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© Semiconductor Components Industries, LLC, 2013 May, 2013 − Rev. P2

1 Publication Order Number:

TCP−3012H/D TCP-3012H Advance Information 1.2 pF Passive Tunable Integrated Circuits (PTIC) Introduction ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC product line is a tunable material called ParaScan/C0116, based on Barium Strontium Titanate (BST). PTICs have the ability to change their capacitance from a supplied bias voltage generated by the Control IC. The 1.2 pF PTICs are available as wafer-level chip scale packages (WLCSP) and in QFN packages for easy mounting directly on printed circuit boards. Key Features

  • High Tuning Range and Operation up to 20 V
  • Usable Frequency Range: from 700 MHz to 2.7 GHz
  • High Quality Factor (Q) for Low Loss
  • High Power Handling Capability
  • Compatible with PTIC Control IC TCC-103
  • WLCSP Package: 0.722 x 0.879 x 0.611 mm (8 pillar)
  • QFN Package: 1.200 x 1.600 x 0.950 mm
  • QFN: MSL−2 Moisture Sensitivity Level (per J−STD−020)
  • Pb−Free and RoHS Compliant Typical Applications
  • Multi-band, Multi-standard, Advanced and Simple Mobile Phones
  • Tunable Antenna Matching Networks
  • Tunable RF Filters
  • Active Antennas This document contains information on a new product. Specifications and information herein are subject to change without notice. QFN MARKING DIAGRAM Device Package Shipping

ORDERING INFORMATION

http://onsemi.com TCP−3012H−DT WLCSP (Pb−Free)

4000 Units /

7” Reel WLCSP 8 pillar CASE TBD X.X = 1.2 H = High Tuning X.XH QFN 6 pin CASE TBD For detailed ordering information, including part number definition and capacitance (pF) see the package dimensions section on page 7 of this datasheet. TCP−3012H−QT QFN (Pb−Free)

8000 Units /

13“ Reel FUNCTIONAL BLOCK DIAGRAM Figure 1. PTIC Functional Block Diagram

Table 1. PERFORMANCE DATA

  1. IP3 and Harmonics are measured in the shunt configuration in a 50 /C0087 environment
  2. RF IN and RFOUT are both connected to DC ground

TCP−3012H http://onsemi.com

PACKAGE INFORMATION

Figure 6. QFN Package Dimensions

0.100 X 45°

0.9 mm pad layout is standard for all products. Shorter pad layouts can be considered for smaller products.

Table 4. PART NUMBERS

Figure 11. 8 Pillar WLCSP Carrier Tape Drawing

Figure 12. QFN Carrier Tape Drawing Table 5. POCKET DIMENSION of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. ParaScan is a trademark of Paratek Microwave, Inc.