIAS ICC R1 SLPE R20 VOLTAGE STABILIZER TR1 TR2 SREF Vint TR1/TR2 CONTROL line

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A LIMITING VALUES In accordance with the Absolute Maximum System (IEC134) THERMAL RESISTANCE SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VSUP Supply voltage continuous − 12 V during switch-on or line interruption − 13.2 V VSUP Repetitive supply voltage from 1 ms to 5 s with 12Ω current limiting resistor in series with supply − 28 V VSREF Supply reference voltage V SS −0.5 V SUP +0.5 V V Voltage on all other pins V SS −0.5 V BB +0.5 V ISUP Supply current see Fig.6 − 120 mA Ptot Total power dissipation T amb = 75°C; Tj = 125°C TEA1083 − 500 mW TEA1083A − 769 mW TEA1083AT − 555 mW Tstg Storage temperature range −40 +125 °C Tamb Operating ambient temperature range −25 +75 °C Tj Junction temperature −+ 125 °C SYMBOL PARAMETER THERMAL RESISTANCE R th j-a from junction to ambient in free air (TEA1083) 100 K/W from junction to ambient in free air (TEA1083A) 65 K/W from junction to ambient in free air (TEA1083AT) 90 K/W

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A Fig.7 Safe operating area; see Table 2 (TEA1083). handbook, halfpage 21 2 MGR051 120 100 468 1 0 VSUP − VSS (V) (3) (2) (1) ISUP (mA) Fig.8 Safe operating areas see Table 3 (TEA1083A). handbook, halfpage 21 2 MGR052 120 100 468 1 0 VSUP − VSS (V) (2) (3) (1) ISUP (mA) Fig.9 Safe operating area; see Table 4 (TEA1083AT). handbook, halfpage 21 2 MGR053 120 100 468 1 0 VSUP − VSS (V) (2) (3) (1) ISUP (mA) Table 2 Table 3 Table 4 CURVE T amb Ptot 15 5 °C 700 mW 26 5 °C 600 mW 37 5 °C 500 mW CURVE T amb Ptot 15 5 °C 1077 mW 26 5 °C 923 mW 37 5 °C 769 mW CURVE T amb Ptot 15 5 °C 777 mW 26 5 °C 666 mW 37 5 °C 555 mW

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A CHARACTERISTICS VSUP = 3.6 V; VSS = 0 V; ISUP = 15 mA; VSUP = 0 V (RMS); f = 800 Hz; Tamb = 25°C; PD = LOW; LSE = HIGH; loudspeaker amplifier load = 50Ω ; all measurements taken in test circuit Fig.10; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VSUP Minimum DC input voltage − VBB + 0.6 − V VSUP −SREF Internal reference voltage 400 500 600 mV VBB Stabilized supply voltage I SUP = 15 mA 2.75 2.95 3.15 V ΔVBB Variation of supply voltage from ISUP = 15 to 120 mA− 15 − mV ΔVBB /ΔT Variation of supply voltage with temperature, referred to 25°C Tamb =−25 to+75 °C; Isup = 15 mA −± 0.2 − mV/K ISUP Minimum operating current − 2.5 4.0 mA THD Distortion of AC signal between SUP and VEE VSUP(RMS) = 1 V − 0.3 − % Vno(RMS) Noise between SUP and VEE (RMS value) psophometrically weighted (P53 curve) −− 71 − dBmp Current consumption in power-down condition PD = HIGH ISUP VSUP = 3.6 V − 50 75 µA IBB VBB = 2.95 V − 400 550 µA Loudspeaker amplifier inputs LSI1 and LSI2 Zi input impedance (LSI1 and LSI2) single ended 7.5 9.5 11.5 k Ω differential (LSI1 to LSI2) 15 19 23 k Ω G v Voltage gain from LSI1/2 to QLS ISUP = 15 mA; Vi = 2 mV (RMS) 34 35 36 dB ΔG v Total gain variation with input signal from 2 mV(RMS) to 10 mV(RMS) − 0.2 − dB ΔG/ΔT Total gain variation with temperature referred to 25°C T amb =−25 to+75 °C −± 0.4 − dB Output capabilities VO(p-p) Maximum output voltage (peak-to-peak value) THD = 3%; 50Ω load 2.0 2.5 − V VO(p-p) Output voltage (peak-to-peak value) Vi = 10 mV(RMS); ISUP = 15 mA; VSUP −VEE = 1 V (RMS) − 1.6 − V Vno(RMS) Noise output voltage (RMS value) 1k Ω between inputs LSI1 and LSI2; psophometrically weighted (P53 curve) − 250 −µ V Power-down input (PD) (TEA1083A only) V IL LOW level input voltage 0 − 0.3 V VIH HIGH level input voltage 1.5 − VBB V IPD Input current PD = HIGH − 2.3 2.8 µA

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A Notes to figure 10 1. ISUP =I IN − ITR 4. The pin numbers in parenthesis refer to the TEA1083A/AT 5. LSE has to be HIGH to measure the voltage gain 6. PD has to be HIGH to measure in PD conditions 7. The pins not shown in the TEA1060 are left open-circuit 8. An impedance in series with pin SUP (e.g. an ammeter) should be avoided as it interferes with the values of I TR and ISUP . LSE input VIL LOW level input voltage 0 − 0.3 V VIH HIGH level input voltage 1.5 − VBB V II Input current LSE = HIGH − 51 0 µA ΔG Reduction of gain from LSI1/LSI2 to QLS LSE = LOW 60 80 − dB SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Fig.10 Test circuit. handbook, full pagewidth MGR054 TEA1060 VCC VCC VCC VLSI LN VEE SLPE REGSTAB MIC + GAS1 MIC − GAS2 QR + GAR 4.7 µF C21 220 µF C20 470 µF 100 µF 3.6 kΩ R LS 50 Ω 620 Ω R20 150 Ω 20 Ω 16910 115 TEA1083 (TEA1083A) VBBSREF VSS LSE QLS 7 (15)(13) 6 PD (12) LSI1 (8) 4 LSI2 (9) 5 1 (1) 8 (16)3 (4) SUP 2 (2) ITR Iin Iline ICC A VSUP VSUP − VSREF ISUP IBB VO VBB G v 20 log V o V LSI ITR V SUP SREF–

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A

APPLICATION INFORMATION

An application of the TEA1083/83A, in conjunction with a member of the TEA1060 family, is illustrated in figure 11. The TEA1083/83A is used for call progress monitoring during on-hook dialling. The dialling facilities are performed by a microcontroller (e.g. PCD3344, PCD3349). Only the most important components have been shown. For detailed information refer to a data sheet of the TEA1060 family. The electronic hook switch can be replaced by a mechanical system (hook switch) with a hold/release function which is intended for on-hook dialling. ook, full pagewidth MGR055 VEE Zbal PD GAR QR DTMF MIC − VCC LN 10 16 18 MIC + REG SLPE MICROCONTROLLER AND INTERFACE CIRCUITRY ENABLEDTMFDP/FLMUTE 15 1 4.7 µF 20 Ω R22 2.2 kΩ MUTE IR TEA1060 50 kΩ R21 2.2 kΩ 10 µF 150 µH C14 150 nF 100 nF (12) QLS LSE (15) (13) PD 4 (8) 5 (9) 1 (1) LSI1 LSI2 VSS SREF V BB TEA1083 (TEA1083A) SUP 3 (4) 8 (16)2 (2) C22 220 nF C23 220 nF 47 µF C21 100 µF C24 150 nF R20 150 Ω 620 Ω 130 kΩ 390 Ω 3.9 kΩ C20 220 µF VSS VDD XTAL CRS cradle switch line-interrupter electronic hook switch a/b line b/a Fig.11 Application example when the TEA1083/83A is used in conjunction with the TEA1060. Pin numbers in parenthesis refer to the TEA1083A/AT.

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A PACKAGE OUTLINES REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT97-1 92-11-17 95-02-04 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M ZHL mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max.wM Ee1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 7.80 10.0 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.31 0.39 050G01 MO-001AN M H c (e )1 M E A L seating plane w M e D A 2 Z b E 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. pin 1 index DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A UNIT A max. 1 2 b1 cE e M HL REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT38-1 92-10-02 95-01-19 A min. A max. b max.wM Ee1 1.40 1.14 0.055 0.045 0.53 0.38 0.32 0.23 21.8 21.4 0.86 0.84 6.48 6.20 0.26 0.24 3.9 3.4 0.15 0.13 0.2542.54 7.62 0.30 8.25 7.80 0.32 0.31 9.5 8.3 0.37 0.33 2.2 0.087 4.7 0.51 3.7 0.15 0.021 0.015 0.013 050G09 MO-001AE M H c (e )1 M E A L seating plane w M e D A 2 Z b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1)D (1)Z DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A UNIT A max. A 1 A 2 A 3 bp cD (1) E (1) (1)eH E LL p Q Zywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 SOT162-1 w M bp D detail X Z e y 0.25 075E03 MS-013AA pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.41 0.40 0.30 0.29 0.050 1.4 0.0550.419 0.394 0.043 0.039 0.035 0.0160.01 0.25 0.01 0.0040.043 0.0160.01 X θ AA 1 A 2 H E Lp Q E c L v M A (A )3 A 0 5 10 mm scale SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 95-01-24 97-05-22

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. R EPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300°C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400°C, contact may be up to 5 seconds. SO R EFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250°C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. W AVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
• The longitudinal axis of the package footprint must be parallel to the solder flow.
• The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260°C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150°C within 6 seconds. Typical dwell time is 4 seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. R EPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320°C.

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A DEFINITIONS LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Where application information is given, it is advisory and does not form part of the specification.

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A NOTES

Philips Semiconductors Product specification Call progress monitor for line powered telephone sets TEA1083; TEA1083A NOTES

Internet: http://www.semiconductors.philips.com Philips Semiconductors – a worldwide company © Philips Electronics N.V. 1998 SCA60 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria:Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil:see South America Bulgaria:Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Printed in The Netherlands 415102/00/02/pp20 Date of release: March 1994 Document order number: 9397 750 nnnnn