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© Semiconductor Components Industries, LLC, 2015 October, 2015 − Rev. 0
1 Publication Order Number:
TCP−4168UB/D TCP-4168UB 6.8 pF Passive Tunable Integrated Circuits (PTIC) Introduction ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC product line is a tunable material called ParaScan/C0116, based on Barium Strontium Titanate (BST). PTICs have the ability to change their capacitance from a supplied bias voltage generated by the Control IC. The 6.8 pF ultra−high tuning PTICs are available as wafer-level chip scale packages (WLCSP). Key Features
- Ultra−High Tuning Range and Operation up to 24 V
- Usable Frequency Range: from 700 MHz to 2.7 GHz
- High Quality Factor (Q) for Low Loss
- High Power Handling Capability
- Compatible with PTIC Control IC TCC-10x, 20x
- WLCSP Package: 0.609 x 1.009 x 0.310 mm (4 bump)
- These devices are Pb−Free and RoHS Compliant Typical Applications
- Multi-band, Multi-standard, Advanced and Simple Mobile Phones
- Tunable Antenna Matching Networks
- Tunable RF Filters
- Active Antennas Device Package Shipping †
ORDERING INFORMATION
www.onsemi.com TCP−4168UB−DT WLCSP4 (Pb−Free)
4000 Units /
7” Tape & Reel FUNCTIONAL BLOCK DIAGRAM PTIC Functional Block Diagram MARKING DIAGRAM PTIC Bias RF1 RF2 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification s Brochure, BRD8011/D. WLCSP4 1.009x0.609 CASE 567LZ
Figure 1. PTIC Functional Block Diagram Table 1. SIGNAL DESCRIPTIONS
Table 2. PERFORMANCE DATA
- IP3 and Harmonics are measured in the shunt configuration in a 50 /C0087 environment
- RF IN and RFOUT are both connected to DC ground
Table 4. PART NUMBERS *See PTIC package dimensions on following page. (TND310/D) from www.onsemi.com.
TCP−4168UB www.onsemi.com PACKAGE DIMENSIONS WLCSP4, 1.009x0.609 CASE 567LZ ISSUE O SEATING PLANE 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. 4. BACKSIDE TAPE APPLIED TO IMPROVE PIN 1 MARKING. DIM A MIN MAX 0.275 MILLIMETERS D 1.009 BSC E b1 0.044 0.094 e 0.420 BSC 0.345 È E D A B PIN A1 REFERENCE 0.05 C B A 0.06 C C 0.045 0.085
0.609 BSC
0.05 C2X TOP VIEW
e e1 0.400 BSC b 0.079 0.129 A DETAIL A DETAIL A A0.05 BC 0.03 C 4X b 4X b1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* RECOMMENDED DETAIL C DETAIL C NOTE 4 TAPE DIMENSIONS: MILLIMETERS PACKAGE OUTLINE 0.13 0.55 0.55 0.15 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a numb er of patents, trademarks, reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 TCP−4168UB/D ParaScan is a trademark of Paratek Microwave, Inc. LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative